MicroSD SBT DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • Wide temperature range (-55C to +180C). • High current capability (up to 4A). • Excellent signal integrity at high frequencies. • Low and stable contact resistance for reliable production yield. • Highly compliant to accommodate wide co-planarity variations. • Automated probe manufacturing enables low cost and short lead time. Torque until hard stop is reached (floating guide bottoms out on bottom guide) 14.14 22.839 7.112 Front View 22.85 18.85 Description: Micro SD SBT Socket SIde View Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-MICROSD-01 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 18.14 STATUS: Released SHEET: 1 OF 5 REV. B ENG: B. Fedde DRAWN BY: B. Fedde SCALE: 2.5:1 FILE: SBT-MICROSD-01 DATE: 7/31/2012 *Note: BGA pattern is not symmetrical with respect to the mounting holes. 7.8375 (X4) 1.700±0.100 (X4) 0.035 A B B Target PCB Pads 7.70 11.125 1.10TYP. 9.825 0.850±0.025 0.025 A B 1.00 1.00 2.55 9.8375 (X4) MicroSD 7.2975 1.850 6.60 15.125 4.7575 0.1075 3.00 3.15 A 2.85 2.85 1.00 TYP. 5.1875 Alignment Guide TOP VIEW 5.00 TOP VIEW 3.85 MicroSD Alignment Guide Target PCB Recommendations Total thickness: 1.5mm min. Plating: Gold or Solder finish Description: Recommended PCB layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-MICROSD-01 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 18.14 STATUS: Released SHEET: 2 OF 5 REV. B ENG: B. Fedde DRAWN BY: B. Fedde SCALE: 4:1 FILE: SBT-MICROSD-01 DATE: 7/31/2012 A C 1.00 2.85 Ironwood Package Code: MIcroSD8A1 0.70 b (X21) 1.00 1.20 B 7.90 2.90 1.10 A4 C1 A2 A3 A1 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. Description: Package information DIM A A1 A2 A3 A4 B b C C1 MIN 10.9 9.6 3.85 7.6 1.1 14.9 0.3 0.9 0.6 MAX 11.1 9.8 7.8 15.1 0.5 1.1 0.8 Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-MICROSD-01 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 18.14 STATUS: Released SHEET: 3 OF 5 DRAWN BY: B. Fedde SCALE: 6:1 FILE: SBT-MICROSD-01 DATE: 7/31/2012 REV. B 11 13 ITEM NO. 1 DESCRIPTION SBT Socket Base 11x15mm MicroSD 2 IC Guide MicroSD 11x15 Pin Alignment Guide MicroSD 11x15 3 4 12 5 4 6 1 10 7 8 2 14 Insulation Plate 10 3 11 5 17 12 6 15 9 13 MicroSD DUT 1mm Pitch Top Guide Micro SD 11x15 1mm Pitch Bottom Guide MicroSD Test PCB C11649 MicroSD 11x15 Insulation plate MicroSD 11x15 SBT/CBT NI PLT BACKING PLT 22.85x18.85 #0-80 Shoulder Screw, 0.062" thread length 22.85x18.85 SBT Lid 11x15 Compression Plate for MicroSD Compression Screw M10 14 Dowel Pin, 1/32" x 3/8", SS #0-80X0.25", 90 deg., 15 head pin guide screw, Peek material #0-80 X .625 LG, SOC HD 16 CAP SCREW, ALLOY STL, BLK OXIDE Pogo Pin, 1mm Pitch SBT 17 LGA pin 7 8 9 16 Pin detail 12:1 Material 7075-T6 Alumium Alloy Torlon 4203 Kapton Polyimide/Cirlex Ceramic Porcelain PEEK Ceramic filled PEEK Ceramic filled FR4 High temp FR4 High temp 7075-T6 Alumium Alloy Stainless Steel (303) 7075-T6 Alumium Alloy 7075-T6 Alumium Alloy 7075-T6 Alumium Alloy Chrome Stainless Steel PEEK unfilled Alloy Steel BeCu Description: Skt, Insulation Plate, Pin Det Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-MICROSD-01 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 18.14 STATUS: Released SHEET: 4 OF 5 REV. B ENG: B. Fedde DRAWN BY: B. Fedde SCALE: 3:1 FILE: SBT-MICROSD-01 DATE: 7/31/2012 Rev A B Date 07/31/12 03/30/15 Initials BMF DH Description Original Changed IC guide material from Ultem to torlon Description: Revisions Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-MICROSD-01 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: Finish: Weight: STATUS: Released SHEET: 5 OF 5 REV. B ENG: B. Fedde DRAWN BY: B. Fedde SCALE: 1:1 FILE: SBT-MICROSD-01 DATE: 7/31/2012