www.ironwoodelectronics.com Socket Technologies Toll Free: (800) 404-0204 U.S. Only Tel: (952) 229-8200 Fax: (952) 229-8201 email: [email protected] Introduction www.ironwoodelectronics.com Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2008 Registration Socket Technology Overview – – – – – Embedded gold plated wire elastomer (SG) Stamped & Etched spring pins (SBT) Embedded silver ball elastomer matrix (SM/SMP) Compressible silver button in polyimide (GT) Surface mount adapters for sockets (SF) IP, 7/29/2015 Development Proven Capability 18 Years Continuous improvement Embedded gold plated wire 30.5 GHz elastomer socket (SG) www.ironwoodelectronics.com Heat sink lid Protruded wire from elastomer BGA compressed on Elastomer Wire marks on BGA Features Benefits Short contact High bandwidth applications Gold plated Brass wire Low contact resistance Small socket footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs High resilient elastomer Compression cycles in thousands Optimized contact force Reliable connection without damage to device or board Torque indicator Xilinx FPGA socket Capabilities • 0.3mm to 1.27mm pitch • 1x1mm to 55x55mm device • BGA, QFN, QFP, SOIC • 4000 pin count • Heat sink options • Easy chip replacement • Custom support plate options IP, 7/29/2015 Open top lid No mounting hole socket Custom insulation plate Development Proven Capability www.ironwoodelectronics.com Open top socket BGA low force pin LGA high force pin 7 Years Continuous improvement Stamped & Etched spring pin 31.7 GHz socket (SBT) BGA socket w/ Snap Lid Features Benefits Long contact travel Compliancy for large package warpage Gold plated BeCu material High temperature applications Small socket footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs High resilient spring Compression cycles in hundreds of thousands Optimized pin diameter to length ratio Impedance matched high speed applications Stamped contact High current applications Automated assembly Low cost, short lead time Capabilities • 0.4mm to 1.27mm pitch • 1x1mm to 60x60mm device • BGA, LGA, QFN, QFP, SOIC • 5000 pin count • Heat sink options • Easy chip replacement • Custom support plate options IP, 7/29/2015 Floating plate for precise alignment and swivel lid Super short Etched spring pin Cone /ball Plunger Clamshell BGA socket Embedded silver ball 40 GHz elastomer socket (SM/SMP) www.ironwoodelectronics.com Development SM Actuate d Array of Columns - Elastomer Matrix 5 Years Proven Capability Continuous improvement SMP Cross section - Silver balls SMP = Elastomer layer + Protective layer Features Benefits Shortest contact Highest bandwidth applications Silver balls Low contact resistance Small socket footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs High resilient elastomer Compression cycles in hundreds of thousands Matrix with core Optimized force and built-in compression stop mechanism Capabilities • 0.25mm to 1.27mm pitch • 1x1mm to 60x60mm device • BGA, LGA, QFN • 3000 pin count • Heat sink options • Easy chip replacement • Custom support plate options IP, 7/29/2015 Replaceable elastomer module Relaxed Actuated Rest & Test condition ATE socket with double latch clam shell lid Continuous improvement Compressible silver button 75 GHz elastomer socket (GT) TEST REST Array of Silver Buttons - Elastomer Matrix 2 Years Proven Capability Development www.ironwoodelectronics.com BGA Rest & Test condition Features Benefits Shortest contact Highest bandwidth applications Silver particles Low contact resistance Small socket footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs Individual buttons No mechanical coupling Laser cut substrate Precise contact location Capabilities • 0.3mm to 1.27mm pitch • 1x1mm to 50x50mm device • BGA, LGA, QFN • 3000 pin count • Heat sink options • Easy chip replacement • Custom support plate options IP, 7/29/2015 Socket with heat sink Relaxed Actuated QFN Rest & Test condition BGA socket with Swivel lid Contact Technology Summary Characteristics Bandwidth, GHz Embedded Wire Elastomer (SG) Stamped spring pins (SBT) www.ironwoodelectronics.com Embedded Silver Ball Elastomer Matrix (SM/SMP) Silver Button Elastomer (GT) 27 to >40 7 to 31.7 >40 75 Endurance, Cycles 2K 500K 5K/500K 1K Resistance, mΩ 20 15 15 20 0.11 to 0.28 0.88 to 0.98 0.21 0.04 2 8 4 5 Temp Range, ⁰C -35 to +100 -55 to +180 -55 to +155 -55 to +160 Pitch, mm 0.3 to 1.27 0.4 to 1.27 0.25 to 1.27 0.3 to 1.27 BGA, QFN, QFP, SOIC BGA, LGA, QFN, QFP, SOIC BGA, LGA, QFN BGA, LGA, QFN √ √ √ √ √ √ Self Inductance, nH Max Current, Amp Package Types Lab test Production test Field upgrade √ √ Temperature test √ √ √ √ Kelvin test √ √ √ √ Burn-in test IP, 7/29/2015 √ Pin Datasheet IP, 7/29/2015 www.ironwoodelectronics.com Socket Lid Options IP, 7/29/2015 www.ironwoodelectronics.com Development Proven Capability 18 Years Continuous improvement Surface Mount Adapters for sockets (SF) Surface mount adapter Socket + SM adapter QFN SM adapter QFP SM adapter Features Benefits Pluggable interface Easy insertion and extraction for device swap FR4 & Gold plated contacts High temperature applications Small adapter footprint Easy to place inductors, capacitors, resistors, etc for tuning and increasing bandwidth. Ideal for IC prototype and system testing and field upgradeable system designs Conductive filled via Excellent thermal dissipation and high current applications Optimized plated thru hole with filled via Low inductance and high speed applications Edge castellation (QFN) Easy manual assembly Standard Solder (BGA) Easy assembly (industry standard reflow profile) Capabilities • 0.5mm to 1.27mm pitch • 2x3mm to 50x50mm device • BGA, LGA, QFN, QFP, SOIC • 2000 pin count • Lead free options • Easy pluggable module • Custom height extension IP, 7/29/2015 Pluggable adapter pair with soldered device www.ironwoodelectronics.com Thru hole adapter Spring pin socket + Thru hole adapter + Surface mount adapter Thru hole adapter + Surface mount adapter 0.5mm pitch Pluggable adapter pair Custom Capability Custom socket designs in 2 days Match customer’s PCB footprint Custom socket manufacturing in 10 days Multiple contactor technologies Heat sink simulation and design Contactor signal integrity simulation In-house automated optical inspection In-house machining Quick-turn production IP, 7/29/2015 www.ironwoodelectronics.com