EL7457CLZ - Intersil

EL7457
Data Sheet
January 26, 2012
40MHz Non-Inverting Quad CMOS Driver
Features
The EL7457 is a high speed, non-inverting, quad CMOS
driver. It is capable of running at clock rates up to 40MHz
and features 2A peak drive capability and a nominal
on-resistance of just 3Ω. The EL7457 is ideal for driving
highly capacitive loads, such as storage and vertical clocks
in CCD applications. It is also well suited to ATE pin driving,
level-shifting, and clock-driving applications.
• Clocking speeds up to 40MHz
The EL7457 is capable of running from single or dual power
supplies while using ground referenced inputs. Each output
can be switched to either the high (VH) or low (VL) supply
pins, depending on the related input pin. The inputs are
compatible with both 3V and 5V CMOS and TTL logic. The
output enable (OE) pin can be used to put the outputs into a
high-impedance state. This is especially useful in CCD
applications, where the driver should be disabled during
power down.
• Low quiescent current - <1mA
The EL7457 also features very fast rise and fall times which
are matched to within 1ns. The propagation delay is also
matched between rising and falling edges to within 2ns.
The EL7457 is available in 16-pin QSOP, 16-pin SO
(0.150"), and 16-pin QFN packages. All are specified for
operation over the full -40°C to +85°C temperature range.
FN7288.4
• 4 channels
• 12ns tR/tF at 1000pF CLOAD
• 1ns rise and fall time match
• 1.5ns prop delay match
• Fast output enable function - 12ns
• Wide output voltage range
• 8V ≥ VL ≥ -5V
• -2V ≤ VH ≤ 16.5V
• 2A peak drive
• 3Ω on resistance
• Input level shifters
• TTL/CMOS input-compatible
• Pb-free (RoHS compliant)
Applications
• CCD drivers
Pinouts
• Digital cameras
3 INB
OUTB 14
VL 2
NC 13
VL 3
5 GND
VH 12
GND 4
6 NC
OUTC 11
7 INC
OUTD 10
8 IND
VS- 9
• Ultrasound transducer drivers
• Ultrasonic and RF generators
12 OUTB
• Level shifting
11 VH
THERMAL
PAD*
10 VH
9 OUTC
INC 5
4 VL
• Clock/line drivers
13 OUTA
INB 1
• Pin drivers
OUTD 8
OUTA 15
VS- 7
2 OE
IND 6
VS+ 16
14 VS+
16 OE
1 INA
15 INA
EL7457
[16-PIN QFN (4X4MM)]
TOP VIEW
EL7457
[16-PIN SO (0.150”),
QSOP (0.150”)]
TOP VIEW
* THERMAL PAD CONNECTED
TO PIN 7 (VS-)
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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EL7457
Ordering Information
PART NUMBER
(Notes 2, 3)
PART
MARKING
TEMP.
RANGE (°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
EL7457CUZ
7457CUZ
-40°C to +85°C
16 Ld QSOP (0.150”)
MDP0040
EL7457CUZ-T13 (Note 1)
7457CUZ
-40°C to +85°C
16 Ld QSOP (0.150”)
MDP0040
EL7457CUZ-T7 (Note 1)
7457CUZ
-40°C to +85°C
16 Ld QSOP (0.150”)
MDP0040
EL7457CUZ-T7A (Note 1)
7457CUZ
-40°C to +85°C
16 Ld QSOP (0.150”)
MDP0040
EL7457CSZ
EL7457CSZ
-40°C to +85°C
16 Ld SO (0.150”)
MDP0027
EL7457CSZ-T13 (Note 1)
EL7457CSZ
-40°C to +85°C
16 Ld SO (0.150”)
MDP0027
EL7457CSZ-T7 (Note 1)
EL7457CSZ
-40°C to +85°C
16 Ld SO (0.150”)
MDP0027
EL7457CSZ-T7A (Note 1)
EL7457CSZ
-40°C to +85°C
16 Ld SO (0.150”)
MDP0027
EL7457CLZ
7457CLZ
-40°C to +85°C
16 Ld QFN (4x4mm)
L16.4X4H
EL7457CLZ-T13 (Note 1)
7457CLZ
-40°C to +85°C
16 Ld QFN (4x4mm)
L16.4X4H
EL7457CLZ-T7 (Note 1)
7457CLZ
-40°C to +85°C
16 Ld QFN (4x4mm)
L16.4X4H
EL7457CLZ-T7A (Note 1)
7457CLZ
-40°C to +85°C
16 Ld QFN (4x4mm)
L16.4X4H
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for EL7457. For more information on MSL please see tech brief TB363.
2
FN7288.4
January 26, 2012
EL7457
Absolute Maximum Ratings (TA = 25°C)
Thermal Information
Supply Voltage (VS+ to VS-) . . . . . . . . . . . . . . . . . . . . . . . . . . .+18V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . VS- -0.3V, VS+ +0.3V
Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Thermal Resistance
θJA (°C/W)
θJC (°C/W)
16 Ld QFN (Notes 4, 5) . . . . . . . . . . . .
43
5
16 Ld SOIC (Notes 6, 7). . . . . . . . . . . .
73
45
16 Ld QSOP (Note 6). . . . . . . . . . . . . .
112
N/A
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
Maximum Die Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . +125°C
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
6. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
7. For θJC, the “case temp” location is taken at the package top center.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests
are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
VS+ = +5V, VS- = -5V, VH = +5V, VL = -5V, TA = 25°C, unless otherwise specified.
DESCRIPTION
CONDITION
MIN
(Note 8)
TYP
MAX
(Note 8)
UNIT
INPUT
VIH
Logic “1” Input Voltage
2.0
IIH
Logic “1” Input Current
VIL
Logic “0” Input Voltage
IIL
Logic “0” Input Current
CIN
Input Capacitance
3.5
pF
RIN
Input Resistance
50
MΩ
VIH = 5V
VIL = 0V
V
0.1
0.1
10
µA
0.8
V
10
µA
OUTPUT
ROH
ON Resistance VH to OUTx
IOUT = -100mA
4.5
6
Ω
ROL
ON Resistance VL to OUTx
IOUT = +100mA
4
6
Ω
ILEAK
Output Leakage Current
VH = VS+, VL = VS-
0.1
10
µA
IPK
Peak Output Current
Source
2.0
A
Sink
2.0
A
Inputs = VS+
0.5
POWER SUPPLY
IS
Power Supply Current
1.5
mA
SWITCHING CHARACTERISTICS
tR
Rise Time
CL = 1000pF
13.5
ns
tF
Fall Time
CL = 1000pF
13
ns
tRFΔ
tR, tF Mismatch
CL = 1000pF
0.5
ns
tD+
Turn-Off Delay Time
CL = 1000pF
12.5
ns
tD-
Turn-On Delay Time
CL = 1000pF
14.5
ns
tDD
tD-1 - tD-2 Mismatch
CL = 1000pF
2
ns
tENABLE
Enable Delay Time
12
ns
3
FN7288.4
January 26, 2012
EL7457
Electrical Specifications
PARAMETER
tDISABLE
VS+ = +5V, VS- = -5V, VH = +5V, VL = -5V, TA = 25°C, unless otherwise specified.
DESCRIPTION
CONDITION
MIN
(Note 8)
TYP
Disable Delay Time
Electrical Specifications
PARAMETER
MAX
(Note 8)
12
UNIT
ns
VS+ = +15V, VS- = 0V, VH = +15V, VL = 0V, TA = 25°C, unless otherwise specified
DESCRIPTION
CONDITION
MIN
(Note 8)
TYP
MAX
(Note 8)
UNIT
INPUT
VIH
Logic “1” Input Voltage
2.4
V
IIH
Logic “1” Input Current
VIL
Logic “0” Input Voltage
IIL
Logic “0” Input Current
CIN
Input Capacitance
3.5
pF
RIN
Input Resistance
50
MΩ
VIH = 5V
0.1
VIL = 0V
0.1
10
µA
0.8
V
10
µA
OUTPUT
ROH
ON Resistance VH to OUT
IOUT = -100mA
3.5
5
Ω
ROL
ON Resistance VL to OUT
IOUT = +100mA
3
5
Ω
ILEAK
Output Leakage Current
VH = VS+, VL = VS-
0.1
10
µA
IPK
Peak Output Current
Source
2.0
A
Sink
2.0
A
Inputs = VS+
0.8
POWER SUPPLY
IS
Power Supply Current
2
mA
SWITCHING CHARACTERISTICS
tR
Rise Time
CL = 1000pF
11
ns
tF
Fall Time
CL = 1000pF
12
ns
tRFΔ
tR, tF Mismatch
CL = 1000pF
1
ns
tD +
Turn-Off Delay Time
CL = 1000pF
11.5
ns
tD -
Turn-On Delay Time
CL = 1000pF
13
ns
tDD
tD-1 - tD-2 Mismatch
CL = 1000pF
1.5
ns
tENABLE
Enable Delay Time
12
ns
tDISABLE
Disable Delay Time
12
ns
NOTE:
8. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
4
FN7288.4
January 26, 2012
EL7457
Typical Performance Curves
1.8
2
HIGH LIMIT=2.4V
T=25°C
1.6
HYSTERESIS
1.4
1.2
SUPPLY CURRENT (V)
INPUT VOLTAGE (V)
T=25°C
ALL INPUTS=0
1.6
1.2
0.8
0.4
ALL INPUTS=VS+
LOW LIMIT=0.8V
0
1
5
7
10
12
5
15
7
10
12
15
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
FIGURE 1. SWITCH THRESHOLD vs SUPPLY VOLTAGE
FIGURE 2. QUIESCENT SUPPLY CURRENT vs SUPPLY
VOLTAGE
9
25
RISE/FALL TIME (ns)
“ON” RESISTANCE (Ω)
IOUT=100mA
8 T=25°C
7
6
VH TO OUT
5
VL TO OUT
4
tR
20
tF
15
10
3
CL=1000pF
T=25°C
2
5
5
7
10
12
15
5
7
SUPPLY VOLTAGE (V)
12
15
SUPPLY VOLTAGE (V)
FIGURE 3. “ON” RESISTANCE vs SUPPLY VOLTAGE
FIGURE 4. RISE/FALL TIME vs SUPPLY VOLTAGE
16
25
CL=1000pF
VS+=15V
CL=1000pF
14
12
DELAY TIME (ns)
RISE/FALL TIME (ns)
10
tF
10
tR
tD2
15
tD1
10
8
6
-50
20
5
-25
0
25
50
75
100
125
TEMPERATURE (°C)
FIGURE 5. RISE/FALL TIME vs TEMPERATURE
5
5
7
10
12
15
SUPPLY VOLTAGE (V)
FIGURE 6. PROPAGATION DELAY vs SUPPLY VOLTAGE
FN7288.4
January 26, 2012
EL7457
Typical Performance Curves
(Continued)
18
VS+=15V
120
14
RISE/FALL TIME (ns)
DELAY TIME (ns)
16
140
CL=1000pF
VS+=15V
tD2
12
tD1
10
100
8
6
-50
80
60
tF
40
tR
20
-25
0
25
50
75
100
0
100
125
470
TEMPERATURE (°C)
1K
2.2K
4.7K
10K
LOAD CAPACITANCE (pF)
FIGURE 7. PROPAGATION DELAY vs TEMPERATURE
FIGURE 8. RISE/FALL TIME vs LOAD
SUPPLY CURRENT (mA)
12
VS+=VH=10V
VS-=VL=0V
10 f=100kHz
8
6
4
2
0
100
1K
10K
LOAD CAPACITANCE (pF)
FIGURE 9. SUPPLY CURRENT PER CHANNEL vs CAPACITIVE LOAD
6
FN7288.4
January 26, 2012
EL7457
Timing Diagram
TABLE 1. NOMINAL OPERATING VOLTAGE RANGE
PIN
MIN
MAX
VS+ to VS-
5V
16.5V
VS- to GND
-5V
0V
VH
VS- + 2.5V
VS+
VL
VS-
VS+
VH to VL
0V
16.5V
VL to VS-
0V
8V
5V
INPUT
2.5V
0
OUTPUT
90%
10%
t D+
tDtR
tF
Standard Test Configuration (CS/CU)
VS+
0.1µF
4.7µF
VS+
10kΩ
1
INA
16
OUTA
1000pF
EN
INB
2
15
3
14
OUTB
1000pF
VL
4.7µF
4
13
0.1µF
0.1µF
5
12
6
11
VH
4.7µF
OUTC
1000pF
INC
7
10
IND
8
9
OUTD
1000pF
VS0.1µF
7
4.7µF
FN7288.4
January 26, 2012
EL7457
Pin Descriptions
16-PIN
QSOP (0.150”),
SO (0.150”)
16-PIN QFN
(4x4mm)
NAME
1
15
INA
FUNCTION
EQUIVALENT CIRCUIT
Input channel A
VS+
VS+
INPUT
VS-
VS-
CIRCUIT 1
2
16
OE
Output Enable
(Reference Circuit 1)
3
1
INB
Input channel B
(Reference Circuit 1)
4
2, 3
VL
Low voltage input pin
5
4
GND
6, 13
Input logic ground
NC
No connection
7
5
INC
Input channel C
(Reference Circuit 1)
8
6
IND
Input channel D
(Reference Circuit 1)
9
7
VS-
Negative supply voltage
10
8
OUTD
Output channel D
VH
VS+
OUTPUT
VSVSVL
CIRCUIT 2
11
9
OUTC
12
10, 11
VH
14
12
OUTB
Output channel B
(Reference Circuit 2)
15
13
OUTA
Output channel A
(Reference Circuit 2)
16
14
VS+
8
Output channel C
(Reference Circuit 2)
High voltage input pin
Positive supply voltage
FN7288.4
January 26, 2012
EL7457
Block Diagram
OE
VH
VS+
INPUT
GND
LEVEL
SHIFTER
3-STATE
CONTROL
OUTPUT
VSVL
Applications Information
Product Description
The EL7457 is a high performance 40MHz high speed quad
driver. Each channel of the EL7457 consists of a single
P-channel high side driver and a single N-channel low side
driver. These 3Ω devices will pull the output (OUTX) to either
the high or low voltage, on VH and VL respectively,
depending on the input logic signal (INX). It should be noted
that there is only one set of high and low voltage pins.
A common output enable (OE) pin is available on the
EL7457. This pin, when pulled low will put all outputs in to
the high impedance state.
The EL7457 is available in 16-pin SO (0.150"), 16-pin
QSOP, and ultra-small 16-pin QFN packages. The relevant
package should be chosen depending on the calculated
power dissipation.
Supply Voltage Range and Input Compatibility
The EL7457 is designed for operation on supplies from 5V to
15V with 10% tolerance (i.e. 4.5V to 18V). The table on page
6 shows the specifications for the relationship between the
VS+, VS-, VH, VL, and GND pins. The EL7457 does not
contain a true analog switch and therefore VL should always
be less than VH.
All input pins are compatible with both 3V and 5V CMOS
signals With a positive supply (VS+) of 5V, the EL7457 is
also compatible with TTL inputs.
Power Supply Bypassing
When using the EL7457, it is very important to use adequate
power supply bypassing. The high switching currents
developed by the EL7457 necessitate the use of a bypass
capacitor on both the positive and negative supplies. It is
recommended that a 4.7µF tantalum capacitor be used in
parallel with a 0.1µF low-inductance ceramic MLC capacitor.
These should be placed as close to the supply pins as
possible. It is also recommended that the VH and VL pins
have some level of bypassing, especially if the EL7457 is
driving highly capacitive loads.
9
Power Dissipation Calculation
When switching at high speeds, or driving heavy loads, the
EL7457 drive capability is limited by the rise in die
temperature brought about by internal power dissipation. For
reliable operation die temperature must be kept below
TJMAX (125°C). It is necessary to calculate the power
dissipation for a given application prior to selecting package
type.
Power dissipation may be calculated:
4
PD = ( V S × I S ) +
2
2
× f)
∑ ( CINT × VS × f ) + ( CL × VOUT
(EQ. 1)
1
where:
VS is the total power supply to the EL7457 (from VS+ to
VS-)
VOUT is the swing on the output (VH - VL)
CL is the load capacitance
CINT is the internal load capacitance (80pF max)
IS is the quiescent supply current (3mA max)
f is frequency
Having obtained the application’s power dissipation, the
maximum junction temperature can be calculated:
T JMAX = T MAX + Θ JA × PD
(EQ. 2)
where:
TJMAX is the maximum junction temperature (125°C)
TMAX is the maximum ambient operating temperature
PD is the power dissipation calculated above
θJA is the thermal resistance, junction to ambient, of the
application (package + PCB combination). Refer to the
Package Power Dissipation curves on page 6.
FN7288.4
January 26, 2012
EL7457
Quarter Size Outline Plastic Packages Family (QSOP)
MDP0040
A
QUARTER SIZE OUTLINE PLASTIC PACKAGES FAMILY
D
(N/2)+1
N
INCHES
SYMBOL QSOP16 QSOP24 QSOP28 TOLERANCE NOTES
E
PIN #1
I.D. MARK
E1
1
(N/2)
A
0.068
0.068
0.068
Max.
-
A1
0.006
0.006
0.006
±0.002
-
A2
0.056
0.056
0.056
±0.004
-
b
0.010
0.010
0.010
±0.002
-
c
0.008
0.008
0.008
±0.001
-
D
0.193
0.341
0.390
±0.004
1, 3
E
0.236
0.236
0.236
±0.008
-
E1
0.154
0.154
0.154
±0.004
2, 3
e
0.025
0.025
0.025
Basic
-
L
0.025
0.025
0.025
±0.009
-
L1
0.041
0.041
0.041
Basic
-
N
16
24
28
Reference
-
B
0.010
C A B
e
H
C
SEATING
PLANE
0.007
0.004 C
b
C A B
Rev. F 2/07
NOTES:
L1
A
1. Plastic or metal protrusions of 0.006” maximum per side are not
included.
2. Plastic interlead protrusions of 0.010” maximum per side are not
included.
c
SEE DETAIL "X"
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
0.010
A2
GAUGE
PLANE
L
A1
4°±4°
DETAIL X
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
10
FN7288.4
January 26, 2012
EL7457
Small Outline Package Family (SO)
A
D
h X 45°
(N/2)+1
N
A
PIN #1
I.D. MARK
E1
E
c
SEE DETAIL “X”
1
(N/2)
B
L1
0.010 M C A B
e
H
C
A2
GAUGE
PLANE
SEATING
PLANE
A1
0.004 C
0.010 M C A B
L
b
0.010
4° ±4°
DETAIL X
MDP0027
SMALL OUTLINE PACKAGE FAMILY (SO)
INCHES
SYMBOL
SO-14
SO16 (0.300”)
(SOL-16)
SO20
(SOL-20)
SO24
(SOL-24)
SO28
(SOL-28)
TOLERANCE
NOTES
A
0.068
0.068
0.068
0.104
0.104
0.104
0.104
MAX
-
A1
0.006
0.006
0.006
0.007
0.007
0.007
0.007
±0.003
-
A2
0.057
0.057
0.057
0.092
0.092
0.092
0.092
±0.002
-
b
0.017
0.017
0.017
0.017
0.017
0.017
0.017
±0.003
-
c
0.009
0.009
0.009
0.011
0.011
0.011
0.011
±0.001
-
D
0.193
0.341
0.390
0.406
0.504
0.606
0.704
±0.004
1, 3
E
0.236
0.236
0.236
0.406
0.406
0.406
0.406
±0.008
-
E1
0.154
0.154
0.154
0.295
0.295
0.295
0.295
±0.004
2, 3
e
0.050
0.050
0.050
0.050
0.050
0.050
0.050
Basic
-
L
0.025
0.025
0.025
0.030
0.030
0.030
0.030
±0.009
-
L1
0.041
0.041
0.041
0.056
0.056
0.056
0.056
Basic
-
h
0.013
0.013
0.013
0.020
0.020
0.020
0.020
Reference
-
16
20
24
28
Reference
-
N
SO-8
SO16
(0.150”)
8
14
16
Rev. M 2/07
NOTES:
1. Plastic or metal protrusions of 0.006” maximum per side are not included.
2. Plastic interlead protrusions of 0.010” maximum per side are not included.
3. Dimensions “D” and “E1” are measured at Datum Plane “H”.
4. Dimensioning and tolerancing per ASME Y14.5M-1994
11
FN7288.4
January 26, 2012
EL7457
Package Outline Drawing
L16.4x4H
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 1/12
2.40
4X 1.95
4.00
12X 0.65
A
B
13
6
PIN 1
INDEX AREA
6
PIN #1
INDEX AREA
16
1
4.00
12
2.40
9
4
(4X)
0.15
5
8
0.10 M C A B
16x 0.550±0.05
TOP VIEW
BOTTOM VIEW
4 0.30 ±0.05
SEE DETAIL "X"
0.90±0.10
0.10 C
C
BASE PLANE
SEATING PLANE
( 3 . 6 TYP )
SIDE VIEW
(
(12x0.65)
2.40)
(16x0.30)
C
0 . 20 REF
5
(16x0.75)
+0.03/-0.02
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
12
FN7288.4
January 26, 2012