SG-BGA DIRECT MOUNT, SOLDERLESS SOCKET Features • Directly mounts to target PCB (needs tooling holes) with hardware • High speed, reliable Elastomer connection • Minimum real estate required • Compression plate distributes forces evenly • Ball guide prevents over compression of elastomer • Easily removable swivel socket lid 55.225 Recommended torque= 40 in-lb 52.725 22.805 12.468 7.938 Description: SG-BGA skt 47.5x47.5mm 1mm 44x44 array Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SG-BGA-6409 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 147.09 STATUS: Released SHEET: 1 OF 4 REV. A ENG: R. Patil DRAWN BY: M. Raske SCALE: 1:1 FILE: SG-BGA-6409 Dwg DATE: 08/05/2014 *Note: BGA pattern is not symmetrical with respect to the mounting holes. It is shifted by 0.375mm to the right. of center. 52.725 43.000 (x4) 3.9875* 2X B 0.850 THRU ALL Non Plated Hole 0.025 A B 3.6125 22.5725 A 0.510±0.025 20.0325 25.1125 1.000 Typ. 8X 25.1125 25.1125 Target PCB Recommendations Total thickness: 2mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SG-BGA-6409 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 147.09 1.700±0.100 THRU ALL Non Plated Hole 0.035 A B STATUS: Released SHEET: 2 OF 4 REV. A ENG: R. Patil DRAWN BY: M. Raske SCALE: 2:1 FILE: SG-BGA-6409 Dwg DATE: 08/05/2014 Y X D Ironwood Package Code: BGA 1936A E 0.25 M 0.10 M b X Y Z X e 0.25 Z A 0.2 Z Z A1 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. DIM Minimum Maximum A 3.89 4.29 A1 0.40 0.60 b 0.50 0.70 D 47.50 BSC E 47.50 BSC e 1.00 BSC ARRAY 44 x 44 PIN COUNT 1936 Description: Compatible BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SG-BGA-6409 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 147.09 STATUS: Released SHEET: 3 OF 4 REV. A ENG: R. Patil DRAWN BY: M. Raske SCALE: 2:1 FILE: SG-BGA-6409 Dwg DATE: 08/05/2014 13 ITEM NO. Description Material 1 PCB 44x44 array 1mm pitch FR4 2 Swivel Socket Base 47.5x47.5mm IC 6.5mm ht 7075-T6 Aluminum Alloy 3 Dowel Pin, 1/32" x 3/16", SS Ball Guide 47.5x47.5mm, 44x44 array Chrome Stainless Steel 11 12 4 5 14 7 2 8 3 4 6 5 1 9 10 6 Elastomer Guide 47.5mm IC 0.75mm thick 0.1mm pitch 63 deg angled elastomer Silicon Rubber 7 #0-80 Shoulder Screw, 0.090" thread length Stainless Steel (303) 8 #0-80 X .625 LG, SOC HD CAP SCREW, ALLOY STL, BLK OXIDE Alloy Steel 9 Insulation Plate, 47.5 x 47.5 10 Backing Plate 47.5x47.5mm IC FR4 7075-T6 Aluminum Alloy 11 Socket Lid for 47.5mm IC 7075-T6 Aluminum Alloy 12 Compression Plate for 45mm IC 7075-T6 Aluminum Alloy 13 Compression Screw, M30 7075-T6 Aluminum Alloy 14 Customer's BGA device FR4 Standard 1.613 Note: Do not use drop in IC guide with Xilinx FHGE1924/FHGJ1924. Use it with Xilinx FFVJ1924. Kapton Polyimide/Cirlex 50.225 Ultem 1000 1.588 55.225 6.350 Description: Socket Assy, Insulation Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SG-BGA-6409 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 147.09 BACKING AND INSULATION PLATE STATUS: Released SHEET: 4 OF 4 REV. A ENG: R. Patil DRAWN BY: M. Raske SCALE: 2:1 FILE: SG-BGA-6409 Dwg DATE: 08/05/2014