IS31SE5000 IR SENSOR FOR TOUCHLESS MOTION AND PROXIMITY October 2012 FEATURES GENERAL DESCRIPTION The IS31SE5000 is a low-power, reflectance-based infrared light sensor with advanced signal processing and digital output. The sensor can detect making touchless motion possible. The IS31SE5000 uses one infrared LED and 2-channel receivers which pick up the reflectance signal from the 2 photodiodes to perform touchless motion detection. When horizontal motion or proximity motion happen, the flag bits in status register will be triggered and an interrupt signal is generated to inform the master to read the flag bit through I2Cinterface. Supply voltage from 2.7V~5.5V 400kHz I2C compatible interface 1µA shutdown current 0.6mA low supply current Detection range can be adjusted Motion Mode and Proximity Mode Integrated signal processing and digital output Auto interrupt clear Package in UTQFN-12 (2mm × 2mm) APPLICATIONS IS31SE5000 is available in UTQFN-12 (2mm × 2mm). It operates from 2.7V to 5.5V over the temperature range of -40°C to +85°C. Smart phones/GPS/MID/PAD/MP3 Lighting/switch controller/ household electrical appliances Toys/game machine TYPICAL APPLICATION CIRCUIT VBattery 1 F 10 VBattery VCC 0.1 F IRLED 11 IRLED 8 PD1 7 PD2 VDD 4.7k 4.7k 4.7k 4 3 Micro Controller 2 1 IS31SE5000 RX1 SDA SCL RX2 INTB SDB GND 12 100k PD1 IRLED PD2 LCD Figure 1 Typical Application Circuit (Motion Mode) Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 1 IS31SE5000 VBattery 1 F 10 VBattery VCC 0.1 F IRLED 11 IRLED VDD 4.7k 4.7k 4.7k 4 3 Micro Controller 2 1 IS31SE5000 SDA RX1 SCL 8 PD1 INTB SDB GND 12 100k PD1 IRLED LCD PD1 Figure 2 IRLED Typical Application Circuit (Proximity Mode) Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 2 IS31SE5000 PIN CONFIGURATION 10 VCC INTB 2 8 RX1 SCL 3 7 RX2 SDA NC 6 9 NC NC 5 SDB 1 4 UTQFN-12 11 IRLED Pin Configuration (Top View) 12 GND Package PIN DESCRIPTION No. Pin Description 1 SDB Shutdown pin, low active. 2 INTB Interrupt signal, pulled down to inform master to read data. 3 SCL The input for the I2C clock signal. 4 SDA The input for the I2C data signal. 5,6,9 NC Not connect. 7 RX2 Input signal of channel 2 infrared LED receiver. 8 RX1 Input signal of channel 1 infrared LED receiver. 10 VCC Power supply. 11 IRLED IRLED emitting pin. Connect to IRLED. 12 GND Ground. Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 3 IS31SE5000 ORDERING INFORMATION Industrial Range: -40°C to +85°C Order Part No. Package QTY/Reel IS31SE5000-UTLS2-TR UTQFN-12, Lead-free 3000 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 4 IS31SE5000 ABSOLUTE MAXIMUM RATINGS Supply voltage, VCC Voltage at any input pin Maximum junction temperature, TJMAX Operating temperature range, TA Storage temperature range, TSTG -0.3V ~ +6.0V -0.3V ~ VCC+0.3V 150°C -40°C ~ +85°C -65°C ~ +150°C Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS TA = 25°C, VCC = 2.7V ~ 5.5V, unless otherwise noted. Typical value are TA = +25°C, VCC = 3.6V. Symbol Parameter Condition Min. Typ. Unit 5.5 V VCC Supply voltage ICC Quiescent current VSDB = VCC 0.6 ISD Shutdown current VSDB = 0V 1 IIR Average current of IRLED VLED =3.6V(Note 1) 0.8 mA IP Peak current of IRLED EC = “000” (Note 1,2) 400 mA INTB pin output voltage low IOL = 4mA Maximum detect distance EC = “000” (Note 3) VIH Input logic high voltage VCC = 2.7V VIL Input logic low voltage VCC = 5.5V VINT L 2.7 Max. mA 3 0.2 9 μA V cm 0.4 1.4 V V DIGITAL INPUT SWITCHING CHARACTERISTICS (Note 1) Symbol Parameter Condition Min. Typ. Max. Unit 400 kHz fSCL Serial-Clock frequency tBUF Bus free time between a STOP and a START condition 1.3 μs tHD, STA Hold time (repeated) START condition 0.6 μs tSU, STA Repeated START condition setup time 0.6 μs tSU, STO STOP condition setup time 0.6 μs tHD, DAT Data hold time tSU, DAT Data setup time 100 ns tLOW SCL clock low period 1.3 μs tHIGH SCL clock high period 0.7 μs 0.9 μs tR Rise time of both SDA and SCL signals, receiving (Note 4) 20+0.1Cb 300 ns tF Fall time of both SDA and SCL signals, receiving (Note 4) 20+0.1Cb 300 ns Note 1: Guaranteed by design. Note 2: The EC bit is used to set the emitting current. Please refer to the detailed information in Page 8. Note 3: Because of different IRLED, receive LED and material of cover, the detection distance will be different. The detail parameter should be tested. IR11-21C/TR8 (for IRLED) and PD15-22C-R/TR8 (for PD) is recommended. Note 4: Cb = total capacitance of one bus line in pF. ISINK ≤ 6mA. tR and tF measured between 0.3 × VCC and 0.7 × VCC. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 5 IS31SE5000 DETAILED DESCRIPTION After the last bit of the chip address is sent, the master checks for the IS31SE5000’s acknowledge. The master releases the SDA line high (through a pull-up resistor). Then the master sends an SCL pulse. If the IS31SE5000 has received the address correctly, then it holds the SDA line low during the SCL pulse. If the SDA line is not low, then the master should send a “STOP” signal (discussed later) and abort the transfer. I2C INTERFACE The IS31SE5000 uses a serial bus, which conforms to the I2C protocol, to control the chip’s functions with two wires: SCL and SDA. The IS31SE5000 has a 7-bit slave address (A7:A1), followed by the R/W bit, A0. Set A0 to “0” for a write command and set A0 to “1” for a read command. The complete slave address is: Following acknowledge of IS31SE5000, the register address byte is sent, most significant bit first. IS31SE5000 must generate another acknowledge indicating that the register address has been received. Table 1 Slave Address (Write only): Bit A7:A1 A0 Value 1010101 1/0 Then 8-bit of data byte are sent next, most significant bit first. Each data bit should be valid while the SCL level is stable high. After the data byte is sent, the IS31SE5000 must generate another acknowledge to indicate that the data was received. The SCL line is uni-directional. The SDA line is bi-directional (open-collector) with a pull-up resistor (typically 4.7kΩ). The maximum clock frequency specified by the I2C standard is 400kHz. In this discussion, the master is the microcontroller and the slave is the IS31SE5000. The “STOP” signal ends the transfer. To signal “STOP”, the SDA signal goes high while the SCL signal is high. READING PORT REGISTERS The timing diagram for the I2C is shown in Figure 3. The SDA is latched in on the stable high level of the SCL. When there is no interface activity, the SDA line should be held high. To read the device data, the bus master must first send ____ the IS31SE5000 address with the R/W bit set to “0”, followed by the command byte, which determines which register is accessed. After a restart, the bus master must then send the IS31SE5000 address with The “START” signal is generated by lowering the SDA signal while the SCL signal is high. The start signal will alert all devices attached to the I2C bus to check the incoming address against their own chip address. ____ the R/W bit set to “1”. Data from the register defined by the command byte is then sent from the IS31SE5000 to the master (Figure 6). The 8-bit chip address is sent next, most significant bit first. Each address bit must be stable while the SCL level is high. Figure 3 Interface timing Figure 4 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 Bit transfer 6 IS31SE5000 Figure 5 Writing to IS31SE5000 Figure 6 Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 Reading from IS31SE5000 7 IS31SE5000 REGISTERS DEFINITIONS Table 2 Register Function Address Name Function R/W Table Default xxxx xxxx 00h Status Register Store the motion information R 3 01h Shutdown Register Set software shutdown W 4 11h Configuration Register Configure operating function W 5 Table 3 00h Status Register (Read Only) Table 4 0000 0000 01h Shutdown Register Bit D7:D4 D3:D2 D1:D0 Bit D7:D1 D0 Name - PD MD Name - SSD Default 0000000 0 Default - The Status Register stores the motion information which detected by IS31SE5000. PD 01 10 Others Proximity Detection (Figure 7) Be off Be close No motion The Shutdown Register sets software shutdown mode of IS31SE5000. SSD 0 1 Software Shutdown Enable Software shutdown mode Normal operation Table 5 11h Configuration Register Bit D7:D4 D3:D1 D0 Name - EC MODE Default 0000 000 0 The Configuration Register sets the operating function. PD1 Figure 7 MD 01 10 Others IRLED Proximity Mode Detect (Side View) Motion Detection (Figure 8) From PD2 to PD1 From PD1 to PD2 No motion EC Emitting Current Setting (Adjusting detection distance, information in Page 10) 000 400mA 001 280mA 01x 210mA 1xx 70mA MODE 0 1 Figure 8 refer to detail Mode Selection Motion mode Proximity mode Motion Mode Detect (Top View) Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 8 IS31SE5000 FUNCTIONAL BLOCK DIAGRAM Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 9 IS31SE5000 APPLICATION INFORMATION GENERAL DESCRIPTION DETECTION DISTANCE The IS31SE5000 is a low-power, reflectance-based infrared light sensor with advanced signal processing and digital output. The sensor can detect making touchless motion possible. The emitting current can be adjusted by the EC bit of Configuration Register (11h). The larger current is, the longer distance detected. MODE CONTROL By setting the MODE bit of Configuration Register (11h) IS31SE5000 operates in Motion Mode or Proximity Mode. When setting the MODE bit to “0”, IS31SE5000 operates in the Motion Mode. When the MODE bit is set to “1”, IS31SE5000 operates in the Proximity Mode. STATUS INFORMATION Master can get the current motion information by reading the PD, MD bits of Status Register (00h). MOTION MODE Because of the different IRLED, receiver and material of cover, the detection distance will be different for the same emitting current. Detail information should be decided by testing. In the stable mode, the average emitting current for both two modes, IIR, can be calculated by the Equation (1): I IR 1 I 512 EC (1) In the operating mode, the average emitting current for the Proximity Mode is the same as stable mode. And the average emitting current for the Motion Mode can be calculated by the Equation (2): 1 I 8 EC The MD bit is available when IS31SE5000 operates in the Motion Mode. If the MD bit is “01”, it means the current motion is from PD2 to PD1. If the MD bit is “10”, it means the current motion is from PD1 to PD2 (Table 3). If MD bit is other data, there is no motion. The IEC is the emitting current which setting by the EC bit. PROXIMITY MODE SHUTDOWN MODE The PD bit is available when IS31SE5000 operates in the Proximity Mode. If the PD bit is “01”, it means the object is away from the IC. If the PD bit is “10”, it means the object is close to the IC (Table 3). If PD bit is other data, there is no motion. Shutdown mode can be used as a means of reducing power consumption. During shutdown mode all registers retain their data. INTERRUPTION The changing of motion can be signed by the INTB pin. The INTB pin will be pulled low when object moving before the LCD panel (PD or MD bit changing). And the MCU can get the information via reading the Status Register (00h). The INTB will be back to high until the MCU reading the Status Register (00h). The INTB pin will be high automatically when it stays low last 10ms to ensure system operating normally. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 I IR (2) SOFTWARE SHUTDOWN By setting SSD bit of the Shutdown Register (01h) to “0”, the IS31SE5000 will operate in software shutdown mode. HARDWARE SHUTDOWN The chip enters hardware shutdown mode when the SDB pin is pulled low, wherein they consume only 1μA (Typ.) current. 10 IS31SE5000 CLASSIFICATION REFLOW PROFILES Profile Feature Pb-Free Assembly Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) 150°C 200°C 60-120 seconds Average ramp-up rate (Tsmax to Tp) 3°C/second max. Liquidous temperature (TL) Time at liquidous (tL) 217°C 60-150 seconds Peak package body temperature (Tp)* Max 260°C Time (tp)** within 5°C of the specified classification temperature (Tc) Max 30 seconds Average ramp-down rate (Tp to Tsmax) 6°C/second max. Time 25°C to peak temperature Figure 9 8 minutes max. Classification Profile Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 11 IS31SE5000 PACKAGE INFORMATION UTQFN-12 Note: All dimensions in millimeters unless otherwise stated. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 10/11/2012 12