DirectFET Large Can RoHS Compliance Document Contents: 1. Composition 2. Solder Reflow The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. July 2014 DirectFET - Large Can Component Material Name Material Mass (g) Chip Silicon 0.01442 Lead Frame Plated Copper 0.15674 Die Attach Silver Epoxy 0.00374 Wire Bond Solder Bumps 0.00162 Element Name Composition Si Epoxy Cu Ni Ag Ag Epoxy Sn Ag Cu Total Weight (g) CAS # Substance Mass (g) 7440-21-3 90598-46-2 7440-50-8 7440-02-0 7440-22-4 7440-22-4 90598-46-2 7440-31-5 7440-22-4 7440-50-8 0.01374 0.00068 0.15343 0.00092 0.00239 0.00280 0.00094 0.00151 0.00009 0.00002 Material Analysis Weight (%) 95% 5% 97% 1% 2% 75% 25% 93% 6% 1% % of Total Weight 7.8% 0.4% 86.9% 0.5% 1.3% 1.6% 0.5% 0.9% 0.1% 0.0% 0.17652 No tin whisker mitigation strategy This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 1 July 2014