SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS FEATURES: Wide temperature range (-55C to +180C ) High current capability (up to 4A ) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable production yield Highly compliant to accommodate wide co-planarity variations Automated probe manufacturing enables low cost and short lead time 33.60 RECOMMENDED TORQUE: 84.8 N-cm [7.5 lbf-in] (When using DROP IN POGO PIN NEST) 42.00 TOP VIEW RECOMMENDED TORQUE: 42.9 N-cm [3.8 lbf-in] (WITHOUT DROP IN POGO PIN NEST) 42.00 35.10 1.59 Target PCB thickness 9.524 FRONT VIEW SIDE VIEW Description: SBT POP Socket Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 STATUS: Released SHEET: 1 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 1:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015 SOCKET BASE OUTLINE 10.8625 PIN A1 ORIENTATION 1.700±0.100 (x4) NON-PLATED MOUNTING HOLE 4.6875 0.850±0.025 (x2) NON-PLATED ALIGNMENT HOLE 10.8625 8.3225 38.00 21.725 15.60 5.7825 0.65 typ. 0.30 (x500) ref. only 12.350 21.725 24.225 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: same or higher than solder mask 26.725 Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 STATUS: Released SHEET: 2 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 4:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015 Ironwood Package Code: BGA500C (POP CHIP BOTTOM) 14.00 PIN A1 MARKING 0.27 0.17 12.00 0.65 12.00 17.00 2.10 PACKAGE OFFSET 0.38 0.28 (x500) 2.00 MAX TOP VIEW 0.65 SIDE VIEW BOTTOM VIEW 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 STATUS: Released SHEET: 3 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 4:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015 Ironwood Package Code: BGA216D (POP CHIP TOP) PIN A1 MARKING 12.00±0.10 11.20 12.00±0.10 0.40 0.40 0.13 MIN TOP VIEW 11.20 0.9±0.1 SIDE VIEW BOTTOM VIEW 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Description: Compatible BGA-POP Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 STATUS: Released SHEET: 4 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 4:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015 4 9 8 7 6 1 5 2 3 17 25 32 15 30 14 16 11 12 13 10 18 27 26 11 20 31 19 16 29 22 21 23 28 24 PIN 16:1 Description: Socket BOM_w_pogonest_BGA216 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 ITEM NO. DESCRIPTION Material 1 2 3 Socket lid Dbl latch Compression plate 19mm split rolled spring pin M1 x 4mm long 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy Plain Carbon Steel 4 compression screw M18x1.5 fluted knob 7075-T6 Aluminum Alloy 5 Latch 7075-T6 Aluminum Alloy 6 Hinge Pin and Snap Ring, 3mm OD, 30mm long, 1045 Stl, Blk Oxide AISI 1045 Steel, cold drawn 7 Precision Compression Spring, Zinc-Plated Music Wire, 1/2" Length, .12" OD, .016" Wire Zinc Plated Music Wire 8 9 10 11 12 13 14 Spring Clamshell lid assembly Screw, M3 x 12mm, Low Head Cap, SS Screw, #0-80 x 1/8", Flat Undercut, SS Floating Guide Spring Middle Guide BGA216 12mm PoP Bottom Guide BGA216 12mm PoP Floating Guide BGA216 12mm PoP 15 IC guide 12mm PoP chip 16 17 18 19 20 21 22 23 24 25 26 Stamped Pin, 0.4mm SBT-BGA Compression plate for PoP chip Socket Base Floating Guide Middle Guide Bottom Guide Customer's target PCB Insulation plate Backing Plate 19mm BGA216_12x12mm_0.4mm pitch BGA500 14x17mm 0.65mm pitch Steel Music Wire 18-8 Stainless Steel Stainless Steel (303) Alloy Steel (SS) Semitron MDS 100 Semitron MDS 100 Semitron MDS 100 TECAPEEK CMF Ceramic filled N/A 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy Semitron MDS 100 Semitron MDS 100 Semitron MDS 100 High Temp FR4 Ultem 7075-T6, Plate (SS) Material <not specified> Material <not specified> 27 Dowel Pin, 1/32" dia, 7/16" Long, 18-8 SS Chrome Stainless Steel 28 #0-80 X .75 LG, SOC HD CAP SCREW, 18-8 SS Screw, #0-80 X .375", Flat, SS Dowel Pin, 1/32" x 3/8", SS IC Guide 14x17mm Low Profile Button Head T-5 Torx #0-80 machine screw Stainless Steel (18-8) 29 30 31 32 STATUS: Released Material <not specified> Chrome Stainless Steel 7075-T6 Aluminum Alloy Stainless Steel (18-8) SHEET: 5 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 1:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015 ITEM NO. Description Material 1 Socket lid Dbl latch 7075-T6 Aluminum Alloy 2 Compression plate 19mm 7075-T6 Aluminum Alloy 8 3 split rolled spring pin M1 x 4mm long Plain Carbon Steel 4 compression screw M18x1.5 fluted knob 7075-T6 Aluminum Alloy 6 5 Latch 7075-T6 Aluminum Alloy 6 Hinge Pin and Snap Ring, 3mm OD, 30mm long, 1045 Stl, Blk Oxide AISI 1045 Steel, cold drawn 7 Precision Compression Spring, Zinc-Plated Music Wire, 1/2" Length, .12" OD, .016" Zinc Plated Music Wire Wire 4 9 7 1 5 2 3 25 24 19 20 12 21 26 13 14 10 15 11 16 17 23 18 22 Description: Socket BOM_wo_pogonest_POPchp 8 Spring Clamshell lid assembly Steel Music Wire 9 Screw, M3 x 12mm, Low Head Cap, SS 18-8 Stainless Steel 10 Floating Guide Spring Alloy Steel (SS) 11 Stamped Pin, 0.4mm SBT-BGA N/A 12 Socket Base 7075-T6 Aluminum Alloy 13 Floating Guide Semitron MDS 100 14 15 16 Middle Guide Bottom Guide Customer's target PCB Semitron MDS 100 Semitron MDS 100 High Temp FR4 17 Insulation plate Ultem 18 Backing Plate 19mm 7075-T6, Plate (SS) 19 BGA216_12x12mm_0.4mm pitch Material <not specified> 20 BGA500 14x17mm 0.65mm pitch Material <not specified> 21 Dowel Pin, 1/32" dia, 7/16" Long, 18-8 SS Chrome Stainless Steel 22 Stainless Steel (18-8) 23 #0-80 X .75 LG, SOC HD CAP SCREW, 18-8 SS Screw, #0-80 X .375", Flat, SS Material <not specified> 24 compression plate, drop in 7075-T6 Aluminum Alloy 25 IC Spacer Ultem 1000 26 IC Guide 14x17mm 7075-T6 Aluminum Alloy PIN 16:1 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 STATUS: Released SHEET: 6 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 1:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015 CLAMSHELL SOCKET LID ASSEMBLY USER INSTRUCTIONS FOR DROP IN POGO PIN NEST ASSEMBLY: 1. Place BGA500 package into socket base assembly. NOTE PIN A1 orienation. 2. Place POP CHIP POGO PIN NEST into socket base assembly. Alignment pins should line up with alignment holes. 3. Place BGA216 POP chip into POP CHIP POGO PIN NEST cavity. NOTE PIN A1 orientaion. 4. Place compression plate for POP CHIP into POP CHIP. 5. Place clamshell socket lid assembly over socket base and secure it with dual latch. 6. Apply torque. Recommended torque: 7.5 in-lbs. 7. Test. COMPRESSION PLATE FOR POP CHIP POP CHIP COMPRESSION PLATE ORIENTATION MARK. BGA216 POP CHIP ALIGNMENT PIN POP CHIP POGO PIN NEST PIN A1 ORIENTATION MARK BGA500 PACKAGE SOCKET BASE ASSEMBLY Description: Socket assy_w_pogonest_BGA216 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 STATUS: Released SHEET: 7 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 1.75:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015 CLAMSHELL SOCKET LID ASSEMBLY POP CHIP SOLDERED TO BGA500 PACKAGE DROP IN COMPRESSION PLATE POP CHIP SPACER SOCKET ASSEMBLY INSTRUCITON WHEN USED FOR THE POP CHIP SOLDERD TO BGA500 PACKAGE: DROP IN COMPRESSION PLATE ORIENTATION MARK 1. Place BGA500 package into socket base assembly. NOTE PIN A1 orienation. 2. Place POP CHIP SPACER into socket base cavity. 3. Place DROP IN COMPRESSION PLATE into socket base cavity. NOTE PIN A1 ORIENTATION. 4. Place clamshell socket lid assembly over socket base and secure it with dual latch. 5. Apply torque. Recommended torque: 3.8 in-lbs. 6. Test. PIN A1 ORIENATION MARK SOCKET BASE ASSEMBLY Description: Socket assy_wo_POP_pogonest Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 STATUS: Released SHEET: 8 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 1.75:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015 26.725 21.725 5.00 (x4) 3.00 3.00 26.725 21.725 5.50 (x4) 5.50 (x4) TOP VIEW 4.00 SIDE VIEW 2.50 8.00 FRONT VIEW Description: Insulation Plate ISO VIEW Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. CBT-BGA-7506 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 120.45 STATUS: Released SHEET: 9 OF 9 REV. A ENG: S. Faiz DRAWN BY: M. Raske SCALE: 2.5:1 FILE: CBT-BGA-7506 Dwg DATE: 03/04/2015