EVAL Board ISO1I813T

AN-EVAL 2x8-ISO1I813T
ISOFACETM Evaluation Board for galvanically isolated 8-Channel Digital Input ICs
with IEC61131-2 compatible characteristics for industrial applications
ISO1I813T EVAL - Board
Application Note
V 1.0, 2011-09-09
Industrial & Multimarket
Edition 2011-09-09
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2011 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
AN-EVAL 2x8-ISO1I813T
Draft Version
Table of Contents
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Board Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
3.1
3.2
3.3
3.3.1
3.4
3.5
3.6
3.7
3.8
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
μC Control Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Sensor Input Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Wire Break Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Filter Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
DC/DC Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4
Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5
Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6
PCB Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7
Bill of Material . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8
Transformer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Application Note
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Application Note
Table of Contents
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Draft Version
1
Introduction
Introduction
Application
This Application Note describes an Evaluation Board with two isolated 8 Channel IEC61131-2 compatible Digital
Input ICs for a wide range of industrial applications.
The board is designed to allow easy exploration of the features of the ISOFACETM Digital Input part. It contains
two ISO1I813T as an electrically isolated 8 bit data input interface in TSSOP-48 package. These parts are used
to detect the signal states of up to eight independent input lines according to IEC61131-2 Type 1/2/3 (e.g. twowire proximity switches) with a common ground.
An 8 bit parallel/serial µC compatible interface allows to connect the IC directly to a µC system. The input interface
supports also a direct control mode and is designed to operate with 3.3/5V CMOS compatible levels.
The data transfer from input to output side across the galvanic isolation uses Infineon’s Coreless Transformer
Technology.
VBB
VFI
VCC
TS
330n
DC
ENA
SW1
WB
8 sensors
IN0
12k
I0H
2k
I0L
I7H
IN7
12k
2k
I7L
S
E
R
I
A
L
I
Z
E
D
E
S
E
R
I
A
L
I
Z
E
SW2
digital
filter
/ERR
L
O
G
I
C
SYNC
µC
/CS
parallel
or serial
interface
digital
filter
e.g.
XE166
Rosc
GNDFI
GND
GNDBB
ISO1I813T
Figure 1
Typical Application
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Draft Version
Board Characteristics
ISO1I813T
Figure 2
EVAL 2x8-ISO1I813T
2
Board Characteristics
Table 1
Board Characteristics
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
–
35
V
35
V
VBB Input Voltage
VBB
9.6
VINx Input Voltage
VINx
-35
VCC Input Voltage
VCC
3.0
–
5.5
V
Logic Signals uC
Interface
VIL
-0.3
–
0.3 x VCC
V
VIH
0.7 x VCC
–
VCC + 0.3 V V
Oscillator Frequency
50
500
kHz
Note /
Test Condition
set to 500kHz using
ROSC 22k
For a complete description of the characteristics of the ISO1I813T please consult respective Data Sheet available
at: www.infineon.com/isoface
Note: this board is intended to be used in the lab to explore the functionality of the
ISO1I813T device. It is not designed to be used in professional applications!
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3
Functional Description
Functional Description
This board contains two ISO1I813T as an electrically isolated 8 bit data input interface in TSSOP-48 package.
These parts are used to detect the signal states of up to eight independent input lines according to IEC61131-2
Type 1/2/3 (e.g. two-wire proximity switches) with a common ground.
For operation in accordance with IEC61131-2, it is necessary for the ISO1I813T to be wired with resistors rated
RIN and RLED. (it is recommended to use resistors with an accuracy of 2%, in any case < 5% - mandatory,
temperature-coefficients < 200ppm are allowed)
A parallel/serial µC compatible interface allows to connect the Board directly to a µC system.
If the parallel interface is used, only IC1 can be operated. In serial mode either IC1 can be used with 8 Bit SPI or
IC1 and IC2 can be put into a Daisy Chain configuration with 16 Bit SPI.
The isolated data transfer from input to output side is realized by the integrated Coreless Transformer Technology.
K1
VBB
VBB
K4
VCC
VCC
470n
TS
Rosc
WB
/ERR
I0H
IN0
digital
filter
2k
12k
I0L
S
E
R
I
A
L
I
Z
E
I7H
IN7
D
E
S
E
R
I
A
L
I
Z
E
2k
12k
I7L
L
O
G
I
C
ALE
/WR
/RD
/RD
/CS
/CS
AD0
AD0
AD1
AD1
AD2
AD2
AD3
AD3
AD4
AD5
AD6
AD7
AD4
AD5
digital
filter
AD6
K9
AD7
K10
GND
GNDBB
GNDbb
/ERR
ALE
/WR
GND
K11
ISO1I813T
K8
K12
VBB
K2
VBB
470n
VCC
TS
WB
IN0
IN0
12k
Rosc
I0H
I0L
S
E
R
I
A
L
I
Z
E
12k
GNDbb
Figure 3
I7H
IN7
IN7
D
E
S
E
R
I
A
L
I
Z
E
2k
GNDbb
/ERR
digital
filter
2k
I7L
L
O
G
I
C
/CS
AD0
AD1
AD2
AD3
digital
filter
AD4
AD5
AD6
AD7
GND
GNDBB
ISO1I813T
Block Diagram
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3.1
Functional Description
Power Supply
The IC contains 2 electrically isolated voltage domains that are independent from each other. The microcontroller
interface is supplied via pin VCC and the input stage is supplied via pin VBB. The different voltage domains can
be switched on at different time. If the VCC and VBB voltage have reached their operating range and the internal
data transmission have been started successfully, the IC indicates the end of the Start-Up procedure by setting
the pin /ERR to logic high.
3.2
Oscillator
The frequency of the internal oscillator can be set by the resistor ROSC. This internal oscillator provides the clock
for the data sampling and transmission as well as for the digital averaging filter. For adjusting the frequency of the
oscillator the values of ROSC can be taken out of the diagram in the ISO1I813T datasheet.
3.3
Parallel Interface
The ISO1I813T contains a parallel interface that can be selected by pulling the pin SEL to logic low state (see also
Table 2).
This interface can be directly controlled by the microcontroller output signals.
Table 2
Mode Select
Mode
K13
K9
K10
K11
K12
K8
Parallel (IC1)
2-3
close
open
close
open
1-2
Serial 8 Bit (IC1)
1-2
close
open
close
open
1-2
Serial 16 Bit
1-2
open
close
open
close
2-3
3.3.1
μC Control Mode
CS - Chip select. The system microcontroller selects the ISO1I813T by means of the pin CS. Whenever the pin
is in a logic low state, data can be transferred from or to the μC.
RD, WR (Read / Write) By pulling one of these pins down, a read or write transaction is initiated on the
AddressData bus and the data becomes valid. These pins have internal Pull-Up resistors.
ALE (Address Latch Enable) the pin ALE is used to select between address (ALE is in a logic High state) or data
(ALE is in a logic Low state). When ALE is pulled high, addresses are transferred and latched over the bit AD0 to
AD7. During the Low State of ALE all read or write transactions hit the same adress. This pin has an internal PullDown resistor.
The pins AD0 .. AD7 are the bidirectional input / outputs for data write and read. Depending on the state of the
ALE, RD, WR pins, register addresses or data can be transferred between the internal registers and e.g. the
microcontroller.
The μC Control Mode can be operated by connecting a Processor Board to the corresponding Signals of
Connector K4. The timing requirements for the μC Control Mode are shown in Figure 5.
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Functional Description
VCC
VCC
ALE
/CS
/RD
/WR
AD0
AD1
INx
AD2
AD3
AD4
AD5
AD6
AD7
ISO1I813T
Figure 4
MCU (e.g. XE166)
or ASIC
SEL
parallel _interface_uc.vsd
μC Control Mode
/CS
tCSD
tRD_su
ALE
tRDlow
tRD_hd
tRDhigh
/RD
tAD_su tAD_hd
AD[7:0]
GLERR address (04h)
tclrrdy
tfloat
tADvalid
GLERR data
GLERR data
GLERR
00h
Rd_timing_813T - Parallel _Timing_Read
Figure 5
Timing Diagram μC Control Mode Read
/CS
tCSD
tWR_su
ALE
tWRhigh
tWR_hd
/WR
tWR_su tWR_hd
tAD_su tAD_hd
AD[7:0]
COEFILx
COEFILx address
COEFILx data 0FH
00h
tlat
COEFILx data 0AH
0Fh
Wr_timing_813T - Parallel _Timing_Write
Figure 6
Timing Diagram μC Control Mode Write
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3.4
Functional Description
Serial Interface
The ISO1I813T contains two serial interfaces that can be activated by pulling the SEL pin to logic High state. The
interface can be directly controlled by the microcontroller output ports. The output pins SDO and SSO are in state
“Z” as long as CS=1. Otherwise, the bits are sampled with the falling edge of CS. With every falling edge of SCLK
the bits are provided serially to the pin SDO and SSO, respectively. At the same time, the inputs to SDI, SSI are
registered into input-FIFO buffers (sampled with the rising edge of SCLK). When all internally sampled bits have
been transferred to SDO/SSO, the buffered bits from the inputs SDI/SSI are provided to these pins (daisy-chain
support).
The timing requirements for the serial interface are shown in Figure 8.
The serial interface can be set to 8 Bit operation by using IC1 only or to 16 Bit operation by using IC1 and IC2 in
daisy-chain mode. For this purpose the jumpers K8, K9, K10 have to be set in the according manner (see also
Figure 7)
IC1
SCLK
INx
SCLK
SDI
SDI
SSI
SSI
SSO
SDO
/CS
/CS
K8
IC2
SCLK
K10
K9
SDI
SSI
INx
SSO
K12
K11
SSO
SDO
SDO
/CS
Figure 7
SPI Configuration
inactive
/CS
tSCLK_su
active
tCSD
tSCLK
receive
edge
SCLK
tSU
transmit
edge
tHD
MSB
SDI, SSI
LSB
tCS_valid
SDO, SSO
t CSH
tSCLK_valid
MSB
t float
LSB
Serial_Bus_Timing
Figure 8
Timing Diagram Serial Mode
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3.5
Functional Description
Sensor Input Stage
The sensor input structure is shown in Figure 9. Due to its active current a I-V-characteristic as shown in
Figure 10 is maintained. This I-V-curve is well within the IEC 61131 standard requirements of Type 1 and Type 3
sensors, respectively. Type 2 sensors are supported as well with the restriction that 2 input channels have to be
used in parallel i.e. only 4 channels are available. Additionally RIN and RLED has to be modified according Figure 9.
It is recommended to choose for the external resistors RIN, RLED an accuracy of 2 % (< 5% is mandatory) otherwise
the I/V-characteristic shown in Figure 10 cannot be attained. The Input Type 1, 2, 3 can be selected by modifying
RTS according Table 3.
Table 3
Type Select
Input Characteristic
Type 1
according IEC61131-2
33R
RTS
Type 2
Type 3
33k
330k
VBB
P24
TS
RTS
Inputx
INx
12k (8.5k *)
0V
2k (1,5k *) IxH
DATAx
RIN
RLED
IxL
GNDBB
*) : for Type2
Figure 9
Sensor Input
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Functional Description
VFI=30V
15V/11V
VINxDset
VINxDhys
VINxDclr
active
current sink
5V
-3V
0.5mA
Data Bit must be zero
Figure 10
Sensor Input Characteristic
3.6
Wire Break Detection
2mA/3mA I INxsnkC,M
15mA
Data Bit must be one
The wire-break detection current can be adjusted by the RWB-resistor value connected to the pin WB (Figure 11).
The minimum wirebreak-current can be choosen only when a LED- or Zener-Diode is connected to the pin IxL with
a forward current in the range of few uA in the voltage range below 1 V. In the case of a connected resistor at IxL
a great current is flowing across the external resistor Rext and the IxL-resistor (RLED). This part cannot be
measured internally and has to be added to the internal current part. In this case the minimum adjustable current
is 230uA (RLED = 2kOhm). The currently assembled WB resistor of 33kOhm leads to a WB detection limit of
80...160uA for Type 1/3 Sensor Interfaces. The WB bits in the status register have a sticky (latched) property and
remains set as long as they are not cleared by a read access and the fault condition is not detected anymore.
In case that a relay contact is connected to the input interface, the contact needs to be bypassed with a resistor
to provide the needed WB current
If the wire-break function is not needed, it can be switched off by setting the MWB bit in the registers COEFIL0-7.
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Functional Description
Wire-Break-Current Versus RWB
450
Wire-Break-Current[uA]
400
350
300
250
200
150
100
50
0
25
30
35
40
45
50
55
RWB[kOhm]
WBmin_LED
Figure 11
WBmax_LED
WBmin_Rled
WBmax_Rled
Wire Break Detection for Type 1/3 (typ. @ 25°C)
Wire-Break-Current Versus RWB
800
Wire-Break-Current[uA]
700
600
500
400
300
200
100
0
25
30
35
40
45
50
55
RWB[kOhm]
WBmin_LED
Figure 12
WBmax_LED
WBmin_Rled
WBmax_Rled
Wire Break Detection for Type 2 (typ. @ 25°C)
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Functional Description
In the case of Type 2 two sense inputs need to be switched in parallel to achieve 2 * 3 mA (Figure 12). In each
sense input a mimimum wirebreak current of 60 uA can be measured which means in sum a minimum wirebreak
current of 120 uA. It is not recommended to use external resistors at the pins IxL in case of wirebreak
measurements. The recommended value would be RLED = 1.2 kOhm which has been choosen in order not to
produce a large voltage drop between IxL and GNDBB which in turn would limit the voltage drop across the sink.
But the low value of RLED would cause a high external current in case of wirebreak-measurements which has to
be multiplied by two due to the parallel circuitry of the sense inputs.
3.7
Filter Setting
The sensor data bits can be filtered by a configurable digital input filter. If selected, the filter changes its output
according to an averaging rule with a selectable average length. When the sensor state changes without any
spikes and noise the change is delayed by the averaging length. Sensor spikes that are shorter than the averaging
length are suppressed. The averaging length is selected for each channel individually using the configuration
registers COEFIL0-7. The programmed filter time apply for both the data and the diagnostics of one channel. See
ISO1I813T datasheet for the different setting options including filter bypass. The filters are dimensioned for the
nominal internal sampling fscannom. The corresponding filter delays can be adjusted by changing the oscillator
frequency i.e. by tuning the resistor at the pin ROSC.
The filters are dimensioned for the nominal internal sampling fscannom. The corresponding filter delays can be
adjusted by changing the oscillator frequency i.e. by tuning the resistor at the pin ROSC.
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3.8
Functional Description
DC/DC Supply
DC_ENA
21
uC Supply (5V / 3.3V)
VCC 5
PP Output driver
SW1
VBB
22
1uF
10uF
Clk
100nF
Temp.
Sense
:2
DCK
SW2
23
GND
24
N1
N2
GNDBB
Tr
GND 1, 7, 18
uC Supply (GND)
uC-Domain
Figure 13
dcdc _typapp .vsd
Sense-Domain
Typical Circuitry for Self Powered Mode with Push-Pull Converter
The IC can as well operate in self powered mode. In this case, the Process Side can be supplied at VBB with an
isolated push-pull converter connected to the Micro-controller Side and driven by the pins SW1 and SW2 . The
internal driver stage at SW1 and SW2 is designed to power up two ISO1I813T parts. The DC/DC-Converter is
driven by the internal clock. Parameters are calculated with the internal clock = 500 kHz. By setting the bit DCK in
the GLCFG register a prescaler by 2 can be activated. This may be useful to improve the EMI behaviour. Should
the user adjusts another different frequency the transformer has to be adjusted accordingly.
The built in short-circuit protection uses a temperature sensor located close to the drivers (Figure 13) and disables
the driver stages when a predefined temperature is reached. That means that the drivers are switched off at a
temperature of 160 °C and switched on at a temperature of <=150°C
The transformer will be offered by EPCOS as a dedicated product for this ISO1I813T part.
Order number for 3.3V to 12V @ 500kHz: DS-T7389-51-02 (see also Chapter 8).
Special effort have to be spent on a proper layout, in order to minimize the noise caused by the DC/DC converter.
As it can be seen in Figure 13 the current path of the DC/DC converter has to be layouted separately, using the
ground pin 24.
Please Note: the transformer as well as the necessary diode and capacitors are not assebled on the board. The
recommended parts can be seen in the bill of material (Chapter 7).
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Connectors
4
Connectors
Table 4
K1, K2 Connector
Pin Number
K1 (IC1)
K3 (IC2)
1
VBB
VBB
2
Input0
Input0
3
Input1
Input1
4
Input2
Input2
5
Input3
Input3
6
Input4
Input4
7
Input5
Input5
8
Input6
Input6
9
Input7
Input7
10
GNDBB
GNDBB
Table 5
K4 Connector
Pin Number
Serial Mode
Parallel Mode
1
VCC
VCC
2
ERR
ERR
3
SYNC
SYNC
4
RD
5
DS0
WR
6
DS1
ALE
7
CS
CS
8
SDI
D0
9
SSO
D1
10
D2
11
D3
12
CRCERR
D4
13
SCLK
D5
14
SSI
D6
15
SDO
D7
16
GND
GND
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Connectors
1
1
1 2 3
1 2 3
ISO1I813T
1
Figure 14
Board Assembly
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5
Schematic
Figure 15
Schematic Page 1
Application Note
Schematic
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Figure 16
Schematic
Schematic Page 2
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PCB Layout
6
PCB Layout
Figure 17
Board Layout - Component Side
Figure 18
Board Layout - Bottom Side (mirror view)
Application Note
20
V 1.0, 2011-09-09
AN-EVAL 2x8-ISO1I813T
Draft Version
7
Bill of Material
Bill of Material
Nr
1
2
3
4
5
6
Count
2
1
2
0
0
4
7
16
8
2
9
10
11
12
0
2
2
4
13
7
14
15
2
1
16
16
17
18
19
20
21
2
2
2
2
2
22
16
23
0
24
5
Application Note
Pos.
Value
470nF, 50V
10uF,10V
100nF, 50V
1uF, 50V
10uF, 10V
4,7nF, 500V
C1, C7
C11
C2, C8
C3
C4
C5, C6, C9, C10
D1, D2, D3, D4, D5, D6,
D7, D8, D10, D11, D12, LED, gn KPHCMD13, D14, D15, D16,
2012CGCK
D17
LED, rt KPHCMD18, D19
2012EC-T
D9
BAS70-05
IC1, IC2
ISO1I813T
K1, K3
MKDS 1/10-3,81
K9, K10, K11, K12
Connector 2pol
K6, K7, K8, K13, K14,
Connector 3pol
K15, K16
K17, K18
Connector 1pol
K4
Connector 16pol
R1, R2, R3, R4, R5, R6,
R7, R8, R24, R25, R26,
2k, 1%
R27, R28, R29, R30,
R31
R17, R40
1k
R18, R41
33k
R19, R42
33R
R20, R43
100R
R21, R44
22k
R9, R10, R11, R12,
R13, R14, R15, R16,
12k, 1%
R32, R33, R34, R35,
R36, R37, R38, R39
T1
DS-T7389-51-02
Spacer D8mm ,
H2,8mm
21
Package
805
C_AL_B
805
805
805
1206
0805-DIODE
0805-DIODE
SOT-23
TSSOP48
KLEMME_10_3,81
1X02
1X03
1X01
1X16-90
1206
805
805
805
1206
805
1206
E6,3 SMD
V 1.0, 2011-09-09
AN-EVAL 2x8-ISO1I813T
Draft Version
8
Transformer
Transformer
In corporation by courtesy of EPCOS
Application Note
22
V 1.0, 2011-09-09
AN-EVAL 2x8-ISO1I813T
Draft Version
References
References
[1]
ISO1I813T, Isolated 8 Channel Digital Input with IEC61131-2 Type 1/2/3 Characteristics, Data Sheet,
Infineon Technologies
Application Note
23
V 1.0, 2011-09-09
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG