2 Pad Ceramic Base SMD Crystal, 2.0 mm x 1.2 mm IL3T Series Applications: Product Features: Low Cost SMD Package RoHS Compliant Compatible with Leadfree Processing Ultra Low Profile Real Time Clocks Metering Industrial Control Time Reference Frequency 32.768 KHz ESR (Equivalent Series Resistance) Less than 90 kΩ Shunt Capacitance (C0) 1.3 pF Typ. Motional Capacitance (Cl) 6.5 fF Typ. Frequency Tolerance @ 25 C ±5ºC 20 ppm Standard Frequency Stability over Temperature Parabolic -0.034 ppm / C Typ. Turnover point +25º ±5ºC See Graph Below Crystal Cut X-Cut Load Capacitance 12.5 pF Standard Drive Level 0.1 µW Typ., 0.5 µW Max. Aging 5 ppm Max. / Year Standard 2.00±0.10 1.20±0.10 R0.10 2 0.60 MAX 0.10 1 1.00 2 Temperature 0.50 Operating -40 C to +85 C Standard Storage -55 C to +125 C Standard 0.50 SUGGESTED LAND PATTERN ppm Typical X Cut Tem perature Coefficient 0.80 0 -30 -60 -90 -120 -150 -180 1.10 0.60 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 0.60 DIMMENSION UNITS: mm Tem perature Part Number Guide Package IL3T - Sample Part Number: IL3T - HX5F12.5 - 32.768 KHz Stability (ppm) at Room Temperature Stability (ppm) over Operating Temperature Operating Temperature Range H = ±20 ppm X = X Cut 5 = -40°C to +85°C ode (overtone) F = Fundamental Load Capacitance (pF) Frequency 12.5 pF Standard - 32.768 KHz ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail.ilsiamerica@com ● www.ilsiamerica.com Specifications subject to change without notice Rev: 04/05/15_B Page 1 of 2 2 Pad Ceramic Base SMD Crystal, 2.0 mm x 1.2 mm Pb Free Solder Reflow Profile: IL3T Series Typical Circuit: *Units are backward compatible with 240C reflow processes Package Information: MSL = 2 Termination = e1 (Sn/Cu/Ag over Ni over Kovar base metal) Tape and Reel Information: Quantity per Reel A B C D E F 3000 8.0 ±0.2 4.0 ±0.1 3.5 ±0.05 9.0 ±0.3 60 / 80 180 / 250 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: Frequency, Date Code PROPRIETARY AND CONFIDENTIAL THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION, AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE NOR USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM ILSI America. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail.ilsiamerica@com ● www.ilsiamerica.com Specifications subject to change without notice Rev: 04/05/15_B Page 2 of 2