CBT-BGA-7506 Dwg - Ironwood Electronics

SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
FEATURES:
Wide temperature range (-55C to +180C )
High current capability (up to 4A )
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
Highly compliant to accommodate wide co-planarity variations
Automated probe manufacturing enables low cost and short lead time
33.60
RECOMMENDED TORQUE:
84.8 N-cm [7.5 lbf-in]
(When using DROP IN POGO
PIN NEST)
42.00
TOP VIEW
RECOMMENDED
TORQUE: 42.9 N-cm
[3.8 lbf-in]
(WITHOUT DROP IN
POGO PIN NEST)
42.00
35.10
1.59 Target PCB thickness
9.524
FRONT VIEW
SIDE VIEW
Description: SBT POP Socket
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
STATUS: Released
SHEET: 1 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 1:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015
SOCKET BASE OUTLINE
10.8625
PIN A1
ORIENTATION
1.700±0.100 (x4)
NON-PLATED MOUNTING HOLE
4.6875
0.850±0.025 (x2)
NON-PLATED ALIGNMENT HOLE
10.8625
8.3225
38.00
21.725
15.60
5.7825
0.65 typ.
0.30 (x500) ref. only
12.350
21.725
24.225
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: same or higher than solder mask
26.725
Description: Recommended PCB Layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
STATUS: Released
SHEET: 2 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 4:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015
Ironwood Package Code: BGA500C (POP CHIP BOTTOM)
14.00
PIN A1 MARKING
0.27
0.17
12.00
0.65
12.00
17.00
2.10
PACKAGE
OFFSET
0.38
0.28 (x500)
2.00 MAX
TOP VIEW
0.65
SIDE VIEW
BOTTOM VIEW
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: Compatible BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
STATUS: Released
SHEET: 3 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 4:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015
Ironwood Package Code: BGA216D (POP CHIP TOP)
PIN A1 MARKING
12.00±0.10
11.20
12.00±0.10
0.40
0.40
0.13 MIN
TOP VIEW
11.20
0.9±0.1
SIDE VIEW
BOTTOM VIEW
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: Compatible BGA-POP
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
STATUS: Released
SHEET: 4 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 4:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015
4
9
8
7
6
1
5
2
3
17
25
32
15
30
14
16
11
12
13
10
18
27
26
11
20
31
19
16
29
22
21
23
28
24
PIN 16:1
Description: Socket BOM_w_pogonest_BGA216
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
ITEM
NO.
DESCRIPTION
Material
1
2
3
Socket lid Dbl latch
Compression plate 19mm
split rolled spring pin M1 x 4mm long
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
Plain Carbon Steel
4
compression screw M18x1.5 fluted knob
7075-T6 Aluminum Alloy
5
Latch
7075-T6 Aluminum Alloy
6
Hinge Pin and Snap Ring, 3mm OD, 30mm
long, 1045 Stl, Blk Oxide
AISI 1045 Steel, cold
drawn
7
Precision Compression Spring, Zinc-Plated
Music Wire, 1/2" Length, .12" OD, .016"
Wire
Zinc Plated Music Wire
8
9
10
11
12
13
14
Spring Clamshell lid assembly
Screw, M3 x 12mm, Low Head Cap, SS
Screw, #0-80 x 1/8", Flat Undercut, SS
Floating Guide Spring
Middle Guide BGA216 12mm PoP
Bottom Guide BGA216 12mm PoP
Floating Guide BGA216 12mm PoP
15
IC guide 12mm PoP chip
16
17
18
19
20
21
22
23
24
25
26
Stamped Pin, 0.4mm SBT-BGA
Compression plate for PoP chip
Socket Base
Floating Guide
Middle Guide
Bottom Guide
Customer's target PCB
Insulation plate
Backing Plate 19mm
BGA216_12x12mm_0.4mm pitch
BGA500 14x17mm 0.65mm pitch
Steel Music Wire
18-8 Stainless Steel
Stainless Steel (303)
Alloy Steel (SS)
Semitron MDS 100
Semitron MDS 100
Semitron MDS 100
TECAPEEK CMF Ceramic
filled
N/A
7075-T6 Aluminum Alloy
7075-T6 Aluminum Alloy
Semitron MDS 100
Semitron MDS 100
Semitron MDS 100
High Temp FR4
Ultem
7075-T6, Plate (SS)
Material <not specified>
Material <not specified>
27
Dowel Pin, 1/32" dia, 7/16" Long, 18-8 SS
Chrome Stainless Steel
28
#0-80 X .75 LG, SOC HD CAP SCREW,
18-8 SS
Screw, #0-80 X .375", Flat, SS
Dowel Pin, 1/32" x 3/8", SS
IC Guide 14x17mm
Low Profile Button Head T-5 Torx #0-80
machine screw
Stainless Steel (18-8)
29
30
31
32
STATUS: Released
Material <not specified>
Chrome Stainless Steel
7075-T6 Aluminum Alloy
Stainless Steel (18-8)
SHEET: 5 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 1:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015
ITEM NO.
Description
Material
1
Socket lid Dbl latch
7075-T6 Aluminum Alloy
2
Compression plate 19mm
7075-T6 Aluminum Alloy
8
3
split rolled spring pin M1 x 4mm long
Plain Carbon Steel
4
compression screw M18x1.5 fluted knob
7075-T6 Aluminum Alloy
6
5
Latch
7075-T6 Aluminum Alloy
6
Hinge Pin and Snap Ring, 3mm OD, 30mm
long, 1045 Stl, Blk Oxide
AISI 1045 Steel, cold
drawn
7
Precision Compression Spring, Zinc-Plated
Music Wire, 1/2" Length, .12" OD, .016"
Zinc Plated Music Wire
Wire
4
9
7
1
5
2
3
25
24
19
20
12
21
26
13
14
10
15
11
16
17
23
18
22
Description: Socket BOM_wo_pogonest_POPchp
8
Spring Clamshell lid assembly
Steel Music Wire
9
Screw, M3 x 12mm, Low Head Cap, SS
18-8 Stainless Steel
10
Floating Guide Spring
Alloy Steel (SS)
11
Stamped Pin, 0.4mm SBT-BGA
N/A
12
Socket Base
7075-T6 Aluminum Alloy
13
Floating Guide
Semitron MDS 100
14
15
16
Middle Guide
Bottom Guide
Customer's target PCB
Semitron MDS 100
Semitron MDS 100
High Temp FR4
17
Insulation plate
Ultem
18
Backing Plate 19mm
7075-T6, Plate (SS)
19
BGA216_12x12mm_0.4mm pitch
Material <not specified>
20
BGA500 14x17mm 0.65mm pitch
Material <not specified>
21
Dowel Pin, 1/32" dia, 7/16" Long, 18-8 SS
Chrome Stainless Steel
22
Stainless Steel (18-8)
23
#0-80 X .75 LG, SOC HD CAP SCREW,
18-8 SS
Screw, #0-80 X .375", Flat, SS
Material <not specified>
24
compression plate, drop in
7075-T6 Aluminum Alloy
25
IC Spacer
Ultem 1000
26
IC Guide 14x17mm
7075-T6 Aluminum Alloy
PIN 16:1
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
STATUS: Released
SHEET: 6 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 1:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015
CLAMSHELL SOCKET LID ASSEMBLY
USER INSTRUCTIONS FOR DROP IN
POGO PIN NEST ASSEMBLY:
1. Place BGA500 package into socket base
assembly. NOTE PIN A1 orienation.
2. Place POP CHIP POGO PIN NEST into
socket base assembly. Alignment pins
should line up with alignment holes.
3. Place BGA216 POP chip into POP CHIP
POGO PIN NEST cavity. NOTE PIN A1
orientaion.
4. Place compression plate for POP CHIP
into POP CHIP.
5. Place clamshell socket lid assembly over
socket base and secure it with dual latch.
6. Apply torque.
Recommended torque: 7.5 in-lbs.
7. Test.
COMPRESSION
PLATE FOR
POP CHIP
POP CHIP
COMPRESSION
PLATE
ORIENTATION
MARK.
BGA216 POP CHIP
ALIGNMENT
PIN
POP CHIP
POGO PIN
NEST
PIN A1
ORIENTATION
MARK
BGA500
PACKAGE
SOCKET BASE
ASSEMBLY
Description: Socket assy_w_pogonest_BGA216
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
STATUS: Released
SHEET: 7 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 1.75:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015
CLAMSHELL SOCKET LID ASSEMBLY
POP CHIP
SOLDERED
TO BGA500
PACKAGE
DROP IN
COMPRESSION
PLATE
POP CHIP
SPACER
SOCKET ASSEMBLY INSTRUCITON
WHEN USED FOR THE POP CHIP
SOLDERD TO BGA500 PACKAGE:
DROP IN
COMPRESSION
PLATE
ORIENTATION
MARK
1. Place BGA500 package into socket
base assembly. NOTE PIN A1
orienation.
2. Place POP CHIP SPACER into socket
base cavity.
3. Place DROP IN COMPRESSION
PLATE into socket base cavity. NOTE
PIN A1 ORIENTATION.
4. Place clamshell socket lid assembly
over socket base and secure it with dual
latch.
5. Apply torque.
Recommended torque: 3.8 in-lbs.
6. Test.
PIN A1
ORIENATION
MARK
SOCKET BASE
ASSEMBLY
Description: Socket assy_wo_POP_pogonest
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
STATUS: Released
SHEET: 8 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 1.75:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015
26.725
21.725
5.00 (x4)
3.00
3.00
26.725
21.725
5.50 (x4)
5.50 (x4)
TOP VIEW
4.00
SIDE VIEW
2.50
8.00
FRONT VIEW
Description: Insulation Plate
ISO VIEW
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-7506 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 120.45
STATUS: Released
SHEET: 9 OF 9
REV. A
ENG: S. Faiz
DRAWN BY: M. Raske
SCALE: 2.5:1
FILE: CBT-BGA-7506 Dwg
DATE: 03/04/2015