DDR3 Integrated Memory Modules

CompanyPROFILE
>K'/ ĞǀŝĐĞƐ ŚĂƐ ŽǀĞƌ Ϯϱ LJĞĂƌƐ ĞdžƉĞƌŝĞŶĐĞ ĚĞǀĞůŽƉŝŶŐ ĂŶĚ ŵĂƌŬĞƟŶŐ ŚŝŐŚͲ
ƉĞƌĨŽƌŵĂŶĐĞŝŶƚĞŐƌĂƚĞĚĐŝƌĐƵŝƚƐ͘KƵƌƚĞĐŚŶŽůŽŐŝĞƐĂƌĞƵƟůŝnjĞĚŝŶĂǁŝĚĞƌĂŶŐĞ
ŽĨ ǀŝĚĞŽ ĂŶĚ ŵĞĚŝĐĂů ŝŵĂŐĞ ƉƌŽĐĞƐƐŝŶŐ͕ ƚĞůĞĐŽŵŵƵŶŝĐĂƟŽŶƐ͕ ĐŽŵƉƵƟŶŐ͕
ŵŝůŝƚĂƌLJ͕ ĂŶĚ ŚŝŐŚ ƌĞůŝĂďŝůŝƚLJ ĂƉƉůŝĐĂƟŽŶƐ͘ Ɛ ĂůǁĂLJƐ͕ >K'/ ŝƐ ĐŽŵŵŝƚĞĚ ƚŽ
ƉƌŽǀŝĚŝŶŐŽƵƌĐƵƐƚŽŵĞƌƐǁŝƚŚƚŚĞŚŝŐŚĞƐƚƉĞƌĨŽƌŵŝŶŐƉƌŽĚƵĐƚƐ͕ƉƌŽĐĞƐƐĞĚǁŝƚŚ
ƚŚĞ ŚŝŐŚƚĞƐƚ ƋƵĂůŝƚLJ ŵĂƚĞƌŝĂů͕ ĚĞůŝǀĞƌĞĚ ŽŶ ƟŵĞ ĂŶĚ Ăƚ Ă ĐŽŵƉĞƟƟǀĞ ƉƌŝĐĞ͘
ProductOVERVIEW
>K'/͛ƐŝŶƚĞŐƌĂƚĞĚŵĞŵŽƌLJŵŽĚƵůĞƐ;ŝDKƐͿƉƌŽǀŝĚĞĞŶƟƌĞ^ZDŵĞŵŽƌLJƐƵďƐLJƐƚĞŵƐŝŶĂƐŝŶŐůĞ'
ƉĂĐŬĂŐĞ͘dŚĞLJŽīĞƌƐŝŐŶŝĮĐĂŶƚůLJƌĞĚƵĐĞĚďŽĂƌĚĂƌĞĂ͕ďĞƩĞƌĞůĞĐƚƌŝĐĂůƉĞƌĨŽƌŵĂŶĐĞ͕ůĞƐƐǁĞŝŐŚƚ͕ĂŶĚ
ƐŝŵƉůĞƌƌŽƵƟŶŐŽŶƚŚĞWŵŽƚŚĞƌďŽĂƌĚ͘ůĞĐƚƌŝĐĂůƉĞƌĨŽƌŵĂŶĐĞŝƐĞŶŚĂŶĐĞĚďLJƚŚĞƌĞĚƵĐƟŽŶŽĨƚƌĂĐĞ
ƉĂƌĂƐŝƟĐƐ;>͕Z͕ͿĂƐĂƌĞƐƵůƚŽĨƚŚĞĞdžƚƌĞŵĞůLJĐŽŵƉĂĐƚŝŶƚĞƌŶĂůŵĞŵŽƌLJŝŶƚĞƌĐŽŶŶĞĐƟŽŶƐĐŽŵƉĂƌĞĚƚŽ
ďŽĂƌĚůĞǀĞůŝŶƚĞƌĐŽŶŶĞĐƟŽŶŽĨĚŝƐĐƌĞƚĞĐŚŝƉƐ͘>K'/ĞǀŝĐĞƐŝƐƚŚĞƉĞƌĨŽƌŵĂŶĐĞůĞĂĚĞƌŝŶŚŝŐŚƐƉĞĞĚ
memory modules.
KƵƌƵƉĐŽŵŝŶŐŚŝŐŚƉĞƌĨŽƌŵĂŶĐĞ^^ŽŶĂĐŚŝƉĨĂŵŝůLJŝƐĂƌĞǀŽůƵƟŽŶĂƌLJŝŶĐƌĞĂƐĞŝŶƉĂĐŬĂŐŝŶŐĚĞŶƐŝƚLJ
ǁŚŝĐŚŽīĞƌƐŚŝŐŚͲƌĞůŝĂďŝůŝƚLJ͕ĞdžĐĞƉƟŽŶĂůĞŶĚƵƌĂŶĐĞ͕ĂŶĚĨƌĞĞĚŽŵĨƌŽŵƐŚŽĐŬĂŶĚǀŝďƌĂƟŽŶŝƐƐƵĞƐƚŚĂƚ
ŽŌĞŶ ƉůĂŐƵĞ ĐŽŶŶĞĐƚŽƌ ďĂƐĞĚ ^^Ɛ͘ KƵƌ ^^ ĨĂŵŝůLJ ŝƐ ŶŽƚ ũƵƐƚ Ă ŚŝŐŚ ƉĞƌĨŽƌŵĂŶĐĞ͕ ŚŝŐŚͲƌĞůŝĂďŝůŝƚLJ
ƉƌŽĚƵĐƚ͖ŝƚŝƐƉƌŝĐĞĚĂŐŐƌĞƐƐŝǀĞůLJĨŽƌďŽƚŚǀĞƌLJŚŝŐŚͲƌĞůŝĂďŝůŝƚLJŵŝůŝƚĂƌLJƐLJƐƚĞŵƐ͕ĂƐǁĞůůĂƐŝŶĚƵƐƚƌŝĂůĚĂƚĂ
ĐĞŶƚĞƌĂŶĚĐůŽƵĚƐƚŽƌĂŐĞĂƉƉůŝĐĂƟŽŶƐ͘ƐĂƌĞƐƵůƚŽĨƚŚĞĞdžĐĞƉƟŽŶĂůǁƌŝƚĞĞŶĚƵƌĂŶĐĞ͕ƌĞĚƵĐĞĚƐLJƐƚĞŵ
ƐŝnjĞ͕ĞůŝŵŝŶĂƟŽŶŽĨĐŽŶŶĞĐƚŽƌƐΘĐĂďůŝŶŐ͕ĂŶĚůŽǁĞƌƉŽǁĞƌŽƉĞƌĂƟŽŶ͕ƚŚĞƚŽƚĂůĐŽƐƚŽĨŽǁŶĞƌƐŚŝƉŽĨŽƵƌ
ƌĞǀŽůƵƟŽŶĂƌLJ^^ĨĂŵŝůLJŝƐƐŝŐŶŝĮĐĂŶƚůLJůĞƐƐƚŚĂŶĂůƚĞƌŶĂƟǀĞƐŽůƵƟŽŶƐ͘
>K'/ƉƌŽĚƵĐƚƐĂƌĞƐƵƉƉŽƌƚĞĚďLJƌŝŐŽƌŽƵƐĞůĞĐƚƌŝĐĂůƚĞƐƟŶŐ͕ĞdžƚĞŶƐŝǀĞƋƵĂůŝĮĐĂƟŽŶ͕ĚŝĞƌĞǀŝƐŝŽŶĐŽŶƚƌŽů͕
ƚŚĞ ƵƐĞ ŽĨ ŚŝŐŚ ƋƵĂůŝƚLJ ĂƐƐĞŵďůLJ ŵĂƚĞƌŝĂůƐ Θ ƚĞĐŚŶŝƋƵĞƐ͕ ĂŶĚ ǁŽƌůĚ ĐůĂƐƐ ƐƵďĐŽŶƚƌĂĐƚŽƌƐ ƚŚĂƚ ƌĞƐƵůƚ
ŝŶ ĞdžĐĞƉƟŽŶĂů ƋƵĂůŝƚLJ ƉƌŽĚƵĐƚƐ͘ >K'/ ŝƐ ĂŶ /^K ϵϬϬϭ͗ϮϬϬϴ ƐƵƉƉůŝĞƌ ĂŶĚ ŽīĞƌƐ ŵĂŶLJ ŽĨ ŝƚƐ ŚĞƌŵĞƟĐ
ƉƌŽĚƵĐƚƐƚŽD/>ͲWZ&ϯϴϱϯϱ͘
Typical Digital Processing:
Analog Real World
Interfaces
Processor
Digital Interfaces
Cache Memory
Main Memory
Mass Memory
Off-line Storage
SRAM
10ns
SDRAM
50ns
Solid State Drive
500μs
Magnetic Tape,
Removable Media
LOGIC Memory Solutions
1
Short Form Product Guide
INTEGRATED MEMORY SOLUTIONS
DDR2
DDR3
Integrated Memory Modules
'ϱͲϮϱŵŵdžϮϱŵŵW'
L9D232MxxSBG5
Ϯ'ď͕ϯϮDdžϲϰ;ϮϱϲDͿ͕^ŝŶŐůĞŚĂŶŶĞů
Ϯ͘ϯ'ď͕ϯϮDdžϳϮ;ϮϴϴDͿ͕^ŝŶŐůĞŚĂŶŶĞů
Ϯ͘ϱϲ'ď͕ϯϮDdžϴϬ;ϯϮϬDͿ͕^ŝŶŐůĞŚĂŶŶĞů
L9D264MxxSBG5
ϰ'ď͕ϲϰDdžϲϰ;ϱϭϮDͿ͕^ŝŶŐůĞŚĂŶŶĞů
ϰ͘ϲ'ď͕ϲϰDdžϳϮ;ϱϳϲDͿ͕^ŝŶŐůĞŚĂŶŶĞů
ϱ͘ϭϮ'ď͕ϲϰDdžϴϬ;ϭ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
ϲ
Integrated Memory Modules
ϵŵŵdžϭϰŵŵƐƚĂŶĚĂƌĚ^ZDĨŽŽƚƉƌŝŶƚW'
L9D3512M16BG1
ϴ'ď͕ϱϭϮDdžϭϲ;ϭ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
L9D31G16BG1
ϭϲ'ď͕ϭ'džϭϲ;Ϯ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
ϲ
ϭϲŵŵdžϮϮŵŵW'
L9D364M64SBG2
ϰ'ď͕ϲϰDdžϲϰ;ϱϭϮDͿ͕^ŝŶŐůĞŚĂŶŶĞů
L9D3256M32DBG2
ϭϲ'ď͕ϮϱϲDdžϯϮ;Ϯ'Ϳ͕ƵĂůŚĂŶŶĞůͬdžϲϰ^ŝŶŐůĞŚĂŶŶĞů
L9D3512M32DBG2
ϯϮ'ď͕ϱϭϮDdžϯϮ;ϰ'Ϳ͕ƵĂůŚĂŶŶĞůͬdžϲϰ^ŝŶŐůĞŚĂŶŶĞů
L9D3256M72SBG2
ϭϴ'ď͕ϮϱϲDdžϳϮ;Ϯ͘Ϯϱ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
L9D3256M80SBG2
ϮϬ'ď͕ϮϱϲDdžϴϬ;Ϯ͘ϱ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
ϳ
ϳ
ϴ
ϵ
ϵ
ϭϬ
ϭϬ
/Ed'ZdDDKZz^K>hd/KE^ĐŽŶƟŶƵĞĚ͘͘͘
^ZD
SSD
ƐLJŶĐŚƌŽŶŽƵƐ^ƚĂƟĐZĂŶĚŽŵĐĐĞƐƐDĞŵŽƌLJ
ϭϮϴ<džϴ͕ůŽǁƉŽǁĞƌ͕ŚĞƌŵĞƟĐƉĂĐŬĂŐĞ
L7C108Y/D; L7C109Y/D/K/KA
1 Mb, 12 ns
ϱϭϮ<džϴ͕ůŽǁƉŽǁĞƌ͕ŚĞƌŵĞƟĐƉĂĐŬĂŐĞ
L7C1049Y
ϰDď͕ϭϬŶƐ
11
11
Serial ATA Solid State Drive-on-Chip
L8SCxxxxxxxx
12
ϯϱŵŵdžϯϱŵŵW'͕Ϯϱ'ͲϰϬϬ'
Assembly Flows
WůĂƐƟĐ
Ceramic
SSD
YƵĂůŝĮĐĂƟŽŶĂƚĂ
ϭϯ
ϭϰ
15
ϭϲ
Product Nomenclature Guide:
ZEÊÛđ½ƒãçٛ
Logic Devices Incorporated
Product Type
9D = DDR
2 = DDR2
3 = DDR3
Words
32M = 32 MB
64M = 64 MB
128M = 128 MB
256M = 256 MB
512M = 512 MB
1G = 1024 MB
Wordwidth
32 = x32
64 = x64
72 = x72
80 = x80
S = Single Channel
D = Dual Channel
Package
L
XXX XXXX XXX XXX X XX X
G
BG1 = 9 x 14 PBGA
BG2 = 16 x 22 PBGA
BG5 = 25 x 25 PBGA
Green Product Offering
G = RoHS compliant, lead-free
Power
L = Low Voltage
Speed Grade
5=
5ns / 200MHz / 400Mbs
38 = 3.75ns / 267 MHz / 533Mbs
3=
3ns / 333MHz / 667Mbs
25 = 2.5ns / 400MHz / 800Mbs
187 = 1.87ns / 533MHz / 1066Mbs
15 = 1.5ns / 667MHz / 1333Mbs
125 = 1.25ns / 800MHz / 1600Mbs
107 = 1.07ns / 933MHz / 1866Mbs
093 = 0.938ns /1066MHz / 2133Mbs
Temperature
C = Commercial (0oC to 70oC) I = Industrial (-40oC to 85oC)
E = Extended (-40oC to 105oC) M = Military (-55oC to 125oC)
^ZDEÊÛđ½ƒãçٛ
Logic Devices Incorporated
Product Type
7C = SRAM
108 = single chip enable, 1 Mb
109 = dual chip enable, 1 Mb
1049 = 4 Mb
Package Code
L XXXXX X
X
X XX X
D = ceramic DIP
Y = ceramic SOJ K = ceramic Dual LCC
KA = ceramic Quad LCC
Low Power Designator (Oponal)
L = Low Voltage
Speed Grade (ns)
Military Class
B = Military Class B
Temperature
E = Extended (-40oC to 105oC) I = Industrial (-40oC to 85oC) M = Military (-55oC to 125oC)
^^EÊÛđ½ƒãçٛ
Logic Devices Incorporated
SSD Product
Interface
A = 1.5 Gbps
B = 3.0 Gbps
C = 6.0 Gbps
Density
L
8S X XXXX X
X XX XX
0025 = 25 GB
0050 = 50 GB
0100 = 100GB
0200 = 200GB
0400 = 400GB
Producon Status
Blank = Producon
ES = Engineering Sample MS = Mechancial Sample
Temperature
IT = Industrial (-40oC to 85oC)
Reserved
(Reliability Tesng)
FLASH TYPE
M = MLC
S = SLC
Blank = Commercial (0oC to 70oC)
iMOD Road Map:
L9D3512M32DBG2
32.0 Gb
512M x (32+32)
Dual Channel
1866 Mbs
4Mb x 8
Eng Samples
L9D3256M80SBG2
20.0 Gb
256M x 80
Single Channel
1866 Mbs
4Mb x 5
DDR3
L9D3256M32DBG2
L9D31G16BG1
16.0 Gb
256M x (32+32)
Dual Channel
1866 Mbs
4Mb x 4
16.0 Gb
1G x 16
1866 Mbps
Eng Samples
Q4 2012
L9D364M64SBG2
L9D3512M16BG1
4.0 Gb
64M x 64
1666 Mbps
1Mb x 4
8.0 Gb
512M x 16
1866 Mbps
In Stock
Q4 2012
BG2
BG1
DDR3
Q4 2012
2.0-5.0 Gb
32M X 64/72/80
64m X 64/72/80
800 Mbs
DDR2
DDR2
L9D2xxMxxSBG5
In Stock
25 x 25 mm
255 PBGA
1.27 mm pitch
16 x 22 mm
273 PBGA
1 mm pitch
9 x 14
mm
96 PBGA
0.8 mm
pitch
Packages
Packages
BG5
DDR2
L9D232M64SBG5, L9D232M72SBG5, L9D232M80SBG5,
L9D264M64SBG5, L9D264M72SBG5, L9D264M80SBG5
2.0-5.0 Gb, DDR2, 32 M [64 M] x 64/72/80 Integrated Memory Module
&ĂƐƚ͕ůŽǁƉŽǁĞƌ͕ŚŝŐŚĚĞŶƐŝƚLJ͕ǁŝĚĞǁŽƌĚǁŝĚƚŚƐ
ZϮ͕ϱ͘Ϭ'ďŝDK
32 M [64 M] x 64/72/80, 25mm x 25mm, 255 PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϲϲϳΘϱϯϯDďƉƐ/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
ZϮϮϱŵŵ2 Module
΀ŝDK΁͗
! ϯϮͲϲϰDǁŽƌĚƐ
! džϴϬ͕džϳϮ͕džϲϬǁŽƌĚǁŝĚƚŚƐ
ŚŝŐŚƉĞƌĨŽƌŵĂŶĐĞ͗
! ϲϲϳĂŶĚϴϬϬDďƉƐ
! ƚĞŵƉĞƌĂƚƵƌĞ͗
/;ͲϰϬОƚŽнϴϱОC)
;ͲϰϬОƚŽнϭϬϱОC)
D;ͲϱϱОC to +125ОC )
ůŽǁƉŽǁĞƌ͗
! ϭ͘ϴsƐƵƉƉůLJ
! Ϯ͘ϰtĂƩƐŵĂdž
space saving footprint
! ϮϱŵŵdžϮϱŵŵ͕ϭϲdžϭϲ
ŵĂƚƌŝdžǁͬϮϱϱďĂůůƐ͕ϭ͘Ϯϳŵŵ
pitch
! ϭ͘ϳŵŵůŽǁƉƌŽĮůĞŚĞŝŐŚƚ
thermally enhanced, impedance
matched, integrated packaging
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
ĚŝīĞƌĞŶƟĂůĚĂƚĂƐƚƌŽďĞ
ϰŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϰ;ϯϮ'ďͿΘϴ;ϲϰ'ďͿŝŶƚĞƌŶĂů
banks
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
strobe, and mask signals
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϯ͕ϰ͕ϱ͕ĂŶĚϲ
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
! ϲϰŵƐϴϭϵϮͲĐLJĐůĞZ&Z^,
! ϯϮŵϴϭϵϮͲĐLJĐůĞZ&Z^,
ĂďŽǀĞϴϱОC
ŽƵƚƉƵƚĚƌŝǀĞƌĐĂůŝďƌĂƟŽŶ
ĂĚũƵƐƚĂďůĞĚƌŝǀĞƐƚƌĞŶŐƚŚ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
ĞŶƐŝƚLJ͗
>ϵϮϯϮDϲϰ^'ϱ Ϯ͘Ϭ'ď
>ϵϮϯϮDϳϮ^'ϱ Ϯ͘Ϯ'ď
>ϵϮϯϮDϴϬ^'ϱϮ͘ϱ'ď
>ϵϮϲϰDϲϰ^'ϱ ϰ͘Ϭ'ď
>ϵϮϲϰDϳϮ^'ϱϰ͘ϱ'ď
>ϵϮϲϰDϴϬ^'ϱ ϱ͘Ϭ'ď
ĞƉƚŚ͗
ϯϮD
ϯϮD
ϯϮD
ϲϰD
ϲϰD
ϲϰD
tŽƌĚtŝĚƚŚƐ͗
džϲϰ
džϳϮ
džϴϬ
džϲϰ
džϳϮ
džϴϬ
ǀĂŝůĂďůĞdŝŵŝŶŐƐ͗
ŽŶĮŐƵƌĂƟŽŶ͗
ZϮͲϱϯϯ ZϮͲϱϯϯ ZϮͲϲϲϳ
ZϮͲϲϲϳ ůŽĐŬ͗ LJĐůĞdŝŵĞ͗ĂƚĂZĂƚĞ͗^>ĂƚĞŶĐLJ͗
ϮϲϳD,nj
ϯ͘ϳϱŶƐ ϱϯϯDďƉƐ ϱ
ϮϲϳD,nj
ϯ͘ϳϱŶƐ ϱϯϯDďƉƐ ϰ
ϯϯϯD,nj
ϯ͘ϬŶƐ ϲϲϳDďƉƐ ϱ
ϯϯϯD,nj
ϯ͘ϬŶƐ ϲϲϳDďƉƐ ϰ
ϲ
ĞŶĞĮƚƐ͗
‡
‡
‡
‡
‡
‡
ƌĞĚƵĐĞĚ/ͬK;ϰϲйͿĐŽŶŶĞĐƟŽŶƐ
reduced trace lengths due to the
highly integrated, impedance matched
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
ZŽ,^ͲĐŽŵƉůŝĂŶƚ
DDR3
L9D31G16BG1, L9D3512M16BG1
2GByte, x 16 DDR3 SDRAM
Zϯ͕ϴ͘ϬͲϭϲ͘Ϭ'ďŝDK
512 M - 1G x 16, 9mm x 14mm, 96 PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϭϴϲϲ͕ϭϲϬϬ͕ϭϯϯϯDďƉƐKDDZ/>͕/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
Zϯ/ŶƚĞŐƌĂƚĞĚDŽĚƵůĞ
΀ŝDK΁͗
! sDDсsDDQ = ϭ͘ϱsцϬ͘Ϭϳϱs
! ϭ͘ϱsĐĞŶƚĞƌͲƚĞƌŵŝŶĂƚĞĚ͕
ĚŝīĞƌĞŶƟĂů/ͬK
! WĂĐŬĂŐĞ͗ϵŵŵdžϭϰŵŵdž
Ϯŵŵ͕ϵϲďĂůůW'
! DĂƚƌŝdžďĂůůƉŝƚĐŚ͗Ϭ͘ϴϬŵŵ
space saving footprint
ĚŝīĞƌĞŶƟĂůĐůŽĐŬŝŶƉƵƚƐ;<͕<ηͿ
ĚŝīĞƌĞŶƟĂů͕ďŝͲĚŝƌĞĐƟŽŶĂůĚĂƚĂ
strobe
ϴŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϴŝŶƚĞƌŶĂůďĂŶŬƐ;ƉĞƌǁŽƌĚ͕ϰ
ǁŽƌĚƐŝŶƚĞŐƌĂƚĞĚŝŶƉĂĐŬĂŐĞͿ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
strobe, and mask signals
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϲ͕ϴ͕ϭϬ͕ϭϭ͕ĂŶĚϭϯ
ƉŽƐƚĞĚ^ĂĚĚŝƟǀĞůĂƚĞŶĐLJ;>Ϳ
^;tZ/dͿůĂƚĞŶĐLJ;t>Ϳ͗ϲ͕
ϳ͕ϴ͕ϵ͕ĂŶĚϭϭ
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
‡
‡
‡
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞ
(ambient temp = TͿ͗
! ĐŽŵŵĞƌĐŝĂů͗ϬОƚŽнϳϬОC
! industrial ͗ͲϰϬОƚŽнϴϱОC
ƐƵƉƉŽƌƟŶŐ^>&ΘhdK
Z&Z^,
! ĞdžƚĞŶĚĞĚ͗ͲϰϬОƚŽнϭϬϱОC
ĞŶĞĮƚƐ͗
‡
‡
‡
‡
‡
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
! ŵŝůͲƚĞŵƉ͗ͲϱϱОC to +125ОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
‡
‡
‡
‡
‡
‡
dĐŽĨϬОƚŽнϵϱОC
! ϲϰŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚĂƚ
ϬОƚŽнϴϱОC
! ϯϮŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚ
ĂďŽǀĞϴϱОC
KZĐůŽĐŬŝŶŐĨƌĞƋƵĞŶĐŝĞƐ͗ϱϯϯ͕
ϲϲϳ͕ϴϬϬ͕ϵϯϯD,nj
ĚĂƚĂƚƌĂŶƐĨĞƌƌĂƚĞƐ͗ϭϬϲϲ͕ϭϯϯϯ͕
ϭϲϬϬ͕ĂŶĚϭϴϲϲDďƉƐ
ǁƌŝƚĞͲůĞǀĞůŝŶŐ
ŵƵůƟƉƵƌƉŽƐĞƌĞŐŝƐƚĞƌ
ŽƵƚƉƵƚĚƌŝǀĞƌĐĂůŝďƌĂƟŽŶ
‡
‡
ϰϬйƐƉĂĐĞƐĂǀŝŶŐƐǁŚŝůĞƉƌŽǀŝĚŝŶŐĂ
ƐƵƌĨĂĐĞŵŽƵŶƚĨƌŝĞŶĚůLJƉŝƚĐŚ;Ϭ͘ϴϬŵŵͿ
ƌĞĚƵĐĞĚ/ͬKƌŽƵƟŶŐ;ϯϰйͿ
ϯϬйŝŵƉƌŽǀĞŵĞŶƚŝŶƌŽƵƟŶŐĨŽƌLJŽƵƌ
memory array
reduced trace lengths due to the
highly integrated, impedance matched
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
^ƉĞĞĚ'ƌĂĚĞ͗W<'&ŽŽƚƉƌŝŶƚ͗ /ͬK͗
>ϵϯϭ'ϭϲ'ϭdžϭϬϳZϯͲϭϴϲϲ >ϵϯϭ'ϭϲ'ϭdžϭϮϱZϯͲϭϲϬϬ >ϵϯϭ'ϭϲ'ϭdžϭϱZϯͲϭϯϯϯ
ϵŵŵdžϭϰŵŵ ϵϲ
>ϵϯϱϭϮDϭϲ'ϭdžϭϬϳZϯͲϭϴϲϲ >ϵϯϱϭϮDϭϲ'ϭdžϭϮϱZϯͲϭϲϬϬ >ϵϯϱϭϮDϭϲ'ϭdžϭϱZϯͲϭϯϯϯ
ϳ
ĂůůWŝƚĐŚ͗ W<'EŽ͗͘
Ϭ͘ϴϬŵŵ'ϭ
DDR3
L9D364M64SBG2
4.0 Gb, DDR3, 64 M x 64 Integrated Memory Module
Zϯ͕ϰ͘Ϭ'ďŝDK
64M x 64, 16mm x 22mm, 271 - I/O Thermally Enhanced PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϭϲϬϬ͕ϭϯϯϯ͕ΘϭϬϲϲDďƉƐKDDZ/>͕/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
Zϯ/ŶƚĞŐƌĂƚĞĚDŽĚƵůĞ
΀ŝDK΁͗
! sDD сsDDQ = ϭ͘ϱs±Ϭ͘Ϭϳϱs
! ϭ͘ϱsĐĞŶƚĞƌͲƚĞƌŵŝŶĂƚĞĚ͕
ĚŝīĞƌĞŶƟĂů/ͬK
! WĂĐŬĂŐĞ͗ϭϲŵŵdžϮϮŵŵdž
ϭ͘Ϯŵŵ͕ϭϯdžϮϭŵĂƚƌŝdžǁͬ
ϮϳϭďĂůůƐ
! DĂƚƌŝdžďĂůůƉŝƚĐŚ͗ϭ͘ϬϬŵŵ
space saving footprint
thermally enhanced, impedance
matched, integrated packaging
ĚŝīĞƌĞŶƟĂů͕ďŝͲĚŝƌĞĐƟŽŶĂůĚĂƚĂ
strobe
ϴŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϴŝŶƚĞƌŶĂůďĂŶŬƐ;ƉĞƌǁŽƌĚ͕ϰ
ǁŽƌĚƐŝŶƚĞŐƌĂƚĞĚŝŶƉĂĐŬĂŐĞͿ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
strobe, and mask signals
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϲ͕ϴ͕ϭϬ͕ϭϭĂŶĚ
ϭϯ
‡
‡
‡
‡
‡
ĞŶĞĮƚƐ͗
‡
^;tZ/dͿůĂƚĞŶĐLJ;t>Ϳ͗ϲ͕ϳ͕
ϴ͕ϵ͕ĂŶĚϭϭ
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞ
(ambient temp = TͿ͗
! ĐŽŵŵĞƌĐŝĂů͗ϬОƚŽнϳϬОC
! industrial ͗ͲϰϬОƚŽнϴϱОC
‡
‡
‡
‡
ƐƵƉƉŽƌƟŶŐ^>&ΘhdK
Z&Z^,
‡
‡
‡
‡
‡
‡
! ϯϮŵ͕ϴϭϵϮĐLJĐůĞZ&Z^,
ĂďŽǀĞϴϱОC
KZĐůŽĐŬŝŶŐĨƌĞƋƵĞŶĐŝĞƐ͗ϱϯϯ͕
ϲϲϳ͕ϴϬϬ͕ϵϯϯD,nj
ĚĂƚĂƚƌĂŶƐĨĞƌƌĂƚĞƐ͗ϭϬϲϲ͕ϭϯϯϯ͕
ϭϲϬϬ͕ϭϴϲϲDďƉƐ
ǁƌŝƚĞͲůĞǀĞůŝŶŐ
ŵƵůƟƉƵƌƉŽƐĞƌĞŐŝƐƚĞƌ
ŽƵƚƉƵƚĚƌŝǀĞƌĐĂůŝďƌĂƟŽŶ
‡
ϰϬйƐƉĂĐĞƐĂǀŝŶŐƐǁŚŝůĞƉƌŽǀŝĚŝŶŐĂ
ƐƵƌĨĂĐĞŵŽƵŶƚĨƌŝĞŶĚůLJƉŝƚĐŚ;ϭ͘ϬϬŵŵͿ
ZĞĚƵĐĞĚ/ͬKƌŽƵƟŶŐ;ϯϰйͿ
ϯϬйŝŵƉƌŽǀĞŵĞŶƚŝŶƌŽƵƟŶŐƐĨŽƌLJŽƵƌ
memory array
reduced trace lengths due to the
highly integrated, impedance matched
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
^ƉĞĞĚ'ƌĂĚĞ͗
W<'&ŽŽƚƉƌŝŶƚ͗
>ϵϯϲϰDϲϰ^'ϮdžϭϮϱZϯͲϭϲϬϬ
>ϵϯϲϰDϲϰ^'ϮdžϭϱZϯͲϭϯϯϯ ϭϲŵŵdžϮϮŵŵ
>ϵϯϲϰDϲϰ^'ϮdžϭϴϳZϯͲϭϬϲϲ
ϴ
/ͬK͗
ĂůůWŝƚĐŚ͗
W<'EŽ͗͘
Ϯϳϭ
'Ϯ
ϭ͘ϬϬŵŵ
DDR3
L9D3256M32DBG2, L9D3512M32DBG2
4GByte, x 64 BGA DDR3 SDRAM
Zϯ͕ϭϲ͘ϬͲϯϮ͘Ϭ'ďŝDK
256 -512 M, x 32, Dual Channel Or x 64 Single Channel, 16mm x 22mm, 271 PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϭϴϲϲ͕ϭϲϬϬ͕ϭϯϯϯDďƉƐKDDZ/>͕/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
Zϯ/ŶƚĞŐƌĂƚĞĚDŽĚƵůĞ
΀ŝDK΁͗
! sDDсsDDQ = ϭ͘ϱsцϬ͘Ϭϳϱs
! ϭ͘ϱsĐĞŶƚĞƌͲƚĞƌŵŝŶĂƚĞĚ͕
ĚŝīĞƌĞŶƟĂů/ͬK
! WĂĐŬĂŐĞ͗ϭϲŵŵdžϮϮŵŵdž
Ϯŵŵ͕ϮϳϭďĂůůW'
! DĂƚƌŝdžďĂůůƉŝƚĐŚ͗ϭ͘ϬϬŵŵ
space saving footprint
ĚŝīĞƌĞŶƟĂůĐůŽĐŬŝŶƉƵƚƐ;<͕<ηͿ
ĚŝīĞƌĞŶƟĂů͕ďŝͲĚŝƌĞĐƟŽŶĂůĚĂƚĂ
strobe
ϴŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϴŝŶƚĞƌŶĂůďĂŶŬƐ;ƉĞƌǁŽƌĚ͕ϰ
ǁŽƌĚƐŝŶƚĞŐƌĂƚĞĚŝŶƉĂĐŬĂŐĞͿ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
strobe, and mask signals
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϲ͕ϴ͕ϭϬ͕ϭϭ͕ĂŶĚϭϯ
ƉŽƐƚĞĚ^ĂĚĚŝƟǀĞůĂƚĞŶĐLJ;>Ϳ
^;tZ/dͿůĂƚĞŶĐLJ;t>Ϳ͗ϲ͕
ϳ͕ϴ͕ϵ͕ĂŶĚϭϭ
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
ĞŶĞĮƚƐ͗
‡
‡
‡
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞ
(ambient temp = TͿ͗
! ĐŽŵŵĞƌĐŝĂů͗ϬОƚŽнϳϬОC
! industrial ͗ͲϰϬОƚŽнϴϱОC
ƐƵƉƉŽƌƟŶŐ^>&ΘhdK
Z&Z^,
‡
‡
‡
‡
! ĞdžƚĞŶĚĞĚ͗ͲϰϬОƚŽнϭϬϱОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
! ŵŝůͲƚĞŵƉ͗ͲϱϱОC to +125ОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
‡
‡
‡
‡
‡
‡
dĐŽĨϬОƚŽнϵϱОC
! ϲϰŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚĂƚ
ϬОƚŽнϴϱОC
! ϯϮŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚ
ĂďŽǀĞϴϱОC
KZĐůŽĐŬŝŶŐĨƌĞƋƵĞŶĐŝĞƐ͗
ϲϲϳ͕ϴϬϬ͕ϵϯϯD,nj
ĚĂƚĂƚƌĂŶƐĨĞƌƌĂƚĞƐ͗ϭϯϯϯ͕ϭϲϬϬ͕
ĂŶĚϭϴϲϲDďƉƐ
ǁƌŝƚĞͲůĞǀĞůŝŶŐ
ŵƵůƟƉƵƌƉŽƐĞƌĞŐŝƐƚĞƌ
ŽƵƚƉƵƚĚƌŝǀĞƌĐĂůŝďƌĂƟŽŶ
‡
‡
ůĂƌŐĞďŽĂƌĚĂƌĞĂƐĂǀŝŶŐƐǁŝƚŚƐƵƌĨĂĐĞ
ŵŽƵŶƚĨƌŝĞŶĚůLJƉŝƚĐŚ;ϭ͘ϬϬŵŵͿ
ƐŝŐŶŝĮĐĂŶƚůLJƌĞĚƵĐĞĚŝŶƚĞƌĐŽŶŶĞĐƚ
ƌŽƵƟŶŐ
reduced trace lengths due to the
highly integrated, impedance matched
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
^ƉĞĞĚ'ƌĂĚĞ͗W<'&ŽŽƚƉƌŝŶƚ͗ /ͬK͗
>ϵϯϮϱϲDϯϮ'ϮdžϭϬϳZϯͲϭϴϲϲ >ϵϯϮϱϲDϯϮ'ϮdžϭϮϱZϯͲϭϲϬϬ >ϵϯϮϱϲDϯϮ'ϮdžϭϱZϯͲϭϯϯϯ ϭϲŵŵdžϮϮŵŵ Ϯϳϭ
>ϵϯϱϭϮDϯϮ'ϮdžϭϬϳZϯͲϭϴϲϲ
>ϵϯϱϭϮDϯϮ'ϮdžϭϮϱZϯͲϭϲϬϬ
>ϵϯϱϭϮDϯϮ'ϮdžϭϱZϯͲϭϯϯϯ
ϵ
ĂůůWŝƚĐŚ͗
W<'EŽ͗͘
ϭ͘ϬϬŵŵ'Ϯ
DDR3
L9D3256M72SBG2, L9D3256M80SBG2
2.5GByte, x 80 DDR3 SDRAM BGA
Zϯ͕ϭϴ͘ϬͲϮϬ͘Ϭ'ďŝDK
256 M, x 72 [80], 16mm x 22mm, 271 PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϭϴϲϲ͕ϭϲϬϬ͕ϭϯϯϯDďƉƐKDDZ/>͕/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
Zϯ/ŶƚĞŐƌĂƚĞĚDŽĚƵůĞ
΀ŝDK΁͗
! sDDсsDDQ = ϭ͘ϱsцϬ͘Ϭϳϱs
! ϭ͘ϱsĐĞŶƚĞƌͲƚĞƌŵŝŶĂƚĞĚ͕
ĚŝīĞƌĞŶƟĂů/ͬK
! WĂĐŬĂŐĞ͗ϭϲŵŵdžϮϮŵŵdž
Ϯŵŵ͕ϮϳϭďĂůůW'
! DĂƚƌŝdžďĂůůƉŝƚĐŚ͗ϭ͘ϬϬŵŵ
space saving footprint
ĚŝīĞƌĞŶƟĂůĐůŽĐŬŝŶƉƵƚƐ;<͕<ηͿ
ĚŝīĞƌĞŶƟĂů͕ďŝͲĚŝƌĞĐƟŽŶĂůĚĂƚĂ
strobe
ϴŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϴŝŶƚĞƌŶĂůďĂŶŬƐ;ƉĞƌǁŽƌĚ͕ϰ
ǁŽƌĚƐŝŶƚĞŐƌĂƚĞĚŝŶƉĂĐŬĂŐĞͿ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
strobe, and mask signals
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϲ͕ϴ͕ϭϬ͕ϭϭ͕ĂŶĚϭϯ
ƉŽƐƚĞĚ^ĂĚĚŝƟǀĞůĂƚĞŶĐLJ;>Ϳ
^;tZ/dͿůĂƚĞŶĐLJ;t>Ϳ͗ϲ͕
ϳ͕ϴ͕ϵ͕ĂŶĚϭϭ
ĞŶĞĮƚƐ͗
‡
‡
‡
‡
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞ
(ambient temp = TͿ͗
! ĐŽŵŵĞƌĐŝĂů͗ϬОƚŽнϳϬОC
! industrial ͗ͲϰϬОƚŽнϴϱОC
‡
‡
‡
‡
ƐƵƉƉŽƌƟŶŐ^>&ΘhdK
Z&Z^,
! ĞdžƚĞŶĚĞĚ͗ͲϰϬОƚŽнϭϬϱОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
‡
! ŵŝůͲƚĞŵƉ͗ͲϱϱОC to +125ОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
‡
‡
‡
dĐŽĨϬОƚŽнϵϱОC
! ϲϰŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚĂƚ
ϬОƚŽнϴϱОC
! ϯϮŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚ
ĂďŽǀĞϴϱОC
KZĐůŽĐŬŝŶŐĨƌĞƋƵĞŶĐŝĞƐ͗
ϱϯϯ͕ϲϲϳ͕ϴϬϬ͕ϵϯϯD,nj
ĚĂƚĂƚƌĂŶƐĨĞƌƌĂƚĞƐ͗ϭϬϲϲ͕ϭϯϯϯ͕
ϭϲϬϬ͕ĂŶĚϭϴϲϲDďƉƐ
‡
ůĂƌŐĞďŽĂƌĚĂƌĞĂƐĂǀŝŶŐƐǁŝƚŚƐƵƌĨĂĐĞ
ŵŽƵŶƚĨƌŝĞŶĚůLJƉŝƚĐŚ;ϭ͘ϬϬŵŵͿ
ƐŝŐŶŝĮĐĂŶƚůLJƌĞĚƵĐĞĚŝŶƚĞƌĐŽŶŶĞĐƚ
ƌŽƵƟŶŐ
reduced trace lengths due to the
highly integrated, impedance matched
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
^ƉĞĞĚ'ƌĂĚĞ͗W<'&ŽŽƚƉƌŝŶƚ͗ /ͬK͗
>ϵϯϮϱϲDϳϮ^'ϮdžϭϬϳ ZϯͲϭϴϲϲ >ϵϯϮϱϲDϳϮ^'ϮdžϭϮϱZϯͲϭϲϬϬ >ϵϯϮϱϲDϳϮ^'ϮdžϭϱZϯͲϭϯϯϯ
ϭϲŵŵdžϮϮŵŵ Ϯϳϭ
>ϵϯϮϱϲDϴϬ^'ϮdžϭϬϳZϯͲϭϴϲϲ
>ϵϯϮϱϲDϴϬ^'ϮdžϭϮϱZϯͲϭϲϬϬ
>ϵϯϮϱϲDϴϬ^'ϮdžϭϱZϯͲϭϯϯϯ
ϭϬ
ĂůůWŝƚĐŚ͗
W<'EŽ͗͘
ϭ͘ϬϬŵŵ'Ϯ
SRAM
L7C108Y, L7C108D, L7C109Y, L7C109D, L7C109K, L7C109KA, L7C1049Y
1 Mb, 4Mb, x8, Asynchronous Random Access Memory
ϭDď^ZD͕ϰDď^ZD
128K x 8, 512K x 8 Asynchronous Random Access Memory
ĞŶƐŝƟĞƐ͗ϭ͕ϰDď/Eh^dZ/>͕ydE͕D/>/dZzΘ>^^
‡
‡
‡
‡
‡
DK^džϴ^ƚĂƟĐZD
ƐŝŶŐůĞΘĚƵĂůĐŚŝƉĞŶĂďůĞ;Ϳ
(1M)
ƐĞƉĂƌĂƚĞtZ/dĂŶĚKhdWhd
enables
ŚŝŐŚƐƉĞĞĚ͕ϭϬŶƐƚŽнϭϮϱОC
ŽƉĞƌĂƟŶŐĐƵƌƌĞŶƚ͕Ͳ>ǀĞƌƐŝŽŶ͗
! ĂĐƟǀĞ͗ϴϬŵŵĂdž
! DK^ƐƚĂŶĚďLJ͗Ϯŵ
! ϮsĚĂƚĂƌĞƚĞŶƟŽŶ͗ϳϱϬʅ
(1Mb)
! ϮsĚĂƚĂƌĞƚĞŶƟŽŶ͗Ϯŵ;ϰDďͿ
‡
‡
‡
ŚĞƌŵĞƟĐƉĂĐŬĂŐĞŽƉƟŽŶƐ͗
! ϯϮ>Ϭ͘ϰϬϬ͟^K:
! ϯϮ>Ϭ͘ϰϬϬ͟/W
! ϯϮ>YƵĂĚ>
! ϯϮ>ƵĂů>
! ϯϲ>Ϭ͘ϰϬϬ͟^K:
1Mb
! ĐŽŶǀĞŶƟŽŶĂůƉŝŶŽƵƚ
ϰDď
! ƌĞǀŽůƵƟŽŶĂƌLJƉŝŶŽƵƚ
WĂĐŬĂŐĞƌŽƐƐZĞĨĞƌĞŶĐĞ͗
WĂĐŬĂŐĞ͗
>/WŬŐ͗^Ͳ^D͗ >/WĂƌƚEƵŵďĞƌ͗
ϯϮ>͕^K:
z
z͕ϳ
>ϳϭϬϴz͕>ϳϭϬϵzΎ
ϯϮ>͕/W 
>ϳϭϬϴ͕>ϳϭϬϵΎ
ϯϮ>͕YƵĂĚ>< D
>ϳϭϬϵ<Ύ
ϯϮ>͕ƵĂů>
< h
>ϳϭϬϵ<Ύ
ϯϲ>͕^K:
z
z͕ϳ
>ϳϭϬϰϵz
ΎƵĂůĐŚŝƉĞŶĂďůĞ͕ůŽǁƉŽǁĞƌŽīĞƌĞĚ;Ͳ>Ϳ
A0
1
36
NC
A1
2
35
A18
A2
3
34
A17
A3
4
33
A16
A4
5
32
A15
CE
6
I/O0
7
I/O1
8
VCC
9
VSS
10
I/O2
11
I/O3
12
WE
13
A5
14
A6
15
A7
L7C1049Y
&ĞĂƚƵƌĞƐΘĞŶĞĮƚƐ͗
31
OE
30
I/O7
29
I/O6
28
VSS
27
VCC
26
I/O5
25
I/O4
24
A14
23
A13
22
A12
16
21
A11
A8
17
20
A10
A9
18
19
NC
^DWƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
SRAM ΂ϭϮϴ<džϴ^ƚĂƟĐZD͕ŽƌŶĞƌWŽǁĞƌ͕ǁŝƚŚ>ŽǁWŽǁĞƌŽƉƟŽŶ΃
^ŝŶŐůĞĂŶĚƵĂůŚŝƉŶĂďůĞĚ^K:ƐĂŶĚ/WƐ ƵĂůŚŝƉŶĂďůĞĚ^K:Ɛ͕/WƐ͕>Ɛ͕ĂŶĚƵĂů>Ɛ
^DĂƐĞ͗
^DĂƐĞ͗
ϱϵϲϮͲϴϵϱϵϴϬϵ ϱϵϲϮͲϴϵϱϵϴϮϵ ϱϵϲϮͲϴϵϱϵϴϭϳ ϱϵϲϮͲϴϵϱϵϴϭϬ ϱϵϲϮͲϴϵϱϵϴϯϵ ϱϵϲϮͲϴϵϱϵϴϭϴ ϱϵϲϮͲϴϵϱϵϴϭϭ ϱϵϲϮͲϴϵϱϵϴϰϰ ϱϵϲϮͲϴϵϱϵϴϭϵ ϱϵϲϮͲϴϵϱϵϴϭϮ ϱϵϲϮͲϴϵϱϵϴϯϰ ϱϵϲϮͲϴϵϱϵϴϮϬ ϱϵϲϮͲϴϵϱϵϴϰϬ ϱϵϲϮͲϴϵϱϵϴϯϱ ϱϵϲϮͲϴϵϱϵϴϮϭ ϱϵϲϮͲϴϵϱϵϴϰϴ ϱϵϲϮͲϴϵϱϵϴϯϲ ϱϵϲϮͲϴϵϱϵϴϯϰ ϱϵϲϮͲϴϵϱϵϴϮϲ ϱϵϲϮͲϴϵϱϵϴϯϳ ϱϵϲϮͲϴϵϱϵϴϯϱ ϱϵϲϮͲϴϵϱϵϴϮϳ ϱϵϲϮͲϴϵϱϵϴϯϴ ϱϵϲϮͲϴϵϱϵϴϯϲ ϱϵϲϮͲϴϵϱϵϴϮϴ ϱϵϲϮͲϴϵϱϵϴϰϭ ϱϵϲϮͲϴϵϱϵϴϯϳ &ŽƌĂĐŽŵƉƌĞŚĞŶƐŝǀĞ^ZD^DůŝƐƟŶŐ͕ƉůĞĂƐĞǀŝƐŝƚǁǁǁ͘ůŽŐŝĐĚĞǀŝĐĞƐ͘ĐŽŵͬƉƐͬ^ZDƐͬ
11
SSD
L8SCxxxxxxxx
^^Ž^d
Serial ATA Solid State Drive-on-Chip
ĞŶƐŝƟĞƐ͗Ϯϱ͕ϱϬ͕ϭϬϬ͕ϮϬϬ͕ĂŶĚϰϬϬ'
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
ĞŶĞĮƚƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
^dϲ'ďƉƐͬϯ'ďƉƐͬϭ͘ϱ'ďƉƐ
ǀĂŝůĂďůĞƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞƐ͗
! KDDZ/>;ϬОƚŽнϳϬОC)
! /Eh^dZ/>;ͲϰϬОƚŽнϴϱОC)
ϯϱŵŵdžϯϱŵŵ'ĨŽŽƚƉƌŝŶƚ
ĞdžƚƌĞŵĞŽǀĞƌƉƌŽǀŝƐŝŽŶŝŶŐĨŽƌĞdžĐĞƉƟŽŶĂůǁƌŝƚĞĞŶĚƵƌĂŶĐĞ
ĐŽŶĮŐƵƌĂďůĞĂƐƐŝŶŐůĞͲůĞǀĞůŇĂƐŚ;^>ͿĨŽƌŵĂdžŝƵŵƵŵ
ĞŶĚƵƌĂŶĐĞŽƌŵƵůƟͲůĞůǀĞůŇĂƐŚ;D>ͿĨŽƌĐŽƐƚĞīĞĐƟǀĞ
storage
ƵƉƚŽϳ͘ϯWĞƚĂďLJƚĞƚŽƚĂůǁƌŝƚĞĞŶĚƵƌĂŶĐĞ;ďĂƐĞĚŽŶĚĞŶƐŝƚLJͿ
ĂĚǀĂŶĐĞĚǁĞĂƌͲůĞǀĞůŝŶŐĂůŐŽƌŝƚŚŵ
ŝŵĞŶƐŝŽŶƐ͗
ĞĸĐŝĞŶƚĞƌƌŽƌƌĞĐŽǀĞƌLJ;,Ϳ
ĞŶŚĂŶĐĞĚ^ĞĐƵƌŝƚLJƌĂƐĞhŶŝƚĐŽŵŵĂŶĚ;DŝůŝƚĂƌLJƌĂƐĞͿ
ŚĂƌĚǁĂƌĞďĂƐĞĚ^ĞĐƵƌŝƚLJƌĂƐĞdƌŝŐŐĞƌ
^ͲϮϱϲ͕^ͲϭϮϴ͕ĂŶĚd'KƉĂůĂƚĂŶĐƌLJƉƟŽŶ
EĂƟǀĞŽŵŵĂŶĚYƵĞƵŝŶŐƐƵƉƉŽƌƚ
^͘D͘͘Z͘dĐŽŵŵĂŶĚƚƌĂŶƐƉŽƌƚ;^dͿƚĞĐŚŶŽůŽŐLJ
ůŽǁͲƉŽǁĞƌƐƚĂŶĚďLJ͕ƐůĞĞƉΘŚŝďĞƌŶĂƟŽŶŶĞĞĚƐ
KƉƟŽŶĂůWŽǁĞƌdŚƌŽƩůŝŶŐ
Internal temperature sensor
ZŽ,^ŽŵƉůŝĂŶƚĂŶĚ,ĂůŽŐĞŶͲ&ƌĞĞ
WĞƌĨŽƌŵĂŶĐĞ;^ƵƐƚĂŝŶĞĚͿ͗
ĂĐĐĞƐƐƚLJƉĞ͗
ƐĞƋƵĞŶƟĂůZ
ƐĞƋƵĞŶƟĂůtZ/d
ĨŽŽƚƉƌŝŶƚ͗
DͬƐĞĐ΀ΛϭϮϴ<ďůŽĐŬƐ΁͗
ƵƉƚŽϱϬϬDͬƐ
ƵƉƚŽϱϬϬDͬƐ
DĂdžŝŵƵŵ/ŶƉƵƚͬKƵƚƉƵƚKƉĞƌĂƟŽŶƐ͗
ĂĐĐĞƐƐƚLJƉĞ͗
ϯϱŵŵ
>ϴ^dždždždždždždždž
ƌĂŶĚŽŵZ
ƌĂŶĚŽŵtZ/d
/KWƐ΀Λϰ<ďůŽĐŬƐ΁͗
ƵƉƚŽϲϬ<
ƵƉƚŽϲϬ<
ǀĂŝůĂďůĞĞŶƐŝƟĞƐ͗
ϯϱŵŵ
^>EE&>^,Ͳх
Ϯϱ'͕ϱϬ'͕ϭϬϬ'͕ϮϬϬ'
D>EE&>^,Ͳх
ϱϬ'͕ϭϬϬ'͕ϮϬϬ'͕ϰϬϬ'
ŚĞŝŐŚƚƉƌŽĮůĞ͗
tƌŝƚĞŶĚƵƌĂŶĐĞ͗
ϳŵŵ
/ŶĚƵƐƚƌLJ^ƚĂŶĚĂƌĚϭϬĨƵůůĚƌŝǀĞǁƌŝƚĞƐͬĚĂLJĨŽƌϱLJĞĂƌƐ
12
hƉƚŽϳ͘ϯWĞƚĂďLJƚĞƐƚŽƚĂůǁƌŝƚĞĞŶĚƵƌĂŶĐĞ
Assembly Flows
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗WůĂƐƟĐWƌŽĚƵĐƚƐ
dĞƐƚͲĮŶĂů
ƵƌŶͲŝŶ
(C) Commerical
(I) Industrial
;ͿdžƚĞŶĚĞĚ
(M) Military
нϳϬОC
ͲϰϬО͕нϴϱОC
ͲϰϬО͕нϭϬϱОC
ͲϱϱОC, +125ОC
E͘͘
.
;ϭϬϬйͿϰϴŚƌƐ
;ϭϬϬйͿϰϴŚƌƐ
;ϭϬϬйͿϭϲϬŚƌƐ
W'WƌŽĚƵĐƚƐDĂŶƵĨĂĐƚƵƌŝŶŐ&ůŽǁ
Wafer/Die
Substrate
Cure
Electrical
Test
Substrate
Saw
Marking
Ball
Attach
Final
QA
Solder
Reflow
Bake & Pack
Die Bond
Die Stack
Plasma
Clean
Wire Bond
Clean
QA
Visual
Electrical
Test
Plasma
Clean
Burn-in
Encapsulation
ϭϯ
Ship
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗ĞƌĂŵŝĐWƌŽĚƵĐƚƐ
(I)
Industrial
(M)
Military
;^DͿ
D/>ͲWZ&Ͳϯϴϱϯϱ
ŝĞsŝƐƵĂů/ŶƐƉĞĐƟŽŶ
EŽ
EŽ
zĞƐ
Temp Cycle
zĞƐ
zĞƐ
zĞƐ
Centrifuge
zĞƐ
zĞƐ
zĞƐ
WƌĞͲďƵƌŶͲŝŶƚĞƐƚΛнϮϱОC
ƵƌŶͲŝŶ
zĞƐ
ϰϴŚƌƐ
ϭϲϬŚƌƐ
ϭϲϬŚƌƐ
ͲϰϬО͕нϴϱОC
ͲϱϱОC, +125ОC
ͲϱϱОC, +125ОC
W
EŽ
EŽ
zĞƐ
&ŝŶĞ>ĞĂŬ
EŽ
zĞƐ
zĞƐ
Gross Leak
ƵďďůĞdĞƐƚKŶůLJ
zĞƐ
zĞƐ
dĞƐƚͲĮŶĂů
D/>ͲWZ&ͲϯϴϱϯϱŽŵƉůŝĂŶƚWƌŽĚƵĐƚƐDĂŶƵĨĂĐƚƵƌŝŶŐ&ůŽǁ
<ŝƫŶŐ
,ĞƌŵĞƟĐ^ĞĂů
&ŝŶĞ>ĞĂŬ
<ŝƚ/ŶƐƉĞĐƟŽŶ
DĂƌŬ
'ƌŽƐƐ>ĞĂŬ
ŝĞƩĂĐŚ
džƉŽdžLJͬ^ŝůǀĞƌ'ůĂƐƐ
dĞŵƉĞƌĂƚƵƌĞLJĐůĞ
&ŝŶĂůY͘͘
Cure
ŽŶƐƚĂŶƚĐĐĞůĞƌĂƟŽŶ
Y͘͘ĂƚĂZĞǀŝĞǁΘ
>ŽƚĐĐĞƉƚĂŶĐĞ
tŝƌĞŽŶĚYƵĂůͬĞƐƚƌƵĐƚ
tŝƌĞWƵůů
>ĞĂĚdƌŝŵ;/ĨƉƉůŝĐĂďůĞͿ
tŝƌĞŽŶĚ
WƌĞͲďƵƌŶͲŝŶůĞĐƚƌŝĐĂů
tŝƌĞŽŶĚ
EŽŶͲĞƐƚƌƵĐƚWƵůů
ƵƌŶͲŝŶ
WƌĞͲĐĂƉsŝƐƵĂů/ŶƐƉĞĐƟŽŶ
WŽƐƚͲďƵƌŶͲŝŶůĞĐƚƌŝĐĂů
Y͘͘sŝƐƵĂů;WƌĞͲĐĂƉͿ
WsĞƌŝĮĐĂƟŽŶ
ƵƐƚŽŵĞƌ^ŽƵƌĐĞ
/ŶƐƉĞĐƟŽŶ;/ĨƉƉůŝĐĂďůĞͿ
/ŶͲůŝŶĞ'ƌŽƵƉ
Y͘͘sĞƌŝĮĐĂƟŽŶ
ϭϰ
WĂĐŬĂŶĚ^ŚŝƉ
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗^^WƌŽĚƵĐƚƐ
(C) Commerical
(I) Industrial
нϳϬОC
ͲϰϬО͕нϴϱОC
ƵƌŶͲŝŶ
E͘͘
;ϭϬϬйͿϰϴŚƌƐ
Temp Cycle
E͘͘
.
ϱϬĐLJĐůĞƐ
dĞƐƚͲĮŶĂů
>ϴ^dždždždždždždždž
^^WƌŽĚƵĐƚƐDĂŶƵĨĂĐƚƵƌŝŶŐ&ůŽǁ
BOM
Burn In
Individual Module Assembly
- Memory
- Controller
Thermal
dĞƐƟŶŐ
Module
/ŶƚĞŐƌĂƟŽŶ
YdĞƐƟŶŐ
Secure
Erase
DC Level
dĞƐƟŶŐ
Firmware
Download
Final QA
&ƵŶĐƟŽŶĂů
dĞƐƟŶŐ
Pack/Ship
15
YƵĂůŝĮĐĂƟŽŶĂƚĂ͗
/ŶƚĞŐƌĂƚĞĚDĞŵŽƌLJDŽĚƵůĞYƵĂůŝĮĐĂƟŽŶĂƚĂ
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗ĞƌĂŵŝĐWƌŽĚƵĐƚƐ
D/>Ͳ^dͲϴϴϯŽƌ:
Type of Test
WƌĞĐŽŶĚŝƟŽŶŝŶŐ
Life Test
:^ϮϮͲϭϬϴ
Temperature Cycling
:^ϮϮͲϭϬϰ
,^d
:^Ͳϭϭϴ
^:^ϮϮͲϭϭϴ
D/>Ͳ^dϯϬϭϱ͘ϳ
DĞƚŚŽĚͬŽŶĚŝƟŽŶ
^ĂŵƉůĞ^ŝnjĞ
:^ϮϮͲϭϬ
ϭ͘ϮdžsĐĐ
125°C
ϭϬϬϬĐLJĐ
ͲϱϱΣƚŽнϭϮϱΣ
ϭϯϬΣ
ϴϱйZ,
ϭϬϬƉĨ͕ϭϱϬϬё
ϮϬ
25 units
ϯůŽƚƐ
25 units
ϯůŽƚƐ
25 units
ϯůŽƚƐ
ϯƵŶŝƚƐ
ƵƌĂƟŽŶ
&ĂŝůͬhŶŝƚƐ
Eͬ
ϭϬϬϬŚƌƐ
ϬͬϮϬ
Ϭͬϳϱ
ϭϬϬϬĐLJĐ
Ϭͬϳϱ
ϵϲŚƌƐ
Ϭͬϳϱ
ϮϬϬϬs,D
Ϭͬϯ
^ZDYƵĂůŝĮĐĂƟŽŶĂƚĂ
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗ĞƌĂŵŝĐWƌŽĚƵĐƚƐ
D/>Ͳ^dͲϴϴϯ
DĞƚŚŽĚͬŽŶĚŝƟŽŶ
^ĂŵƉůĞ^ŝnjĞ
&ĂŝůͬhŶŝƚƐ
ůĞĐƚƌŝĐĂůdĞƐƚͬ'ƌŽƵƉ
ϭϬϬй&ĂƵůƚ͕ΘĐŽǀĞƌĂŐĞĂƚϮϱΣ͕ϭϮϱΣ͕ͲϱϱΣĂƐƉĞƌ
ƉƉĞŶĚŝdž͕ƐĞĐƟŽŶϭϬŽĨ^DϱϵϲϮͲϴϵϱϵϴ
ϭϭϲ
Ϭͬϭϭϲ
ZĞƐŝƐƚĂŶĐĞƚŽ^ŽůǀĞŶƚƐ
D/>Ͳ^dͲϴϴϯdDϮϬϭϱ
ϯ
Ϭͬϯ
D/>Ͳ^dͲϴϴϯdDϮϬϬϯ͕ƐŽůĚĞƌŝŶŐƚĞŵƉĞƌĂƚƵƌĞŽĨϮϰϱΣ
22
ϬͬϮϮůĚ;ϯĚĞǀͿ
D/>Ͳ^dͲϴϴϯdDϮϬϭϭ͕ĐŽŶĚŝƟŽŶŽƌ
15
ϬͬϭϱďĚƐ;ϰĚĞǀͿ
D/>Ͳ^dͲϴϴϯdDϮϬϭϲ
15
Ϭͬϭϱ
Lead Integrity
D/>Ͳ^dͲϴϴϯdDϮϬϬϰ͕ĐŽŶĚŝƟŽŶϮ>ĞĂĚ&ĂƟŐƵĞ
ϯ
Ϭͬϯ
dŚĞƌŵĂů^ŚŽĐŬ
D/>Ͳ^dͲϴϴϯdDϭϬϭϭ͕ĐŽŶĚŝƟŽŶϭϮϱΣƚŽͲϱϱΣ͕ϭϱĐLJĐůĞƐ
15
Ϭͬϭϱ
Temperature Cycle
D/>Ͳ^dͲϴϴϯdDϭϬϭϬ͕ĐŽŶĚŝƟŽŶϭϱϬΣƚŽͲϲϱΣ͕ϭϬϬĐLJĐůĞƐ
15
Ϭͬϭϱ
DŽŝƐƚƵƌĞZĞƐŝƐƚĂŶĐĞ
D/>Ͳ^dͲϴϴϯdDϭϬϬϰ͘ϳ
15
Ϭͬϭϱ
&ŝŶĞ>ĞĂŬ
D/>Ͳ^dͲϴϴϯdDϭϬϭϰ
15
Ϭͬϭϱ
Gross Leak
D/>Ͳ^dͲϴϴϯdDϭϬϭϰ
15
Ϭͬϭϱ
ϮϱΣ&Ƶůů^ƵďŐƌŽƵƉƐ
15
Ϭͬϭϱ
DĞĐŚĂŶŝĐĂů^ŚŽĐŬ
D/>Ͳ^dͲϴϴϯdDϮϬϬϮ͕ĐŽŶĚŝƟŽŶϭϱϬϬŐ
15
Ϭͬϭϱ
^ĂůƚƚŵŽƐƉŚĞƌĞ
D/>Ͳ^dͲϴϴϯdDϭϬϬϵ͕ĐŽŶĚŝƟŽŶϮϰŚƌƐ
15
Ϭͬϭϱ
D/>Ͳ^dͲϴϴϯdDϭϬϭϴ͕ϱϬϬϬƉƉŵǀ
ϯ
Ϭͬϯ
D/>Ͳ^dͲϴϴϯdDϮϬϮϱ
ϯ
Ϭͬϯ
Type of Test
^ŽůĚĞƌĂďŝůŝƚLJ
ŽŶĚ^ƚƌĞŶŐƚŚ
WŚLJƐŝĐĂůŝŵĞŶƐŝŽŶ
ůĞĐƚƌŝĐĂůŶĚƉŽŝŶƚdĞƐƚƐ
/ŶƚĞƌŶĂů'ĂƐŶĂůLJƐŝƐ
ĚŚĞƐŝŽŶŽĨ>ĞĂĚ&ŝŶŝƐŚ
&ŽƌƚŚĞůĂƚĞƐƚƌĞƐƵůƚƐŽĨŽŶͲŐŽŝŶŐŝŶůŝŶĞƉƌŽĐĞƐƐƋƵĂůŝĮĐĂƟŽŶĚĂƚĂ͕
ƉůĞĂƐĞǀŝƐŝƚŽƵƌǁĞďƐŝƚĞǁǁǁ͘ůŽŐŝĐĚĞǀŝĐĞƐ͘ĐŽŵ.
ϭϲ