Soldering/Taping Specifications

STN
+ 125°C Surface Mount
Solid Tantalum Chip
Capacitors
Soldering/Taping Specifications
Immersion
Method
270
Reflow
Method
260
250
260
240
Surface temperature
of substance
250
Temperature of
solder bath (°C )
270
Allowable
range
230
220
210
0
2
4 6 8 10 12 14
Time in solder bath (sec)
240
230
Allowable
range
220
210
200
0
20
10 20 30 40 50
Time in reflow (sec)
60
Tape and Reel Specifications
Dimensions
Case Code C
Case Code B
Case Code D
Dimension
Case Code A
A
1.9±0.1
B
3.5±0.1
3.8±0.1
6.4±0.1
7.7±0.1
7.7±0.1
C
8.0±0.3
8.0±0.3
12.0±0.3
12.0±0.3
12.0±0.3
D
3.5±0.05
3.5±0.05
5.65±0.05
5.65±0.05
5.7±0.05
E
4.7 max
5.0 max
7.3 max
8.4 max
8.4 max
F
4.0±0.1
4.0±0.1
8.0±0.1
8.0±0.1
8.0±0.1
3.1±0.1
3.7±0.1
G
4.8±0.1
Case Code E
4.8±0.1
2.0±0.05
H
4.0±0.1
T
1.5±0.1, -0
I
0.2
K
2. 0 max
0.3
0.3
Carrier Tape
2.1±0.2
3.0±0.2
Emboss Plastic
Cover tape
Polyester
0.3
0.3
3.6±0.2
4.7±0.2
(mm)
Reel Specifications
Quantities Per Packaged Reel
A
178±2.0
B
50 min.
C
13.0±0.5
D
21.0±0.8
E
W
F
2.0±0.5
10.0±1.5(C:8.0)
14.0±1.5(C:12.0)
2.0±0.5
Case Code
Reel
A
2,000
B
2,000
C
500
D
500
E
400
(mm)
3757 W. Touhy Ave., Lincolnwood, IL 60712 • (847) 675-1760 • Fax (847) 673-2850 • www.illcap.com
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