Plastic Packages for Integrated Circuits Small Outline Plastic Packages (SOIC) M28.3A-S N INDEX AREA 1 2 28 LEAD SMALL OUTLINE PLASTIC PACKAGE (300 MIL) H INCHES E 3 L SEATING PLANE D A e A1 B SYMBOL MIN MAX MIN MAX A 0.085 0.106 2.15 2.7 - A1 0.002 0.011 0.05 0.30 - B 0.014 0.021 0.35 0.55 - C 0.004 0.009 D 0.737 0.755 E 0.296 0.311 e α C 0.15(0.006) 0.24 M MILLIMETERS 0.05 BSC 0.10 0.25 18.7 19.2 7.50 7.90 1.27 BSC NOTES 1 2 - H 0.390 0.421 9.90 10.70 - L 0.012 0.027 0.30 0.70 3 10o 0o N α 28 0o 28 4 10o Rev. 1 4/95 NOTES: 1. Dimension “D” does not include mold flash, protrusions or gate burrs. 2. Dimension “E” does not include interlead flash or protrusions. 3. “L” is the length of terminal for soldering to a substrate. 4. “N” is the number of terminal positions. 5. Terminal numbers are shown for reference only. 6. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 55