TCA62724FMG(O,S,EL TOSHIBA CMOS Integrated Circuits Silicon Monolithic TCA62724FMG(O,S,EL 3-Channel Constant-Current LED Driver The TCA62724FMG is an optimal constant-current LED driver for RGB pixel LEDs. The device supports 16 dimming states for each color in the RGB pixel LED setup, resulting in 4096 colors for carrying out illumination by internal PWM. The Max forward current of the LED is set up using the external resistor. This IC is especially for driving back light white LEDs in LCD of PDA, Cellular Phone, or Handy Terminal Equipment. Features • Power supply voltage range : 2.8 to 5.5 V • Constant current range : 5 to 150 mA • Low consumption current Supply current at operation (Iout = 20 mA / DC) : 700 μA (Max) Supply current at standby : 10 μA (Max) • For anode common LED • I2C interface • Package Weight: 0.018 g (typ.) : SON10-P-0303-0.50 1 2010-06-24 TCA62724FMG(O,S,EL Pin Assignment (top view) Ass’ly in first half of year Ass’ly in latter half of year (The 53rd week from the 27th week) (The 26th week from the first week) VIN VIN SHDN 1 10 OUT0 SDA 2 9 OUT0 8 OUT1 SCL 3 8 OUT1 4 7 OUT2 RESET 4 7 OUT2 5 6 REXT GND 5 6 REXT SHDN 1 10 SDA 2 9 SCL 3 RESET GND Terminal Description Pin No. Pin Name 1 SHDN 2 SDA 3 SCL 4 RESET Function The shutdown signal input terminal. In the case of "L" level input, the IC becomes the power-saving mode. In the case of "H" level input, the IC becomes the operation mode. Serial data input / output terminal. Serial clock input terminal. The data reset signal input terminal. In the case of "L" level input, data is reset. In the case of "H" level input, the IC becomes the operation mode. 5 GND Grand terminal. 6 REXT The output current setting resistor connection terminal. Resistance is connected with this terminal between GND. The output current does not flow when this terminal is opened. Excessive output current will destroy the IC if this terminal is connected to GND. 7 OUT2 8 OUT1 9 OUT0 10 VIN Constant current output terminal. Supply voltage input terminal. 2 2010-06-24 TCA62724FMG(O,S,EL Block Diagram VIN 10 SDA 2 SCL 3 I2 C Interface LOGIC 9 OUT0 PWM LOGIC RESET 8 OUT1 4 Constant Current Circuit 7 OUT2 SHDN 1 GND 5 6 REXT Example Applications : Cellular Phone Application as Camera Light (Primary-color red, green and blue LEDs combine to emit good-quality white light for color reproducibility.) VIN SCL Bus Line VIN 2.8 to 5.5 V VOUT SDA Bus Line Camera light ISDA Microcontroller TCA62724FMG 150 mA 150 mA 150 mA VIN SHDN SDA SDA OUT 0 SCL SCL OUT 1 RESET OUT 2 GND REXT RED GREEN BLUE REXT = 3.7 kΩ *ISDA will recommend 3 mA. 3 2010-06-24 TCA62724FMG(O,S,EL I/O Equivalent Pin Circuits VIN 1. SHDN Terminal VIN SHDN VIN VIN SDA 1 3. SCL Terminal VIN SCL 2. SDA Terminal VIN 2 4. RESET Terminal VIN 3 RESET VIN 4 5. VIN,GND Terminal VIN 10 GND 5 4 2010-06-24 TCA62724FMG(O,S,EL I2C Interface *DATA transfer format Slave address 7 bits S R/W Sub-address 8 bits A A DATA byte 8 bits A P *START condition (S), STOP condition (P) START condition STOP condition : A HIGH to LOW transition on the SDA line while SCL is HIGH. : A LOW to HIGH transition on the SDA line while SCL is HIGH. SDA SCL P S STOP condition START condition *DATA validity Please do not change SDA, when SCL is "H". SDA can be changed, when SCL is "L". SDA SCL SDA can't be changed. SDA change is possible. SDA can't be changed. SDA change is possible. SDA change is possible. *Acknowledge (A) Whenever it receives the 1-byte data from a transmitter, a receiver has to generate acknowledge .The receiver is obliged to generate an Acknowledge after each byte has been received. SDA from Transmitter SDA from Receiver SCL from Master Acknowledge S 1 8 9 Clock for acknowledge 5 2010-06-24 TCA62724FMG(O,S,EL *Slave address TCA62724FMG Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 1 0 1 0 1 0 1 R/W R/W: When this bit is set to “H”, READ mode applies; when it is set to “L”, WRITE mode applies. *Sub-address PWM0 (PWM Duty Data Setup of OUT0) Bit 7 Bit 6 Bit 5 Bit 4 AI 0 0 0 PWM1 (PWM Duty Data Setup of OUT1) Bit 7 Bit 6 Bit 5 Bit 4 AI 0 0 0 PWM2 (PWM Duty Data Setup of OUT2) Bit 7 Bit 6 Bit 5 Bit 4 AI 0 0 0 Bit 3 Bit 2 Bit 1 Bit 0 0 0 0 1 Bit 3 0 Bit 2 0 Bit 1 1 Bit 0 0 Bit 3 Bit 2 Bit 1 Bit 0 0 0 1 1 ENABLE / SHDN (Data Setup of ENABLE / SHDN) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 AI 0 0 0 0 1 0 0 AI: When this bit is set to “H”, auto-increment is OFF; when it is set to “L”, auto-increment is ON. *DATA byte PWM0, PWM1, and PWM2 DATA PWM ON Duty DATA (0/15 to 15/15) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Don’t use (default =”0000”) Bit 3 Bit 2 Bit 1 Bit 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Bit 5 Bit 4 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 ENABLE / SHDN DATA Bit 7 Bit 6 Bit 1 Bit 0 PWM ON Duty DATA PWM ON Duty DATA 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 Bit 2 15/15 14/15 13/15 12/15 11/15 10/15 9/15 8/15 7/15 6/15 5/15 4/15 3/15 2/15 1/15 0/15 Don’t use Bit 3 Bit 2 Bit 1 Bit 0 X X ENABLE SHDN (default = ”00000000”) ENABLE DATA H : Output blinks at PWM0, PWM1, and PWM2 rate L : Output is OFF SHDN data H L : Output blinks at PWM0, PWM1, and PWM2 rate : Power-saving mode 6 2010-06-24 TCA62724FMG(O,S,EL *WRITE mode Auto-increment OFF S Slave Address R/W (0) A Subaddress A DATA A Subaddress A DATA R/W (0) A Subaddress A DATA A DATA A --- --- P Auto-increment ON S Slave Address P The data of the immediately following Sub-address can be written in. *READ mode S Slave Address R/W (1) A First Byte A First byte (ENABLE / SHDN DATA and PWM2 DATA) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 x x ENABLE SHDN Second Byte Bit 1 P Bit 0 PWM2 DATA Second byte (PWM1 DATA and PWM0 DATA) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 PWM1 DATA Bit 1 Bit 0 PWM0 DATA 7 2010-06-24 TCA62724FMG(O,S,EL Setting of Output Current (Reference Data) The output current is set by the resistance connected between terminal REXT and GND. The output current can be set according to the following expression. 1.17 (V) IOUT (mA) = × 460 REXT (kΩ) I OUT vs. R EXT 150 Ta=25°C VDS=1.0 V 125 I OUT (mA) 100 75 50 25 0 0 20 40 R EXT(Ω) 60 80 100 Output Voltage – Output Current (Reference Data) V DS vs. IOUT 180 REXT = 3.6 kΩ 160 140 IOUT (mA) 120 100 80 60 REXT = 11 kΩ 40 20 REXT = 110 kΩ 0 0.0 0.5 1.0 1.5 V DS (V) 2.0 2.5 3.0 Note1: These application examples are provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. 8 2010-06-24 TCA62724FMG(O,S,EL Absolute Maximum Ratings (Ta = 25°C) Characteristic S u p p l y O u t p u t I n p u t v o l t a g e v o l t a g e v o l t a g e Symbol Ratings *1 Unit VIN VOUT −0.3 ~ +6.0 −0.3 ~ +6.0 V V Vin −0.3 ~ VIN+0.3 *2 V (SDA/SCL/ SHDN / RESET Terminal) P o w e r 0.36 (free air) PD d i s s i p a t i o n W 0.79(on PCB) *3,4 340 (free air) T h e r m a l r e s i s t a n c e Rth (j-a) Operating temperature Topr −40 ~ +85 °C temperature Tstg −55 ~ +150 °C Tj 150 °C Storage Maximum junction temperature °C/W 158 (on PCB) *3 Note1: Voltage is ground referenced. Note2: Do not exceed 6.0V. Note3: PCB condition 40 mm x 40 mm x 1.6 mm, Cu = 10 % Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each degree (1°C) that the ambient temperature is exceeded (Ta = 25°C). Recommended Operating Condition Characteristic Symbol Condition Min Typ. Max Unit v o l t a g e VIN - 2.8 3.6 5.5 V Constant current output IOUT OUT0 to OUT2 5 - 150 mA/ch R E X T REXT - 3.7 - 109 kΩ S u p p l y r e s i s t a n c e Electrical Characteristics (unless otherwise specified, Ta = 25°C, VIN = 3.6V) Characteristic Symbol Condition Min Typ Max Unit VIN - 2.8 3.6 5.5 V Supply current (IC operation) IIN (On) REXT = 27.6 kΩ, VIN = 3.6 V - - 700 μA Supply current (IC standby) IIN (Off) SHDN = L - - 10 μA 0.7VIN - VIN+0.15V −0.15 - 0.3VIN Supply voltage High level VIH Low level VIL Measuring terminal is SDA, SCL, SHDN , RESET IIH IIL Measuring terminal is SCL, SHDN , RESET −1.0 −1.0 - 1.0 1.0 μA GAIN REXT=11kΩ 359 460 560 A/A VREXT VIN=3.6V, REXT=11kΩ IOZ SHDN =“L”, VOUT=5.5V 1.17 - 1.25 0.1 V Output leakage current 1.09 - μA C o n s t a n t c u r r e n t accuracy between bits dIOUT VIN = 3.6 V, REXT = 11 kΩ - ±1 ±7.5 % P W M fPWM - - 3.0 - kHz tRE - - - 5 ms Input voltage High level Low level G a i n ( I O U T / I R E X T ) REXT terminal voltage Input current f r e q u e n c y Time from SHDN release to start of operat ion 9 V 2010-06-24 TCA62724FMG(O,S,EL 2 Characteristics of the SDA and SCL Bus Lines for I C-bus Devices Standard Mode Characteristic Symbol SCL clock frequency Bus free time between STOP and START condition Hold time (repeated) S TA R T c o n d i t i o n Setup time for repeated S T A R T c o n d i t i o n Setup time for STOP condition D a t a h o l d t i m e D a t a s e t u p t i m e LOW period of the SCL clock fSCL 0 Max 100 tBUF 4.7 - μs tHD;STA 4.0 - μs tSU;STA 4.7 - tSU;STO tHD;DAT tSU;DAT tLOW 4.0 0 250 4.7 HIGH period of the SCL clock tHIGH 4.0 - μs μs μs tf - 1000 ns tr - 300 ns R i s e t im e o f bo t h SDA and SCL signals F a l l t i m e o f b o t h SDA and SCL signals Min Unit kHz ns ns μs SDA tf tLOW tHIGH tBUF tSU;DAT tHD;STA SCL tHD;STA tr tHD;DAT tSU;STA tSU;STO 10 2010-06-24 TCA62724FMG(O,S,EL Package Dimensions Weight: 0.018 g (typ.) 11 2010-06-24 TCA62724FMG(O,S,EL Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 12 2010-06-24 TCA62724FMG(O,S,EL Points to remember on handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 13 2010-06-24 TCA62724FMG(O,S,EL About solderability, following conditions were confirmed Solderability (1) (2) Use of Sn-37Pb solder Bath solder bath temperature: 230°C dipping time: 5 seconds the number of times: once use of R-type flux Use of Sn-3.0Ag-0.5Cu solder Bath solder bath temperature: 245°C dipping time: 5 seconds the number of times: once use of R-type flux 14 2010-06-24 TCA62724FMG(O,S,EL RESTRICTIONS ON PRODUCT USE • Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice. • This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission. • Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS. • Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. • Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. • Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. • Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. • Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 15 2010-06-24