RENESAS HD74UH4066EL

HD74UH4066
Analog Switch
REJ03D0204–0400Z
(Previous ADE-205-022B (Z))
Rev.4.00
Feb.02.2004
Description
The HD74UH4066 is high-speed CMOS analog switch using silicon gate CMOS process. With CMOS
low power dissipation, it provides high speed. The device has low ON resistance for good transfer
characteristics and can take wide range of input voltage.
Features
• Encapsulated in very small 5pins package of 2.9 × 1.6 × 1.1 mm, the efficiency to mount on substrate is
significantly improved.
• The basic gate function is lined up as Renesas uni logic series.
• Supplied on emboss taping for high-speed automatic mounting.
• Electrical characteristics equivalent to the HD74HC4066
Supply voltage range: 2 to 6 V
Operating temperature range: –40 to +85°C
• | IOH | = IOL = 2 mA (min)
• Ordering Information
Part Name
Package Type
Package Code
Package
Abbreviation
Taping Abbreviation
(Quantity)
HD74UH4066EL
MPAK-5 pin
MPAK-5V
−
EL (3,000 pcs/reel)
Rev.4.00, Feb.02.2004, page 1 of 8
HD74UH4066
Pin Arrangement
IN/OUT 1
5
VCC
OUT/IN 2
GND
4 Control
3
(Top view)
Article Indication
Marking
H
9
Lot number
A
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage
VCC
–0.5 to +7.0
V
Input voltage
VIN
–0.5 to VCC +0.5
V
Output voltage
VOUT
–0.5 to VCC +0.5
V
Input diode current
IIK
±20
mA
Output diode current
IOK
±20
mA
Output current
IOUT
±25
mA
VCC/GND current
ICC, IGND
±25
mA
Power dissipation
PT
200
mW
Storage temperature
Tstg
–65 to +150
°C
Rev.4.00, Feb.02.2004, page 2 of 8
HD74UH4066
Recommended Operating Conditions
Item
Symbol
Ratings
Unit
Supply voltage
VCC
2 to 6
V
Input voltage
VIN
0 to VCC
V
Output voltage
VOUT
0 to VCC
V
Operating temperature
Topr
–40 to +85
°C
Input rise/fall time
tr, tf
0 to 1000 (VCC = 2.0 V)
ns
0 to 500 (VCC = 4.5 V)
0 to 400 (VCC = 6.0 V)
Electrical Characteristics
VCC
Ta = 25°C
Ta = –40 to 85°C
Item
Symbol
(V)
Min
Typ
Max
Min
Max
Unit
Input voltage
VIH
2.0
1.5
—
—
1.5
—
V
4.5
3.15
—
—
3.15
—
6.0
4.2
—
—
4.2
—
2.0
—
—
0.5
—
0.5
4.5
—
—
1.35
—
1.35
6.0
—
—
1.8
—
1.8
2.0
—
2000 5000 —
6250
4.5
—
100
200
—
250
VIN = 0 to VCC
6.0
—
60
170
—
210
IIN/OUT = 1 mA
IS
(off)
6.0
—
—
±0.1
—
±1.0
µA
VC = VIL
VIN = VCC, VOUT = GND
or VIN = GND, VOUT = VCC
IS
(on)
6.0
—
—
±0.1
—
±1.0
µA
VC = VIH
VIN = VCC or GND
Input current
IIN
6.0
—
—
±0.1
—
±1.0
µA
VIN = VCC or GND
Operating
current
ICC
6.0
—
—
1.0
—
10.0
µA
VIN = VCC or GND
VIL
On resistance
Leak current
RON
Rev.4.00, Feb.02.2004, page 3 of 8
Test Conditions
V
Ω
VC = VIH
HD74UH4066
Switching Characteristics
Ta = 25°C
Ta = –40 to 85°C
Item
Symbol
VCC
Min
Typ
Max
Min
Propagation
delay time
tPLH
tPHL
2.0
—
—
50
—
65
4.5
—
4
10
—
13
6.0
—
—
9
—
11
2.0
—
—
115
—
145
4.5
—
10
23
—
29
6.0
—
—
20
—
25
2.0
—
—
115
—
145
4.5
—
14
23
—
29
6.0
—
—
20
—
25
2.0
—
20
—
—
—
4.5
—
30
—
—
—
6.0
—
30
—
—
—
Output enable
time
tPZL
tPZH
Output disable tLZ
tHZ
time
Maximum
control
frequency
tmax
Max
Unit
Test Conditions
ns
RL = 10 KΩ
ns
RL = 1 KΩ
ns
RL = 1 KΩ
MHz
Control input
capacitance
CIN
—
—
5
10
—
10
pF
Switch I/O
capacitance
CIN/OUT
—
—
6
—
—
—
pF
Feed through
capacitance
CIN-OUT
—
—
0.5
—
—
—
pF
Power
dissipation
capacitance
CPD
—
—
13
—
—
—
pF
Rev.4.00, Feb.02.2004, page 4 of 8
HD74UH4066
Test Circuit
RON
VCC
VC =VIH
VCC
VIN =VCC
(ON)
VOUT
VIN–OUT
RON =
10 -3
GND
1.0 mA
+
V
(Ω)
—
VIN–OUT
IS (OFF), IS (ON)
VCC
VCC
VC =VIL
VC =VIH
VCC
A
VCC
A
(OFF)
VIN =VCC
or GND
GND
VOUT =GND
or VCC
(ON)
VIN =VCC
or GND
GND
VOUT
OPEN
tPLH, tPHL
VCC
VC =VIH
tr
VIN
VCC
VIN
GND
RL=
10 k Ω
CL=
50 pF
90%
50%
t PLH
VOUT
(ON)
tf
VOUT
VCC
10%
t PHL
GND
VOH
50%
VOL
Rev.4.00, Feb.02.2004, page 5 of 8
HD74UH4066
tZH, tZL / tHZ, tLZ
VCC
VC
S1
tr
R L=1 kΩ
VIN
VCC
GND
VCC
90%
50%
VC
VOUT
tf
10%
S2
CL=50 pF
GND
t HZ
t ZH
RL =1 kΩ
90%
VOH
50%
VOUT
VOL
t ZL
t LZ
50%
Item
S1
S2
tZH
VCC
GND
tZL
GND
VCC
tHZ
VCC
GND
tLZ
GND
VCC
VOH
10%
VOL
Maximum control frequency
VCC
VC
VCC
VC
VCC
VIN =VCC
GND
Rev.4.00, Feb.02.2004, page 6 of 8
GND
VOUT
RL=
1 kΩ
CL=15 pF
VOUT
VCC /2
HD74UH4066
CIN/OUT, CIN–OUT
CIN–OUT
VC =GND
VCC
VCC
(OFF)
CIN/OUT
Rev.4.00, Feb.02.2004, page 7 of 8
GND
CIN/OUT
HD74UH4066
Package Dimensions
Unit: mm
1.9 ± 0.2
0.95
0.16
+ 0.1
– 0.05
0 – 0.1
2.8
+ 0.2
– 0.3
+ 0.2
0.6 1.6 – 0.1
0.6
0.95
+ 0.1
5 – 0.4 – 0.05
+ 0.2
1.1 – 0.1
0.3
2.9 ± 0.2
Package Code
JEDEC
JEITA
Mass (reference value)
Rev.4.00, Feb.02.2004, page 8 of 8
MPAK–5V
—
—
0.015 g
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501
Renesas Technology Europe Limited.
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom
Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900
Renesas Technology Europe GmbH
Dornacher Str. 3, D-85622 Feldkirchen, Germany
Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11
Renesas Technology Hong Kong Ltd.
7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2375-6836
Renesas Technology Taiwan Co., Ltd.
FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
© 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .1.0