LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only BIPOLAR TYPE LED LAMPS Pb Lead-Free Parts LVYUG65062/L15 DATA SHEET DOC. NO : QW0905- LVYUG65062/L15 REV. : B DATE : 19 - Dec. - 2008 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/8 PART NO. LVYUG65062/L15 Package Dimensions 2.7 1.5 R1.38 4.0 1.0MAX 0.40TYP 0.45MAX 25.0MIN 0.35TYP 2.0TYP + - 1.0MIN Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation 0° -30° 30° -60° 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LVYUG65062/L15 Page 2/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT VY UG Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 60 100 mA Power Dissipation PD 75 120 mW Ir 10 10 μA Reverse Current @5V Electrostatic Discharge( * ) ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic * glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted AlGaInP Yellow AlGaInP Green Lens Dominant Spectral wave halfwidth length △λ nm λDnm Forward Luminous Viewing voltage intensity angle @20mA(V) @20mA(mcd) 2θ 1/2 Min. Max. Min. Max. (deg) Min. Max. 583 598 20 1.7 2.6 28 300 174 564 576 20 1.7 2.6 28 300 174 White Diffused LVYUG65062/L15 Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LVYUG65062/L15 Page 3/8 Brightness Code For Standard LED Lamps VY CHIP Group Luminous Intensity(mcd) at 20 mA Min. Max. A8 28 38 A9 38 50 A10 50 65 A11 65 90 A12 90 120 A13 120 160 A14 160 220 A15 220 300 UG CHIP Group Luminous Intensity(mcd) at 20 mA Min. Max. A8 28 38 A9 38 50 A10 50 65 A11 65 90 A12 90 120 A13 120 160 A14 160 220 A15 220 300 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LVYUG65062/L15 Page 4/8 Brightness Code For Standard LED Lamps Color Code VY CHIP Group Wave length(nm) at 20 mA Min. Max. 14 583 585 15 585 587 16 587 589 17-1 589 590 17-2 590 591 17-3 591 592 18 592 595 19 595 598 UG CHIP Group Wave length(nm) at 20 mA Min. Max. 5 564 566 6 566 568 7 568 570 8-1 570 571 8-2 571 572 9 572 574 10 574 576 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page5/8 PART NO. LVYUG65062/L15 Typical Electro-Optical Characteristics Curve VY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 1.5 1.0 2.0 2.5 2.5 2.0 1.5 1.0 0.5 0.0 3.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 650 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page6/8 PART NO. LVYUG65062/L15 Typical Electro-Optical Characteristics Curve UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 3.0 Relative Intensity@20mA Normalize @25℃ 1.2 Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 650 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LVYUG65062/L15 Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO. LVYUG65062/L15 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11