AD MAT12

Low Noise, Matched
Dual Monolithic Transistor
MAT12
Preliminary Technical Data
FEATURES
PIN CONFIGURATION
Low offset voltage (VOS): 50 μV max
Very Low Voltage Noise: 1nV/√Hz max @ 100Hz
High Gain (hFE):
500 min at IC = 1mA
300 min at IC = 1μA
Excellent Log Conformance: rBE = 0.3 Ω
Low Offset Voltage Drift: 0.1 μV/ºC max
High Gain Bandwidth Product: 200MHz
Note: Substrate is connected to case on TO-78 package. Substrate is
normally connected to the most negative circuit potential, but can
be floated
GENERAL DESCRIPTION
The design of the MAT12 series of NPN dual monolithic transistors is optimized for very low noise, low drift and
low rBE. Exceptional characteristics of the MAT12 include offset voltage of 50 µV max and high current gain (hFE)
which is maintained over a wide range of collector current. Device performance is specified over the full
temperature range as well as at 25°C.
Input protection diodes are provided across the emitter-base junctions to prevent degradation of the device
characteristics due to reverse-biased emitter current. The substrate is clamped to the most negative emitter by the
parasitic isolation junction created by the protection diodes. This results in complete isolation between the
transistors.
The MAT12 is ideal for applications where low noise is a priority. The MAT12 can be used as an input
stage to make an amplifier with noise voltage of less than 1.0 nV/√Hz at 100 Hz. Other applications, such as
log/antilog circuits, may use the excellent logging conformity of the MAT12. Typical bulk resistance is only 0.3
Ω to 0.4 Ω. The MAT12 electrical characteristics approach those of an ideal transistor when operated over a
collector current range of 1µA to 10 mA.
Rev. PrA
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©2010 Analog Devices, Inc. All rights reserved.
MAT12
Preliminary Technical Data
SPECIFICATIONS
ELECTRICAL CHARACTERISTICS; VCB = 15V
VCB = 15 V, IO = 10μA, TA = 25°C, unless otherwise specified.
Table 1.
Parameter
Current Gain
Symbol
Conditions
Min
Typ
hFE
IC = 1mA (note 1)
-25ºC≤TA≤+85ºC
IC = 100μA
-25ºC≤TA≤+85ºC
IC = 10μA
-25ºC≤TA≤+85ºC
IC = 1μA
-25ºC≤TA≤+85ºC
500
325
500
275
400
225
300
200
605
Max
Unit
590
550
485
Current Gain Match
ΔhFE
10μA ≤ IC ≤ 1mA (note 2)
0.5
2
%
Noise Voltage Density
eN
IC = 1mA, VCB = 0 (note 3)
f O= 10Hz
f O= 100Hz
f O= 1kHz
f O= 10kHz
1.6
0.9
0.85
0.85
2
1
1
1
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
Offset Voltage
VOS
VCB = 0, 1μA ≤ IC ≤ 1mA
-25ºC≤TA≤+85ºC
10
50
70
μV
uV
Offset Voltage Change vs. VCB
ΔVOS/ΔVCB
0 ≤ VCB ≤ VMAX (note 4)
1μA ≤ IC ≤ 1mA (note 5)
10
25
μV
Offset Voltage Change vs. IC
ΔVOS/ΔIC
1μA ≤ IC ≤ 1mA (note 5), VCB=0
5
25
μV
Offset Voltage Drift
ΔVOS/ΔT
-25ºC≤TA≤+85ºC
-25ºC≤TA≤+85ºC, VOS
trimmed to zero
0.08
0.03
0.3
0.3
μV/ ºC
μV/ ºC
Breakdown Voltage
BVCEO
V
40
Gain-Bandwidth Product
Collector-Base Leakage Current
fT
ICBO
IC = 100mA, VCE = 10V
VCB=VMAX
-25ºC≤TA≤+85ºC
200
25
2
Collector-Collector Leakage Current
ICC
VCC=VMAX (notes 6,7)
-25ºC≤TA≤+85ºC
35
3
200
pA
nA
Collector-Emitter Leakage Current
ICES
VBE=0 (notes 6,7)
-25ºC≤TA≤+85ºC
35
3
200
pA
nA
Rev. PrA | Page 2 of 4
200
MHz
pA
nA
Preliminary Technical Data
MAT12
Input Bias Current
IB
IC = 10μA
-25ºC≤TA≤+85ºC
25
45
nA
nA
Input Offset Current
IOS
IC = 10μA
-25ºC≤TA≤+85ºC
0.6
8
nA
nA
Input Offset Current Drift
ΔIOS/ΔT
IC=10μA (note 6)
-25ºC≤TA≤+85ºC
40
90
pA/ºC
Offset Current Change vs. VCB
ΔIOS/ΔVCB
0 ≤ VCB ≤ VMAX (note 4)
30
70
pA/V
Collector Saturation Voltage
Output Capacitance
Bulk Resistance
Collector-Collector Capacitance
VCE(SAT)
COB
rBE
CCC
IC = 1mA, IB=100μA
VCB=15V, IE=0
10μA≤IC≤10mA (note6)
VCC = 0
0.05
23
0.3
35
0.1
V
pF
Ω
pF
Notes:
1.
2.
3.
4.
5.
6.
7.
0.5
Current gain is guaranteed with Collector-Base Voltage (VCB) swept from 0 to VMAX at the indicated collector currents.
Current Gain Match (ΔhFE) defined as: ΔhFE = (100(ΔIB)( hFE min)/IC)
Noise Voltage Density is guaranteed, but not 100% tested
This is the maximum change in VOS as VCB is swept from 0V to 40V.
Measured at IC=10μA and guaranteed by design over the specified range of IC
Guaranteed by Design
ICC and ICES are verified by measurement of ICBO
Rev. PrA | Page 3 of 4
MAT12
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Parameter
Collector-Base Voltage (BVCBO)
Collector-Emitter Voltage (BVCEO)
Collector-Collector Voltage (BVCC)
Emitter-Emitter Voltage (BVEE)
Collector Current (IC)
Emitter Current (IE)
Rating
40 V
40V
40V
40V
20 mA
20 mA
Storage Temperature Range H Packages
Operating Temperature Range
Junction Temperature Range RM, CP Packages
Lead Temperature (Soldering, 60 sec)
−65°C to +150°C
−25°C to +85°C
−65°C to +150°C
300°C
1
Table 3. Thermal Resistance
Package Type
TO-78 (H)
ESD CAUTION
Differential input voltage is limited to 5 V or the supply voltage, whichever
is less.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
©2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
PR09044-0-4/10(PrA)
Rev. PrA | Page 4 of 4
θJA
TBD
θJC
TBD
Unit
ºC/W