IS62WV2568ALL/BLL

 IS62WV2568ALL IS62WV2568BLL
256K x 8 LOW VOLTAGE,
ULTRA LOW POWER CMOS STATIC RAM
FEATURES
• High-speed access time: 45ns, 55ns, 70ns
• CMOS low power operation
– 36 mW (typical) operating
– 9 µW (typical) CMOS standby
• TTL compatible interface levels
JANUARY 2013
DESCRIPTION
The ISSI IS62WV2568ALL / IS62WV2568BLL are high-
speed, 2M bit static RAMs organized as 256K words
by 8 bits. It is fabricated using ISSI's high-performance
CMOS technology. This highly reliable process coupled
with innovative circuit design techniques, yields highperformance and low power consumption devices.
When CS1 is HIGH (deselected) or when CS2 is LOW
(deselected) , the device assumes a standby mode at
which the power dissipation can be reduced down with
CMOS input levels.
• Single power supply – 1.65V--2.2V Vcc (62WV2568ALL)
– 2.5V--3.6V Vcc (62WV2568BLL)
• Fully static operation: no clock or refresh
required
• Three state outputs
• Industrial temperature available
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE) controls both writing and reading of the memory.
The IS62WV2568ALL and IS62WV2568BLL are packaged
in the JEDEC standard 32-pin TSOP (TYPE I), sTSOP
(TYPE I), and 36-pin mini BGA.
• Lead-free available
FUNCTIONAL BLOCK DIAGRAM
A0-A17
DECODER
256K x 8
MEMORY ARRAY
I/O
DATA
CIRCUIT
COLUMN I/O
VCC
GND
I/O0-I/O7
CS2
CS1
OE
CONTROL
CIRCUIT
WE
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 1
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
PIN DESCRIPTIONS
A0-A17 Address Inputs
CS1 Chip Enable 1 Input
CS2 Chip Enable 2 Input
OE Output Enable Input
WE Write Enable Input
I/O0-I/O7Input/Output
NC
No Connection
Vcc
Power
GND
Ground
PIN CONFIGURATION
36-pin mini BGA (B) (6mm x 8mm)
1
2
2
3
4
5
32-pin TSOP (TYPE I), sTSOP (TYPE I)
6
A
A0
A1
CS2
A3
A6
A8
B
I/O4
A2
WE
A4
A7
I/O0
C
I/O5
NC
A5
D
GND
Vcc
E
Vcc
GND
F
I/O6
G
I/O7
H
A9
I/O1
NC
A17
I/O2
OE
CS1
A16
A15
I/O3
A10
A11
A12
A13
A14
A11
A9
A8
A13
WE
CS2
A15
VCC
A17
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CS1
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
Vterm
Tstg
Pt
Parameter
Terminal Voltage with Respect to GND
Storage Temperature
Power Dissipation
Value
–0.2 to Vcc+0.3
–65 to +150
1.0
Unit
V
°C
W
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
OPERATING RANGE (Vcc)
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
–40°C to +85°C
IS62WV2568ALL
1.65V - 2.2V
1.65V - 2.2V
IS62WV2568BLL
2.5V - 3.6V
2.5V - 3.6V
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter
Test Conditions
Vcc
Voh
Output HIGH Voltage
Ioh = -0.1 mA
1.65-2.2V
Ioh = -1 mA
2.5-3.6V
Vol
Output LOW Voltage
Iol = 0.1 mA
1.65-2.2V
Iol = 2.1 mA
2.5-3.6V
Vih
Input HIGH Voltage
1.65-2.2V
2.5-3.6V
(1)
Vil Input LOW Voltage
1.65-2.2V
2.5-3.6V
Ili
Input Leakage
GND ≤ Vin ≤ Vcc
Ilo
Output Leakage
GND ≤ Vout ≤ Vcc, Outputs Disabled
Min.
Max.
Unit
1.4
—
V
2.2
—
V
—
0.2
V
—
0.4
V
1.4
Vcc + 0.2
V
2.2
Vcc + 0.3
V
–0.2
0.4
V
–0.2
0.6
V
–11µA
–1
1
µA
Notes:
1. Undershoot: -1.0V for pulse width less than 10ns. Not 100% tested.
2. Overshoot: Vdd + 1.0V for pulse width less than 10ns. Not 100% tested.
Integrated Silicon Solution, Inc. — www.issi.com3
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
CAPACITANCE(1)
Symbol
Cin
Cout
Parameter
Input Capacitance
Input/Output Capacitance
Conditions
Vin = 0V
Vout = 0V
Max.
8
10
Unit
pF
pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
AC TEST CONDITIONS
Parameter
62WV2568ALL
(Unit)
62WV2568BLL
(Unit)
0.4V to Vcc-0.2V
5 ns
Vref
0.4V to Vcc-0.3V
5ns
Vref
See Figures 1 and 2
See Figures 1 and 2
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
R1(Ω)
R2(Ω)
Vref
Vtm
1.65-2.2V 3070
3150
0.9V
1.8V
2.5V - 3.6V
3070
3150
1.5V
2.8V
AC TEST LOADS
R1
R1
VTM
VTM
OUTPUT
OUTPUT
30 pF
Including
jig and
scope
Figure 1
4
5 pF
Including
jig and
scope
R2
R2
Figure 2
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
62WV2568ALL (1.65V - 2.2V)
Symbol Parameter
Test Conditions Max. Unit
70ns
Icc
Vcc Dynamic Operating Vcc = Max.,
Com.
15
mA
Supply Current
Iout = 0 mA, f = fmax Ind.
15
Icc1
Operating Supply
Vcc = Max.,
Com.
3
mA
Current
Iout = 0 mA, f = 0
Ind. 3
Isb1
TTL Standby Current
Vcc = Max.,
Com.
0.3
mA
(TTL Inputs)
Vin = Vih or Vil
Ind. 0.3
CS1 = Vih , CS2 = Vil,
f = 1 MHz
Isb2
CMOS Standby
Current (CMOS Inputs)
Vcc = Max., Com.
CS1 ≥ Vcc – 0.2V,
Ind.
CS2 ≤ 0.2V,
Vin ≥ Vcc – 0.2V, or
Vin ≤ 0.2V, f = 0
5
µA
10
Note:
1. At f = fmax, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
62WV2568BLL (2.5V - 3.6V)
Symbol Parameter
Test Conditions Max.Max.Max. Unit
45ns55ns70ns
Icc
Vcc Dynamic Operating Vcc = Max.,
Com.
35
30
25
mA
Supply Current
Iout = 0 mA, f = fmax Ind.
40
35
30
Isb1
TTL Standby Current
Vcc = Max.,
Com.
0.3
0.3
0.3
mA
(TTL Inputs)
Vin = Vih or Vil
Ind.0.3
0.3
0.3
CS1 = Vih , CS2 = Vil,
f = 1 MHz
Isb2
CMOS Standby
Current (CMOS Inputs)
Vcc = Max., Com.
CS1 ≥ Vcc – 0.2V,
Ind.
CS2 ≤ 0.2V,
Vin ≥ Vcc – 0.2V, or
Vin ≤ 0.2V, f = 0
10
10
10
10
10
10
µA
Note:
1. At f = fmax, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13
5
IS62WV2568ALL, IS62WV2568BLL
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
45ns
55ns
70ns
Symbol
Parameter
Min.
Max.
Min.
Max.
Min.
Max
Unit
trc
Read Cycle Time
45
—
55
—
70
—
ns
taa
Address Access Time
—
45
—
55
—
70
ns
toha
Output Hold Time
10
—
10
—
10
—
ns
tacs1/tacs2
CS1/CS2 Access Time
—
45
—
55
—
70
ns
tdoe
OE Access Time
—
20
—
25
—
35
ns
thzoe(2)
OE to High-Z Output
—
15
—
20
—
25
ns
tlzoe(2)
OE to Low-Z Output
5
—
5
—
5
—
ns
thzcs1/thzcs2(2)
CS1/CS2 to High-Z Output
0
15
0
20
0
25
ns
tlzcs1/tlzcs2
CS1/CS2 to Low-Z Output
10
—
10
—
10
—
ns
(2)
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V, input pulse levels of 0.4 to 1.4V
and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CS1 = OE = Vil, CS2 = WE = Vih)
tRC
ADDRESS
tAA
tOHA
DOUT
6
PREVIOUS DATA VALID
tOHA
DATA VALID
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
AC WAVEFORMS
READ CYCLE NO. 2(1,3)(CS1, CS2, OE Controlled)
tRC
ADDRESS
tAA
tOHA
OE
tDOE
CS1
tHZOE
tLZOE
tACS1/tACS2
CS2
DOUT
tLZCS1/
tLZCS2
HIGH-Z
tHZCS
DATA VALID
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CS1= Vil. CS2=WE=Vih.
3. Address is valid prior to or coincident with CS1 LOW and CS2 HIGH transition.
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13
7
IS62WV2568ALL, IS62WV2568BLL
WRITE CYCLE SWITCHING CHARACTERISTICS(1,2) (Over Operating Range)
45ns
Symbol
Parameter
twc
55ns
70ns
Min.
Max.
Min.
Max.
Min.
Max
Unit
Write Cycle Time
45
—
55
—
70
—
ns
tscs1/tscs2
CS1/CS2 to Write End
35
—
45
—
60
—
ns
taw
Address Setup Time to Write End
35
—
45
—
60
—
ns
tha
Address Hold from Write End
0
—
0
—
0
—
ns
tsa
Addrress Setup Time
0
—
0
—
0
—
ns
tpwe
WE Pulse Width
35
—
40
—
50
—
ns
tsd
Data Setup to Write End
20
—
25
—
30
—
ns
thd
Data Hold from Write End
0
—
0
—
0
—
ns
thzwe
WE LOW to High-Z Output
—
20
—
20
—
20
ns
tlzwe
WE HIGH to Low-Z Output
5
—
5
—
5
—
ns
Notes:
1. Test conditions assume signal transition times of 5 ns or less, timing reference levels of 0.9V, input pulse levels of 0.4V to 1.4V
and output loading specified in Figure 1.
2. The internal write time is defined by the overlap of CS1 LOW, CS2 HIGH and WE LOW. All signals must be in valid states to
initiate a Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the
rising or falling edge of the signal that terminates the write.
3. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC WAVEFORMS
WRITE CYCLE NO. 1 (CS1/CS2 Controlled, OE = HIGH or LOW)
tWC
ADDRESS
tHA
tSCS1
CS1
tSCS2
CS2
tAW
tPWE
WE
tSA
DOUT
DATA UNDEFINED
tHZWE
tLZWE
HIGH-Z
tSD
DIN
8
tHD
DATA-IN VALID
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
AC WAVEFORMS
WRITE CYCLE NO. 2 (WE Controlled: OE is HIGH During Write Cycle)
tWC
ADDRESS
OE
tHA
tSCS1
CS1
tSCS2
CS2
tAW
tPWE
WE
tSA
DOUT
tHZWE
tLZWE
HIGH-Z
DATA UNDEFINED
tSD
DIN
tHD
DATA-IN VALID
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
tWC
ADDRESS
OE
tHA
tSCS1
CS1
tSCS2
CS2
tAW
tPWE
WE
tSA
DOUT
DATA UNDEFINED
tHZWE
tLZWE
HIGH-Z
tSD
DIN
tHD
DATA-IN VALID
Integrated Silicon Solution, Inc. — www.issi.com9
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
DATA RETENTION SWITCHING CHARACTERISTICS
Symbol
Vdr
Idr
tsdr
trdr
Parameter
Vcc for Data Retention
Data Retention Current
Data Retention Setup Time
Recovery Time
Test Condition
See Data Retention Waveform
Vcc = 1.0V, CS1 ≥ Vcc – 0.2V
See Data Retention Waveform
See Data Retention Waveform
Min. Max. Unit
1.0
3.6
V
—
10
µA
0
—
ns
trc
—
ns
DATA RETENTION WAVEFORM (CS1 Controlled)
Data Retention Mode
tSDR
3.0V
2.2V
tRDR
VCC
VDR
CS1 ≥ VCC
CS1
GND
- 0.2V
DATA RETENTION WAVEFORM (CS2 Controlled)
Data Retention Mode
3.0
VCC
CS2
2.2V
tSDR
tRDR
VDR
0.4V
CS2 ≤ 0.2V
GND
10
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
ORDERING INFORMATION
IS62WV2568ALL (1.65V - 2.2V)
Commercial Range: 0°C to +70°C
Speed (ns)
70 Order Part No.
IS62WV2568ALL-70T
Package
TSOP, TYPE I,
Industrial Range: –40°C to +85°C
Speed (ns)
70 70 70 70 Order Part No.
IS62WV2568ALL-70TI
IS62WV2568ALL-70TLI
IS62WV2568ALL-70BI
IS62WV2568ALL-70BLI
Package
TSOP, TYPE I
TSOP, TYPE I, Lead-free
mini BGA (6mm x 8mm)
mini BGA (6mm x 8mm), Lead-free
70
70
IS62WV2568ALL-70HI
IS62WV2568ALL-70HLI
sTSOP, TYPE I
sTSOP, TYPE I, Lead-free
IS62WV2568BLL (2.5V - 3.6V)
Commercial Range: 0°C to +70°C
Speed (ns)
70 70 70 Order Part No.Package
IS62WV2568BLL-70T
TSOP, TYPE I
IS62WV2568BLL-70B
mini BGA (6mm x 8mm)
IS62WV2568BLL-70H
sTSOP, TYPE I
Industrial Range: –40°C to +85°C
Speed (ns)
45 45 45 55 55 55 55 55 55 70 70 70 Order Part No.
IS62WV2568BLL-45TLI
IS62WV2568BLL-45BLI
IS62WV2568BLL-45HLI
IS62WV2568BLL-55TI
IS62WV2568BLL-55TLI
IS62WV2568BLL-55BI
IS62WV2568BLL-55BLI
IS62WV2568BLL-55HI
IS62WV2568BLL-55HLI
IS62WV2568BLL-70TI
IS62WV2568BLL-70BI
IS62WV2568BLL-70HI
Package
TSOP, TYPE I, Lead-free
mini BGA (6mm x 8mm), Lead-free
sTSOP, TYPE I
TSOP, TYPE I
TSOP, TYPE I, Lead-free
mini BGA (6mm x 8mm)
mini BGA (6mm x 8mm), Lead-free
sTSOP, TYPE I
sTSOP, TYPE I, Lead-free
TSOP, TYPE I
mini BGA (6mm x 8mm)
sTSOP, TYPE I
Integrated Silicon Solution, Inc. — www.issi.com11
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
12
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13
IS62WV2568ALL, IS62WV2568BLL
Integrated Silicon Solution, Inc. — www.issi.com13
Rev. I
1/10/13
14
Package Outline
08/12/2008
1. CONTROLLING DIMENSION : MM .
2. Reference document : JEDEC MO-207
NOTE :
IS62WV2568ALL, IS62WV2568BLL
Integrated Silicon Solution, Inc. — www.issi.com
Rev. I
1/10/13