Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L24.4x4H
24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 09/11
2.50
4.00
20X 0.50
A
B
6
24
19
PIN #1 INDEX AREA
6
PIN 1
INDEX AREA
4.00
18
(4X)
1
Exp. DAP
2.50 ±0.05 Sq.
2.50
6
13
0.15
0.10 M C A B
24X 0.25 +0.07 4
-0.05
TOP VIEW
7
12
24X 0.40 ±0.10
0.25 min (4 sides)
BOTTOM VIEW
SEE DETAIL "X"
C
0.10 C
0.90 ±0.10
0 . 2 REF
5
C
SEATING PLANE
0.08 C
0 . 00 MIN.
0 . 05 MAX.
SIDE VIEW
DETAIL "X"
( 3.80 )
( 2.50)
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
( 20X 0.50)
( 3.80 )
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
( 2.50 )
5. Tiebar shown (if present) is a non-functional feature.
(24X .25)
6.
( 24 X 0.60)
TYPICAL RECOMMENDED LAND PATTERN
1
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Compliant to JEDEC MO-220 VGGD-8