Hermetic Packages for Integrated Circuits Ceramic SOIC Flatpack Packages (SOIC Flatpack) K28.E N INDEX AREA 28 LEAD CERAMIC SOIC FLATPACK PACKAGE H INCHES E -B- 1 2 3 L MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.092 0.154 2.35 3.90 - A1 0.004 0.018 0.10 0.45 - B 0.013 0.020 0.33 0.51 5 C 0.006 0.013 0.15 0.32 - SEATING PLANE -A- A D -C- e α A1 D 0.697 0.720 17.70 18.30 - E 0.289 0.301 7.35 7.65 - e C B 0.05 BSC H 0.393 L 0.015 N α NOTES: 1. Dimensioning and tolerancing per ANSI Y14.5M-1982. 2. “L” is the length of terminal for soldering to a substrate. 3. “N” is the number of terminal positions. 4. Terminal numbers are shown for reference only. 5. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 6. Controlling dimension: MILLIMETER. 54 1.27 BSC 0.420 10.00 0.050 0.40 28 0o - 1.27 2 28 8o 0o - 10.65 3 8o Rev. 0 4/94