KGD(Known Good Die)

Introduction to ESMT
Known Good Die
1Q of Y2006
Why Choose ESMT as Partner of
MCP / MCM / SiP
ESMT’s KGD(Known Good Die) Can meet top
level (level1) requirement as definition of EIAJ
EDR-4703 : Make KGD reach the same
quality/reliability level as packaged products
should be.
Level 1: KGD (Known Good Dice)
Level 2 : KTD (Known Tested Die)
Level 3 : PD (Probed Die)
KGD Definition in EIAJ EDR-4703
EIAJ EDR-4703 : Bare die quality level classification
Level 1
Level 2
LEVEL
KGD
KTD
Visual mechanical
V
Level 3
PD
V
V
Electric characteristics
V
V
not assured after
mounting
Early failures
V
not assured
not assured
Long-term reliability
V
not assured
not assured
Why Choose ESMT as Partner of
MCP / MCM / SiP
Well-experienced KGD business relationship
with alliances.
Excellent power consumption makes your MCP
solution much powerful in handset/portable
solution. ESMT Mobile SDRAM series product
perform 88% off power consumption against
normal SDRAM.
Well Experience in KGD for MCP/SiP
of Diverse Applications
DSC
Digital TV
LCD Controller
MP3
Mobile phone
Optical Storage
Portable Multimedia Player
ESMT KGD Ordering Information
- List of Available part
1Mx16 SDRAM (1.8V~3.3V) :
M12L16161A / M12S16161A / M12D16161A
4Mx16 SDRAM (1.8V~3.3V) :
M12L64164A / M12S64164A / M12D64164A
2Mx32 SDRAM (1.8V~3.3V) :
M12L64322A / M12S64322A / M12D64322A
4Mx32 SDRAM (2.5V~3.3V) :
M12L128324A / M12S128324A
4Mx32 DDR SDRAM (2.5V) :
M13S128324A
Logistic Control of ESMT KGD
Stable supply and reasonable delivery
schedule(lead-time) reduce risk on your
production control.
ESMT supports logistic control for your
MCP assembly both in data flow and
material flow.
Further Information Requirement
on
ESMT’s KGD
Welcome to contact us for further
information you need such as wafer
testing flow, power consumption and
quality/reliability control flow.
Emmie Wang : Technical Marketing ,
[email protected]
886-3-5781970 ext 1113
ESMT is your best partner on memory
die support for your Multi-chip package