TB62781FNG

TB62781FNG
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62781FNG
9-Channel Constant-Current LED Driver of the 3.3V and 5V Power Supply Voltage
Operation
1. Features
•
Power supply voltages: VCC = 3.3 V/5 V
•
Output drive capability and output count: 80 mA (max)× 9 channels
•
Constant-current output range: 5 to 40 mA
•
Voltage applied to constant-current output terminals: 0.4 V(min) (IOUT = 5 to 40 mA)
•
Designed for common-anode LEDs
•
The input interface is controlled by the SDA and SCLK signal lines.
•
Thermal shutdown (TSD) (min: 150℃)
•
Logical Input signal voltage level: 3.3V and 5V CMOS interfaces (Schmitt trigger input)
•
Maximum output voltage: 28 V
•
Incorporates PWM control circuitry: Provides seven-bit PWM control.
•
Driver identification: Up to 64 drivers can be controlled individually.
•
Operating temperature range: Topr = −40 to 85°C
•
Package: SSOP20-P-225-0.65A
Absolute Maximum Ratings (Ta = 25 °C)
Characteristics
Symbol
Rating
Unit
Supply voltage
VCC
6.0
V
Input voltage
VIN
Output current
IOUT
85
mA/ch
Output voltage
VOUT
−0.3 to 29
V
Power dissipation
Pd
Thermal resistance
−0.3 to VCC + 0.3 (Note 1)
1.02 (Notes 2 and 3)
Rth (j-a)
122 (Note 2)
V
W
°C/W
Operating temperature range
Topr
−40 to 85
°C
Storage temperature range
Tstg
−55 to 150
°C
Tj
150
°C
Maximum junction temperature
Note 1:
However, do not exceed 6.0 V.
Note 2:
When mounted on a PCB (76.2 × 114.3 × 1.6 mm; Cu = 30%; 35-µm-thick; SEMI-compliant)
Note 3:
Power dissipation is reduced by 1/Rth (j-a) for each °C above 25°C ambient.
Please use contents on this material as reference.
Please contact if you need formal datasheet.
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Operating Condition (Unless otherwise specified, VDD = 3.0~5.5 V Ta = −40~85 °C)
Characteristics
Supply voltage
Symbol
Test Condition
⎯
Vcc
VIH
Clock frequency
Typ.
Max
Unit
3
⎯
5.5
V
0.7 × Vcc
⎯
Vcc
GND
⎯
0.3 × Vcc
SDA、SCLK、RESET
VIL
Input voltage
Min
VID0
0
⎯
0.3
VID1
1/3Vcc-0.3
1/3 Vcc
1/3Vcc+0.3
VID2
2/3Vcc-0.3
2/3 Vcc
2/3Vcc+0.3
VID3
Vcc −0.3
⎯
Vcc
⎯
⎯
10
V
ID0、ID1、ID2
fCLK
SCLK
MHz
Electrical Characteristics (Unless otherwise specified, VDD = 3.3 V or 5.0 V, Ta = 25 °C)
Characteristics
Output current
Output current error between
channels
Pin Assignment
Symbol
Test Condition
Name
1
RESET
2
SDA
3
SCLK
4
ID0
5
ID1
6
ID2
7
Rext-R
8
Rext-G
9
Rext-B
10
GND
11
/OUTR0
12
/OUTG0
13
/OUTB0
14
/OUTR1
15
/OUTG1
16
/OUTB1
17
/OUTR2
18
/OUTG2
19
/OUTB2
20
Vcc
Typ.
Max
Unit
IOUT1
VOUT = 0.4 V,
Rext-R/G/B = 1.2kΩ,
Vcc = 5 V,
12.69
13.5
14.41
mA
∆IOUT2
VOUT = 0.4 V,
Rext-R/G/B = 1.2kΩ,
All ch ON Vcc = 5 V
⎯
⎯
±3
%
Package
Weight：0.10 g (typ)
Pin No.
Min
2
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TB62781FNG
Block Diagram
ID0 ID1
ID2
Rext-R
Vcc
Address
Configuration
RESET
SDA
SCLK
Logic
Processing
Data
Buffer
PWM (7 bits)
ConstantCurrent Driver
/OUTR0
PWM (7 bits)
ConstantCurrent Driver
/OUTR1
PWM (7 bits)
ConstantCurrent Driver
/OUTR2
/OUTG0
PWM (7 bits)
ConstantCurrent Driver
ConstantCurrent Driver
PWM (7 bits)
ConstantCurrent Driver
/OUTG2
PWM (7 bits)
ConstantCurrent Driver
/OUTB0
PWM (7 bits)
ConstantCurrent Driver
/OUTB1
PWM (7 bits)
ConstantCurrent Driver
/OUTB2
PWM (7 bits)
CLK
Generation
TSD
POR
Rext-G
3
/OUTG1
Rext-B
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TB62781FNG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury
by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of
over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or
ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings,
such as fuse capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush current
at power ON or the negative current resulting from the back electromotive force at power OFF. IC
breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
[5] Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC output
DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage,
overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from
the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC
that inputs output DC voltage to a speaker directly.
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Points to remember on handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so
that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design
the device taking into considerate the effect of IC heat radiation with peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is
small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum
ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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Restrictions on product use
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also
refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the
specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS,
INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF
DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF
PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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