la92b/hrfug.ugug-r1-pf - Ligitek Electronics Co. Ltd.

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED ARRAY
Pb
Lead-Free Parts
LA92B/HRFUG.UGUG-R1-PF
DATA SHEET
DOC. NO :
QW0905- LA92B/HRFUG.UGUG-R1-PF
REV.
:
A
DATE
:
05 - Dec. - 2014
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/8
PART NO. LA92B/HRFUG.UGUG-R1-PF
Package Dimensions
HRF
UG
11.72 ±0.5
7.0
9.02
ψ2.9X2
1
+
HRFUG
9.65
5.08
TYP 1
2
3.3±0.3
3
2.54TYP
UG
2.54TYP
+
-
5.08 ±0.5
3
+
1.ANODE RED
2.COMMON CATHODE
3.ANODE GREEN
UGUG
□0.5
2
-
2.54±0.5
UG
1 2 3
+
1.ANODE GREEN
2.COMMON CATHODE
3.ANODE GREEN
LHRFUG2692-PF
LUGUG2692-PF
3.1
2.9
HRF
6.45 ±0.5
4.3
UG
1 2 3
3.3
1.5
MAX
1.ANODE RED
2.COMMON CATHODE
3.ANODE GREEN
□0.5
TYP
18.0MIN
UG
1
2
UG
3
2.0MIN
1 2 3
2.0MIN
2.54TYP
2.54TYP
1.ANODE GREEN
2.COMMON CATHODE
3.ANODE GREEN
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without not ice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/8
PART NO. LA92B/HRFUG.UGUG-R1-PF
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HRF
UG
Forward Current
IF
25
25
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
75
75
mA
Power Dissipation
PD
65
65
mW
Electrostatic Discharge
ESD
2000
V
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
AlGaInP
Lens
Red
Luminous Viewing
Dominant Spectral Forward
intensity
angle
wave
halfwidth voltage
length
△λnm @20mA(V) @20mA(mcd) 2θ 1/2
(deg)
λDnm
Typ.
Min. Max. Min.
630
20
1.5
2.4
220
550
70
574
20
1.7
2.6
65
90
70
574
20
1.7
2.6
65
90
70
574
20
1.7
2.6
65
90
70
Whtie Diffused
AlGaInP
Green
AlGaInP
Green
LA92B/HRFUG.UGUG-R1-PF
Whtie Diffused
AlGaInP
Green
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/8
PART NO. LA92B/HRFUG.UGUG-R1-PF
Brightness Code For Standard LED Lamps
UG CHIP
Group
Luminous Intensity(mcd) at 20 mA
Min.
Max.
A11
A12
65
90
90
120
A13
120
160
A14
160
220
A15
220
300
A16
300
350
HRF CHIP
Group
Luminous Intensity(mcd) at 20 mA
Min.
Max.
A15
220
300
A16
A17
300
350
350
450
A18
450
550
A19
550
700
A20
700
900
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA92B/HRFUG.UGUG-R1-PF
Page 4/8
Brightness Code For Standard LED Lamps
Color Code
UG CHIP
Group
Wave length(nm) at 20 mA
Min.
Max.
7
568
570
8
570
572
9
572
574
10
574
576
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA92B/HRFUG.UGUG-R1-PF
Page 5/8
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
2.0
50
Relative Intensity
Normalize @20mA
Forward Current(mA)
60
40
30
20
10
0
1.0
0.0
0
1.0
0.5
2.0
1.5
3.0
2.5
1.0
10
1.2
1.1
1.0
0.9
0.8
20
40
60
80
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0.0
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative Intensity@20mA
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
0
1000
Forward Current(mA)
Forward Voltage(V)
-20
100
700
80
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA92B/HRFUG.UGUG-R1-PF
Page 6/8
Typical Electro-Optical Characteristics Curve
UG CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
2.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
60
50
40
30
20
10
0
1.0
0
0
0.5
1.0
1.5
2.0
2.5
1.0
3.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
1.1
1.0
0.9
0.8
20
40
60
80
Relative Intensity @20mA
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0
550
600
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0
-20
0
20
40
60
Ambient Temperature( ℃)
Ambient Temperature( ℃)
500
Relative Intensity @20mA
Normalize @25 ℃
Forward Voltage@20mA
Normaliz @25 ℃
Fig.3 Forward Voltage vs. Temperature
0
1000
Forward Current(mA)
Forward Voltage(V)
-20
100
650
80
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/8
PART NO. LA92B/HRFUG.UGUG-R1-PF
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(° C)
260° C3sec Max
260°
5° /sec
max
120°
25°
0° 0
2° /sec
max
Preheat
50
100
Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LA92B/HRFUG.UGUG-R1-PF
Page 8/8
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃± 5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃± 5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃± 5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5℃ &-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=245 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11