2.5X2.0mm SURFACE MOUNT LED LAMP Part Number: AT2520SE9ZS-350MA ATTENTION Reddish-Orange OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Application Note Static electricity and surge damage the LEDS. Features z Dimension: 2.5mmx 2.0mm x 0.8mm. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. z Low thermal resistance. z Ceramic package with silicone resin. z Small package with high efficiency. z Surface mount technology. All devices, equipment and machinery must be electrically grounded. Typical Applications z ESD protection. PDAs z Package : 2000pcs / reel. Room lighting z Moisture sensitivity level : level 2a. z Soldering methods: IR reflow soldering. z RoHS compliant. Architectural lighting Decorative/pathway lighting Front panel backlight Exterior automotive lighting: (brake lights, turn lights, backlighting) Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAJ0363 REV NO: V.7 DATE: ARP/12/2011 PAGE: 1 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1212000004 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. 5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances. SPEC NO: DSAJ0363 REV NO: V.7 DATE: ARP/12/2011 PAGE: 2 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1212000004 Selection Guide luminous Intensity [2] Iv(mcd)@ 350mA Dice Part No. AT2520SE9ZS-350MA Reddish-Orange (AlGaInP) Φv (lm) [2] @ 350mA Viewing Angle [1] Min. Typ. Typ. 2 θ 1/2 8000 10500 23 130 ° Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. Luminous intensity/ luminous Flux: +/-15%. Absolute Maximum Ratings at TA=25°C Parameter Symbol Value Unit IF 350 mA Peak Forward Current [2] IFM 500 mA Power dissipation PD 1.05 W Reverse Voltage VR 5 V Operating Temperature Top -40 To +100 °C Storage Temperature Tstg -40 To +120 °C TJ 120 °C Rth j-a 95 °C/W Rth j-s 30 °C/W 8000 V DC Forward Current [1] Junction temperature[1] Thermal resistance [1] (Junction/ambient) Thermal resistance [1] (Junction/solder point) Electrostatic Discharge Threshold (HBM) Notes: 1. Results from mounting on metal core PCB,mounted on pc board-metal core PCB is recommend.for lowest thermal resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. Electrical / Optical Characteristics at TA = 25°C Parameter Symbol Forward Voltage IF = 350mA [Min.] Value Unit 2.0 VF [2] Forward Voltage IF = 350mA [Typ.] Forward Voltage IF = 350mA [Max.] 2.5 V 3.0 Allowable Reverse Current [Max.] IR 85 mA λ peak 635 nm λ dom [1] 623 nm Δλ 22 nm Temperature coefficient of λ peak IF = 350mA, - 10 ° C ≤ T ≤ 100 ° C [Typ.] TC λ peak 0.1 nm/°C Temperature coefficient of λ dom IF = 350mA, - 10 ° C ≤ T ≤ 100 ° C [Typ.] TC λ dom 0.08 nm/°C Temperature coefficient of VF IF = 350mA, - 10 ° C ≤ T≤ 100 ° C [Typ.] TCV -3.0 mV/°C Wavelength at peak emission IF = 350mA Dominant Wavelength IF = 350mA Spectral bandwidth at 50% Φ REL MAX [Typ.] [Typ.] IF = 350mA [Typ.] Notes: 1.Wavelength : + / -1nm. 2. Forward Voltage : + / - 0.1V. SPEC NO: DSAJ0363 REV NO: V.7 DATE: ARP/12/2011 PAGE: 3 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1212000004 AT2520SE9ZS-350MA SPEC NO: DSAJ0363 REV NO: V.7 DATE: ARP/12/2011 PAGE: 4 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1212000004 SPEC NO: DSAJ0363 REV NO: V.7 DATE: ARP/12/2011 PAGE: 5 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1212000004 AT2520SE9ZS-350MA Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Reel Dimension Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Tape Specifications (Units : mm) SPEC NO: DSAJ0363 REV NO: V.7 DATE: ARP/12/2011 PAGE: 6 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1212000004 PACKING & LABEL SPECIFICATIONS AT2520SE9ZS-350MA SPEC NO: DSAJ0363 REV NO: V.7 DATE: ARP/12/2011 PAGE: 7 OF 7 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: J.Yu ERP: 1212000004