Top View GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB (needs epoxy) . High speed, reliable Elastomer connection Minimum real estate required 12.125mm Compression plate distributes forces evenly Easily removable socket lid A A Side View (Section AA) 1 Socket Li d: Bla ck a nodized Alu mi num. Thickn ess = 2.5mm. 2 Socket ba se : Black a nodized Alumin um. Thickn ess = 5mm. 3 Compression Plate: B lack ano dize d A luminum. Thickn ess = 2.5mm. 4 Compression screw: Clear an odized Aluminu m. Thickn ess = 5mm, Hex socke t = 5mm. 5 Ela stomer: 2 0 micron dia go ld plated brass filaments ar ranged symmetrically in a silicone rub ber (63.5 degre e a ngle). Thickn ess = 0.5mm. 6 Socket lid screw: Socket hea d cap , Alloy steel with bla ck o xid e finish, 0-80 fine th read , 4.76mm long. 12.125mm Recommended torque 1 in lb. 1 4 3 Assembled 8.0mm + IC thickness 6 2 Epoxy Customer's BGA IC Note: Alignment guide for positioning socket base to target PCB will be supplied. 5 7.68mm Customer's Target PCB SG-BGA-7141 Drawing Status: Released © 2008 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: E Smolentseva Date: 08/06/08 File: S G-BGA -7141 Dwg Modified: 07/31/14 Scale: - Rev: B All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 OF 4 Recommended PCB Layout Top View 6mm 1.09mm 0.84mm 0.59mm A1 0.84mm 8.21mm 7.68mm 6mm 0.5mm Ø 0.3mm (x169) pad Socket Base Outline 7.68mm 8.21mm Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. SG-BGA-7141 Drawing Status: Released © 2008 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: E Smolentseva Date: 08/06/08 File: S G-BGA -7141 Dwg Modified: 07/31/14 Scale: - Rev: B PAGE 2 OF 4 X D Y DETAIL A1 A1 e E 3 Ø0.15 Z X Y Ø0.05 0.08 Top View DETAIL 5 A Z 4 Bottom View Side View 0.08 Z DIM MIN MAX 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. A1 0.18 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. b 0.25 D 7.00 BSC 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. E 7.00 BSC Parallelism measurement shall exclude any effect of mark on top surface of package. e 0.5 BSC 5 0.10 Z A1 Øb 1.00 A 0.35 13x13 array SG-BGA-7141 Drawing Status: Released © 2008 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: E Smolentseva Date: 08/06/08 File: S G-BGA -7141 Dwg Modified: 07/31/14 Scale: - Rev: B PAGE 3 OF 4 Socket base orientation mark Elastomer Orientation mark When elastomer orientation mark is on upper left corner, side view of elastomer should be Top View Alignment Plate Compression Screw Socket Lid Screw User Instuctions: Socket Lid Compression Plate BGA package Elastomer Alignment Plate Dowel Pin Socket Base Epoxy Area Target Board 1. Insert alignment plate onto dowel pins in socket base. Place alignment plate + socket base assembly onto target board. 2. Align holes on alignment plate with four corner pads on target board, hold socket base on to board tightly with finger and put a drop of super glue on each corner. Let it dry, remove the alignment plate, then run a bead of epoxy around socket base and let it cure for 24 hours at room temperature. Recommended epoxy: DP420 (3M brand, 15 min work life). Other equivalent epoxies can be substituted. Cure at room temperature. Note: Do not oven cure. 3. Place elastomer inside the socket base cavity (direction and orientation are critical) as shown above. 4. Place BGA package and compression plate into the socket base cavity. 5. Assemble socket lid onto socket base with socket lid screws. 6. Assemble compression screw into socket lid and apply 8-16 in-oz torque. SG-BGA-7141 Drawing Status: Released © 2008 IRONWOOD ELECTRONICS, INC. 11351 Rupp Dr. Ste 400 Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: E Smolentseva Date: 08/06/08 File: S G-BGA -7141 Dwg Modified: 07/31/14 Scale: - Rev: B PAGE 4 OF 4