Semiconductor Embedded in SUBstrate: SESUB CEATEC2013-21 SESUB technology from TDK realizes ultra-miniaturized power management units (PMU), Bluetooth modules, and more! SESUB (Semiconductor Embedded in SUBstrate) technique for embedding extremely low-profile chips into the substrate enables the creation of extremely compact, high-performance PMUs for smartphones, as well as the world's smallest class Bluetooth module. Cross-section view of SESUB 1mm Features • Small size: • Low profile: • Thermal dissipation: • Reduced noise emissions: 0.3mm IC Die IC Die Higher integration of parts enables drastic miniaturization. 4-layer substrate can be realized with a thickness of only 300 micron. Efficient thermal dissipation provides higher degree of freedom for design. Chip connections within substrate enhance EMI performance. Major Applications • Smartphones, mobile phones, tablet devices • Digital still cameras and other mobile devices • Healthcare products, wearable devices, etc. Advantages Compact, low-profile, low power consumption, low noise PMU lineup Bluetooth module Charge Pump μDC-DC Converter (Bluetooth Low Energy) mm Battery Charger 4.6 PMUs for smartphones 1.0mm 5 .6 mm World’s smallest class! More compact products are under development. 5.2 × 4.3 × 1.0mm ■ 64% smaller mounting footprint (Compared to modular construction using packaged ICs) 11×11×1.65mm 8.9×10.3×1.4mm (Prototype) 6.65×5.3×1.4mm (Prototype) 2.3×2.4×1.0mm 2.9×2.3×1.0mm Laminate Module SESUB module 8.5×8.5mm (= 72.3mm 2 ) Height 1.0mm 5.6×4.6 mm (= 25.8mm 2 ) Height 1.0mm 11.0×11.0mm Height 1.65mm (max.) 6.0×6.0mm Package IC -64% 2.9 mm 2.3mm Chips are embedded in this substrate area ■ Ideal for wearable devices and portable devices with emphasis on small size and elegant design μDC-DC Converter Shielded switching DC-DC converter (prototype) Newly developed shielding structure for μDC-DC converter results in further reduced noise. 76.0 74.1 72.2 70.3 68.4 66.5 64.6 62.7 60.8 58.9 57.0 55.1 53.2 51.3 49.4 47.5 45.6 43.7 41.8 39.9 38.0 (dBμV) Performance comparison Bluetooth module demonstration Conventional small-size Bluetooth tag Thickness 5 to 13mm Without shield With shield Ultra low profile tag utilizing SESUB Thickness 2mm Easily fits into any wallet