XG-BGA-5007 Dwg - Ironwood Electronics

XG-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR TEST
APPLICATIONS
Agilent Probe
Sold Seperately
8.0
74.00
Recommended Torque: 10 in. lbs.
17.2250
37
8.0
37
13.0647
2.6650
38 (x4)
65
4.6000
18.7250
Description: XG-BGA617/BGA168 PoP socket for Agilent Probe board
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
XG-BGA-5007 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
WEIGHT: 10.21
MATERIAL: N/A
FINISH: N/A
STATUS: Released
SHEET 1 OF 5
DRAWN BY: V. Panavala
SCALE: 3:2
File: XG-BGA-5007
DATE: 8/16/2012
REV. A
18.725
BACKING PLATE
14.725±0.050 (4)
1.7625±0.0250
1.25±0.13
1.25±0.13
1.7625±0.0250
2.54±0.025
0.850±0.025 (2)
NON-PLATED ALIGNMENT HOLE
0.40 TYP
5.080±0.025
0.27 PAD TYP
11.20
17.225±0.125
SOCKET BASE
1.70±0.05 (4)
NON-PLATED MOUNTING HOLE
BGA617 A1 Corner
Description: Recommmended PCB layout
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
XG-BGA-5007 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
WEIGHT: 10.21
MATERIAL: N/A
FINISH: N/A
STATUS: Released
Target PCB Recommendations
Total thickness: 1.5mm min.
Plating: Gold or Solder finish
SHEET 2 OF 5
DRAWN BY: V. Panavala
SCALE: 6:1
File: XG-BGA-5007
DATE: 8/16/2012
REV. A
0.1250
B
D
11.0000
E
0.5000
E
0.2
A
b
0.15 M
e
A B C
0.10 C
A
A1
1.
Dimensions are in millimeters.
2.
Interpret dimensions and tolerances per ASME Y14.5M-1994.
3.
Dimension b is measured at the maximum solder ball diameter, parallel to
datum plane Z.
4.
Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5.
Parallelism measurement shall exclude any effect of mark on top surface of
package.
0.20 C
C
DETAIL E
SCALE 12 : 1
Description: XG-BGA617/BGA168 PoP socket for Agilent Probe board
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
XG-BGA-5007 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
WEIGHT: 10.21
MATERIAL: N/A
FINISH: N/A
STATUS: Released
DIM
A
A1
b
D
E
e
PIn Count
MIN
0.11
0.20
12.00 BSC
12.00 BSC
0.40
617 /168 on top
MAX
0.94
0.21
0.30
Array
SHEET 3 OF 5
DRAWN BY: V. Panavala
SCALE: 6:1
File: XG-BGA-5007
DATE: 8/16/2012
REV. A
12 MAX
(4)
BGA168 Probe A1 Corner
0.5 Typ.
1.863±0.025
0.678±0.025
7.105±0.025
3.218±0.025
0.850±0.025 (2)
NON-PLATED ALIGNMENT HOLE
1.863±0.025
11.0
14.725±0.025
TOP VIEW
DESCRIPTION: Probe Board Layout
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"],all other tolerances ±0.13mm [±0.005"] unless stated otherwise.
Materials and specifications are subject to change without notice.
XG-BGA-5007 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
WEIGHT: 10.21
MATERIAL: N/A
FINISH: N/A
STATUS: Released
SHEET: 4 of 5
DRAWN BY: M. Tully
SCALE: 6:1
File: XG-BGA-5007
DATE: 8/17/2012
REV. A
10
11
ITEM NO.
1
2
3
4
5
6
13
7
8
9
12
14
10
11
12
1
13
17
14
15
8
16
17
9
9
8
6
7
3
15
2
DESCRIPTION
Socket Base 12mm POP socket
Cflex 12mm 0.4mm pitch BGA617
Ball Guide BGA 12x12mm, 0.4mm Pitch
Target PCB BGA617
12x12mm, 5 post Clamshell Backing
Plate
BGA chip 617pin with 0.4mm Pitch and
29x29 array BGA168 0.5mm pitch top
IC guide 12mm IC
Cflex BGA168 0.5mm pitch
Agilent BGA168 Probe board 0.5mm
pitch
Compression Screw M10
Socket Lid 12mm
Compression Plate
#0-80 Shoulder Screw, 0.062" thread
length
Memory chip BGA168
Dowel pin, 1/32" X 1/2", SS
#0-80 X .313 LG, SOC HD CAP SCREW,
ALLOY STL, BLK OXIDE
Ball Guide BGA168 0.5mm pitch
Material
7075-T6 Aluminum Alloy
Kapton Polyimide
Kapton Polyimide
Material <not specified>
7075-T6 Aluminum Alloy
Kapton Polyimide/ Cirlex
Kapton Polyimide/Cirlex
7075-T6 Alumium Alloy
7075-T6 Alumium Alloy
7075-T6 Aluminum Alloy
Stainless Steel (303)
Material <not specified>
Alloy Steel
Alloy Steel
Kapton Polyimide
17.225
4.00 (x4)
1.70
1.60
4
18.725
5
3.00
16
Description: XG-BGA617/BGA168 PoP socket for Agilent Probe board
14.725
4.60
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
XG-BGA-5007 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
WEIGHT: 10.21
MATERIAL: N/A
FINISH: N/A
STATUS: Released
SHEET 5 OF 5
DRAWN BY: V. Panavala
SCALE: 3:1
File: XG-BGA-5007
DATE: 8/16/2012
REV. A