HMC Series-High Temperature Stacked Capacitors Holy Stone Multilayer Ceramic Chip Capacitors for High Temperature Applications [High Temperature Stacked Capacitors] HMC Series MLCC Design, Suitable for High CV Applications that Require Elevated Operating Temperatures Applications Features High temperature ratings (150˚ through 250˚C) Stacked design offers the high capacitance Power supplies DC-DC converters Surge protection Industrial control circuits Snubbers Filtering, smoothing, and decoupling application Down-Hole applications Under the hood Jet engine controls Other high operating temperature applications similar to Tantalum but with extremely low ESR advantage. ‘J’, ‘L’ and ‘N’ Leaded configuration provide mechanical and thermal stress relief. Capacitance values up to 8.5µF Voltage from 50V to 1000V. NP0 and X8R dielectric. HIREL screening available. Summary of Specifications Operating Temperature -55 to +150 Ԩ, 175 ˚C, 200 ˚C, and 250 ˚C Rated Voltage 50Vdc to 1000Vdc Temperature Coefficient of Capacitance X8R : ≤ ± 15% Capacitance Range X8R : 14nF to 8.5uF NP0 : 5.6 nF to 400 nF Dissipation Factor : X8R : 2.5%max. at 1KHz NP0: Q> 1000 at 1KHz Insulation Resistance 10GΩ or 500/C Ω whichever is smaller Aging X8R : 2.5% per decade of time NP0: negligible -55 to +150 Ԩ (EIA Class Ⅱ ) NP0 : ≤ +/- 30 ppm Dielectric Withstanding Voltage V ≤50V -55 to 125 ˚C (EIA Class I) ; 250% Rated Voltage 100V ≤ V <500V ; 200% Rated Voltage 500V ≤ V <1KV ; 150% Rated Voltage 1000V = 120% Rated Voltage ± 5% ~ ± 20% tolerances Tolerance How To Order HMC 49 J Product Code Stack and Size HMC: High temperature Stacked Capacitors The first digit: Ex.: # of chips in J :J Lead for h=0.070” stack L :L Lead for Second Digit: h=0.070” Chip Size N:Straight 6: 1812 Lead P :J Lead for 7: 2220 8: 1825 h=0.045” S:L Lead for 9: 2225 h=0.045” H Lead Material Configuration Ex.: H: X8R N: NP0 224 K 501 T H Capacitance Tolerance (pF) Rated Voltage Ex.: 103:10x103 224:22x104 475:47x105 Ex.: B: Bulk 050: 50Vdc T:Tape&Reel 101: 100Vdc W: Waffle 201: 200Vdc pack 501: 500Vdc 102:1000Vdc Ex.: J: +/-5.0% K: +/- 10% M: +/- 20% - 71 - Packaging 01 Special Test Special Requirement Requirement Blank: Standard electrical test H: Hi-Rel Testing Blank: No special requirement 01~99: Customer special requirement Revision date : 2010.07.16 HMC Series-High Temperature Stacked Capacitors Holy Stone Dimensions 1812 Size 1825/2225 J Type 2220 Size 1825/2225 L Type - 72 - 1825/2225 N Type HMC Series-High Temperature Stacked Capacitors Holy Stone Unit : mm [inches] EIA Size Code Size Code L W (max.) H(max.) S P h* (Typical) h* (P/S Type) LL** (min.) t # of leads per side EIA Size Code Size Code L W (max.) H(max.) S P h* (Typical) h* (P/S Type) LL** (min.) t # of leads per side 1812 16 26 18 1825 38 28 48 58 5.35±0.50 [.210±.020] 3.60 [.142] 2.54 [.100] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.05 [.020±.002] 5.35±0.50 [.210±.020] 3.60 [.142] 5.08 [.200] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.05 [.020±.002] 5.35±0.50 [.210±.020] 6.85 [.270] 2.54 [.100] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 5.08 [.200] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 7.62 [.300] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 10.16 [.400] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 5.35±0.50 [.210±.020] 6.85 [.270] 12.70 [.500] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 2 2 3 3 3 3 3 27 19 29 2225 39 2220 17 49 59 6.35±0.50 [.210±.020] 6.10 [.240] 2.54 [.100] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.210±.020] 6.10 [.240] 5.08 [.200] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 2.54 [.100] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 5.08 [.200] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 7.62 [.300] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 10.16 [.400] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 6.35±0.50 [.250±.020] 6.85 [.270] 12.70 [.500] 1.65±0.50 [.065±.020] 2.54±0.25 [.100±.010] 1.78 [.070] 1.14 [.045] 2.54 [.100] 0.50±0.10 [.020±.004] 2 2 3 3 3 3 3 * ‘h’ varies depends on the lead style. See lead configuration above ** “LL” Applies only to Straight (N) leads Capacitance Range EIA Chip Size 1812 2220 Size Code 16 (1×Cap) 26 (2×Cap) 17 (1×Cap) 27 (2×Cap) 18 (1×Cap) 28 (2×Cap) 1825 38 (3×Cap) 48 (4×Cap) 58 (5×Cap) 19 (1×Cap) 29 (2×Cap) 2225 39 (3×Cap) 49 (4×Cap) 59 (5×Cap) NPO Maximum Capacitance X8R Maximum Capacitance 50V 100V 200V/250V 500V 1000V 50V 100V 200V/250V 500V 1000V 293 583 623 124 653 134 194 264 324 813 164 244 324 404 183 363 543 104 563 114 164 224 284 653 134 194 264 324 123 243 453 903 473 943 144 184 234 563 114 164 224 284 822 163 393 783 393 783 114 154 194 473 943 144 184 234 562 113 123 243 123 243 363 483 603 153 303 453 603 753 574 115 135 265 135 265 395 525 655 175 345 515 685 855 454 904 105 205 105 205 305 405 505 145 285 425 565 705 354 704 804 165 804 165 245 325 405 105 205 305 405 505 923 184 214 424 214 424 634 844 105 284 564 844 115 145 143 283 363 723 363 723 104 144 184 493 983 144 194 244 Other Stacked configurations, sizes, capacitance values and voltages ratings are available. Please contact the factory for details. *Soldering And Handling Precautions: We recommend reflow soldering for soldering the HMC Series capacitors. Wave soldering and use of manual solder iron processes are to be avoided. For the reflow solder process, all capacitors should be heated to within 50˚C and then ramped to peak temperature and back down to within 50˚C using a ramp rate of no greater than 2˚C per second. Sudden increases or decreases in temperature(more than the recommended rate) may cause thermal cracking. Please note that controlling the rate of cooling is as important as the rate of heating in thermal crack prevention. - 73 -