HD74LS153 Dual 4-Line to 1-Line Data Selectors / Multiplexers REJ03D0439–0200 Rev.2.00 Feb.18.2005 This data selector / multiplexer contains inverters and drivers to supply fully complementary, on-chip, binary decoding data selection to the AND-OR-INVERT gates. Separate strobe inputs are provided for each of the two four-line sections. Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS153P DILP-16 pin PRDP0016AE-B (DP-16FV) P — HD74LS153FPEL SOP-16 pin (JEITA) PRSP0016DH-B (FP-16DAV) FP EL (2,000 pcs/reel) HD74LS153RPEL SOP-16 pin (JEDEC) PRSP0016DG-A (FP-16DNV) RP EL (2,500 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement Strobe 1G 1 Select B 2 1C3 3 1G 1C3 2G 2C3 1C2 4 1C2 1C1 5 1C0 6 Output 1Y 7 1C1 B B 1C0 A A 1Y GND 8 Data Inputs B 2C2 B A 2C1 A 2C0 2Y (Top view) Rev.2.00, Feb.18.2005, page 1 of 7 16 VCC 15 2G Strobe 14 Select A 13 2C3 12 2C2 11 2C1 10 2C0 9 2Y Output Data Inputs HD74LS153 Function Table Inputs Select Data B X L L L L H H H H A X L L H H L L H H C0 X L H X X X X X X C1 X X X L H X X X X C2 X X X X X L H X X Strobe G C3 X X X X X X X L H Outputs Y L L H L H L H L H H L L L L L L L L H ; high level, L ; low level, X ; irrelevant Block Diagram Strobe (Enable) 1G 1C0 1Y Output 1C1 Data 1 1C2 1C3 B Select A 2C0 2C1 2Y Output Data 2 2C2 Strobe (Enable) 2C3 2G Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage VCC 7 V Input voltage VIN 7 V PT 400 mW Tstg –65 to +150 °C Power dissipation Storage temperature Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Rev.2.00, Feb.18.2005, page 2 of 7 Symbol Min Typ Max Unit VCC 4.75 5.00 5.25 V IOH — — –400 µA IOL — — 8 mA Topr –20 25 75 °C HD74LS153 Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Symbol VIH VIL min. 2.0 — typ.* — — max. — 0.8 Unit V V VOH 2.7 — — V — — — — — — — — — — 0.4 0.5 20 –0.4 0.1 Output voltage VOL Input current IIH IIL II V µA mA mA Short-circuit output –20 — –100 mA IOS current Supply current** ICC — 6.2 10 mA Input clamp voltage VIK — — –1.5 V Notes: * VCC = 5 V, Ta = 25°C ** ICC is measured with all outputs open and all inputs grounded. Condition VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = –400 µA IOL = 4 mA VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V IOL = 8 mA VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Symbol tPLH tPHL tPLH tPHL tPLH tPHL Rev.2.00, Feb.18.2005, page 3 of 7 Inputs Data Data Select Select Strobe Strobe Outputs Y Y Y Y Y Y min. — — — — — — typ. 10 17 19 25 16 21 max. 15 26 29 38 24 32 Unit ns ns ns ns ns ns Condition CL = 15 pF, RL = 2 kΩ HD74LS153 Testing Method Test Circuit VCC 4.5V Output RL Input P.G. Zout = 50Ω See Testing Table G A Y B CL C0 C1 C2 C3 Notes: 1. CL includes probe and jig capacitance. 2. All diodes are 1S2074(H). Testing Table Item tPLH tPHL X: B GND GND 4.5 V 4.5 V A GND 4.5 V GND 4.5 V GND IN IN GND GND "4.5 V" or "GND" GND Rev.2.00, Feb.18.2005, page 4 of 7 C0 IN X X X GND 4.5 V GND 4.5 V 4.5 V Inputs C1 X IN X X 4.5 V GND C2 X X IN X C3 X X X IN G GND GND GND GND Output Y OUT OUT OUT OUT X X GND OUT X 4.5 V GND X GND OUT X X X IN OUT HD74LS153 Waveform tTLH tTHL 90% 1.3 V Input 3V 90% 1.3 V 10% 10% 0V tPHL tPLH VOH In phase output 1.3 V 1.3 V VOL tPLH tPHL VOH Out of phase output 1.3 V 1.3 V VOL Input pulse; Input pulse; tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz, duty cycle 50% Rev.2.00, Feb.18.2005, page 5 of 7 HD74LS153 Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B MASS[Typ.] 1.05g Previous Code DP-16FV D 9 E 16 1 8 b3 0.89 Z A1 A Reference Symbol L e Nom θ c e1 D 19.2 E 6.3 JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV 7.4 A1 0.51 b p 0.40 b 3 0.48 0.56 1.30 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 1.12 L 2.54 MASS[Typ.] 0.24g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. D F 16 20.32 5.06 Z ( Ni/Pd/Au plating ) Max 7.62 1 A bp e Dimension in Millimeters Min 9 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 bp Nom D 10.06 E 5.50 Max 10.5 A2 8 e Dimension in Millimeters Min x A1 M 0.00 0.10 0.20 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 0.80 Z L L Rev.2.00, Feb.18.2005, page 6 of 7 8° 0.50 1 0.70 1.15 0.90 HD74LS153 JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A *1 Previous Code FP-16DNV MASS[Typ.] 0.15g D NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 16 9 c *2 Index mark HE E bp Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) Dimension in Millimeters Min Nom Max D 9.90 10.30 E 3.95 A2 8 1 Z e *3 bp x A1 0.10 0.14 0.25 0.34 0.40 0.46 0.15 0.20 0.25 6.10 6.20 1.75 A M L1 bp b1 c A c A1 θ L y Detail F 1 θ 0° HE 5.80 1.27 e x 0.25 y 0.15 0.635 Z 0.40 L L Rev.2.00, Feb.18.2005, page 7 of 7 8° 1 0.60 1.08 1.27 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 © 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .2.0