www.ironwoodelectronics.com SG 9000 Series High Performance IC Sockets And Test Adaptors IP, Jan2015 Application Need & Solution www.ironwoodelectronics.com •Low cost for small quantity •High bandwidth GHz BGA socket technology provide up to 30.5 GHz bandwidth in a small, cost effective ZIF socket for •Low inductance •Low contact resistance prototype and test applications. The GHz BGA socket is a simple mechanical socket based on elastomer contact •Low cycle count technology. Protruded wire from elastomer BGA compressed on Elastomer Wire marks on BGA The elastomer consists of a fine pitch wire matrix which are embedded at a 63-degree angle in a soft insulating sheet of silicone rubber. The insulation resistance between connections with 500V DC is 1000 MΩ. The elastomer is ideal for high-current (50mA per filament) applications where a thin, high-density anisotropic connector is required. The gold-plated brass filaments protrude several microns from the top and bottom surfaces of the silicone sheet to penetrate heavily oxidized solder ball. The operating temperature range for the elastomer is -35° to 100° C. IP, Jan2015 Elastomer Classification www.ironwoodelectronics.com SG-6000 series L Ps, Pi = 0.1mm L, W = 1mm to 50mm t = 0.75mm BGA, QFN, etc, >=0.75mm pitch Ps:0.10±0.05 Pi:0.10±0.03 SG-7000 series W Ps, Pi = 0.05mm L, W = 1mm to 50mm t = 0.5mm BGA, QFN, etc, >=0.3mm pitch Insulation Silicone Rubber InsulationSilicone Rubber Gold-plated brass wire(φ40μm) Inclined plated brasstowire Inclined in theGold direction paralel the dimension L SG-8000 series Ps, Pi = 0.1mm L, W = 1mm to 50mm t = 0.5mm BGA, QFN, etc, >=0.75mm pitch SG-9000 series Offset Ps, Pi = 0.075mm L, W = 1mm to 50mm t = 0.5mm ＋0.05 ＋0.05 ＋0.05 BGA, ＋0.05 t:0.25 ,0.5 ,1.0 ,2.0 QFN, etc, >=0.4mm pitch 0 IP, Jan2015 0 0 0 Socket Lid Options IP, Jan2015 www.ironwoodelectronics.com SG 9000 Test Data www.ironwoodelectronics.com BGA1224, 31x24mm, 0.65mm pitch interstitial ball array 1. Socket assembled to daisy chain test PCB. 2. Daisy chain device simulator placed inside the socket. 3. Recommended torque applied. 4. Contact resistance measured using multi-meter. 5. Un-tighten the compression screw. 6. Step 3-5 repeated. 50.000 Resistance Per ball (mohms) 45.000 40.000 35.000 30.000 25.000 20.000 15.000 10.000 5.000 0.000 0 5 10 15 20 25 Cycle Count IP, Jan2015 30 35 40 45 50 SG 9000 Test Data www.ironwoodelectronics.com BGA529, 10x10mm, 0.4mm pitch 23x23 ball array 1. Socket assembled to daisy chain test PCB. 2. Daisy chain device simulator placed inside the socket. 3. Recommended torque applied. 4. Contact resistance measured using multi-meter. 5. Un-tighten the compression screw. 6. Step 3-5 repeated. 90.00 Resistance per ball (mohms) 80.00 Test chip Solder balls reflowed 70.00 60.00 50.00 40.00 30.00 20.00 10.00 0.00 1 IP, Jan2015 6 11 16 21 Cycle Count 26 31 36 41 SG 9000 Test Data www.ironwoodelectronics.com BGA324, 10x10mm, 0.5mm pitch 18x18 ball array 1. Socket assembled to daisy chain test PCB. 2. Daisy chain device simulator placed inside the socket. 3. Recommended torque applied. 4. Contact resistance measured using multi-meter. 5. Un-tighten the compression screw. 6. Step 3-5 repeated. 70.00 Test chip Solder balls reflowed Resistance per ball ( milli ohms) 60.00 50.00 40.00 30.00 20.00 10.00 0.00 1 IP, Jan2015 6 11 16 21 26 31 Cycle count 36 41 46 51