Thin Film Capacitor (TFCP) for Embedding in Organic Package Prototype CEATEC2013-22b Decoupling immediately below IC supports higher frequencies and lower voltages TDK has succeeded in creating a barium titanate dielectric layer on a nickel foil substrate, using a sputtering technique. This results in a flexible thin film capacitor sheet with high dielectric constant (ε = 1000). An IC package with such an embedded thin film capacitor (TFCP) has a low impedance value in the high frequency range, making it possible to obtain superior performance from semiconductor chips driven at high frequency or with low voltages. Features • Thin film material with high dielectric constant (ε = up to 1000, 1μF/cm ) • Nickel foil substrate can be kept thin and flexible (to 50μm). • High degree of freedom in shaping and electrode patterning, from individual chip types to sheets 2 Major Applications • Capacitors for substrate embedding • 1608 chip (22nF), 1005 chip (4.7nF), 0603 chip (1nF), sheet (1μF/cm ) • IC decoupling, board power supply stabilization 2 Characteristics and Roadmap IC MLCC Single layer Multiple layers Current package Copper Insulator Dielectric IC Nickel foil Thickness 30μm~100μm Embedded TFCP package n= 2~ TFCP Capacitance 0.020 Year Impedance (Ω) Current package 2014 2015 2016 2017 2018 Form factor 0.015 1608 22nF 47nF 100nF 470nF 2.2μF 1005 4.7nF 10nF 22nF 100nF 470nF 0603 1nF 2.2nF 4.7nF 22nF 100nF 0.010 Embedded TFCP package 0.005 0.000 1E4 Sheet type 1E5 1E6 1E7 Frequency (Hz) 1E8 1E9 1μF/cm2 3μF/cm2 5μF/cm2