HD74AC245/HD74ACT245 Octal Bi-directional Transceiver with 3-State Input/Output REJ03D0263–0200Z (Previous ADE-205-384 (Z)) Rev.2.00 Jul.16.2004 Description The HD74AC245/HD74ACT245 contains eight non-inverting bidirectional buffers with 3-state outputs and is intended for bus-oriented applications. Current sinking capability is 24 mA at both the A and B ports. The Transmit/Receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active-High) enables data from A ports to B ports; Receive (active-Low) enables data from B ports to A ports. The Output Enable input, when High, disables, both A and B ports by placing them in a High Z condition. Features • Noninverting Buffers • Bi-directional Data Path • A and B Outputs Source/Sink 24 mA • HD74ACT245 has TTL-Compatible Inputs • Ordering Information: Ex. HD74AC245 Part Name HD74AC245P Package Type Package Code Package Abbreviation Taping Abbreviation (Quantity) DIP-20 pin DP-20N, -20NEV P HD74AC245FPEL SOP-20 pin (JEITA) FP-20DAV FP EL (2,000 pcs/reel) HD74AC245RPEL SOP-20 pin (JEDEC) FP-20DBV RP EL (1,000 pcs/reel) HD74AC245TELL TSSOP-20 pin T ELL (2,000 pcs/reel) TTP-20DAV — Notes: 1. Please consult the sales office for the above package availability. 2. The packages with lead-free pins are distinguished from the conventional products by adding V at the end of the package code. Rev.2.00, Jul.16.2004, page 1 of 8 HD74AC245/HD74ACT245 Pin Names OE T/R A0 to A7 B0 to B7 Output Enable Input Transmit/Receive Input Side A 3-State Inputs or 3-State Outputs Side B 3-State Inputs or 3-State Outputs Pin Arrangement T/R 1 20 VCC A0 2 19 OE A1 3 18 B0 A2 4 17 B1 A3 5 16 B2 A4 6 15 B3 A5 7 14 B4 A6 8 13 B5 A7 9 12 B6 GND 10 11 B7 (Top view) Truth Tables Inputs OE T/R R Outputs L L Bus B Data to Bus A L H H X Bus A Data to Bus B High Z State H : L : X : High Voltage Level Low Voltage Level Immaterial Absolute Maximum Ratings Item Supply voltage DC input diode current Symbol Ratings Unit Condition VCC IIK –0.5 to 7 –20 V mA VI mA V VI = Vcc+0.5V DC input voltage 20 –0.5 to Vcc+0.5 DC output diode current IOK –50 50 mA mA VO = –0.5V VO = Vcc+0.5V DC output voltage DC output source or sink current VO IO –0.5 to Vcc+0.5 ±50 V mA DC VCC or ground current per output pin Storage temperature ICC, IGND Tstg ±50 –65 to +150 mA °C Rev.2.00, Jul.16.2004, page 2 of 8 VI = –0.5V HD74AC245/HD74ACT245 Recommended Operating Conditions: HD74AC245 Item Symbol Ratings Unit Supply voltage Input and Output voltage VCC VI, VO 2 to 6 0 to VCC V V Operating temperature Input rise and fall time (except Schmitt inputs) VIN 30% to 70% VCC Ta tr, tf –40 to +85 8 °C ns/V Condition VCC = 3.0V VCC = 4.5 V VCC = 5.5 V DC Characteristics: HD74AC245 Item Input Voltage Symbol VIH VIL Output voltage VOH VOL Ta = 25°°C Vcc (V) 3.0 min. 2.1 typ. 1.5 max. — Ta = –40 to +85°°C min. max. 2.1 — 4.5 5.5 3.15 3.85 2.25 2.75 — — 3.15 3.85 — — 3.0 4.5 — — 1.50 2.25 0.9 1.35 — — 0.9 1.35 5.5 3.0 — 2.9 2.75 2.99 1.65 — — 2.9 1.65 — 4.5 5.5 4.4 5.4 4.49 5.49 — — 4.4 5.4 — — 3.0 4.5 2.58 3.94 — — — — 2.48 3.80 — — 5.5 3.0 4.94 — — 0.002 — 0.1 4.80 — — 0.1 4.5 5.5 — — 0.001 0.001 0.1 0.1 — — 0.1 0.1 3.0 4.5 — — — — 0.32 0.32 — — 0.37 0.37 Unit V Condition VOUT = 0.1 V or VCC –0.1 V VOUT = 0.1 V or VCC –0.1 V V VIN = VIL or VIH IOUT = –50 µA VIN = VIL or VIH IOH = –12 mA IOH = –24 mA IOH = –24 mA VIN = VIL or VIH IOUT = 50 µA VIN = VIL or VIH IOL = 12 mA IOL = 24 mA Input leakage current IIN 5.5 5.5 — — — — 0.32 ±0.1 — — 0.37 ±1.0 µA VIN = VCC or GND 3 State current IOZ 5.5 — — ±0.5 — ±5.0 µA IOLD 5.5 — — — 86 — mA VIN(OE) = VIL, VIH VIN = VCC or GND VOUT = VCC or GND VOLD = 1.1 V IOHD ICC 5.5 5.5 — — — — — 8.0 –75 — — 80 mA µA VOHD = 3.85 V VIN = VCC or ground Dynamic output current* Quiescent supply current IOL = 24 mA *Maximum test duration 2.0 ms, one output loaded at a time. Recommended Operating Conditions: HD74ACT245 Item Symbol Ratings Unit Supply voltage Input and output voltage VCC VI, VO 2 to 6 0 to VCC V V Operating temperature Input rise and fall time (except Schmitt inputs) VIN 0.8 to 2.0 V Ta tr, tf –40 to +85 8 °C ns/V Rev.2.00, Jul.16.2004, page 3 of 8 Condition VCC = 4.5V VCC = 5.5V HD74AC245/HD74ACT245 DC Characteristics: HD74ACT245 Item Input voltage Output voltage Symbol Ta = 25°°C VIH 4.5 min. 2.0 typ. 1.5 max. — Ta = –40 to +85°°C min. max. 2.0 — VIL 5.5 4.5 2.0 — 1.5 1.5 — 0.8 2.0 — — 0.8 VOH 5.5 4.5 — 4.4 1.5 4.49 0.8 — — 4.4 0.8 — 5.5 4.5 5.4 3.94 5.49 — — — 5.4 3.80 — — 5.5 4.5 4.94 — — 0.001 — 0.1 4.80 — — 0.1 5.5 4.5 — — 0.001 — 0.1 0.32 — — 0.1 0.37 — — — — 0.32 ±0.1 — — 0.37 ±1.0 VOL VCC (V) Unit V Condition VOUT = 0.1 V or VCC–0.1 V VOUT = 0.1 V or VCC –0.1 V V VIN = VIL or VIH IOUT = –50 µA VIN = VIL IOH = –24 mA IOH = –24 mA VIN = VIL or VIH IOUT = 50 µA VIN = VIL IOL = 24 mA Input current IIN 5.5 5.5 IOL = 24 mA µA VIN = VCC or GND 3 State current IOZ 5.5 — — ±0.5 — ±5.0 µA ICC/input current ICCT 5.5 — 0.6 — — 1.5 mA VIN = VIL, VIH VOUT = VCC or GND VIN = VCC–2.1 V Dynamic output current* IOLD IOHD 5.5 5.5 — — — — — — 86 –75 — — mA mA VOLD = 1.1 V VOHD = 3.85 V Quiescent supply current ICC 5.5 — — 8.0 — 80 µA VIN = VCC or ground *Maximum test duration 2.0 ms, one output loaded at a time. AC Characteristics: HD74AC245 Item Symbol VCC (V)*1 Ta = +25°C CL = 50 pF Min Typ Max Ta = –40°C to +85°C CL = 50 pF Min Max Unit Propagation delay Data to output tPLH 3.3 5.0 1.0 1.0 5.0 3.5 8.5 6.5 1.0 1.0 9.0 7.0 ns Propagation delay Data to output tPHL 3.3 5.0 1.0 1.0 5.0 3.5 8.5 6.0 1.0 1.0 9.0 7.0 ns Output enable time tZH 3.3 5.0 1.0 1.0 7.0 5.0 11.5 8.5 1.0 1.0 12.5 9.0 ns Output enable time tZL 3.3 5.0 1.0 1.0 7.5 5.5 12.0 9.0 1.0 1.0 13.5 9.5 ns Output disable time tHZ 3.3 5.0 1.0 1.0 6.5 5.5 12.0 9.0 1.0 1.0 12.5 10.0 ns Output disable time tLZ 3.3 5.0 1.0 1.0 7.0 5.5 11.5 9.0 1.0 1.0 13.0 10.0 ns Note: 1. Voltage Range 3.3 is 3.3 V ± 0.3 V Voltage Range 5.0 is 5.0 V ± 0.5 V Rev.2.00, Jul.16.2004, page 4 of 8 HD74AC245/HD74ACT245 AC Characteristics: HD74ACT245 Ta = +25°C CL = 50 pF Item Propagation delay Data to output Ta = –40°C to +85°C CL = 50 pF tPLH VCC (V)*1 Min 5.0 1.0 Typ 4.0 Max 7.5 1.0 8.0 ns Symbol Min Max Unit Propagation delay Data to output Output enable time tPHL 5.0 1.0 4.0 8.0 1.0 9.0 ns tZH 5.0 1.0 5.0 10.0 1.0 11.0 ns Output enable time Output disable time tZL tHZ 5.0 5.0 1.0 1.0 5.5 5.5 10.0 10.0 1.0 1.0 12.0 11.0 ns ns Output disable time tLZ 5.0 1.0 5.0 10.0 1.0 11.0 ns Note: 1. Voltage Range 5.0 is 5.0 V ± 0.5 V Capacitance Item Input capacitance Symbol CIN 4.5 pF VCC = 5.5 V Input/output capacitance Power dissipation capacitance CI/O CPD 15.0 45.0 pF pF VCC = 5.5 V VCC = 5.0 V Rev.2.00, Jul.16.2004, page 5 of 8 Typ Unit Condition HD74AC245/HD74ACT245 Package Dimensions As of January, 2003 Unit: mm 24.50 25.40 Max 6.30 11 1 7.00 Max 20 10 2.54 ± 0.25 0.51 Min 1.27 Max 0.48 ± 0.10 2.54 Min 5.08 Max 1.30 0.89 7.62 + 0.11 0.25 – 0.05 0˚ – 15˚ Package Code JEDEC JEITA Mass (reference value) DP-20N — Conforms 1.26 g Unit: mm 24.50 25.40 Max 1 7.00 Max 11 6.30 20 10 1.30 2.54 ± 0.25 *0.48 ± 0.08 0.51 Min 1.27 Max 2.54 Min 5.08 Max 0.89 7.62 *0.25 ± 0.06 0˚ – 15˚ *NI/Pd/AU Plating Rev.2.00, Jul.16.2004, page 6 of 8 Package Code JEDEC JEITA Mass (reference value) DP-20NEV — Conforms 1.26 g HD74AC245/HD74ACT245 As of January, 2003 Unit: mm 12.6 13 Max 11 1 10 1.27 *0.40 ± 0.06 0.20 7.80 +– 0.30 1.15 0˚ – 8 ˚ 0.10 ± 0.10 0.80 Max *0.20 ± 0.05 2.20 Max 5.5 20 0.70 ± 0.20 0.15 0.12 M Package Code JEDEC JEITA Mass (reference value) *Ni/Pd/Au plating FP-20DAV — Conforms 0.31 g As of January, 2003 Unit: mm 12.8 13.2 Max 11 1 10 1.27 *0.40 ± 0.06 0.20 ± 0.10 0.935 Max *0.25 ± 0.05 2.65 Max 7.50 20 0.25 10.40 +– 0.40 1.45 0˚ – 8˚ 0.57 0.70 +– 0.30 0.15 0.12 M *Ni/Pd/Au plating Rev.2.00, Jul.16.2004, page 7 of 8 Package Code JEDEC JEITA Mass (reference value) FP-20DBV Conforms — 0.52 g HD74AC245/HD74ACT245 As of January, 2003 Unit: mm 6.50 6.80 Max 11 1 10 4.40 20 0.65 *0.20 ± 0.05 1.0 0.13 M 6.40 ± 0.20 *Ni/Pd/Au plating Rev.2.00, Jul.16.2004, page 8 of 8 0.07 +0.03 –0.04 0.10 *0.15 ± 0.05 1.10 Max 0.65 Max 0˚ – 8˚ 0.50 ± 0.10 Package Code JEDEC JEITA Mass (reference value) TTP-20DAV — — 0.07 g Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501 Renesas Technology Europe Limited. Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900 Renesas Technology Europe GmbH Dornacher Str. 3, D-85622 Feldkirchen, Germany Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11 Renesas Technology Hong Kong Ltd. 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2375-6836 Renesas Technology Taiwan Co., Ltd. FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. 26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 © 2004. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .1.0