ONSEMI CM1416

Headset/Speaker EMI Filter
with ESD Protection
CM1416
Features
Product Description
•
The CM1416 is an EMI filter array with ESD
protection, which integrates two Pi-filters (C-R-C).
The CM1416 has component values of 117pF-2Ω117pF. The parts include avalanche-type ESD diodes
on every pin, which provide a very high level of
protection for sensitive electronic components that
may be subjected to electrostatic discharge (ESD).
The ESD diodes safely dissipate ESD strikes of
±30kV, exceeding the maximum requirement of the
IEC 61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human
Body Model (HBM) ESD, these devices protect for
contact discharges at greater than ±30kV.
•
•
•
•
•
•
•
•
Functionally and pin compatible with the
CSPEMI201A and CM1411
OptiGuard™ coated for improved reliability at
assembly
Two channels of EMI filtering for 8Ω speakers
Pi-style EMI filters in a capacitor-resistorcapacitor (C-R-C) network
Greater than 30dB attenuation at 1GHz
±30kV ESD protection on each channel per
IEC 61000-4-2 Level 4, contact discharge
Extremely low lead inductance for optimum filter
and ESD performance
5-bump, 0.96mm X 1.33mm footprint Chip Scale
Package (CSP)
RoHS-compliant, lead-free finishing
Applications
•
•
•
Headset Speaker port in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs
or notebook computers.
This device is well suited for portable electronics (e.g.
mobile handsets, PDAs, notebook computers)
because of its small package and easy-to-use pin
assignments. In particular, the CM1416 is ideal for
filtering unwanted EMI-induced noise and providing
ESD protection for headset speaker port applications
in wireless handsets with 8Ω speakers.
The CM1416 incorporates OptiGuard™ coating which
results in improved reliability at assembly. The
CM1416 is available in a space saving, low profile
Chip Scale Package with RoHS-compliant, lead-free
finishing.
©2010 SCILLC. All rights reserved.
April 2010 Rev. 2
Publication Order Number:
CM1416/D
CM1416
Block Diagram
Rev. 2 | Page 2 of 9 | www.onsemi.com
CM1416
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
A1
FILTER1
EMI FIlter 1
A3
FILTER2
EMI FIlter 2
B2
GND
C1
FILTER1
EMI FIlter 1
C3
FILTER2
EMI FIlter 2
Device Ground
Ordering Information
PART NUMBERING INFORMATION
Lead-free Finish
Pins
Package
Ordering Part Number1
Part Marking
5
CSP
CM1416-03CP
CJ
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
-65 to +150
°C
DC Power per Resistor (note 5)
100
mW
DC Package Power Rating (note 5)
500
mW
RATING
UNITS
-40 to +85
°C
Storage Temperature Range
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
Rev. 2 | Page 3 of 9 | www.onsemi.com
CM1416
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL
PARAMETER
R
R1 Resistance
CTOT
CONDITIONS
MIN
TYP
MAX
UNITS
Ω
2
Total Channel Capacitance
At 2.5VDC, 1MHz,
30mVAC
187
234
281
pF
C1 Capacitance
At 2.5VDC, 1MHz,
30mVAC
93
117
140
pF
VDIODE
Diode Standoff Voltage
IDIODE = 10μA
6.0
ILEAK
Diode Leakage Current
VIN= 3.3V
(reverse bias voltage)
0.1
2
μA
VSIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
7.6
-7.6
9.8
-6.4
V
V
C1
VESD
RDYN
fC
ILOAD = 10mA
ILOAD = -10mA
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Note 2
Dynamic Resistance
Positive
Negative
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
6.4
-9.8
V
R = 2Ω, C = 117pF
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Rev. 2 | Page 4 of 9 | www.onsemi.com
±30
kV
±30
kV
0.95
0.90
Ω
Ω
21
MHz
CM1416
Performance Information
Figure 1. Typical EMI FIlter Performance (0VDC, 50 Ohm Environment)
Figure 2. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
Rev. 2 | Page 5 of 9 | www.onsemi.com
CM1416
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50μm
Solder Ball Side Coplanarity
+20μm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder Mask Defined Pad
0.240mm DIA.
Solder Stencil Opening
0.300mm DIA.
Solder Mask Opening
0.290mm DIA.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 6 of 9 | www.onsemi.com
260°C
CM1416
Mechanical Details
CSP Mechanical Specifications
The CM1416 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below.
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
5
Millimeters
Inches
Dim
Min
Nom
Max
Min
Nom
Max
A1
0.955 1.000 1.045 0.0376 0.0394 0.0411
A2
1.325 1.370 1.415 0.0522 0.0539 0.0557
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.200 0.250 0.300 0.0079 0.0098 0.0118
C2
0.200 0.250 0.300 0.0079 0.0098 0.0118
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
Package Dimensions for
CM1416 Chip Scale Package
3500 pieces
Controlling dimension: millimeters
Rev. 2 | Page 7 of 9 | www.onsemi.com
CM1416
CSP Tape and Reel Specifications
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P0
P1
CM1416
1.33 x 0.96 x 0.644
1.42 x 1.07 x 0.74
8mm
178mm (7")
3500
4mm
4mm
Figure 5. Tape and Reel Mechanical Data
Rev. 2 | Page 8 of 9 | www.onsemi.com
CM1416
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors
harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action
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Rev. 2 | Page 9 of 9 | www.onsemi.com
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