TCA62723FMG

TCA62723FMG
TOSHIBA CMOS Integrated Circuits Silicon Monolithic
TCA62723FMG
Three-Channel Constant-Current LED Driver
The TCA62723FMG is an optimal constant-current LED driver for RGB pixel
LEDs.
This IC does not have to connect external resistance to each output in the
case of most. The output current of 3ch is set up by one external resistance.
Features
•
Power supply voltage range
: 2.7 to 5.5 V
•
Constant current range
: 5 to 150 mA
•
Low consumption current
At the time of IC operation mode (Iout = 20 mA/DC)
: 700 μA (MAX)
At the time of IC power-saving mode
: 10 μA (MAX)
•
For anode common LED
•
Package
Weight: 0.018 g (typ.)
: SON10-P-0303-0.50
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TCA62723FMG
Pin Layout (Top view)
Ass’ly in first half of year
Ass’ly in latter half of year
(The 53rd week from the 27th week)
(The 26th week from the first week)
VIN
VIN
SHDN
1
10
9
OUT0
CTL0
2
9
OUT0
3
8
OUT1
CTL1
3
8
OUT1
CTL2
4
7
OUT2
CTL2
4
7
OUT2
GND
5
6
REXT
GND
5
6
REXT
SHDN
1
10
CTL0
2
CTL1
Terminal Description
Pin
No.
Pin
Name
1
SHDN
2
CTL0
3
CTL1
4
CTL2
The ON/OFF control signal of OUT2 Input terminal.
In the case of "L" level input, OUT2 is turned OFF.
In the case of "H" level input, OUT2 is turned ON.
5
GND
Grand terminal.
6
REXT
The output current setting resistor connection terminal.
Resistance is connected with this terminal between GND.
The output current does not flow when this terminal is opened.
Excessive output current will destroy the IC if this terminal is connected to GND.
7
OUT2
8
OUT1
9
OUT0
10
VIN
Function
The shutdown signal input terminal.
In the case of "L" level input, the IC becomes the power-saving mode.
In the case of "H" level input, the IC becomes the operation mode.
The ON/OFF control signal of OUT0 Input terminal.
In the case of "L" level input, OUT0 is turned OFF.
In the case of "H" level input, OUT0 is turned ON.
The ON/OFF control signal of OUT1 Input terminal.
In the case of "L" level input, OUT1 is turned OFF.
In the case of "H" level input, OUT1 is turned ON.
Constant current output terminal.
Supply voltage input terminal.
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Block Diagram
VIN
OUT0
CTL0
OUT1
CTL1
Constant current output
circuit
OUT2
CTL2
SHDN
REXT
Reference current
circuit
GND
Application Circuit Example
VOUT
VIN
2.7V~5.5V
TCA62723FMG
SHDN
VIN
CTL0
OUT 0
CTL1
OUT 1
CTL2
OUT 2
GND
REXT
REXT
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Method of setting output current (Reference data)
The output current is set by REXT connected with the terminal REXT.
1.17 (V)
× 460
IOUT (mA) =
REXT (kΩ)
IOUT vs. REXT
120
Ta = 25°C
VDS = 1.0V
R EXT (kΩ)
100
80
60
40
20
0
5
25
45
65
85
IOUT (mA)
105
125
145
Output Voltage – Output Current (Reference data)
VDS vs IOUT
180
REXT=3.6kΩ
160
140
IOUT (mA)
120
100
80
60
REXT=11kΩ
40
20
REXT=110kΩ
0
0.0
0.5
1.0
1.5
VDS (V)
2.0
2.5
3.0
Note: These application examples are provided for reference only. Thorough evaluation and testing
should be implemented when designing your application's mass production design.
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Output Current Dimming Control
1) Method of inputting analog voltage to terminal REXT
1. Precondition
Please set the range of the analog voltage input by 0 to 1.17V.
2. The maximum current is defined as αmA.
R1 + REXT
α = 1.17×
×460
R1×REXT
3. The minimum current is defined as βmA.
1
REXT
β =1.17×
(VADJ=0V)
(VADJ=1.17V)
×460
4. IOUT can be set according to the next expression.
IOUT = VADJ×
β-α
+α
1.17
(Example) Current Dimming from IOUT=120mA to 60mA (Reference data)
VADJ
0~1.17V
VOUT
VIN
2.7V~5.5V
TCA62723FMG
SHDN
VIN
CTL0
OUT 0
CTL1
OUT 1
CTL2
OUT 2
GND
REXT
R1
REXT
Current Dimming Control (Reference data)
R1=24kΩ, REXT=9.1kΩ
140
IOUT (mA)
120
100
80
60
40
20
0
0
0.1 0.2
0.3
0.4
0.5 0.6
0.7
0.8
0.9
1
1.1
VADJ (V)
Note: These application examples are provided for reference only. Thorough evaluation and testing
should be implemented when designing your application's mass production design.
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2) Method of inputting PMW signal to terminal REXT
IOUT can be set according to the next expression.
(1.17V – VCONT)×REXT
1.17V+
RCONT
IOUT=
×460
REXT
VCONT=D×VPWM
D: PWM Duty (%)
RCONT=R1+R2
Please define the cutoff frequency to the next expression. (fC ≤ fPWM)
1
fC =
2××R×C
R=
R1× R2
R1 + R2
VIN
2.7V~5.5V
VPWM
0V~2.6V
VOUT
TCA62723FMG
VIN
SHDN
CTL0
OUT 0
CTL1
OUT 1
CTL2
OUT 2
GND
REXT
R2
C
R1
REXT
Current Dimming Control (Reference data)
R1=9.1kΩ, R2=8.2kΩ, REXT=8.2kΩ, C=0.22uF
120
IOUT (mA)
100
fPWM=1kHz
80
60
40
20
0
0
10
20
30
40
50
60
70
80
90
PW M Duty (%)
Note: These application examples are provided for reference only. Thorough evaluation and testing
should be implemented when designing your application's mass production design.
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Absolute Maximum Ratings (Ta = 25°C)
Characteristic
S u p p l y
O u t p u t
I n p u t
v o l t a g e
v o l t a g e
v o l t a g e
( C T L 0 / C T L 1 / C T L 2 / SHDN Te r m i n a l )
P o w e r
d i s s i p a t i o n
Symbol
Ratings *1
Unit
VIN
VOUT
−0.3 ~ +6.0
−0.3 ~ +6.0
V
V
VIN
−0.3 ~ VIN+0.3 *2
V
0.36 (free air)
PD
W
0.79 (on PCB) *3,4
340 (free air)
T h e r m a l
r e s i s ta n c e
Rth (j-a)
Operating
temperature
Topr
−40 ~ +85
°C
temperature
Tstg
−55 ~ +150
°C
Tj
150
°C
Storage
Maximum junction temperature
°C/W
158 (on PCB) *3
Note1: Voltage is ground referenced.
Note2: Do not exceed 6.0V.
Note3: PCB condition 40 mm x 40 mm x 1.6 mm, Cu = 10 %
Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each
degree (1°C) that the ambient temperature is exceeded (Ta = 25°C).
Operating Conditions
Characteristic
Symbol
Condition
Min
Typ.
Max
Unit
v o l t a g e
VIN
-
2.7
3.6
5.5
V
Constant current output
IOUT
OUT0 to OUT2
5
-
150
mA/ch
R
r e s i s t a n c e
REXT
-
3.6
-
110
kΩ
CTL terminal minimum pulse width
tCTL
REXT=11kΩ
25
-
-
μs
S u p p l y
E X T
Electrical Characteristics (unless otherwise specified, VIN = 3.6 V, Ta = 25°C)
Characteristic
Symbol
Condition
Min
Typ
Max
Unit
VIN
-
2.7
3.6
5.5
V
Supply current (IC operation) IIN (On)
REXT = 27.6kΩ
-
-
700
μA
S u p p l y c u r r e n t ( I C s t a n d b y ) IIN (Off)
SHDN = L
-
-
10
μA
0.7VIN
-
VIN+0.15V
−0.15
-
0.3VIN
S u p p l y
v o l t a g e
High
level
VIH
L o w
l e v e l
VIL
Measuring terminal is
CTL0, CTL1, CTL2, SHDN
c u r r e n t
IIH
IIL
Measuring terminal is
CTL0, CTL1, CTL2, SHDN
−1.0
−1.0
-
1.0
1.0
μA
GAIN
REXT = 11 kΩ
359
460
560
A/A
VREXT
VIN=3.6 V, REXT = 11 kΩ
Output leakage current
IOZ
SHDN = “L”, VOUT = 5.5 V
1.09
-
1.17
-
1.25
0.1
μA
Constant current accuracy
dIOUT
VIN = 3.6 V, REXT = 11 kΩ
-
±1
±7.5
%
Ti m e f r om S H D N r e le as e t o
s t a r t o f o p e r a t i o n
tRE
-
-
2
5
ms
Input voltage
I n p u t
G
( I O
REXT
a
i
n
/ I R E X T )
terminal voltage
U
T
7
V
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2010-06-10
TCA62723FMG
Switching characteristics (unless otherwise specified, VIN = 3.6 V, Ta = 25°C)
Characteristic
Symbol
Condition
Min
Typ
MAX
Unit
Propagation delay
tpLH
tpHL
REXT=11kΩ, Voltage waveform
REXT=11kΩ, Voltage waveform
-
50
1
-
ns
μs
tR
REXT=11kΩ, Voltage waveform
-
50
-
ns
REXT=11kΩ, Voltage waveform
tF
F a l l
t i m e
Note: Ta=25°C, VIH=VIN, VIL=0V, VOUT=2.0V, RL=20Ω, CL=10.5pF
-
1
-
μs
R i s e
t i m e
Test Circuit
VOUT
2.0V
VIN
3.6V
CL=10.5pF
CL=10.5pF
TCA62723FMG
VIL,VIH
Logic wave
form generator
SHDN
VIN
CTL0
OUT 0
CTL1
OUT 1
CTL2
OUT 2
GND
REXT
RL=20Ω
RL=20Ω
CL=10.5pF
RL=20Ω
REXT=11kΩ
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Package Dimensions
Weight: 0.018 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory
purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is
required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of application
circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These components
and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for
a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over
current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute
maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or
load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the
effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time
and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to
prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or
the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury,
smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection
function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the
rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or
combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly
even just one time.
[5] Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC
voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent
or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In
particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC
voltage to a speaker directly.
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Points to remember on handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat
is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs
generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,
deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the
effect of IC heat radiation with peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s
motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this
problem, take the effect of back-EMF into consideration in system design.
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About solderability, following conditions were confirmed
Solderability
(1)
(2)
Use of Sn-37Pb solder Bath
solder bath temperature: 230°C
dipping time: 5 seconds
the number of times: once
use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder Bath
solder bath temperature: 245°C
dipping time: 5 seconds
the number of times: once
use of R-type flux
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RESTRICTIONS ON PRODUCT USE
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA’s written
permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for
complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk
and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data
loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications,
customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this
document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application with which the Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the
use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document,
or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment,
industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor
warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of
which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes,
without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety
devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for
Unintended Use unless specifically permitted in this document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable
laws or regulations.
• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of
patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right
is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR
PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING
WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT
LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY
AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION,
INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF
INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the
design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass
destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade
Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited
except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use
Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without
limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable
laws and regulations.
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