SI-SX72-ACQ256SFG484

Actel CQFP – FBGA484 Adapter Boards
(SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484)
Contents
1). Introduction
2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly
instructions
3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly
instructions
4). Appendix C -- Gull Wing Surface mount Foot Soldering Instructions
5). Appendix D – CQ256 Package Pin Assignment List
6). Appendix E – FG484 Package Pin Assignment List
1). Introduction
Actel CQFP- FBGA Adapter Boards
Introduction
Actel’s expanded Adapter Board offering allows for easy prototyping. The
CQFP to FBGA Adapter boards (SI-SX32-ACQ256SFG484 and SI-SX72ACQ256SFG484) are specifically built for prototyping for the SXA and SXS
families. This solution allows a customer to prototype with an A54SX32A-FG484
device and then for production switch to either an A54SX32A-CQ256 or an
RT54SX32S-CQ256 device. Likewise, customers can prototype with an
A54SX72A-FG484 device and then for production switch to either an A54SX72ACQ256 or an RT54SX72S-CQ256 device.
Figure 1. CQ256 to FG484 via CQFP to FBGA adapter board
Figure 2. Assembled “CQFP to FBGA adapter socket” Adapter Board with socket (SI-SX32ACQ256SFG484)
1
Figure 3. Before assembly of “CQFP to FBGA adapter socket” (SI-SX32-CQ256SFG484)
Top from left - adapter board, top frame
Bottom from left – compression plate, top lid
Assembly Procedure
The bottom piece of the adapter board should be soldered either reflow
soldered or manual soldered to the customer’s board based on Ironwood “Gull
Wing Surface mount Foot Soldering Instructions” in Appendix C (Figure 4). The
top frame can then be tightened to the bottom piece using a .05” wrench (figure
5). The programmed FG484 packaged part can then be placed on the top frame
(figure 6). Place the compression plate and top lid on top (figure 7 & 8). Secure
the top lid by tightening down with a .05” wrench (figure 9). Use the Pre-Set 3 inlabs Torque-Limiting Screw Driver to apply force to compress the package (figure
10)
Figure 4. Assembly step 1- solder adapter board bottom to PCB
2
Figure 5. Assembly step 2 – tighten top frame with 0.5” wrench
Figure 6. Assembly step 3 – place in FG484 in socket
Figure 7. Assembly step 4 –place the compression plate on top of device
3
Figure 8. Assembly step 5 – put on top lid
Figure 9. Assembly step 6 – tighten top lid with .05” wrench
Figure 10. Assembly step 7 – tighten top compression screw using Pre-Set 3 lbf-in Torque
Limiting Screw driver
During prototyping, if the design code changes and a new FPGA device is
needed, it is very easy to remove the top lid and compression plate to replace the
FPGA. To insert a new-programmed part, just place it on the top frame and
replace the compression plate and top lid. This can be repeated multiple times
during the prototyping design phase.
4
NOTE:
1). For more detailed assembly information also refer to Ironwood
Electronics
C4002
&
C4228
assembly
Instructions,
online
at
www.ironwoodelectronics.com
2). Torque Limiting Screw Driver can be Mountz, Inc product. Refer
Mountz, Inc products online at www.mountztorque.com
Mountz part #
Torque Limiting Screw Driver part #: 020066 (preset 3 lbf-in)
Hex Power Bit #: 120841
5
2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and
Assembly instructions
Note:
Tighten top compression screw using preset 3 lbf-in Torque
Limiting Screwdriver.
Torque Limiting Screw Driver can be Mountz, Inc product
Refer Mountz, Inc products online at www.mountztorque.com
Mountz part#
Torque Limiting Screw Driver part #: 020066 (preset 3 lbf-in)
Hex Power Bit #: 120841
3.16mm [0.124"]
3.54mm [0.139"]
1
39.3mm
[1.547"]
41.9mm
[1.650"]
32.23mm
[1.269"]
41.9mm [1.650"]
27mm
15.67mm
[0.617"]
DETAIL A
Lead coplanarity
0.005" max.
Side View
0.5mm
Description: BGA to QFP package converter
484 position BGA surface mount GHz BGA socket (1.00mm centers, 26X26 array, 27X27mm body) to 256 QFP, 0.5mm
gull-wing leads. Pin assignment: A54Sx32A CQ256 to A54SX72A FG484
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
10:4
Scale: ______
1 of 5
____
Rev: B
Drawing: M. Tully
Date: 10/2/01
File: C4228 Dwg.mcd
Modified: 1/29/02, MT
DETAIL A
0.91mm
[0.036"] max.
2.03mm
[0.080"]
0.28mm
[0.011"]
1
2
0.18mm [0.007"]
0.49mm [0.019"]
1.3mm
[0.051"]
1
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. 17µm [1/2
oz.] Cu clad. SnPb plating.
2
Leads: material- BeCu Alloy 194; plating- 80/20 SnPb.
Specifications:
Operating Temperature Range (1)
-40 ° C. to 55 ° C
Storage Temperature Range (1)
-62 ° C. to 85 ° C
Solderability (2)
260
C, 55 sec.
sec.maximum
maximum
260 °° C,
Maximum Temperature, Substrate
290 ° C, 5 sec. maximum
Through path Resistance
10 milliohms at 200 mA
Packaging (3)
Best commercial practices
(1) per Mil-STD-202, method 107, test condition A
(2) per Mil-STD-202, method 208 (soldering heat per Method 210, condition B)
(3) Packaging contains Ironwood Electronics part number, Ironwood Electronics name and quantity of parts per shipment
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
15:1
Scale: ______
2 of 5
____
Rev: B
Drawing: M. Tully
Date: 10/2/01
File: C4228 Dwg.mcd
Modified: 1/29/02, MT
C4228 Assembly Instructions
1. Install the socket base assembly (A) on the target PCB using the Gullwing Surface Mount Soldering Instruction document.
Solder procedure #2 or #3 are recommended to induce the least amount of thermal stresses on the base adaptor
2. Place the Socket/Elastomer assembly (B) onto the socket base, aligning the orientation mark on the assembly with the A1 indicator
on the adaptor board (see page 4 for details).
WARNING: ASSEMBLY (B) MUST BE REMOVED IF THE BASE WILL BE SUBJECT TO
REFLOW AGAIN. THE ELASTOMER WILL NOT WITHSTAND TEMPERATURES ABOVE 100
degrees C.
3. Using the 4 Hex head screws (C), attach the Socket/ Elastomer assembly onto the socket base .
4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation into socket is critical.
5. Place the compession plate (D), on top of the BGA package, orientation is not important.
6. Install the Socket Top assembly (E) by placing it over the socket lid screws and rotating.
7. Turn the compression screw (F) clockwise, until it makes contact with the compression plate.
8. Using a torque limiting screw driver or wrench set to 3 in-lbs, tighten the compression screw.
Compression Screw
Socket
Top Assembly
E
F
Socket Lid
Compression plate
D
C
BGA
Package
Hex head screw
Socket lid screws,
DO NOT ADJUST
B
Socket / Elastomer assembly
A
Socket Base
Assembly
63/37 SnPB
Eutictic or equivalent
low temperature solder
TARGET PCB
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
10:4
Scale: ______
3 of 5
____
Rev: B
Drawing: M. Tully
Date: 10/2/01
File: C4228 Dwg.mcd
Modified: 1/29/02, MT
BGA pin A1
1
Socket / Elastomer assembly
with orientation mark
Noting BGA pin A1 orientation
(white silkscreen) on the
adaptor board and Socket /
Elastomer assembly orientation
mark, attach the assembly
onto the socket base
Top view: Lid in initial attachment position
Note: The socket base assembly
will have to be assembled to the
Gull-wing adaptor board only
once. In use, the complete
adaptor will only require the lid
and compression plate to be
removed to exchange BGA IC’s
Side view
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
10:4
Scale: ______
4 of 5
____
Rev: B
Drawing: M. Tully
Date: 10/2/01
File: C4228 Dwg.mcd
Modified: 1/29/02, MT
4
3
1
9
8
2
7
6
5
Materials:
1
Socket Lid: Black anodized 6061 Aluminum. Thickness = 2.0mm.
2
Socket base: Black anodized 6061 Aluminum. Thickness = 5mm.
3
Compression Plate: Black anodized 6061 Aluminum. Thickness = 2.5mm.
4
Compression screw: Black anodized 6061 Aluminum. Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: 30 micron dia gold plated brass filaments arranged symmetrically in a
silicone rubber (63.5 degree angle). Thickness = 1.00mm.
6
Elastomer Guide: Non-clad FR4. Thickness = 0.75mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, 18-8 Stainles steel, 0-80 fine thread , 9.00mm long.
9
Socket lid screw: Socket head cap, 18-8 Stainless steel, 0-80 fine thread , 5.85mm long.
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4228 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
10:4
Scale: ______
5 of 5
____
Rev: B
Drawing: M. Tully
Date: 10/2/01
File: C4228 Dwg.mcd
Modified: 1/29/02, MT
3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and
Assembly instructions
Note:
Tighten top compression screw using preset 3 lbf-in Torque
Limiting Screwdriver.
Torque Limiting Screw Driver can be Mountz, Inc product
Refer Mountz, Inc products online at www.mountztorque.com
Mountz part#
Torque Limiting Screw Driver part #: 020066 (preset 3 lbf-in)
Hex Power Bit #: 120841
3.16mm [0.124"]
3.54mm [0.139"]
1
39.3mm
[1.547"]
41.9mm
[1.650"]
32.23mm
[1.269"]
41.9mm [1.650"]
27mm
15.67mm
[0.617"]
DETAIL A
Lead coplanarity
0.005" max.
Side View
0.5mm
Description: BGA to QFP package converter
484 position BGA surface mount GHz BGA socket (1.00mm centers, 26X26 array, 27X27mm body) to 256 QFP, 0.5mm
gull-wing leads.
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
Scale: 1:0.4
1 of 5
____
Rev: E
Drawing: M. Tully
Date: 6/5/01
File: C4002 Dwg.mcd
Modified: 1/28/02. MT
DETAIL A
0.91mm
[0.036"] max.
2.03mm
[0.080"]
0.28mm
[0.011"]
1
2
0.18mm [0.007"]
0.49mm [0.019"]
1.3mm
[0.051"]
1
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material. 17µm [1/2
oz.] Cu clad. SnPb plating.
2
Leads: material- BeCu Alloy 194; plating- 80/20 SnPb.
Specifications:
Operating Temperature Range (1)
-40 ° C. to 55 ° C
Storage Temperature Range (1)
-62 ° C. to 85 ° C
Solderability (2)
260
C, 55 sec.
sec.maximum
maximum
260 °° C,
Maximum Temperature, Substrate
290 ° C, 5 sec. maximum
Through path Resistance
10 milliohms at 200 mA
Packaging (3)
Best commercial practices
(1) per Mil-STD-202, method 107, test condition A
(2) per Mil-STD-202, method 208 (soldering heat per Method 210, condition B)
(3) Packaging contains Ironwood Electronics part number, Ironwood Electronics name and quantity of parts per shipment
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
Scale: 1:0.4
2 of 5
____
Rev: E
Drawing: M. Tully
Date: 6/5/01
File: C4002 Dwg.mcd
Modified: 1/28/02. MT
C4002 Assembly Instructions
1. Install the socket base assembly (A) on the target PCB using the Gullwing Surface Mount Soldering Instruction document.
Solder procedure #2 or #3 are recommended to induce the least amount of thermal stresses on the base adaptor
2. Place the Socket/Elastomer assembly (B) onto the socket base, aligning the orientation mark on the assembly with the A1 indicator
on the adaptor board (see page 4 for details).
WARNING: ASSEMBLY (B) MUST BE REMOVED IF THE BASE WILL BE SUBJECT TO
REFLOW AGAIN. THE ELASTOMER WILL NOT WITHSTAND TEMPERATURES ABOVE 100
degrees C.
3. Using the 4 Hex head screws (C), attach the Socket/ Elastomer assembly onto the socket base .
4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation into socket is critical.
5. Place the compession plate (D), on top of the BGA package, orientation is not important.
6. Install the Socket Top assembly (E) by placing it over the socket lid screws and rotating.
7. Turn the compression screw (F) clockwise, until it makes contact with the compression plate.
8. Using a torque limiting screw driver or wrench set to 3 in-lbs, tighten the compression screw.
Compression Screw
Socket
Top Assembly
E
F
Socket Lid
Compression plate
D
C
BGA
Package
Hex head screw
Socket lid screws,
DO NOT ADJUST
B
Socket / Elastomer assembly
A
Socket Base
Assembly
63/37 SnPB
Eutictic or equivalent
low temperature solder
TARGET PCB
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
Scale: 1:0.4
3 of 5
____
Rev: E
Drawing: M. Tully
Date: 6/5/01
File: C4002 Dwg.mcd
Modified: 1/28/02. MT
BGA pin A1
1
Socket / Elastomer assembly
with orientation mark
Noting BGA pin A1 orientation
(white silkscreen) on the
adaptor board and Socket /
Elastomer assembly orientation
mark, attach the assembly
onto the socket base
Top view: Lid in initial attachment position
Note: The socket base assembly
will have to be assembled to the
Gull-wing adaptor board only
once. In use, the complete
adaptor will only require the lid
and compression plate to be
removed to exchange BGA IC’s
Side view
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
Scale: 1:0.4
4 of 5
____
Rev: E
Drawing: M. Tully
Date: 6/5/01
File: C4002 Dwg.mcd
Modified: 1/28/02. MT
4
3
1
9
8
2
7
6
5
Materials:
1
Socket Lid: Black anodized 6061 Aluminum. Thickness = 2.0mm.
2
Socket base: Black anodized 6061 Aluminum. Thickness = 5mm.
3
Compression Plate: Black anodized 6061 Aluminum. Thickness = 2.5mm.
4
Compression screw: Black anodized 6061 Aluminum. Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: 30 micron dia gold plated brass filaments arranged symmetrically in a
silicone rubber (63.5 degree angle). Thickness = 1.00mm.
6
Elastomer Guide: Non-clad FR4. Thickness = 0.75mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, 18-8 Stainles steel, 0-80 fine thread , 9.00mm long.
9
Socket lid screw: Socket head cap, 18-8 Stainless steel, 0-80 fine thread , 5.85mm long.
PAGE
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm
[±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
C4002 Drawing
© 2001 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
www.ironwoodelectronics.com
Status: Released
Scale: 1:0.4
5 of 5
____
Rev: E
Drawing: M. Tully
Date: 6/5/01
File: C4002 Dwg.mcd
Modified: 1/28/02. MT
4). Appendix C -- Gull Wing Surface mount Foot Soldering Instructions
Gull Wing Surface mount Foot Soldering Instructions
The gull wing style, surface mount foot (parts with a 'SF-'
prefix and a '-G' suffix) is designed to solder to a quad
flat pack (QFP) surface mount land pattern. The emulator
foot emulates the physical characteristics of a QFP gull
wing package very closely, allowing the foot to be
soldered to a target board land pattern using the methods
commonly employed in attaching actual QFP packages.
The recommended method is explained below with visual
aids showing the step-by-step process. This method has
produced very good results. Figure 1 shows the surface
mount emulator foot and a clean target printed circuit
board. The steps involved in the soldering process follow.
CAUTION: During secondary reflow (i.e. mounting the
emulator foot to a board), the temperature profile should
be tightly controlled. The gull wing leads are attached to
Figure 1: Target PCB/Emulator Foot
the emulator foot with 95/5 tin/silver solder(melting point
245°C). If the temperature during reflow exceeds 245°C,
it will cause bridging between the leads or create opens at
the clip head. The peak temperature during reflow should
not reach more than 240°C. Peaks to 260°C are allowed
only if the residence time is less that 40 seconds above
240°C. If you are attaching the emulator board to a target
board using a hot soldering iron, this can easily happen.
We strongly recommend that furnaces are profiled every
day.
REFLOW OVEN - Soldering method #1
(a) Determine an appropriate temperature solder paste for
your application.
(b) Apply a continuous bead of paste to the target PCB
Figure 2: Apply Solder Paste
pads as shown in Figure 2. Cover approximately 1/3 of the
pad between the center of the pad and the outer edge. Begin with this amount and add additional paste after
reflow, if necessary (excessive paste on an initial trial will
be difficult to remove).
(c) Note the target PCB QFP land pattern and the
emulator foot Pin 1 locations.
(d) Align and place the emulator foot onto the solder
paste and land pattern as shown in Figure 3. 'Pick and
place' equipment or a vacuum pen, are recommended (if
they will accommodate the foot), but, handling the foot
by the gold pins and placing on the land pattern by hand
will suffice.
(e) Reflow target PCB with emulator foot in reflow oven
(convection, IR, etc.). The recommended reflow profile is
shown in the Figure 5. Time and temperature settings will
be determined by the manufactures of the solder paste and
Figure 3: Align foot on the lands
Gull wing Surface mount Foot Soldering Instructions (continued)
reflow oven. The Ironwood gull wing foot has a larger thermal mass than an actual QFP package, and therefore,
may require longer reflow time and/or higher temperature
settings.
(f) Inspect solder fillets. Add additional solder paste to
solder deficient areas as needed or remove excess with
small tip solder iron and copper desoldering braid (Figure
4). If the solder has not completely reflowed, add solder
flux and repeat step (e).
Because of the construction of the emulator foot, a Low
Temperature solder paste must be used. Set reflow
equipment to the lowest setting that will reflow the solder
paste. Reflow the emulator foot with target assembly in a
temperature range of 185 - 210 degree C. This can be
varied depending upon the profile of the oven and the
customer assemblies. The above temperature range is safe
Figure 4: Removing excess solder
for soldering the emulator foot without thermal damage to
the foot. It is recommended that reflow oven be set for a minimum time initially. If reflow was not complete,
reflux and reflow for a longer duration.
250
Maximum Package Body Temperature
Solder Temperature Melting Point
1° to 3°C
per Second
150
150 - 180 Seconds
<2°C
per Second
(°C)
Temperature
200
100
<2°C
per Second
50
Preheat
0
Flux Activation
100
Reflow
200
300
Cool-Down
400
500
Time (seconds)
Figure 5: Recommended Convection Oven Reflow Profile
HOT AIR TOOL - Soldering method #2
Repeat steps (a) through (d) in method #1. The surface tension present between the solder and the emulator
foot in method #1 will not be present in method #2, due to the fact that only a small portion of the solder in this
method will be liquid at one time. It is necessary therefore, to align the foot over the land pattern with greater
accuracy.
Page 2 of 4
reflow instruction, Rev. C
Gull wing Surface mount Foot Soldering Instructions (continued)
(e) Reflow, with a hot air wand/gun, the solder over a few of the pads in opposite corners (diagonally) of the land
pattern (Figure 6).
(f) Check the foot alignment.
(g) Continue by reflowing the remaining solder paste. Add or remove solder as needed (see step (f) in method
1.).
SOLDERING IRON - Soldering method #3
This method has produced very good results but may be
more time consuming than the other two methods.
Caution must be used when touching the soldering iron
tip to the emulator foot. Excessive heat or pressure may
damage the pads on the side of the foot.
(a) Using a small diameter solder wire (approx. 0.015" or
smaller) and a very fine tipped soldering iron, add enough
solder to two opposite corner (diagonal) pads to cover
them.
(b) Align and place the emulator foot over the QFP land
pattern (see steps (c) and (d) in method 1).
(c) Holding the foot in place, by pressing down gently on
the gold terminal pins, place the iron tip on the two pads
to reflow the solder. This will tack and keep the foot in Figure 6: Reflow using hot air tool
alignment.
(d) Under a microscope or magnifying lens, if available, solder the remaining edge pads of the foot to the target
PCB land pattern using a liberal amount of solder (shorts
between adjacent pads can be removed later).
(e) Apply a generous amount of flux along the side of the
foot.
(f) Tilt the PCB and emulator foot at 30 - 45 degree
angle. Start at one corner and pull the tip of the iron
along the side of the foot to remove excess solder
deposits. Clean the tip of the iron often. Repeat this step
several times starting at a point on the foot ahead of the
excess solder. Continue along the side of the foot until
shorts are removed and a fillet is present between feet
and target PCB pads.
(g) Repeat steps (e) and (f) for the remaining three sides.
The finished solder connections are shown in Figure 7.
Figure 7: Finished Solder Fillets
Removing or Desoldering
Conventional methods can be used to remove a surface mount foot from your
target board, however we recommend the use of PRB Line® D’SOLDER™.;
This SMT device removal product avoids the use of excessive heat that can
compromise the integrity of our product and your target board. The specially
Page 3 of 4
reflow instruction, Rev. C
Gull wing Surface mount Foot Soldering Instructions (continued)
formulated alloy and flux make desoldering quick and easy. This solution can be a time and money saver for
many applications. (P/N TL-DS123)
3. filename: GSI.doc, Rev C” with footer autotext filename, Rev. C.Replaced pcb with PCB.
Page 4 of 4
reflow instruction, Rev. C
5). Appendix D – CQ256 Package Pin Assignment List
HiR e l S X -A F a m il y F P GA s
Pa c ka ge P i n A s si g nm e n t s (continued)
256- P in CQF P (T op Vie w)
256 255 254 253 252 251 250 249 248
200 199 198 197 196 195 194 193
Pin #1
Index
1
192
2
191
3
190
4
189
5
188
6
187
7
186
8
185
256-Pin
CQFP
56
137
57
136
58
135
59
134
60
133
61
132
62
131
63
130
64
129
65 66 67 68 69 70 71 72 73
34
121 122 123 124 125 126 127 128
Preliminary v1.0
HiR e l S X -A F a m ily F P GA s
256-Pin CQFP
Pin
Number
HiRel A54SX32A
Function
HiRel A54SX72A
Function
Pin
Number
HiRel A54SX32A
Function
HiRel A54SX72A
Function
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
GND
TDI, I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
TMS
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCI
GND
VCCA
GND
I/O
I/O
TRST, I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCA
I/O
I/O
I/O
I/O
I/O
I/O
GND
TDI, I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
TMS
I/O
I/O
I/O
I/O
I/O
VCCI
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCI
GND
VCCA
GND
I/O
I/O
TRST, I/O
I/O
VCCA
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCA
VCCI
I/O
I/O
I/O
I/O
I/O
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
101
102
103
104
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
PRB, I/O
GND
VCCI
GND
VCCA
I/O
HCLK
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCI
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
QCLKA
PRB, I/O
GND
VCCI
GND
VCCA
I/O
HCLK
I/O
QCLKB
I/O
I/O
I/O
I/O
I/O
I/O
Preliminary v1.0
35
HiR e l S X -A F a m il y F P GA s
256-Pin CQFP (Continued)
36
Pin
Number
HiRel A54SX32A
Function
HiRel A54SX72A
Function
Pin
Number
HiRel A54SX32A
Function
HiRel A54SX72A
Function
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
TDO, I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCA
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCI
I/O
I/O
I/O
I/O
I/O
TDO, I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCA
VCCI
GND
VCCA
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
I/O
GND
NC
GND
VCCI
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCA
GND
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
NC
GND
VCCI
VCCA
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCA
GND
GND
I/O
I/O
I/O
I/O
I/O
I/O
VCCI
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCI
I/O
I/O
I/O
I/O
I/O
I/O
Preliminary v1.0
HiR e l S X -A F a m ily F P GA s
256-Pin CQFP (Continued)
Pin
Number
HiRel A54SX32A
Function
HiRel A54SX72A
Function
Pin
Number
HiRel A54SX32A
Function
HiRel A54SX72A
Function
209
210
211
212
213
214
215
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
CLKA
CLKB
VCCI
GND
NC
GND
PRA, I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
QCLKD
CLKA
CLKB
VCCI
GND
NC
GND
PRA, I/O
I/O
I/O
VCCA
I/O
I/O
QCLKC
I/O
233
234
235
236
237
238
239
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
TCK, I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
GND
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VCCI
I/O
I/O
I/O
I/O
I/O
I/O
TCK, I/O
Preliminary v1.0
37
6). Appendix E – FG484 Package Pin Assignment List
S X -A F a m il y F P GA s
P a c ka ge P i n A s si g nm e n t s (Continued)
484- P in FBG A ( To p V iew )
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
74
v3.0
SX - A F a m ily F P GA s
484- P in FBG A
Pin
Number
A54SX32A
Function
A54SX72A
Function
Pin
Number
A54SX32A
Function
A54SX72A
Function
Pin
Number
A54SX32A
Function
A54SX72A
Function
A1
NC
NC
AB11
A2
NC
NC
AB12
I/O
I/O
AD5
I/O
I/O
PRB, I/O
PRB, I/O
AD6
I/O
I/O
A3
NC
I/O
AB13
VCCA
VCCA
AD7
I/O
I/O
A4
NC
I/O
AB14
I/O
I/O
AD8
I/O
I/O
A5
NC
I/O
AB15
I/O
I/O
AD9
VCCI
VCCI
A6
I/O
I/O
AB16
I/O
I/O
AD10
I/O
I/O
A7
I/O
I/O
AB17
I/O
I/O
AD11
I/O
I/O
A8
I/O
I/O
AB18
I/O
I/O
AD12
I/O
I/O
A9
I/O
I/O
AB19
I/O
I/O
AD13
VCCI
VCCI
A10
I/O
I/O
AB20
TDO, I/O
TDO, I/O
AD14
I/O
I/O
I/O
A11
NC
I/O
AB21
GND
GND
AD15
I/O
A12
NC
I/O
AB22
NC
I/O
AD16
I/O
I/O
A13
I/O
I/O
AB23
I/O
I/O
AD17
VCCI
VCCI
A14
NC
NC
AB24
I/O
I/O
AD18
I/O
I/O
A15
NC
I/O
AB25
NC
I/O
AD19
I/O
I/O
A16
NC
I/O
AB26
NC
I/O
AD20
I/O
I/O
A17
I/O
I/O
AC1
I/O
I/O
AD21
I/O
I/O
A18
I/O
I/O
AC2
I/O
I/O
AD22
I/O
I/O
A19
I/O
I/O
AC3
I/O
I/O
AD23
VCCI
VCCI
A20
I/O
I/O
AC4
NC
I/O
AD24
NC
I/O
A21
NC
I/O
AC5
VCCI
VCCI
AD25
NC
I/O
A22
NC
I/O
AC6
I/O
I/O
AD26
NC
I/O
A23
NC
I/O
AC7
VCCI
VCCI
AE1
NC
NC
A24
NC
I/O
AC8
I/O
I/O
AE2
I/O
I/O
A25
NC
NC
AC9
I/O
I/O
AE3
NC
I/O
A26
NC
NC
AC10
I/O
I/O
AE4
NC
I/O
AA1
NC
I/O
AC11
I/O
I/O
AE5
NC
I/O
AA2
NC
I/O
AC12
I/O
QCLKA
AE6
NC
I/O
AA3
VCCA
VCCA
AC13
I/O
I/O
AE7
I/O
I/O
AA4
I/O
I/O
AC14
I/O
I/O
AE8
I/O
I/O
AA5
I/O
I/O
AC15
I/O
I/O
AE9
I/O
I/O
AA22
I/O
I/O
AC16
I/O
I/O
AE10
I/O
I/O
AA23
I/O
I/O
AC17
I/O
I/O
AE11
NC
I/O
AA24
I/O
I/O
AC18
I/O
I/O
AE12
I/O
I/O
AA25
NC
I/O
AC19
I/O
I/O
AE13
I/O
I/O
AA26
NC
I/O
AC20
VCCI
VCCI
AE14
I/O
I/O
AB1
NC
NC
AC21
I/O
I/O
AE15
NC
I/O
AB2
VCCI
VCCI
AC22
I/O
I/O
AE16
NC
I/O
AB3
I/O
I/O
AC23
NC
I/O
AE17
I/O
I/O
AB4
I/O
I/O
AC24
I/O
I/O
AE18
I/O
I/O
AB5
NC
I/O
AC25
NC
I/O
AE19
I/O
I/O
AB6
I/O
I/O
AC26
NC
I/O
AE20
I/O
I/O
AB7
I/O
I/O
AD1
I/O
I/O
AE21
NC
I/O
AB8
I/O
I/O
AD2
I/O
I/O
AE22
NC
I/O
AB9
I/O
I/O
AD3
GND
GND
AE23
NC
I/O
AB10
I/O
I/O
AD4
I/O
I/O
AE24
NC
I/O
v3.0
75
S X -A F a m il y F P GA s
484- P in FBG A ( Cont i nued)
Pin
Number
A54SX32A
Function
A54SX72A
Function
Pin
Number
A54SX32A
Function
A54SX72A
Function
Pin
Number
A54SX32A
Function
A54SX72A
Function
AE25
NC
NC
B19
I/O
I/O
D13
I/O
I/O
AE26
NC
NC
B20
I/O
I/O
D14
I/O
I/O
AF1
NC
NC
B21
NC
I/O
D15
I/O
I/O
AF2
NC
NC
B22
NC
I/O
D16
I/O
I/O
AF3
NC
I/O
B23
NC
I/O
D17
I/O
I/O
AF4
NC
I/O
B24
NC
I/O
D18
I/O
I/O
AF5
NC
I/O
B25
I/O
I/O
D19
I/O
I/O
AF6
NC
I/O
B26
NC
NC
D20
I/O
I/O
AF7
I/O
I/O
C1
NC
I/O
D21
VCCI
VCCI
AF8
I/O
I/O
C2
NC
I/O
D22
GND
GND
76
AF9
I/O
I/O
C3
NC
I/O
D23
I/O
I/O
AF10
I/O
I/O
C4
NC
I/O
D24
I/O
I/O
AF11
NC
I/O
C5
I/O
I/O
D25
NC
I/O
AF12
NC
NC
C6
VCCI
VCCI
D26
NC
I/O
AF13
HCLK
HCLK
C7
I/O
I/O
E1
NC
I/O
AF14
I/O
QCLKB
C8
I/O
I/O
E2
NC
I/O
AF15
NC
I/O
C9
VCCI
VCCI
E3
I/O
I/O
AF16
NC
I/O
C10
I/O
I/O
E4
I/O
I/O
AF17
I/O
I/O
C11
I/O
I/O
E5
GND
GND
AF18
I/O
I/O
C12
I/O
I/O
E6
TDI, IO
TDI, IO
AF19
I/O
I/O
C13
PRA, I/O
PRA, I/O
E7
I/O
I/O
AF20
NC
I/O
C14
I/O
I/O
E8
I/O
I/O
AF21
NC
I/O
C15
I/O
QCLKD
E9
I/O
I/O
AF22
NC
I/O
C16
I/O
I/O
E10
I/O
I/O
AF23
NC
I/O
C17
I/O
I/O
E11
I/O
I/O
AF24
NC
I/O
C18
I/O
I/O
E12
I/O
I/O
AF25
NC
NC
C19
I/O
I/O
E13
VCCA
VCCA
AF26
NC
NC
C20
VCCI
VCCI
E14
CLKB
CLKB
B1
NC
NC
C21
I/O
I/O
E15
I/O
I/O
B2
NC
NC
C22
I/O
I/O
E16
I/O
I/O
B3
NC
I/O
C23
I/O
I/O
E17
I/O
I/O
B4
NC
I/O
C24
I/O
I/O
E18
I/O
I/O
B5
NC
I/O
C25
NC
I/O
E19
I/O
I/O
B6
I/O
I/O
C26
NC
I/O
E20
I/O
I/O
B7
I/O
I/O
D1
NC
I/O
E21
I/O
I/O
B8
I/O
I/O
D2
TMS
TMS
E22
I/O
I/O
B9
I/O
I/O
D3
I/O
I/O
E23
I/O
I/O
B10
I/O
I/O
D4
VCCI
VCCI
E24
I/O
I/O
B11
NC
I/O
D5
NC
I/O
E25
VCCI
VCCI
B12
NC
I/O
D6
TCK, I/O
TCK, I/O
E26
GND
GND
B13
VCCI
VCCI
D7
I/O
I/O
F1
VCCI
VCCI
B14
CLKA
CLKA
D8
I/O
I/O
F2
NC
I/O
B15
NC
I/O
D9
I/O
I/O
F3
NC
I/O
B16
NC
I/O
D10
I/O
I/O
F4
I/O
I/O
B17
I/O
I/O
D11
I/O
I/O
F5
I/O
I/O
B18
VCCI
VCCI
D12
I/O
QCLKC
F22
I/O
I/O
v3.0
SX - A F a m ily F P GA s
484- P in FBG A ( Cont i nued)
Pin
Number
A54SX32A
Function
A54SX72A
Function
Pin
Number
A54SX32A
Function
A54SX72A
Function
Pin
Number
A54SX32A
Function
A54SX72A
Function
F23
I/O
I/O
K17
GND
GND
N5
I/O
I/O
F24
I/O
I/O
K22
I/O
I/O
N10
GND
GND
F25
I/O
I/O
K23
I/O
I/O
N11
GND
GND
F26
NC
I/O
K24
NC
NC
N12
GND
GND
G1
NC
I/O
K25
NC
I/O
N13
GND
GND
G2
NC
I/O
K26
NC
I/O
N14
GND
GND
G3
NC
I/O
L1
NC
I/O
N15
GND
GND
G4
I/O
I/O
L2
NC
I/O
N16
GND
GND
G5
I/O
I/O
L3
I/O
I/O
N17
GND
GND
G22
I/O
I/O
L4
I/O
I/O
N22
VCCA
VCCA
I/O
G23
VCCA
VCCA
L5
I/O
I/O
N23
I/O
G24
I/O
I/O
L10
GND
GND
N24
I/O
I/O
G25
NC
I/O
L11
GND
GND
N25
I/O
I/O
G26
NC
I/O
L12
GND
GND
N26
NC
NC
H1
NC
I/O
L13
GND
GND
P1
NC
I/O
H2
NC
I/O
L14
GND
GND
P2
NC
I/O
H3
I/O
I/O
L15
GND
GND
P3
I/O
I/O
H4
I/O
I/O
L16
GND
GND
P4
I/O
I/O
H5
I/O
I/O
L17
GND
GND
P5
VCCA
VCCA
H22
I/O
I/O
L22
I/O
I/O
P10
GND
GND
H23
I/O
I/O
L23
I/O
I/O
P11
GND
GND
H24
I/O
I/O
L24
I/O
I/O
P12
GND
GND
H25
NC
I/O
L25
I/O
I/O
P13
GND
GND
H26
NC
I/O
L26
I/O
I/O
P14
GND
GND
J1
NC
I/O
M1
NC
NC
P15
GND
GND
J2
NC
I/O
M2
I/O
I/O
P16
GND
GND
J3
I/O
I/O
M3
I/O
I/O
P17
GND
GND
J4
I/O
I/O
M4
I/O
I/O
P22
I/O
I/O
J5
I/O
I/O
M5
I/O
I/O
P23
I/O
I/O
J22
I/O
I/O
M10
GND
GND
P24
VCCI
VCCI
J23
I/O
I/O
M11
GND
GND
P25
I/O
I/O
J24
I/O
I/O
M12
GND
GND
P26
I/O
I/O
J25
VCCI
VCCI
M13
GND
GND
R1
NC
I/O
J26
NC
I/O
M14
GND
GND
R2
NC
I/O
K1
I/O
I/O
M15
GND
GND
R3
I/O
I/O
K2
VCCI
VCCI
M16
GND
GND
R4
I/O
I/O
K3
I/O
I/O
M17
GND
GND
R5
TRST, I/O
TRST, I/O
K4
I/O
I/O
M22
I/O
I/O
R10
GND
GND
K5
VCCA
VCCA
M23
I/O
I/O
R11
GND
GND
K10
GND
GND
M24
I/O
I/O
R12
GND
GND
K11
GND
GND
M25
NC
I/O
R13
GND
GND
K12
GND
GND
M26
NC
I/O
R14
GND
GND
K13
GND
GND
N1
I/O
I/O
R15
GND
GND
K14
GND
GND
N2
VCCI
VCCI
R16
GND
GND
K15
GND
GND
N3
I/O
I/O
R17
GND
GND
K16
GND
GND
N4
I/O
I/O
R22
I/O
I/O
v3.0
77
S X -A F a m il y F P GA s
484- P in FBG A ( Cont i nued)
Pin
Number
A54SX32A
Function
A54SX72A
Function
Pin
Number
A54SX32A
Function
A54SX72A
Function
Pin
Number
A54SX32A
Function
A54SX72A
Function
R23
I/O
I/O
U3
I/O
I/O
V25
NC
I/O
R24
I/O
I/O
U4
I/O
I/O
V26
NC
I/O
78
R25
NC
I/O
U5
I/O
I/O
W1
I/O
I/O
R26
NC
I/O
U10
GND
GND
W2
I/O
I/O
T1
NC
I/O
U11
GND
GND
W3
I/O
I/O
T2
NC
I/O
U12
GND
GND
W4
I/O
I/O
T3
I/O
I/O
U13
GND
GND
W5
I/O
I/O
T4
I/O
I/O
U14
GND
GND
W22
I/O
I/O
T5
I/O
I/O
U15
GND
GND
W23
VCCA
VCCA
T10
GND
GND
U16
GND
GND
W24
I/O
I/O
T11
GND
GND
U17
GND
GND
W25
NC
I/O
T12
GND
GND
U22
I/O
I/O
W26
NC
I/O
T13
GND
GND
U23
I/O
I/O
Y1
NC
I/O
T14
GND
GND
U24
I/O
I/O
Y2
NC
I/O
T15
GND
GND
U25
VCCI
VCCI
Y3
I/O
I/O
T16
GND
GND
U26
I/O
I/O
Y4
I/O
I/O
T17
GND
GND
V1
NC
I/O
Y5
NC
I/O
T22
I/O
I/O
V2
NC
I/O
Y22
I/O
I/O
T23
I/O
I/O
V3
I/O
I/O
Y23
I/O
I/O
T24
I/O
I/O
V4
I/O
I/O
Y24
VCCI
VCCI
T25
NC
I/O
V5
I/O
I/O
Y25
I/O
I/O
T26
NC
I/O
V22
VCCA
VCCA
Y26
I/O
I/O
U1
I/O
I/O
V23
I/O
I/O
U2
VCCI
VCCI
V24
I/O
I/O
v3.0