Data Sheet

HT36A3
8-Bit Music Synthesizer MCU
Features
· Operating voltage: 2.4V~5.0V
· Sampling rate of 25kHz as 6.4MHz for system
frequency
· Operating frequency: 3.58MHz~12MHz (typ. 8MHz)
· 20 bidirectional I/O lines
· Eight-level subroutine nesting
· Two 8-bit programmable timer with 8 stage prescaler
· HALT function and wake-up feature to reduce power
consumption
· Watchdog Timer
· Bit manipulation instructions
· Built-in 8-bit MCU with 208´8 bits RAM
· 16-bit table read instructions
· Built-in 32K´16-bit ROM for program/data shared
· 63 powerful instructions
· Mono output
· All instructions in 1 or 2 machine cycles
· High D/A converter resolution: 16 bits
· 28-pin SOP, 48-pin SSOP package
· Polyphonic up to 8 notes
· Independent pan and volume mix can be assigned to
each sound component
General Description
The HT36A3 is an 8-bit high performance RISC-like
microcontroller specifically designed for music applications. It provides an 8-bit MCU and a 8 channel
wavetable synthesizer. The program ROM is composed
of both program control codes and wavetable voice
codes, and can be easily programmed.
The HT36A3 has a built-in 8-bit microprocessor which
programs the synthesizer to generate the melody by
setting the special register from 20H~2AH. A HALT feature is provided to reduce power consumption.
Block Diagram
3 2 K ´ 1 6 - b it
R O M
P A 0 ~ P A 7
V D
V S
V D
V S
P B 0 ~ P B 7
P C 0 ~ P C 3
O S C 1
8 - B it
M C U
2 0 8 ´ 8
R A M
D
S
D A
S A
O S C 2
R E S
Rev. 1.00
M u ltip lie r /P h a s e
G e n e ra l
1
1 6 - B it
D A C
A U D
June 30, 2003
HT36A3
Pin Assignment
P A 4
1
4 8
P A 3
P A 5
2
4 7
P A 2
P A 6
3
4 6
P A 1
P A 7
4
4 5
P A 0
P B 0
5
4 4
P C 3
P B 1
6
4 3
P C 2
P B 2
7
4 2
P C 1
P B 3
8
4 1
P C 0
P B 4
9
4 0
N C
P B 5
1 0
3 9
N C
P A 4
1
2 8
P A 3
P B 6
1 1
3 8
N C
P A 5
2
2 7
P A 2
P B 7
1 2
3 7
N C
P A 6
3
2 6
P A 1
N C
1 3
3 6
N C
P A 7
4
2 5
P A 0
N C
1 4
3 5
N C
N C
5
2 4
N C
V S S
1 5
3 4
O S C 2
N C
6
2 3
N C
V S S A
1 6
3 3
O S C 1
N C
7
2 2
O S C 2
V D D
1 7
3 2
N C
V S S
8
2 1
N C
V D D A
1 8
3 1
N C
V S S A
9
2 0
O S C 1
N C
1 9
3 0
R E S
V D D
1 0
1 9
N C
N C
2 0
2 9
N C
V D D A
1 1
1 8
R E S
N C
2 1
2 8
N C
N C
1 2
1 7
N C
N C
2 2
2 7
N C
T E S T
1 3
1 6
N C
N C
2 3
2 6
A U D
A U D
1 4
1 5
N C
N C
2 4
2 5
T E S T
H T 3 6 A 3
2 8 S O P -A
H T 3 6 A 3
4 8 S S O P -A
Pad Assignment
P A 1
2 5
2 4
2 3
2 2
2 1
2 0
1 9
P C 0
P A 2
2 6
P C 1
P A 3
2 7
P C 2
P A 4
2 8
P A 0
P A 5
2 9
P C 3
P A 6
4
P A 7
3
P B 7
P B 0
2
P B 6
P B 1
P B 5
P B 2
1
P B 3
P B 4
1 8
1 7
1 6
1 5
1 4
(0 , 0 )
V S S
V S S A
1 3
O S C 2
1 2
O S C 1
1 1
R E S
5
6
V D D
7
V D D A
8
9
1 0
A U D
T E S T
Chip size: 83 ´ 111 (mil)2
* The IC substrate should be connected to VSS in the PCB layout artwork.
Rev. 1.00
2
June 30, 2003
HT36A3
Pad Coordinates
Pad No.
X
Y
Pad No.
X
Y
1
-879.100
1202.400
16
693.900
1240.150
2
-879.100
1097.100
17
583.300
1240.150
3
-879.100
986.500
18
483.300
1240.150
4
-879.100
886.500
19
372.700
1240.150
5
-898.600
-805.050
20
272.700
1240.150
6
-898.600
-931.910
21
162.100
1240.150
7
-847.650
-1041.910
22
62.100
1240.150
8
-847.650
-1180.350
23
-48.500
1240.150
9
-193.090
-1200.600
24
-148.500
1240.150
10
-1200.600
25
-259.100
1240.150
11
-81.290
875.950
-1262.274
26
-359.100
1240.150
12
875.950
-1149.626
27
-469.700
1240.150
13
875.950
28
-569.700
1240.150
14
15
901.500
793.900
-471.774
1240.150
1240.150
29
-680.300
1240.150
Pad Description
I/O
Internal
Connection
PA0~PA7
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port
PB0~PB7
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port
PC0~PC3
I/O
Pull-High
or None
Bidirectional 8-bit Input/Output port
VSS
¾
¾
Negative power supply, ground
VSSA
¾
¾
Negative power supply of DAC, ground
VDD
¾
¾
Digital power supply
VDDA
¾
¾
DAC power supply
AUD
O
¾
Audio output
TEST
¾
¾
No connection (open)
RES
I
¾
Reset input, active low (no pull-high)
¾
OSC1 and OSC2 are connected to an RC network or a crystal (by mask option) for the internal system clock. In the case of RC operation, OSC2 is the
output terminal for 1/8 system clock. The system clock may come from the
crystal, the two pins cannot be floating.
Pad Name
OSC1
OSC2
Rev. 1.00
I
O
Function
3
June 30, 2003
HT36A3
Absolute Maximum Ratings
Supply Voltage .............................VSS-0.3V to VSS+6V
Storage Temperature ...........................-50°C to 125°C
Input Voltage .............................VSS-0.3V to VDD+0.3V
Operating Temperature ..........................-25°C to 70°C
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
D.C. Characteristics
Symbol
Parameter
Ta=25°C
Test Conditions
VDD
Conditions
¾
¾
Min.
Typ.
Max.
Unit
2.2
4.5
5.5
V
VDD
Operating Voltage
IDD
Operating Current
4.5V No load, fOSC=8MHz
¾
8
16
mA
ISTB
Standby Current (WDT Disabled)
4.5V No load, System HALT
¾
1
3
mA
IOH
I/O Ports Source Current
4.5V VOH=4.5V
2
3
¾
mA
IOL
I/O Ports Sink Current
4.5V VOL=0.5V
2
3
¾
mA
VIH
Input High Voltage for I/O Ports
4.5V
¾
0.8VDD
¾
VDD
V
VIL
Input Low Voltage for I/O Ports
4.5V
¾
0
¾
0.2VDD
V
Rev. 1.00
4
June 30, 2003
HT36A3
Application Circuit
V
D D
1 0 W
4 7 m F
V D D A
V D D
0 .1 m F
P A 0 ~ P A 7
O S C 1
P B 0 ~ P B 7
V
P C 0 ~ P C 3
A U D
V
D D
S P K
8 W
1 k W
D D
7 5 0 W
1 0 0 k W
R E S
V S S A
0 .1 m F
V S S
H T 3 6 A 3
V
D D
1 0 W
V D D
4 7 m F
V D D A
0 .1 m F
P A 0 ~ P A 7
O S C 1
8 M H z
P B 0 ~ P B 7
V
D D
P C 0 ~ P C 3
O S C 2
4 7 m F
A U D
2 0 k W
V
D D
1 0 m F
1 0 0 k W
0 .1 m F
2
V re f
3
IN
8
V D D
H T 8 2 V 7 3 3
5
O U T N
1
V S S
4
S P K
8 W
7
O U T P
C E
R E S
V S S A
0 .1 m F
V S S
H T 3 6 A 3
Rev. 1.00
5
June 30, 2003
HT36A3
Package Information
28-pin SOP (300mil) Outline Dimensions
2 8
1 5
A
B
1
1 4
C
C '
G
H
D
E
Symbol
Rev. 1.00
a
F
Dimensions in mil
Min.
Nom.
Max.
A
394
¾
419
B
290
¾
300
C
14
¾
20
C¢
697
¾
713
D
92
¾
104
E
¾
50
¾
F
4
¾
¾
G
32
¾
38
H
4
¾
12
a
0°
¾
10°
6
June 30, 2003
HT36A3
48-pin SSOP (300mil) Outline Dimensions
4 8
2 5
A
B
2 4
1
C
C '
G
H
D
E
Symbol
Rev. 1.00
a
F
Dimensions in mil
Min.
Nom.
Max.
A
395
¾
420
B
291
¾
299
C
8
¾
12
C¢
613
¾
637
D
85
¾
99
E
¾
25
¾
F
4
¾
10
G
25
¾
35
H
4
¾
12
a
0°
¾
8°
7
June 30, 2003
HT36A3
Product Tape and Reel Specifications
Reel Dimensions
D
T 2
A
C
B
T 1
SOP 28W (300mil)
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330±1.0
B
Reel Inner Diameter
62±1.5
C
Spindle Hole Diameter
13.0+0.5
-0.2
D
Key Slit Width
2.0±0.5
T1
Space Between Flange
24.8+0.3
-0.2
T2
Reel Thickness
30.2±0.2
SSOP 48W
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
330±1.0
B
Reel Inner Diameter
100±0.1
C
Spindle Hole Diameter
13.0+0.5
-0.2
D
Key Slit Width
2.0±0.5
T1
Space Between Flange
32.2+0.3
-0.2
T2
Reel Thickness
38.2±0.2
Rev. 1.00
8
June 30, 2003
HT36A3
Carrier Tape Dimensions
P 0
D
P 1
t
E
F
W
C
D 1
B 0
P
K 0
A 0
SOP 28W (300mil)
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
24.0±0.3
P
Cavity Pitch
12.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
11.5±0.1
D
Perforation Diameter
1.5+0.1
D1
Cavity Hole Diameter
1.5+0.25
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
10.85±0.1
B0
Cavity Width
18.34±0.1
K0
Cavity Depth
2.97±0.1
t
Carrier Tape Thickness
0.35±0.01
C
Cover Tape Width
Rev. 1.00
21.3
9
June 30, 2003
HT36A3
P 0
D
P 1
t
E
F
W
D 1
C
B 0
K 1
P
K 2
A 0
SSOP 48W
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
32.0±0.3
P
Cavity Pitch
16.0±0.1
E
Perforation Position
1.75±0.1
F
Cavity to Perforation (Width Direction)
14.2±0.1
D
Perforation Diameter
2.0 Min.
D1
Cavity Hole Diameter
1.5+0.25
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation (Length Direction)
2.0±0.1
A0
Cavity Length
12.0±0.1
B0
Cavity Width
16.20±0.1
K1
Cavity Depth
2.4±0.1
K2
Cavity Depth
3.2±0.1
t
Carrier Tape Thickness
C
Cover Tape Width
Rev. 1.00
0.35±0.05
25.5
10
June 30, 2003
HT36A3
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Taipei Sales Office)
4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)
Holtek Semiconductor Inc. (Shanghai Sales Office)
7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China 200233
Tel: 021-6485-5560
Fax: 021-6485-0313
http://www.holtek.com.cn
Holtek Semiconductor Inc. (Shenzhen Sales Office)
5/F, Unit A, Productivity Building, Cross of Science M 3rd Road and Gaoxin M 2nd Road, Science Park, Nanshan District,
Shenzhen, China 518057
Tel: 0755-8616-9908, 8616-9308
Fax: 0755-8616-9533
Holtek Semiconductor Inc. (Beijing Sales Office)
Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031
Tel: 010-6641-0030, 6641-7751, 6641-7752
Fax: 010-6641-0125
Holtek Semiconductor Inc. (Chengdu Sales Office)
709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016
Tel: 028-6653-6590
Fax: 028-6653-6591
Holmate Semiconductor, Inc. (North America Sales Office)
46729 Fremont Blvd., Fremont, CA 94538
Tel: 510-252-9880
Fax: 510-252-9885
http://www.holmate.com
Copyright Ó 2003 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.
Rev. 1.00
11
June 30, 2003