- Ironwood Electronics

www.ironwoodelectronics.com
Products, Services &
Capabilities
Toll Free: (800) 404-0204 U.S. Only
Tel: (952) 229-8200
Fax: (952) 229-8201
email: [email protected]
Overview
Company Overview
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Founded 1986
Over 5,000 products
High Performance Adapters and Sockets
Many Custom Designs & Turn-Key Solutions
Engineering – Electrical and Mechanical
ISO9001:2008 Registration
World wide distribution
Customers – Engineering and OEM
40 Employees
Capabilities Overview
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Simulation
QFIN for heat sink design
Microwave Studio for electrical
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3D Solid Modeling CAD & CAM
ProEngineer, Solid Works
Gibbs cam
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www.ironwoodelectronics.com
Product Overview
GHz Elastomer Sockets
Stamped Pin Sockets
Silver Matrix Sockets
Thermal Control System
Giga-snaP BGA Socket
Adapters
SMT Package Emulation
Package Convertors
Prototype, Probing &
Analysis Adapters
Electronic Modules
PCB Technology
PADS Layout, PADS Router
Controlled Impedance, Embedded Resistors, Laser Micro Vias, Filled Via in Pad, 3/3 traces, Rigid-flex
PCBs
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State of the art CNC machines - Tight Tolerance 3D Machining (e.g. ±0.0127mm), Swiss screw
machine, Print, Pick, Place & Reflow assembly line, High speed PCB drilling, Automated Optical
Inspection
IP, 7/29/2015
Development
Proven Capability
18 Years
Continuous improvement
Engineering Sockets
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Heat sink lid
BGA compressed on Elastomer
Double latch lid
Surface mount adapter
Clamshell lid
IP, 7/29/2015
Silver particle
Elastomer
Capabilities
• 0.3mm to 1.27mm pitch
• 1x1mm to 60x60mm device
• BGA, LGA, QFN, QFP,
SOIC, WLP
• 4000 pin count
• 75GHz
•Heat sink options
• Easy chip replacement
• Custom support plate
options
•Custom mounting options
•Industry’s smallest footprint
Gold RF socket
Swivel lid socket with decaps
accommodated back plate
Torque indicator
Back-to-back socket
PoP socket with two elastomers
Open top lid
No mounting hole socket
Custom insulation plate
11 Years
Stamped LGA pogo pin
Short 3piece
Pogo pin
Stamped BGA pogo pin
Capabilities
• 0.2mm to 1.27mm pitch
• 1x1mm to 60x60mm device
• BGA, LGA, QFN, QFP,
SOIC, WLP
• 4000 pin count
• 45 GHz, 500K cycles
• Consistent contact
resistance throughout life
• Low cleaning frequency
• High current & extreme
temperature
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Self cleaning Pogo pin crown
Ceramic QFP socket
with center E-pad
SMP
SM
Offset plunger Kelvin pogo pin
Development
Proven Capability
Continuous improvement
Production & Burn-in Sockets
SOIC production socket
IP, 7/29/2015
BGA production socket
with heat sink lid
Multi Level SBT socket
Flat lead Ceramic
QFP production socket
Contact Technology Summary
Characteristics
Bandwidth, GHz
Embedded Wire
Elastomer (SG)
Stamped spring pins
(SBT)
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Embedded Silver Ball
Elastomer Matrix
(SM/SMP)
Silver Button
Elastomer (GT)
27 to >40
7 to 31.7
>40
75
Endurance, Cycles
2K
500K
5K/500K
1K
Resistance, mΩ
20
15
15
20
0.11 to 0.28
0.88 to 0.98
0.21
0.04
2
8
4
5
Temp Range, ⁰C
-35 to +100
-55 to +180
-55 to +155
-55 to +160
Pitch, mm
0.3 to 1.27
0.4 to 1.27
0.25 to 1.27
0.3 to 1.27
BGA, QFN, QFP,
SOIC
BGA, LGA, QFN, QFP,
SOIC
BGA, LGA, QFN
BGA, LGA, QFN
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Self Inductance, nH
Max Current, Amp
Package Types
Lab test
Production test
Field upgrade
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Temperature test
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Kelvin test
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Burn-in test
IP, 7/29/2015
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Pin Datasheet
IP, 7/29/2015
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25 Years
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SOIC, PLCC adapter
Power PC BGA device interfaced
to Logic analyzer and mother
board for functional analysis
0.5mm pitch 21x21 array 289 position BGA
solder balls to AMP 104068 connectors
using rigid flex PCB with socket fixture
J-leaded PLCC
Emulator foot
Gull-wing QFP
Emulator foot
Capabilities
• 0.4mm to 1.27mm pitch
• 2x2mm to 50x50mm device
• BGA, LGA, QFN, SOIC,
PLCC, QFP, DIP, PGA, etc
• 2000 pin count
• RoHS compatible
• Agilent, Tektronix compatible
• Rigid & flex options
60 pin, 0.8mm pitch BGA
rigid-flex probing adapter
with AMP mictor and
BGA surface mount foot
BGA proto adapter with
Clamshell pogo pin socket
Development
Proven Capability
Continuous improvement
Engineering Adapters
Leadless QFN emulator
IP, 7/29/2015
Allows QFN device to be socketed to mother
board with signals brought out to test pins
Flex emulator – 125 position
AMP Z pack connector to
80 position female interface
25 Years
Daughter card module
Interfaced to QFP footprint
SoC module with high
density connector
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QFP device mounted to PLCC Footprint
on target board with shortest trace length
0.5mm pitch BGA
Pluggable adapter system
BGA to BGA conversion with
complex signal swap due to
device enhancement without
additional real estate
Capabilities
• 0.4mm to 2.54mm pitch
• 2x2mm to 50x50mm device
• BGA, LGA, QFN, SOIC,
PLCC, QFP, DIP, PGA, etc
• 3 mil trace/space
• Laser micro vias
• Embedded caps & resistors
• Lead free options
• Tray, Tape & Reel options
• Turnkey solutions
Development
Proven Capability
Continuous improvement
Production Adapters
2000 pin count BGA adapter
system plugged together
IP, 7/29/2015
SOIC to DIP convertor
using blind hole technology
PLCC plug connects
Daughter card to socket
SOIC device mounted
to PLCC footprint
using solder column
technology for high
volume production
SOIC pitch convertor
Thermal Control System
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FlexTC, -55°C to +155°C, Temperature accuracy of ±0.2°C
MaxTC, -60°C to +300°C, Temperature accuracy of ±0.2°C
FlexTC device plunger, 21W @-40C
MaxTC device plunger, 52W @-40C
Adaptor plate – specific to socket
Universal adaptor plate – mounting hole in PCB
Condensation control – dry air purge
Accommodate device in socket as well as soldered device
Portable, fluid free operation, Ultra-quiet operation
Maintenance-free system
Self contained system - No external chiller and no compressed air required
IP, 7/29/2015
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Facility Overview
24000 Sq. Ft Building
Machining area
IP, 7/29/2015
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Production area
ESD Automated Assembly area
Typical Custom Product
Process Flow
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0 day
Customer Sends
Drawings, Specs
1 day
Concept Designed
With Customer
Documentation
generated
2 days
1 day
Quotes &
Drawings rev A
Components
manufactured
10 days
1 day
Customer
Approves / Orders
Part Assembled
and Tested
3 days
3 days
Engineer designed
product
Part Inspected
and Shipped
1 day
IP, 7/29/2015
Design Approved
by Customer
1 day
Custom Capabilities
Custom designs in 2 days
Match customer’s PCB footprint
Custom manufacturing in 10 days
Multiple contactor technologies
Heat sink simulation and design
Contactor signal integrity simulation
In-house automated optical inspection
In-house machining
Quick turn production
IP, 7/29/2015
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Global Presence
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Headquarter
Distributor
IP, 7/29/2015