ESMT F50L512M41A Flash 3.3V 512 Mbit SPI-NAND Flash Memory PRODUCT LIST Parameters Values VCC VCCQ1 Width Frequency Internal ECC Correction Transfer Rate Loading Throughput Power-up Ready Time Max Reset Busy Time Note: 1. VCCQ should be the same as VCC. 2. x2 PROGRAM operation is not defined. 3.3V 3.3V x1, x22, x4 104MHz 1-bit 10ns 104MT/s 1ms (maximum value) 1ms (maximum value) FEATURES z z z z z z z Voltage Supply: 3.3V (2.7V~3.6V) Organization - Memory Cell Array: (64M + 2M) x 8bit - Data Register: (2K + 64) x 8bit Automatic Program and Erase - Page Program: (2K + 64) Byte - Block Erase: (128K + 4K) Byte Page Read Operation - Page Size: (2K + 64) Byte - Read from Cell to Register with Internal ECC: 100us Memory Cell: 1bit/Memory Cell Support SPI-Mode 0 and SPI-Mode 31 Fast Write Cycle Time - Program time:400us - Block Erase time: 4ms z z z z z z Hardware Data Protection - Program/Erase Lockout During Power Transitions Reliable CMOS Floating Gate Technology - Internal ECC Requirement: 1bit/512Byte - Endurance: 100K Program/Erase cycles - Data Retention: 10 years Command Register Operation NOP: 4 cycles OTP Operation Bad-Block-Protect Note: 1. Mode 0: CPOL = 0, CPHA = 1; Mode 3: CPOL = 1, CPHA = 1 ORDERING INFORMATION Product ID F50L512M41A -104RAG Speed 104MHz Package 8-contact LGA Elite Semiconductor Memory Technology Inc. Comments 8x6mm Pb-free Publication Date: May 2014 Revision: 1.1 1/36 ESMT F50L512M41A GENERAL DESCRIPTION The serial electrical interface follows the industry-standard serial peripheral interface (SPI), providing a cost-effective non-volatile memory storage solution in systems where pin count must be kept to a minimum. The device is a 512Mb SLC SPI-NAND Flash memory device based on the standard parallel NAND Flash, but new command protocols and registers are defined for SPI operation. It is also an alternative to SPI-NOR, offering superior write performance and cost per bit over SPI-NOR. The command set resembles common SPI-NOR command set, modified to handle NAND-specific functions and new features. New features include user-selectable internal ECC. With internal ECC enabled, ECC code is generated internally when a page is written to the memory array. The ECC code is stored in the spare area of each page. When a page is read to the cache register, the ECC code is calculated again and compared with the stored value. Errors are corrected if necessary. The device either outputs corrected data or returns an ECC error status. Elite Semiconductor Memory Technology Inc. The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while old data is erased. The device contains 512 blocks, composed by 64 pages consisting in two NAND structures of 32 series connected Flash cells. Each page consists 2112-Byte and is further divided into a 2048-Byte data storage area with a separate 64-Byte spare area. The 64-Byte area is typically used for memory and error management. The pins serve as the ports for signals. The device has six signal lines plus VCC and ground (GND, VSS). The signal lines are SCK (serial clock), SI (command and data input), SO (response and data output), and control signals CS#, HOLD#, WP#. Publication Date: May 2014 Revision: 1.1 2/36 ESMT F50L512M41A PIN CONFIGURATION (TOP VIEW) 8-Contact LGA (LGA 8C, 8mmx6 mm Body, 1.27mm Contact Pitch) CS# 1 8 VCC SO (IO1) 2 7 HOLD# (IO3) WP# (IO2) 3 6 SCK VSS 4 5 SI (IO0) Pin Description Pin Name CS# HOLD# / IO3 WP# / IO2 SCK SI / IO0 SO / IO1 VCC 6 VSS 6 NC Functions Chip Select (Input) The device is activated1/deactivated2 as CS# is driven LOW/HIGH. After power-on, the device requires a falling-edge on CS# before any command can be written. The device goes to standby mode when no PROGRAM, ERASE, or WRITE STATUS REGISTER operation is in progress. Hold (Input) / IO3 (Input/Output) Hold pauses any serial communication with the device without deselecting it3. When driven LOW, SO is at high impedance (Hi-Z), and all inputs in SI and SCK are ignored; CS# also should be driven LOW. HOLD# must not be driven during x4 operation. Write Protect (Input) / IO2 (Input/Output) WP# is driven LOW to prevent overwriting the block-lock bits (BP0, BP1, and BP2) if the block register write disable (BRWD) bit is set4. WP# must not be driven during x4 operation. Serial Clock (Input) SCK provides serial interface timing. Address, commands, and data in SI are latched on the rising edge of SCK. Output (data in SO) is triggered after the falling-edge of SCK. The clock is valid only when the device is active.5 Serial Data Input (Input) / IO0 (Input/Output) SI transfers data serially into the device. Device latches addresses, commands, and program data in SI on the rising-edge of SCK. SI must not be driven during x2 or x4 READ operation. Serial Data Output (Output) / IO1 (Input/Output) SO transfers data serially out of the device on the falling-edge of SCK. SO must not be driven during x2 or x4 PROGRAM operation. Power VCC is the power supply for device. Ground No Connection Not internally connected. Note: 1. CS# places the device in active power mode. 2. CS# deselects the device and places SO at high impedance. 3. It means HOLD# input doesn’t terminate any READ, PROGRAM, or ERASE operation currently in progress. 4. If the BRWD bit is set to 1 and WP# is LOW, the block protect bits can’t be altered. 5. SI and SO can be triggered only when the clock is valid. 6. Connect all VCC and VSS pins of each device to common power supply outputs. Do not leave VCC or VSS disconnected. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 3/36 ESMT F50L512M41A BLOCK DIAGRAM ARRAY ORGANIZATION Array Address Data Bits 0 1 2 3 4 5 6 7 1st byte 2nd byte 3rd byte 4th byte 5th byte A0 A8 A12 A20 *L A1 A9 A13 A21 *L A2 A10 A14 A22 *L A3 A11 A15 A23 *L A4 *L A16 A24 *L A5 *L A17 A25 *L A6 *L A18 A26 *L A7 *L A19 *L *L Address Column Address Column Address Row Address Row Address Dummy Address Note: Column Address: Starting Address of the Register. *L must be set to “Low”. The device ignores any additional input of address cycles than required. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 4/36 ESMT F50L512M41A COMMAND SET Function BLOCK ERASE 1 GET FEATURE SET FEATURE WRITE DISABLE WRITE ENABLE PROGRAM LOAD 2 PROGRAM LOAD x4 PROGRAM LOAD RANDOM DATA PROGRAM LOAD RANDOM 2 DATA x4 PROGRAM EXECUTE PAGE READ READ FROM CACHE READ FROM CACHE x2 2 READ FROM CACHE x4 3 READ ID RESET Op Code Address Byte Dummy Byte Data Bytes D8h 3 0 0 0Fh 1 0 1 1Fh 04h 06h 02h 1 0 0 2 0 0 0 0 1 0 0 1 to 2112 32h 2 0 1 to 2112 84h 2 0 1 to 2112 34h 2 0 1 to 2112 10h 13h 03h, 0Bh 3Bh 3 3 2 2 0 0 1 1 0 0 1 to 2112 1 to 2112 6Bh 2 1 1 to 2112 9Fh 1 0 2 FFh 0 0 0 Note: 1. Refer to Feature Register. 2. Command/Address is 1-bit input per clock period, data is 4-bit input/output per clock period. 3. Address is 00h to get JEDEC ID Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 5/36 ESMT F50L512M41A Absolute Maximum Ratings Parameter Symbol Rating Unit Temperature Under Bias VCC VIN VI/O TBIAS -0.6 to +4.6 -0.6 to +4.6 -0.6 to VCC + 0.3 (< 4.6) -40 to +125 ℃ Storage Temperature TSTG -65 to +150 ℃ Short Circuit Current IOS 5 mA Voltage on any pin relative to VSS V Note: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Recommended Operating Conditions (Voltage reference to GND, TA = 0 to 70℃) Parameter Symbol Min. Typ. Max. Unit VCC VSS 2.6 0 3.3 0 3.6 0 V V Supply Voltage Supply Voltage DC and Operation Conditions (Recommended operating conditions otherwise noted) Parameter Page Read with Serial Access Program Erase Symbol Test Conditions ILI fC=104MHz, CS#=VIL, IOUT=0mA CS#=VIH, WP#=0V/VCC CS#= VCC -0.2, WP#=0V/ VCC VIN=0 to VCC (max) Output Leakage Current ILO VOUT=0 to VCC (max) Input High Voltage Input Low Voltage, All inputs Output High Voltage Level Output Low Voltage Level VIH1 VIL1 VOH VOL IOH=-20uA IOL=1mA Operating Current ICC1 ICC2 ICC3 Stand-by Current (TTL) ISB1 Stand-by Current (CMOS) ISB2 Input Leakage Current Min. Typ.2 - 12 - 12 12 - Max. Unit 20 mA - 1 mA - 10 50 uA - - ±10 uA - - ±10 uA 0.7 x VCC -0.3 0.7 x VCC - - VCC +0.3 0.2 x VCC VCC +0.3 0.15 x VCC V V V V Note: 1. VIL can undershoot to -0.4V and VIH can overshoot to VCC+0.4V for durations of 20ns or less. 2. Typical value are measured at VCC =3.3V, TA=25℃. Not 100% tested. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 6/36 ESMT F50L512M41A Valid Block and Error Management Description Minimum / Maximum number of valid block number of block Bad block mark Mark location Requirement 502 / 512 Non FFh Column 2048 of page 0 and page 1 Note: 1. The device may include initial invalid blocks when first shipped. The number of valid blocks is presented as first shipped. Invalid blocks are defined as blocks that contain one or more bad bits which cause status failure during program and erase operation. Do not erase or program factory-marked bad blocks. Refer to the attached technical notes for appropriate management of initial invalid blocks. 2. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block at the time of shipment and is guaranteed to be a valid block up to 1K program/erase cycles with 1bit/512Byte ECC. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 7/36 ESMT F50L512M41A AC Test Condition (TA=0 to 70℃, VCC=2.7V~3.6V) Parameter Condition Input Pulse Levels Input Rise and Fall Times Input and Output Timing Levels Output Load 0.2VCC to 0.8VCC Max: 2.4ns VCC /2 1 TTL Gate and CL=15pF Capacitance (TA=25℃, VCC=3.3V, f=1.0MHz) Item Symbol Test Condition Min. Max. Unit CI/O CIN VIL = 0V VIN = 0V - 8 8 pF pF Input / Output Capacitance Input Capacitance Note: Capacitance is periodically sampled and not 100% tested. Read / Program / Erase Timing Characteristics Parameter Symbol Min. Typ. Max. Unit Average Program Time Number of Partial Program Cycles in the Same Page Block Erase Time Data Transfer from Cell to Register with Internal ECC tPROG - 400 900 us NOP - - 4 Cycle tBERS - 4 10 ms tRD - - 100 us General Timing Characteristic Parameter Clock frequency Hold# non-active hold time relative to SCK Hold# hold time relative to SCK Command deselect time CS# Setup Time CS# Hold Time The last valid Clock low to CS# high Output disable time Hold# non-active setup time relative to SCK Hold# setup time relative to SCK Data input setup time Data input hold time Output hold time Hold# to output Hi-Z Hold# to output Low-Z Clock low to output valid Clock high time Clock low time Clock rise time (slew rate) Clock fall time (slew rate) WP# setup time WP# hold time Resetting time during Idle/Read/Program/Erase Symbol fC tCD tCH tCS tCSS tCSH tCSCL tDIS tHC tHD tSUDAT tHDDAT tHO tHZ tLZ tV tWH tWL tCRT tCFT tWPS tWPH tRST Min. Max. 104MHz 5ns 5ns 100ns 5ns 5ns 5ns 20ns 7ns 5ns 2ns 5ns 0ns 15ns 15ns 8ns 4.5ns 4.5ns 0.1V/ns 0.1V/ns 20ns 100ns 5/100/900/500us Note: For first RESET condition after power up, tRST will be 1ms MAX. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 8/36 ESMT F50L512M41A Technical Notes Bus Operation SPI NAND supports two SPI modes: (Mode 0) CPOL (clock polarity) = 0, CPHA (clock phase) = 0 (Mode 3) CPOL=1, CPHA=1 Input data is latched in on the rising edge of SCK, and output data is available from the falling edge of SCK for both modes. When CS# is high, keep SCK at VCC (Mode 0) or VSS (Mode 3). Do not begin toggling SCK until after CS# is driven LOW. SPI Modes Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 9/36 ESMT F50L512M41A Feature Operations The GET FEATURE (0Fh) and SET FEATURE (1Fh) commands are used to alter the device behavior from the default power-on behavior. These commands use a 1-Byte feature address to determine which feature is to be read or modified. When a feature is set, it remains active until the device is power cycled or the feature is written to. Unless otherwise specified in Feature Setting Table, once the device is set, it remains set, even if a RESET (FFh) command is issued. Feature Settings Table Register Block Lock A0h OTP B0h Status Output Driver Data Bits Address C0h 4 D0h 7 6 5 4 3 2 1 0 BRWD1 OTP Protect Reserved Reserved OTP Enable Reserved BP2 BP0 Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved ECC_S1 BP1 ECC Enable2 ECC_S0 P_Fail E_Fail WEL Reserved DRV_S1 DRV_S0 Reserved Reserved Reserved Reserved 3 OIP Reserved Note: 1. BRWD is not protected (fixed) even when BRWD is enabled and WP# is LOW; (38h) is the default data byte value for Block Lock Register after power-up. 2. 1-bit internal ECC for all READ and PROGRAM operations can be enabled (ECC enable = 1) or disabled (ECC enable = 0); (10h) is the default data byte value for OTP Register after power-up. 3. WEL = 0 is the default data bit value for Status Register after power-up. 4. (20h) is the default data byte value for Output Driver Register after power-up. Block Protect Bits of Block Lock Register Table BP2 (5) BP1 (4) BP0 (3) 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 Protected Rows None; all unlocked Upper 1/64 locked Upper 1/32 locked Upper 1/16 locked Upper 1/8 locked Upper 1/4 locked Upper 1/2 locked All locked (default) OTP State Bits of OTP Register Table OTP Protect Bit (7) OTP Enable Bit (6) State 0 0 1 1 0 1 0 1 Normal operation (read array) Access OTP space Not applicable Lock the OTP area Driver Strength Bits of Output Driver Register Table DRV_S1 DRV_S0 0 0 1 1 0 1 0 1 Elite Semiconductor Memory Technology Inc. Driver Strength 100 % 75 % 50 % 25% Publication Date: May 2014 Revision: 1.1 10/36 ESMT F50L512M41A GET FEATURE (0Fh) Timing SET FEATURE (1Fh) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 11/36 ESMT F50L512M41A Array Write Enable / Disable The WRITE ENABLE (06h) command sets the WEL bit (in status register) to 1. This is required in the following WRITE operations that change the contents of the memory array: PAGE PROGRAM, BLOCK ERASE, and OTP PROGRAM. Contrarily, the WRITE DISABLE (04h) command sets the WEL bit to 0. This disables PAGE PROGRAM, BLOCK ERASE, and OTP PROGRAM. WRITE ENABLE (06h) Timing WRITE DISABLE (04h) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 12/36 ESMT F50L512M41A Status Register Software can read status register during the NAND device operation by issuing GET FEATURE (0Fh) command, followed by the feature address C0h. The status register will output the status of the operation, refer to Feature Setting Table, Bits of Status Register Table and ECC Status Bits of Status Register Table. Bits of Status Register Table Bit Name Mode Program fail (Bit 3) R Erase fail (Bit 2) R Write enable latch (Bit 1) W Operation in progress (Bit 0) R ECC_status1 (Bit 5) ECC_status0 (Bit 4) R Description P_Fail is set to 1 as a program failure has occurred. P_Fail = 1 will also be set if the user attempts to program an invalid address or a locked region. P_Fail is set to 0 during the PROGRAM EXECUTE command sequence or the RESET command. E_Fail is set to 1 as an erase failure has occurred. E_Fail = 1 will also be set if the user attempts to erase a locked region, or if ERASE operation fails. E_Fail is set to 0 at the start of the BLOCK ERASE command sequence or the RESET command. WEL must be set to 1 to indicate the current status of the write enable latch, prior to issuing PROGRAM EXECUTE or BLOCK ERASE command. It is set by issuing WRITE ENABLE command. WEL is disabled (WEL=0) by issuing the WRITE DISABLE command. OIP is set to 1 when the device is busy; it means a PROGRAM EXECUTE, PAGE READ, BLOCK ERASE, or RESET command is executing. OIP is cleared to 0 as the interface is in ready state. ECC Status Bits of Status Register Table shows the ECCS definitions. ECC_S is set to 00h either following a RESET, or at the beginning of the READ. It is then updated after the device completes a valid READ operation. ECC_S is invalid if ECC is disabled (via a SET FEATURE command to Bit 4 in OTP register). After power-up RESET, ECC_S is set to reflect the contents of block 0, page 0. ECC Status Bits of Status Register Table ECCS1 (5) ECCS0 (4) 0 0 1 1 0 1 0 1 Elite Semiconductor Memory Technology Inc. Description No errors 1-bit error detected and corrected 2-bit errors detected and not corrected Reserved Publication Date: May 2014 Revision: 1.1 13/36 ESMT F50L512M41A Error Management Mask Out Initial Invalid Blocks Initial invalid blocks are defined as blocks that contain one or more initial invalid bits whose reliability is not guaranteed by ESMT. The information regarding the initial invalid blocks is called the initial invalid block information. Devices with initial invalid blocks have the same quality level as devices with all valid blocks and have the same AC and DC characteristics. An initial invalid block does not affect the performance of valid blocks because it is isolated from the bit line and the common source line by a select transistor. The system design must be able to mask out the initial invalid blocks via address mapping. The 1st block, which is placed on 00h block address, is guaranteed to be a valid block up to 1K program/erase cycles with 1bit/512Byte ECC. Identifying Initial invalid Blocks All device locations are erased (FFh) except locations where the initial invalid block(s) information is written prior to shipping. The initial invalid block(s) status is defined by the 1st byte in the spare area. ESMT makes sure that either the 1st or 2nd page of every initial invalid block has non-FFh data at the 1st byte column address in the spare area. Do not erase or program factory-marked bad blocks. The host controller must be able to recognize the initial invalid block information and to create a corresponding table to manage block replacement upon erase or program error when additional invalid blocks develop with Flash memory usage. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 14/36 ESMT F50L512M41A Algorithm for Bad Block Scanning Check “FFh” at the 1st Byte column address in the spare area of the 1st and 2nd page in the block. For (i=0; i<Num_of_LUs; i++) { For (j=0; j<Blocks_Per_LU; j++) { Defect_Block_Found=False; Read_Page(lu=i, block=j, page=0); If (Data[coloumn=First_Byte_of_Spare_Area]!=FFh) Defect_Block_Found=True; Read_Page(lu=i, block=j, page=1); If (Data[coloumn=First_Byte_of_Spare_Area]!=FFh) Defect_Block_Found=True; If (Defect_Block_Found) Mark_Block_as_Defective(lu=i, block=j); } } Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 15/36 ESMT F50L512M41A Block Replacement Within its lifetime, number of invalid blocks may increase with NAND Flash memory. Refer to the qualification report for the actual data. The following possible failure modes should be considered to implement a highly reliable system. In the case of failure after ERASE or PROGRAM in status register, block replacement should be done. Because PROGRAM status fail during a page program does not affect the data of the other pages in the same block, block replacement can be executed with a page-sized buffer by finding an erased empty block and reprogramming the current target data and copying the rest of the replaced block. In case of READ, ECC must be employed. To improve the efficiency of memory space, it is recommended that the read or verification failure due to single bit error be reclaimed by ECC without any block replacement. The additional block failure rate does not include those reclaimed blocks. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 16/36 ESMT F50L512M41A ECC Protection ECC is enabled after device power-up, so the default PROGRAM and READ commands operate with internal ECC in the active state. During a PROGRAM operation, the device calculates an ECC code on the 2KB page in the cache register, before the page is written to the NAND Flash array. The ECC code is stored in the spare area of the page in array. During a READ operation, the page data is read from the array to the cache register, where the ECC code is calculated and compared with the ECC code value read from the array. If a single-bit data error is discovered, the error is corrected in the cache register and only the corrected data is on the output bus. ECC Protection Table Max Byte Address Min Byte Address 1FFh (511) 3FFh (1023) 5FFh (1535) 7FFh (2047) 800h (2048) 803h (2051) 807h (2055) 80Fh (2063) 810h (2064) 813h (2067) 817h (2071) 81Fh (2079) 820h (2080) 823h (2083) 827h (2087) 82Fh (2095) 830h (2096) 833h (2099) 837h (2103) 83Fh (2111) FFFh (4095) 000h (0) 200h (512) 400h (1024) 600h (1536) 800h (2048) 801h (2049) 804h (2052) 808h (2056) 810h (2064) 811h (2065) 814h (2068) 818h (2072) 820h (2080) 821h (2081) 824h (2084) 828h (2088) 830h (2096) 831h (2097) 834h (2100) 838h (2104) 840h (2112) ECC Protected Area Description Yes Main 0 User data 01 Yes Main 1 User data 11 Yes Main 2 User data 21 Yes Main 3 User data 31 No Reserved No ECC for main 0 Yes ECC for spare 02 Yes 2 Spare 0 1 User meta data 0 No Reserved No ECC for main 12 Yes ECC for spare 12 Yes Spare 1 User meta data 11 No Reserved No ECC for main 2 Yes ECC for spare 22 Yes 2 Spare 2 1 User meta data 2 No Reserved No ECC for main 32 Yes ECC for spare 3 Yes No 2 Spare 3 User meta data 31 Reserved Note: 1. The user areas must be programmed within a single partial-page programming operation so the NAND Flash device can calculate the proper ECC bytes. 2. When internal ECC is enabled, these areas are prohibited to be programming. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 17/36 ESMT F50L512M41A Addressing for Program Operation Within a block, the pages must be programmed consecutively from the LSB (least significant bit) page of the block to MSB (most significant bit) pages of the block. Random page address programming is prohibited. In this case, the definition of LSB page is the LSB among the pages to be programmed. Therefore, LSB page doesn’t need to be page 0. Operations and Timing Diagrams Read Operations and Serial Output The command sequence is follows: 13h (PAGE READ to cache) 0Fh (GET FEATURE command to read the status) 0Bh or 03h (READ FROM CACHE x1) / 3Bh (x2) / 6Bh (x4) PAGE READ command requires 24-bit address with 9 dummy and a 15-bit row address. After row address is registered, the device starts the transfer from the main array to the cache register, and is busy for tR time. During this time, GET FEATURE command can be issued to monitor the status of the operation. Following a status of successful completion, READ FROM CACHE command must be issued to read the data out of the cache. READ FROM CACHE command requires 16-bit address with 4 dummy bits and a 12-bit column address for the starting byte. The starting byte can be 0 to 2011, but after the end of the cache register is reached, the data does not wrap around and SO goes to a Hi-Z state. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 18/36 ESMT F50L512M41A PAGE READ (13h) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 19/36 ESMT F50L512M41A READ FROM CACHE (03h or 0Bh) Timing NOTE: Final data (LSB in the 2112th Byte for x1) would be reset to Hi-Z at SCK rising edge. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 20/36 ESMT F50L512M41A READ FROM CACHE x2 (3Bh) Timing th NOTE: Final data (last 2-bit in the 2112 Byte for x2) would be reset to Hi-Z at SCK rising edge. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 21/36 ESMT F50L512M41A READ FROM CACHE x4 (6Bh) Timing th NOTE: Final data (last 4-bit in the 2112 Byte for x4) would be reset to Hi-Z at SCK rising edge. Serial Output Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 22/36 ESMT F50L512M41A Program Operations and Serial Input Page Program The command sequence is follows: 06h (WRITE ENABLE) 02h (PROGRAM LOAD x1) / 32h (x4) 10h (PROGRAM EXECUTE) 0Fh (GET FEATURE command to read the status) The page program operation sequence programs 1 byte to 2112 bytes of data within a page. If WRITE ENABLE command is not issued (WEL bit is not set), then the rest of the program sequence is ignored. PROGRAM LOAD command requires 16-bit address with 4 dummy and a 12-bit column address, then the data bytes to be loaded into cache register. Only four partial page programs are allowed on a single page. If more than 2112 bytes are loaded, then those additional bytes are ignored by the cache register. After the data is loaded, PROGRAM EXECUTE command must be issued to transfer the data from cache register to main array, and is busy for tPROG time. PROGRAM EXECUTE command requires 24-bit address with 9 dummy bits and a 15-bit row address. PROGRAM LOAD (02h) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 23/36 ESMT F50L512M41A PROGRAM LOAD x4 (32h) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 24/36 ESMT F50L512M41A PROGRAM EXECUTE (10h) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 25/36 ESMT F50L512M41A Random Data Program The command sequence is follows: 06h (WRITE ENABLE) 84h (PROGRAM LOAD RANDOM DATA x1) / 34h (x4) 10h (PROGRAM EXECUTE) 0Fh (GET FEATURE command to read the status) The random data program operation sequence programs or replaces data in a page with existing data. PROGRAM LOAD RANDOM DATA command requires 16-bit address with 4 dummy bits and a 12-bit column address. New data is loaded in the column address provided. If the random data is not sequential, then another PROGRAM LOAD RANDOM DATA command must be issued with a new column address. After the data is loaded, PROGRAM EXECUTE command can be issued to start the programming operation. PROGRAM LOAD RANDOM DATA (84h) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 26/36 ESMT F50L512M41A PROGRAM LOAD RANDOM DATA x4 (34h) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 27/36 ESMT F50L512M41A Serial Input and tCSCL Timing Internal Data Move The command sequence is follows: 13h (PAGE READ to cache) 06h (WRITE ENABLE) 84h (PROGRAM LOAD RANDOM DATA x1) / 34h (x4); this is OPTIONAL in sequence. 10h (PROGRAM EXECUTE) 0Fh (GET FEATURE command to read the status) The INTERNAL DATA MOVE operation sequence programs or replaces data in a page with existing data. Prior to performing an INTERNAL DATA MOVE operation, the target page content must be read into the cache register. PAGE READ command must be followed with a WRITE ENABLE command to change the contents of memory array. Erase Operation The command sequence is follows: 06h (WRITE ENABLE) D8h (BLOCK ERASE) 0Fh (GET FEATURE command to read the status) BLOCK ERASE command requires 24-bit address with 9 dummy bits and a 15-bit row address. If WRITE ENABLE command is not issued (WEL bit is not set), then the rest of the erase sequence is ignored. After the row address is registered, the control logic automatically controls the timing and the erase-verify operations, and the device is busy for tBERS time. BLOCK ERASE command operates on one block at a time. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 28/36 ESMT F50L512M41A BLOCK ERASE (D8h) Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 29/36 ESMT F50L512M41A Read ID The device contains a product identification mode, initiated by writing 9Fh to the command register, followed by an address input of rd th th 00h. Five read cycles sequentially output the manufacturer code (C8h), and the device code and 3 , 4 , 5 cycle ID respectively. The command register remains in Read ID mode until further commands are issued to it. READ ID Timing ID Definition Table Product ID 1st Cycle (Maker Code) 2nd Cycle (Device Code) 3rd Cycle 4th Cycle 5th Cycle F50L512M41A C8h 20h 7Fh 7Fh 7Fh Description st 1 Byte 2nd Byte 3rd Byte 4th Byte th 5 Byte Maker Code Device Code JEDEC Maker Code Continuation Code, 7Fh JEDEC Maker Code Continuation Code, 7Fh JEDEC Maker Code Continuation Code, 7Fh Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 30/36 ESMT F50L512M41A WP# Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 31/36 ESMT F50L512M41A HOLD# Timing HOLD# input provides a method to pause serial communication with the device but doesn’t terminate any READ, PROGRAM, or ERASE operation currently in progress. Hold mode starts at the falling edge of HOLD# provided SCK is also Low. If SCK is High when HOLD# goes Low, hold mode begins after the next falling edge of SCK. Similarly, hold mode is exited at the rising edge of HOLD# provided SCK is also Low. If SCK is High, hold mode ends after the next falling edge of SCK. During hold mode, SO is Hi-Z, and SI and SCK inputs are ignored. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 32/36 ESMT F50L512M41A Power-Up During power transitions, VCC is internally monitored. 250us after VCC has reached 2.5V, WP# is taken High, the device automatically performs the RESET command. The first access to the SPI NAND device can occur 1ms after WP# goes High, and then CS# can be driven Low, SCK can start, and the required command can be issued to the device. Power-Up and RESET Timing Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 33/36 ESMT F50L512M41A PACKING DIMENSIONS 8-Contact LGA ( 8x6 mm ) Symbol A b D D1 E E1 e L Min 0.70 0.35 7.90 3.30 5.90 4.20 0.45 Dimension in mm Min 0.75 0.40 8.00 3.40 6.00 4.30 1.27 BSC 0.50 Min 0.80 0.48 8.10 3.50 6.10 4.40 Min 0.028 0.014 0.311 0.130 0.232 0.165 0.55 0.018 Dimension in inch Norm 0.030 0.016 0.315 0.134 0.236 0.169 0.050 BSC 0.020 Max 0.031 0.019 0.319 0.138 0.240 0.173 0.022 Controlling dimension : millimeter (Revision date : Feb 13 2014) Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 34/36 ESMT F50L512M41A Revision History Revision Date 0.1 2013.01.30 Original 0.2 2013.05.21 Add packing dimension 0.3 2013.07.16 1. Add 16-pin SOIC package 2. Add Bad-Bloack-Protect and the specification of tCSCL 3. Modify the description of Identifying Initial Invalid Block(s) and Block Replacement Management 4. Modify the description of feature operations and ECC_S bits 5. Delete Automatic Read 6. Modify the specification of tHC and tRST 7. Modify ECC protection table and ID definition table 8. Add the note for Read Operation and the description of HOLD# Timing 0.4 2013.08.23 Delete 16-pin SOIC package 0.5 2014.02.19 Add LGA package 1.0 2014.04.17 1. Delete "Preliminary" 2. Delete WSON package 1.1 2014.05.27 Modify the description of Identifying Initial Invalid Blocks Elite Semiconductor Memory Technology Inc. Description Publication Date: May 2014 Revision: 1.1 35/36 ESMT F50L512M41A Important Notice All rights reserved. No part of this document may be reproduced or duplicated in any form or by any means without the prior permission of ESMT. The contents contained in this document are believed to be accurate at the time of publication. ESMT assumes no responsibility for any error in this document, and reserves the right to change the products or specification in this document without notice. The information contained herein is presented only as a guide or examples for the application of our products. No responsibility is assumed by ESMT for any infringement of patents, copyrights, or other intellectual property rights of third parties which may result from its use. No license, either express , implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of ESMT or others. Any semiconductor devices may have inherently a certain rate of failure. To minimize risks associated with customer's application, adequate design and operating safeguards against injury, damage, or loss from such failure, should be provided by the customer when making application designs. ESMT's products are not authorized for use in critical applications such as, but not limited to, life support devices or system, where failure or abnormal operation may directly affect human lives or cause physical injury or property damage. If products described here are to be used for such kinds of application, purchaser must do its own quality assurance testing appropriate to such applications. Elite Semiconductor Memory Technology Inc. Publication Date: May 2014 Revision: 1.1 36/36