SG-BGA-6409 Dwg - Ironwood Electronics

SG-BGA DIRECT MOUNT, SOLDERLESS SOCKET
Features
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid
55.225
Recommended torque= 40 in-lb
52.725
22.805
12.468
7.938
Description: SG-BGA skt 47.5x47.5mm 1mm 44x44 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6409 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 147.09
STATUS: Released
SHEET: 1 OF 4
REV. A
ENG: R. Patil
DRAWN BY: M. Raske
SCALE: 1:1
FILE: SG-BGA-6409 Dwg
DATE: 08/05/2014
*Note: BGA pattern is not symmetrical
with respect to the mounting holes.
It is shifted by 0.375mm to the right. of center.
52.725
43.000 (x4)
3.9875*
2X
B
0.850 THRU ALL
Non Plated Hole
0.025 A B
3.6125
22.5725
A
0.510±0.025
20.0325
25.1125
1.000 Typ.
8X
25.1125
25.1125
Target PCB Recommendations
Total thickness: 2mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
Description: Recommended PCB Layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6409 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 147.09
1.700±0.100 THRU ALL
Non Plated Hole
0.035 A B
STATUS: Released
SHEET: 2 OF 4
REV. A
ENG: R. Patil
DRAWN BY: M. Raske
SCALE: 2:1
FILE: SG-BGA-6409 Dwg
DATE: 08/05/2014
Y
X
D
Ironwood Package Code: BGA 1936A
E
0.25 M
0.10 M
b
X Y Z
X
e
0.25 Z
A
0.2 Z
Z
A1
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances per ASME Y14.5M-1994.
3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z.
4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls.
5. Parallelism measurement shall exclude any effect of mark on top surface of package.
DIM
Minimum Maximum
A
3.89
4.29
A1
0.40
0.60
b
0.50
0.70
D
47.50 BSC
E
47.50 BSC
e
1.00 BSC
ARRAY
44 x 44
PIN COUNT
1936
Description: Compatible BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6409 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 147.09
STATUS: Released
SHEET: 3 OF 4
REV. A
ENG: R. Patil
DRAWN BY: M. Raske
SCALE: 2:1
FILE: SG-BGA-6409 Dwg
DATE: 08/05/2014
13
ITEM NO.
Description
Material
1
PCB 44x44 array 1mm pitch
FR4
2
Swivel Socket Base 47.5x47.5mm
IC 6.5mm ht
7075-T6 Aluminum
Alloy
3
Dowel Pin, 1/32" x 3/16", SS
Ball Guide 47.5x47.5mm, 44x44
array
Chrome Stainless Steel
11
12
4
5
14
7
2
8
3
4
6
5
1
9
10
6
Elastomer Guide 47.5mm IC
0.75mm thick 0.1mm pitch 63 deg
angled elastomer
Silicon Rubber
7
#0-80 Shoulder Screw, 0.090"
thread length
Stainless Steel (303)
8
#0-80 X .625 LG, SOC HD CAP
SCREW, ALLOY STL, BLK OXIDE
Alloy Steel
9
Insulation Plate, 47.5 x 47.5
10
Backing Plate 47.5x47.5mm IC
FR4
7075-T6 Aluminum
Alloy
11
Socket Lid for 47.5mm IC
7075-T6 Aluminum
Alloy
12
Compression Plate for 45mm IC
7075-T6 Aluminum
Alloy
13
Compression Screw, M30
7075-T6 Aluminum
Alloy
14
Customer's BGA device
FR4 Standard
1.613
Note: Do not use drop in IC guide with Xilinx
FHGE1924/FHGJ1924. Use it with Xilinx FFVJ1924.
Kapton Polyimide/Cirlex
50.225
Ultem 1000
1.588
55.225
6.350
Description: Socket Assy, Insulation Plate
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6409 Drawing
Ironwood Electronics, Inc.
Tele: (800) 404-0204
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 147.09
BACKING AND INSULATION PLATE
STATUS: Released
SHEET: 4 OF 4
REV. A
ENG: R. Patil
DRAWN BY: M. Raske
SCALE: 2:1
FILE: SG-BGA-6409 Dwg
DATE: 08/05/2014