SBT-MICROSD-01 Dwg - Ironwood Electronics

MicroSD SBT DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN
AND TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 4A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity
variations.
• Automated probe manufacturing enables low cost and short
lead time.
Torque until hard stop is reached (floating guide bottoms out on bottom guide)
14.14
22.839
7.112
Front View
22.85
18.85
Description: Micro SD SBT Socket
SIde View
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-MICROSD-01 Drawing
©2015 Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 18.14
STATUS: Released
SHEET: 1 OF 5
REV. B
ENG: B. Fedde
DRAWN BY: B. Fedde
SCALE: 2.5:1
FILE: SBT-MICROSD-01
DATE: 7/31/2012
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
7.8375 (X4)
1.700±0.100 (X4)
0.035 A B
B
Target PCB Pads
7.70
11.125
1.10TYP.
9.825
0.850±0.025
0.025 A B
1.00
1.00
2.55
9.8375 (X4)
MicroSD
7.2975
1.850
6.60
15.125
4.7575
0.1075
3.00
3.15
A
2.85
2.85
1.00 TYP.
5.1875
Alignment Guide
TOP VIEW
5.00
TOP VIEW
3.85
MicroSD Alignment Guide
Target PCB Recommendations
Total thickness: 1.5mm min.
Plating: Gold or Solder finish
Description: Recommended PCB layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-MICROSD-01 Drawing
©2015 Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 18.14
STATUS: Released
SHEET: 2 OF 5
REV. B
ENG: B. Fedde
DRAWN BY: B. Fedde
SCALE: 4:1
FILE: SBT-MICROSD-01
DATE: 7/31/2012
A
C
1.00
2.85
Ironwood Package Code: MIcroSD8A1
0.70
b (X21)
1.00
1.20
B
7.90
2.90
1.10
A4
C1
A2
A3
A1
1.
Dimensions are in millimeters.
2.
Interpret dimensions and tolerances per ASME Y14.5M-1994.
3.
Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4.
Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5.
Parallelism measurement shall exclude any effect of mark on top surface of package.
Description: Package information
DIM
A
A1
A2
A3
A4
B
b
C
C1
MIN
10.9
9.6
3.85
7.6
1.1
14.9
0.3
0.9
0.6
MAX
11.1
9.8
7.8
15.1
0.5
1.1
0.8
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-MICROSD-01 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 18.14
STATUS: Released
SHEET: 3 OF 5
DRAWN BY: B. Fedde
SCALE: 6:1
FILE: SBT-MICROSD-01
DATE: 7/31/2012
REV. B
11
13
ITEM
NO.
1
DESCRIPTION
SBT Socket Base
11x15mm MicroSD
2
IC Guide MicroSD 11x15
Pin Alignment Guide
MicroSD 11x15
3
4
12
5
4
6
1
10
7
8
2
14
Insulation Plate
10
3
11
5
17
12
6
15
9
13
MicroSD DUT
1mm Pitch Top Guide
Micro SD 11x15
1mm Pitch Bottom Guide
MicroSD
Test PCB C11649
MicroSD 11x15
Insulation plate MicroSD
11x15
SBT/CBT NI PLT
BACKING PLT
22.85x18.85
#0-80 Shoulder Screw,
0.062" thread length
22.85x18.85 SBT Lid
11x15 Compression Plate
for MicroSD
Compression Screw M10
14 Dowel Pin, 1/32" x 3/8", SS
#0-80X0.25", 90 deg.,
15
head pin guide screw,
Peek material
#0-80 X .625 LG, SOC HD
16
CAP SCREW, ALLOY
STL, BLK OXIDE
Pogo
Pin, 1mm Pitch SBT
17
LGA pin
7
8
9
16
Pin detail
12:1
Material
7075-T6 Alumium Alloy
Torlon 4203
Kapton Polyimide/Cirlex
Ceramic Porcelain
PEEK Ceramic filled
PEEK Ceramic filled
FR4 High temp
FR4 High temp
7075-T6 Alumium Alloy
Stainless Steel (303)
7075-T6 Alumium Alloy
7075-T6 Alumium Alloy
7075-T6 Alumium Alloy
Chrome Stainless Steel
PEEK unfilled
Alloy Steel
BeCu
Description: Skt, Insulation Plate, Pin Det
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-MICROSD-01 Drawing
©2015 Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 18.14
STATUS: Released
SHEET: 4 OF 5
REV. B
ENG: B. Fedde
DRAWN BY: B. Fedde
SCALE: 3:1
FILE: SBT-MICROSD-01
DATE: 7/31/2012
Rev
A
B
Date
07/31/12
03/30/15
Initials
BMF
DH
Description
Original
Changed IC guide material from Ultem to torlon
Description: Revisions
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SBT-MICROSD-01 Drawing
©2015 Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material:
Finish:
Weight:
STATUS: Released
SHEET: 5 OF 5
REV. B
ENG: B. Fedde
DRAWN BY: B. Fedde
SCALE: 1:1
FILE: SBT-MICROSD-01
DATE: 7/31/2012