ZL6105 Datasheet

Digital DC/DC Controller with Drivers and Auto
Compensation
ZL6105
Features
The ZL6105 is a digital power controller with integrated
MOSFET drivers. Auto compensation eliminates the need for
manual compensation design work. Adaptive performance
optimization algorithms improve power conversion efficiency.
Zilker Labs Digital-DC™ technology enables a blend of power
conversion performance and power management features.
Power Conversion
The ZL6105 is designed to be a flexible building block for DC
power and can be easily adapted to designs ranging from a
single-phase power supply operating from a 3.3V to a
multiphase current sharing supply operating from a 12V input.
The ZL6105 eliminates the need for complicated power supply
managers as well as numerous external discrete components.
The ZL6105 uses the I2C/SMBus™ with PMBus™ protocol for
communication with a host controller and the Digital-DC bus
for communication between Zilker Labs devices.
The ZL6105 is pin for pin compatible with the ZL2008. The
POLA VOUT table and compensation table have been removed.
A new single resistor VOUT table and the Auto Compensation
feature have been added.
• Efficient Synchronous Buck Controller
• Auto Compensating PID Filter
• Adaptive Light Load Efficiency Optimization
• 3V to 14V Input Range
• 0.54V to 5.5V Output Range (with margin)
• ±1% Output Voltage Accuracy
• Internal 3A MOSFET Drivers
• Fast Load Transient Response
• Current Sharing and Phase Interleaving
• Snapshot™ Parameter Capture
• Pb-Free (RoHs Compliant)
Power Management
• Digital Soft-start/stop
• Power-Good/Enable
• Voltage Tracking, Sequencing and Margining
Related Literature
• Voltage, Current and Temperature Monitoring
• AN2032, “NLR Configuration for DDC Products”
• I2C/SMBus Interface, PMBus Compatible
• AN2033, “Zilker Labs PMBus Command Set - DDC Products”
• Output Voltage and Current Protection
• AN2034, “Configuring Current Sharing on the ZL2004 and
ZL2006”
• Internal Non-volatile Memory (NVM)
• AN2035, “Compensation Using CompZL™”
Applications
• Servers/Storage Equipment
• Telecom/Datacom Equipment
• Power Supply Modules
EN PG PH_EN FC ILIM CFG UVLO V25
100
VR VDD
VOUT = 3.3V
VOUT = 1.5V
95
LDO
POWER
MANAGEMENT
DDC
DRIVER
NONVOLATILE
MEMORY
SCL
SDA
SALRT
I2 C
PWM
CONTROLLER
MONITOR
ADC
CURRENT
SENSE
TEMP
SENSOR
BST
GH
SW
GL
VSEN+
VSENISENA
ISENB
Efficiency (%)
90
V
SS
VTRK
MGN
SYNC
85
80
75
70
65
60
50
SA
XTEMP
PGND SGND DGND
FIGURE 1. BLOCK DIAGRAM
December 19, 2013
FN6906.5
1
VIN = 12V
fSW = 400kHz
Circuit of Figure 3
4
55
0
2
4
6
8
10
12
14
16
18
20
Load Current (A)
FIGURE 2. EFFICIENCY vs LOAD CURRENT
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas Inc. 2011-2013. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
ZL6105
Table of Contents
Related Literature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Power Conversion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Absolute Maximum Ratings (Note 7) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
ZL6105 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Digital-DC Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Power Conversion Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
Power Management Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Multi-mode Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Power Conversion Functional Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Bias Regulators and Input Supply Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
High-side Driver Boost Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Resistor Output Voltage Setting Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SMBus Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Start-up Procedure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Soft-Start Delay and Ramp Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Good . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Switching Frequency and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Train Component Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current Limit Threshold Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Loop Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Non-linear Response (NLR) Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Efficiency Optimized Driver Dead-time Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Adaptive Diode Emulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11
11
11
11
12
12
12
13
14
14
15
18
20
21
21
21
Power Management Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Undervoltage Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Overvoltage Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Pre-Bias Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Overcurrent Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Overload Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage Tracking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage Margining . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C/SMBus Communications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C/SMBus Device Address Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital-DC Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phase Spreading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fault Spreading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Temperature Monitoring Using the XTEMP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Active Current Sharing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phase Adding/Dropping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Monitoring via I2C/SMBus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Snapshot Parameter Capture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Non-Volatile Memory and Device Security Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
21
22
22
23
23
23
24
24
24
25
26
27
27
27
27
30
30
30
31
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
About Intersil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2
FN6906.5
December 19, 2013
ZL6105
Typical Application Circuit
The following application circuit represents a typical implementation of the ZL6105. For enable using the PMBus, it is recommended to
tie the enable pin (EN) to SGND.
VIN 12V
F.B.1
ENABLE
CIN
3 x 10 µF
25 V
4.7 µF
25 V
PHASE ENABLE
DDC Bus 3
POWER GOOD OUTPUT
CV25
10 µF
4V
CB
BST 26
3 SA0
GH 25
4 SA1
SW 24
ZL6105
5 ILIM
18 VSEN-
EPAD
SGND
17 VSEN+
16 VRTK
ISENB 19
15 SS
9 SALRT
14 UVLO
ISENA 20
13 V1
8 SDA
12 V0
VR 21
11 FC1
GL 22
7 SCL
VOUT
LOUT
2.2 µH
PGND 23
6 CFG0
10 FC0
1 µF
16 V
VDD 27
2 SYNC
I2C/SMBus 2
DB
BAT54
V25 28
DDC 30
XTEMP 29
MGN 31
EN 33
CFG1 32
PH_EN 34
PG 36
1 DGND
V25
CFG2 35
QH
COUT
2 x 47 µF
6.3 V
QL
470 µF
2.5 V
POS-CAP
CVR
4.7 µF
2*220 µF
6.3 V
100 m
RTN
6.3 V
Ground unification
Notes:
1. Ferrite bead is optional for input noise suppression
2. The I2C/SMBus requires pull-up resistors. Please refer to the I2C/SMBus specifications for more details.
3. The DDC bus requires a pull-up resistor. The resistance will vary based on the capacitive loading of the bus (and on the number of devices
connected). The 10 kΩ default value, assuming a maximum of 100 pF per device, provides the necessary 1 µs pull-up rise time. Please refer to the
DDC Bus section for more details.
FIGURE 3. 12V TO 1.8V/16A APPLICATION CIRCUIT
3
FN6906.5
December 19, 2013
ZL6105
Input Voltage Bus
>
PG
EN
MGN
CFG(0,1,2)
SS
ILIM
V(0,1)
FC(0,1)
VDD
VR
VTRK
Power Management
SYNC
GEN
Digital
Compensator
BST
NVM
MOSFET
Drivers
D-PWM
SW
VOUT
NLR
PLL
SYNC
Σ
ADC
-
VSEN
+
REFCN
DAC
VDD
DDC
I2C
ISENB
ISENA
ADC
MUX
SALRT
SDA
SCL
SA(0,1)
ADC
Communication
Voltage
Sensor
VSEN+
VSENXTEMP
TEMP
Sensor
FIGURE 4. ZL6105 BLOCK DIAGRAM
4
FN6906.5
December 19, 2013
ZL6105
Pin Configuration
28 V25
29 XTEMP
30 DDC
31 MGN
32 CFG1
33 EN
34 PH_EN
35 CFG2
36 PG
ZL6105
(36 LD QFN)
TOP VIEW
DGND 1
27 VDD
SYNC 2
26 BST
SA0 3
25 GH
SA1 4
24 SW
EXPOSED PADDLE*
ILIM 5
23 PGND
VSEN- 18
VSEN+ 17
19 ISENB
VTRK 16
SALRT 9
SS 15
20 ISENA
UVLO 14
SDA 8
V1 13
21 VR
V0 12
SCL 7
FC1 11
22 GL
FC0 10
CFG0 6
*CONNECT TO SGND
Pin Descriptions
PIN
LABEL
TYPE (Note 1)
DESCRIPTION
1
DGND
PWR
2
SYNC
I/O,M (Note 2)
3
SA0
I, M
Serial address select pins. Used to assign unique SMBus address to each IC or to enable certain
management features.
Digital ground. Common return for digital signals. Connect to low impedance ground plane.
Clock synchronization input. Used to set switching frequency of internal clock or for synchronization to
external frequency reference.
4
SA1
5
ILIM
I, M
Current limit select. Sets the overcurrent threshold voltage for ISENA and ISENB.
6
CFG0
I, M
Configuration pin. Used to setup current sharing and non-linear response.
7
SCL
I/O
Serial clock. Connect to external host and/or to other ZL devices.
8
SDA
I/O
Serial data. Connect to external host and/or to other ZL devices.
9
SALRT
O
Serial alert. Connect to external host if desired.
10
FC0
I
Loop compensation configuration pins.
11
FC1
12
V0
I
Output voltage selection pins. Used to set VOUT set-point and VOUT max.
13
V1
14
UVLO
I, M
Undervoltage lockout selection. Sets the minimum value for VDD voltage to enable VOUT.
15
SS
I, M
Soft start pin. Sets the output voltage ramp time during turn-on and turn-off. Sets the delay from when EN
is asserted until the output voltage starts to ramp.
16
VTRK
I
Tracking sense input. Used to track an external voltage source.
17
VSEN+
I
Output voltage feedback. Connect to output regulation point.
18
VSEN-
I
Output voltage feedback. Connect to load return or ground regulation point.
19
ISENB
I
Differential voltage input for current limit.
5
FN6906.5
December 19, 2013
ZL6105
Pin Descriptions (Continued)
PIN
LABEL
TYPE (Note 1)
20
ISENA
I
DESCRIPTION
Differential voltage input for current limit. High voltage tolerant.
21
VR
PWR
22
GL
O
23
PGND
PWR
Power ground. Connect to low impedance ground plane.
24
SW
PWR
Drive train switch node.
25
GH
O
26
BST
PWR
Internal 5V reference used to power internal drivers.
Low side FET gate drive.
High-side FET gate drive.
High-side drive boost voltage.
27
VDD (Note 3)
PWR
Supply voltage.
28
V25
PWR
Internal 2.5V reference used to power internal circuitry.
29
XTEMP
I
30
DDC
I/O
31
MGN
I
32
CFG1
I, M
33
EN
I
Enable input (active high). Pull-up to enable PWM switching and pull-down to disable PWM switching.
34
PH_EN
I
Phase enable input (active high). Pull-up to enable phase and pull-down to disable phase for current
sharing.
35
CFG2
I, M
36
PG
O
ePad
SGND
PWR
External temperature sensor input. Connect to external 2N3904 diode connected transistor.
Digital-DC Bus. (Open Drain) Interoperability between Zilker Labs devices.
Signal that enables margining of output voltage.
Configuration pin. Used to setup clock synchronization and sequencing.
Configuration pin. Sets the phase offset (single-phase) or current sharing group position (multi-phase).
Power-good output.
Exposed thermal pad. Common return for analog signals; internal connection to SGND. Connect to low
impedance ground plane.
NOTES:
1. I = Input, O = Output, PWR = Power or Ground. M = Multi-mode pin dependents. (Refer to “Multi-mode Pins” on page 11).
2. The SYNC pin can be used as a logic pin, a clock input or a clock output.
3. VDD is measured internally and the value is used to modify the PWM loop gain.
Ordering Information
PART NUMBER
(Notes 5, 6)
PART
MARKING
ZL6105ALAF
TEMP. RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
6105
-40 to +85
36 Ld QFN
L36.6x6C
ZL6105ALAFT (Note 4)
6105
-40 to +85
36 Ld QFN
L36.6x6C
ZL6105ALAFTK (Note 4)
6105
-40 to +85
36 Ld QFN
L36.6x6C
NOTES:
4. Please refer to TB347 for details on reel specifications.
5. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pbfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
6. For Moisture Sensitivity Level (MSL), please see device information page for ZL6105. For more information on MSL please see techbrief TB363.
6
FN6906.5
December 19, 2013
ZL6105
Absolute Maximum Ratings (Note 7)
Thermal Information
DC Supply Voltage for VDD Pin . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 17V
MOSFET Drive Reference for VR Pin @ 120mA . . . . . . . . . . . -0.3V to 6.5V
2.5V Logic Reference for V25 Pin @ 120mA . . . . . . . . . . . . . . . -0.3V to 3V
Logic I/O Voltage for CFG(0,1,2), DDC, EN,
FC(0, 1), ILIM, MGN, PG, PH_EN, SA(0, 1), SALRT,
SCL, SDA, SS, SYNC, UVLO, V(0,1) Pins . . . . . . . . . . . . . . . . -0.3V to 6.5V
Analog Input Voltages for ISENB, VSEN, VTRK,
XTEMP Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6.5V
Analog Input Voltages for ISENA Pin . . . . . . . . . . . . . . . . . . . . . -1.5V to 30V
High Side Supply Voltage for BST Pin . . . . . . . . . . . . . . . . . . . . -0.3V to 30V
Boost to Switch Voltage for BST - SW Pins . . . . . . . . . . . . . . . . . -0.3V to 8V
High Side Drive Voltage for GH Pin
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(VSW - 0.3V) to (VBST + 0.3V)
Low Side Drive Voltage for GL Pin . . . . . . . . . . (PGND - 0.3V) to VR + 0.3V
Switch Node for SW Pin
Continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(PGND - 0.3V) to 30V
Transient (<100ns) . . . . . . . . . . . . . . . . . . . . . . . . . . . . (PGND - 5V) to 30V
Ground Voltage Differential (DGND - SGND, PGND - SGND)
for DGND, SGND and PGND Pins . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
ESD Rating
Human Body Model (Note 8). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500V
Latch-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tested to JESD78
Thermal Resistance (Typical)
θJA (°C/W) θJC (°C/W)
36 Ld QFN (Notes 9, 10) . . . . . . . . . . . . . . .
35
5
Operating Junction Temperature Range . . . . . . . . . . . . . .-40°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +150°C
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-55°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Recommended Operating Conditions
Input Supply Voltage Range, VDD (see Figure 8)
VDD tied to VR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0V to 5V
VR floating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5V to 14V
Output Voltage Range (VOUT) (Note 11) . . . . . . . . . . . . . . . . . . 0.54V to 5.5V
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
7. Voltage measured with respect to SGND.
8. BST, SW pins rated at 1.5kV.
9. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
10. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
11. Includes margin limits.
Electrical Specifications VDD = 12V, TA = -40°C to +85°C unless otherwise noted. Typical values are at TA = +25°C. Boldface limits apply over
the operating temperature range, -40°C to +85°C.
MIN
(Note 19)
TYP
MAX
(Note 19)
UNIT
GH, GL no load
–
16
30
mA
–
25
50
mA
EN = 0V
No I2C/SMBus activity
–
6.5
9
mA
PARAMETER
CONDITIONS
Input and Supply Characteristics
IDD Supply Current at fSW = 200kHz
IDD Supply Current at fSW = 1.4Mhz
IDDS Shutdown Current
Vr Reference Output Voltage
VDD > 6V, IVR < 20mA
4.5
5.2
5.5
V
V25 Reference Output Voltage
VR > 3V, IV25 < 20mA
2.25
2.5
2.75
V
0.6
–
5.0
V
Output Characteristics
Output Voltage Adjustment Range (Note 12)
VIN > VOUT
Output Voltage Set-point Resolution
Set using resistors
–
10
–
mV
Set using I2C/SMBus
–
±0.025
–
% FS
(Note 13)
Output Voltage Accuracy (Note 14)
Includes line, load, temp
-1
–
1
%
Vsen Input Bias Current
VSEN = 5.5V
–
110
200
µA
Current Sense Differential Input
Voltage (Ground Referenced)
VISENA -VISENB
-100
–
100
mV
Current Sense Differential Input Voltage (Vout
Referenced, Vout < 4.0V)
VISENA -VISENB
-50
–
50
mV
Current Sense Input Bias Current
Ground referenced
-100
–
100
µA
7
FN6906.5
December 19, 2013
ZL6105
Electrical Specifications VDD = 12V, TA = -40°C to +85°C unless otherwise noted. Typical values are at TA = +25°C. Boldface limits apply over
the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
CONDITIONS
MIN
(Note 19)
TYP
MAX
(Note 19)
UNIT
µA
Current Sense Input Bias Current
(Vout Referenced, Vout < 4.0V)
ISENA
-1
–
1
ISENB
-100
–
100
µA
Soft-start Delay Duration Range
Set using SS pin or resistor (Note 15)
5
–
30
ms
0.005
–
500
s
-
-0.25/+4
-
ms
ms
Set using I2C/SMBus (Note 15)
Soft-start Delay Duration Accuracy
Turn-on delay (Note 15)
Turn-off delay (Note 15)
-
-0.25/+4
-
Soft-start Ramp Duration Range
Set using SS pin or resistor
2
–
20
ms
Set using I2C
0
–
200
ms
–
100
–
µs
-250
–
250
nA
–
–
0.8
V
Soft-start Ramp Duration Accuracy
Logic Input/Output Characteristics
Logic Input Leakage Current
EN, SCL, SDA pins
Logic Input Low, VIL
Logic Input OPEN (N/C)
Multi-mode logic pins
Logic Input High, VIH
–
1.4
–
V
2.0
–
–
V
Logic Output Low, VOL
IOL ≤ 4mA (Note 20)
–
–
0.4
V
Logic Output High, VOH
IOH ≥ -2mA (Note 20)
2.25
–
–
V
Oscillator and Switching Characteristics
200
–
1400
kHz
Switching Frequency Set-point Accuracy
Switching Frequency Range
Predefined settings (See Table 11)
-5
–
5
%
Maximum Pwm Duty Cycle
Factory default
95
–
–
%
150
–
–
ns
-13
–
13
%
Minimum Sync Pulse Width
Input Clock Frequency Drift Tolerance
External clock source
Gate Drivers
High-side driver voltage (VBST -VSW)
–
4.5
–
V
High-side Driver Peak Gate Drive
Current (Pull-down)
(VBST -VSW) = 4.5V
2
3
–
A
High-side Driver Pull-up Resistance
(VBST -VSW) = 4.5V, (VBST -VGH) = 50mV
–
0.8
2
Ω
High-side Driver Pull-down Resistance
(VBST -VSW) = 4.5V, (VGH -VSW) = 50mV
–
0.5
2
Ω
Low-side Driver Peak Gate
Drive Current (Pull-up)
VR = 5V
–
2.5
–
A
Low-side Driver Peak Gate
Drive Current (Pull-down)
VR = 5V
–
1.8
–
A
Low-side Driver Pull-up Resistance
VR = 5V, (VR -VGL) = 50mV
–
1.2
2
Ω
Low-side Driver Pull-down Resistance
VR = 5V, (VGL -PGND) = 50mV
–
0.5
2
Ω
Gh Rise and Fall Time
(VBST -VSW) = 4.5V, CLOAD = 2.2nF
–
5
20
ns
Gl Rise and Fall Time
VR = 5V, CLOAD = 2.2nF
–
5
20
ns
Switching Timing
Tracking
VTRK Input Bias Current
VTRK = 5.5V
VTRK Tracking Ramp Accuracy
100% Tracking, VOUT -VTRK, no prebias
–
110
200
µA
-100
–
+ 100
mV
VTRK Regulation Accuracy
100% Tracking, VOUT -VTRK
-1
–
1
%
Configurable via I2C/SMBus
2.85
–
16
V
-150
–
150
mV
–
3
–
%
0
–
100
%
Fault Protection Characteristics
UVLO Threshold Range
UVLO Set-point Accuracy
UVLO Hysteresis
Factory default
Configurable via
8
I2C/SMBus
FN6906.5
December 19, 2013
ZL6105
Electrical Specifications VDD = 12V, TA = -40°C to +85°C unless otherwise noted. Typical values are at TA = +25°C. Boldface limits apply over
the operating temperature range, -40°C to +85°C. (Continued)
PARAMETER
CONDITIONS
UVLO Delay
MIN
(Note 19)
TYP
MAX
(Note 19)
UNIT
–
2.5
-
µs
Power Good VOUT Threshold
Factory default
–
90
–
% VOUT
Power Good VOUT Hysteresis
Factory default
–
5
–
%
Power Good Delay
VSEN Undervoltage Threshold
VSEN Overvoltage Threshold
Using pin-strap or resistor (Note 16)
0
–
200
ms
Configurable via I2C/SMBus
0
–
500
s
Factory default
–
85
–
% VOUT
Configurable via I2C/SMBus
0
–
110
% VOUT
Factory default
–
115
–
% VOUT
Configurable via
I2C/SMBus
0
–
115
% VOUT
–
5
–
% VOUT
Factory default
–
16
–
µs
Configurable via I2C/SMBus
5
–
60
µs
Current Limit Set-point Accuracy
(VOUT Referenced)
–
±10
–
% FS
(Note 17)
Current Limit Set-point Accuracy
(Ground Referenced)
–
±10
–
% FS
(Note 17)
Factory default
–
10
–
tSW
(Note 18)
Configurable via I2C/SMBus
1
–
32
tSW
(Note 18)
VSEN Undervoltage Hysteresis
VSEN Undervoltage/Overvoltage
Fault Response Time
Current Limit Protection Delay
Temperature Compensation of
Current Limit Protection Threshold
Factory default
Thermal Protection Threshold
(Junction Temperature)
Factory default
Configurable via
4400
I2C/SMBus
Configurable via I2C/SMBus
Thermal Protection Hysteresis
100
ppm/°C
12700
–
125
–
°C
-40
–
125
°C
–
15
–
°C
NOTES:
12. Does not include margin limits.
13. Percentage of Full Scale (FS) with temperature compensation applied.
14. VOUT measured at the termination of the VSEN+ and VSEN-sense points.
15. The device requires a minimum delay period following an enable signal and prior to ramping its output as described in “Soft-Start Delay and Ramp
Times” on page 14.
16. Factory default Power Good delay is set to the same value as the soft-start ramp time. Refer to “Soft-Start Delay and Ramp Times” on page 14 for
further restrictions on PG Delay.
17. Percentage of Full Scale (FS) with temperature compensation applied
18. tSW = 1/fSW, where fSW is the switching frequency.
19. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.
20. Nominal capacitance of logic pins is 5pF.
9
FN6906.5
December 19, 2013
ZL6105
The ZL6105 is an innovative mixed-signal power conversion and
power management IC based on Zilker Labs patented Digital-DC
technology that provides an integrated, high performance
step-down converter for a wide variety of power supply
applications.
Today’s embedded power systems are typically designed for optimal
efficiency at maximum load, reducing the peak thermal stress by
limiting the total thermal dissipation inside the system.
Unfortunately, many of these systems are often operated at load
levels far below the peak where the power system has been
optimized, resulting in reduced efficiency. While this may not cause
thermal stress to occur, it does contribute to higher electricity usage
and results in higher overall system operating costs.
Zilker Labs’ efficiency-adaptive ZL6105 DC/DC controller helps
mitigate this scenario by enabling the power converter to
automatically change their operating state to increase efficiency
and overall performance with little or no user interaction needed.
Auto compensation is available to eliminate the need for manual
compensation of the PID filter.
Its unique PWM loop utilizes an ideal mix of analog and digital
blocks to enable precise control of the entire power conversion
process with no software required, resulting in a very flexible
device that is also very easy to use. An extensive set of power
management functions are fully integrated and can be
configured using simple pin connections. The user configuration
can be saved in an internal non-volatile memory (NVM).
Additionally, all functions can be configured and monitored via
the SMBus hardware interface using standard PMBus
commands, allowing ultimate flexibility.
Once enabled, the ZL6105 is immediately ready to regulate
power and perform power management tasks with no
programming required. Advanced configuration options and
real-time configuration changes are available via the I2C/SMBus
interface if desired and continuous monitoring of multiple
operating parameters is possible with minimal interaction from a
host controller. Integrated sub-regulation circuitry enables single
supply operation from any supply between 3V and 14V with no
secondary bias supplies needed.
The ZL6105 can be configured by simply connecting its pins
according to the tables provided in the following sections.
Additionally, a comprehensive set of development tools and
application notes are available to help simplify the design
process. An evaluation board is also available to help the user
become familiar with the device. This board can be evaluated as
a standalone platform using pin configuration settings. A
Windows™ based GUI is also provided to enable full configuration
and monitoring capability via the I2C/SMBus interface using an
available computer and the included USB cable.
Application notes are available to assist the user in designing to
specific application demands. Please visit www.intersil.com to
access the most up-to-date documentation.
10
The ZL6105 operates as a voltage-mode, synchronous buck
converter with a selectable constant frequency pulse width
modulator (PWM) control scheme that uses external MOSFETs,
capacitors, and an inductor to perform power conversion.
VIN
DB
VR
QH
GH
ZL
CIN
BST
SW
CB
VOUT
C OUT
QL
GL
FIGURE 5. SYNCHRONOUS BUCK CONVERTER
Figure 5 illustrates the basic synchronous buck converter
topology showing the primary power train components. This
converter is also called a step-down converter, as the output
voltage must always be lower than the input voltage. In its most
simple configuration, the ZL6105 requires two external
N-channel power MOSFETs, one for the top control MOSFET (QH)
and one for the bottom synchronous MOSFET (QL). The amount
of time that QH is on as a fraction of the total switching period is
known as the duty cycle D, which is described by Equation 1:
D≈
VOUT
VIN
(EQ. 1)
During time D, QH is on and VIN – VOUT is applied across the
inductor. The current ramps up as shown in Figure 6.
When QH turns off (time 1-D), the current flowing in the inductor
must continue to flow from the ground up through QL, during
which the current ramps down. Since the output capacitor COUT
exhibits a low impedance at the switching frequency, the AC
component of the inductor current is filtered from the output
voltage so the load sees nearly a DC voltage.
VIN - VOUT
ILPK
IO
0
-VOUT
CURRENT (A)
Digital-DC Architecture
Power Conversion Overview
VOLTAGE (V)
ZL6105 Overview
ILV
D
1-D
TIME
FIGURE 6. INDUCTOR WAVEFORM
Typically, buck converters specify a maximum duty cycle that
effectively limits the maximum output voltage that can be realized
for a given input voltage. This duty cycle limit ensures that the
low-side MOSFET is allowed to turn on for a minimum amount of
time during each switching cycle, which enables the bootstrap
capacitor (CB in Figure 6) to be charged up and provide adequate
gate drive voltage for the high-side MOSFET. See “High-side Driver
FN6906.5
December 19, 2013
ZL6105
Boost Circuit” on page 12 for more details.
PIN-STRAP SETTINGS
In general, the size of components L1 and COUT as well as the
overall efficiency of the circuit are inversely proportional to the
switching frequency, fSW. Therefore, the highest efficiency circuit
may be realized by switching the MOSFETs at the lowest possible
frequency; however, this will result in the largest component size.
Conversely, the smallest possible footprint may be realized by
switching at the fastest possible frequency but this gives a
somewhat lower efficiency. Each user should determine the
optimal combination of size and efficiency when determining the
switching frequency for each application.
This is the simplest implementation method, as no external
components are required. Using this method, each pin can take
on one of three possible states: LOW, OPEN, or HIGH. These pins
can be connected to the V25 pin for logic HIGH settings as this
pin provides a regulated voltage higher than 2V. Using a single
pin, one of three settings can be selected. Using two pins, one of
nine settings can be selected.
The block diagram for the ZL6105 is illustrated in Figure 4. In this
circuit, the target output voltage is regulated by connecting the
differential VSEN pins directly to the output regulation point. The
VSEN signal is then compared to a reference voltage that has
been set to the desired output voltage level by the user. The error
signal derived from this comparison is converted to a digital
value with a low-resolution, analog to digital (A/D) converter. The
digital signal is applied to an adjustable digital compensation
filter, and the compensated signal is used to derive the
appropriate PWM duty cycle for driving the external MOSFETs in a
way that produces the desired output.
The ZL6105 has several features to improve the power
conversion efficiency. A non-linear response (NLR) loop improves
the response time and reduces the output deviation as a result of
a load transient. The ZL6105 monitors the power converter’s
operating conditions and continuously adjusts the turn-on and
turn-off timing of the high-side and low-side MOSFETs to optimize
the overall efficiency of the power supply. Adaptive performance
optimization algorithms such as dead-time control, diode
emulation, and frequency control are available to provide greater
efficiency improvement.
Power Management Overview
The ZL6105 incorporates a wide range of configurable power
management features that are simple to implement with no
external components. Additionally, the ZL6105 includes circuit
protection features that continuously safeguard the device and
load from damage due to unexpected system faults. The ZL6105
can continuously monitor input voltage, output voltage/current,
internal temperature, and the temperature of an external
thermal diode. A Power-Good output signal is also included to
enable power-on reset functionality for an external processor.
All power management functions can be configured using either
pin configuration techniques (see Figure 8) or via the I2C/SMBus
interface. Monitoring parameters can also be pre-configured to
provide alerts for specific conditions. See Application Note
AN2033 for more details on SMBus monitoring.
Multi-mode Pins
In order to simplify circuit design, the ZL6105 incorporates patented
multi-mode pins that allow the user to easily configure many
aspects of the device with no programming. Most power
management features can be configured using these pins. The
multi-mode pins can respond to four different connections as shown
in Table 1. These pins are sampled when power is applied or by
issuing a PMBus Restore command (see Application Note AN2033).
11
TABLE 1. MULTI-MODE PIN CONFIGURATION
PIN TIED TO
VALUE
LOW
(Logic LOW)
< 0.8 VDC
OPEN
(N/C)
No connection
HIGH
(Logic HIGH)
> 2.0 VDC
Resistor to SGND
Set by resistor value
Logic
high
Open
ZL
ZL
Multi- mode Pin
Multi- mode Pin
RSET
Logic
low
Pin-strap
Settings
Resistor
Settings
FIGURE 7. PIN-STRAP AND RESISTOR SETTING EXAMPLES
RESISTOR SETTINGS
This method allows a greater range of adjustability when connecting
a finite value resistor (in a specified range) between the multi-mode
pin and SGND. Standard 1% resistor values are used, and only every
fourth E96 resistor value is used so the device can reliably recognize
the value of resistance connected to the pin while eliminating the
error associated with the resistor accuracy. Up to 31 unique
selections are available using a single resistor.
I2C/SMBUS METHOD
Almost any ZL6105 function can be configured via the I2C/SMBus
interface using standard PMBus commands. Additionally, any value
that has been configured using the pin-strap or resistor setting
methods can also be re-configured and/or verified via the
I2C/SMBus. See Application Note AN2033 for more details.
The SMBus device address and VOUT_MAX are the only
parameters that must be set by external pins. All other device
parameters can be set via the I2C/SMBus. The device address is
set using the SA0 and SA1 pins. VOUT_MAX is determined as
10% greater than the voltage set by the V0 and V1 pins.
FN6906.5
December 19, 2013
ZL6105
Power Conversion Functional
Description
TABLE 2. OUTPUT VOLTAGE PIN-STRAP SETTINGS
V0
Internal Bias Regulators and Input Supply
Connections
The ZL6105 employs two internal low dropout (LDO) regulators to
supply bias voltages for internal circuitry, allowing it to operate
from a single input supply. The internal bias regulators are as
indicated in the following:
VR - The VR LDO provides a regulated 5V bias supply for the
MOSFET driver circuits. It is powered from the VDD pin. A 4.7µF
filter capacitor is required at the VR pin.
V25 - The V25 LDO provides a regulated 2.5V bias supply for
the main controller circuitry. It is powered from an internal 5V
node. A 10µF filter capacitor is required at the V25 pin.
When the input supply (VDD) is higher than 5.5V, the VR pin should
not be connected to any other pins. It should only have a filter
capacitor attached as shown in Figure 8. Due to the dropout voltage
associated with the VR bias regulator, the VDD pin must be
connected to the VR pin for designs operating from a supply below
5.5V. Figure 8 illustrates the required connections for both cases.
VIN
VIN
VDD
VDD
ZL
ZL
VR
V1
LOW
OPEN
HIGH
LOW
0.6V
0.8V
1.0V
OPEN
1.2V
1.5V
1.8V
HIGH
2.5V
3.3V
5.0V
The resistor setting method can be used to set the output voltage
to levels not available in Table 2. Resistors R0 and R1 are
selected to produce a specific voltage between 0.6V and 5.0V in
10mV steps. Resistor R1 provides a coarse setting and resistor
R0 provides a fine adjustment, thus eliminating the additional
errors associated with using two 1% resistors (this typically adds
approximately 1.4% error).
To set VOUT using resistors, follow the steps indicated to calculate
an index value and then use Table 3 to select the resistor that
corresponds to the calculated index value as follows:
1. Calculate Index1:
(EQ. 2)
Index1 = 4 x VOUT (VOUT in 10mV steps)
2. Round the result down to the nearest whole number.
3. Select the value of R1 from Table 3 using the Index1 rounded
value from step 2.
4. Calculate Index0:
(EQ. 3)
Index0 = 100 x VOUT - (25 x Index1)
VR
5. Select the value of R0 from Table 3 using the Index0 value
from step 4.
3V ≤VIN ≤ 5.5V
5.5V <VIN ≤ 14V
FIGURE 8. INPUT SUPPLY CONNECTIONS
Note: the internal bias regulators are not designed to be outputs
for powering other circuitry. Do not attach external loads to any of
these pins. The multi-mode pins may be connected to the V25
pin for logic HIGH settings.
High-side Driver Boost Circuit
The gate drive voltage for the high-side MOSFET driver is
generated by a floating bootstrap capacitor, CB (see Figure 5).
When the lower MOSFET (QL) is turned on, the SW node is pulled
to ground and the capacitor is charged from the internal VR bias
regulator through diode DB. When QL turns off and the upper
MOSFET (QH) turns on, the SW node is pulled up to VDD and the
voltage on the bootstrap capacitor is boosted approximately 5V
above VDD to provide the necessary voltage to power the
high-side driver. A Schottky diode should be used for DB to help
maximize the high-side drive supply voltage.
TABLE 3. OUTPUT VOLTAGE RESISTORS SETTINGS
INDEX
R0 OR R1
(kΩ)
INDEX
R0 OR R1
(kΩ)
0
10
13
34.8
1
11
14
38.3
2
12.1
15
42.2
3
13.3
16
46.4
4
14.7
17
51.1
5
16.2
18
56.2
6
17.8
19
61.9
7
19.6
20
68.1
8
21.5
21
75
9
23.7
22
82.5
10
26.1
23
90.9
Output Voltage Selection
11
28.7
24
100
STANDARD MODE
12
31.6
The output voltage may be set to any voltage between 0.6V and
5.0V provided that the input voltage is higher than the desired
output voltage by an amount sufficient to prevent the device
from exceeding its maximum duty cycle specification. Using the
pin-strap method, VOUT can be set to any of nine standard
voltages as shown in Table 2.
12
Example from Figure 9: For VOUT = 1.33V,
Index1 = 4 x 1.33V = 5.32;
From Table 3, R1 = 16.2kΩ
Index0 = (100 x 1.33V) – (25 x 5) = 8;
From Table 3, R0 = 21.5kΩ
FN6906.5
December 19, 2013
ZL6105
The output voltage can be determined from the R0 (Index0) and
R1 (Index1) values using Equation 4:
VOUT
Index0 + (25 × Index1)
=
100
(EQ. 4)
Single Resistor Output Voltage Setting Mode
Some applications desire the output voltage to be set using a
single resistor. This can be accomplished using a resistor on the
V1 pin while the V0 pin is tied to SGND. Table 4 lists the available
output voltage settings with a single resistor.
TABLE 4. SINGLE RESISTOR VOUT SETTING (Continued)
RV1
(kΩ)
RV0
VOUT
133
LOW
3.30
147
LOW
4.00
162
LOW
5.00
178
LOW
5.50
VIN
SMBus Mode
The output voltage may be set to any value between 0.6V and
5.0V using a PMBus command over the I2C/SMBus interface.
See Application Note AN2033 for details.
GH
SW
ZL
VOUT
1.33V
GL
Start-up Procedure
V0
The ZL6105 follows a specific internal start-up procedure after
power is applied to the VDD pin. Table 5 describes the start-up
sequence.
TABLE 4. SINGLE RESISTOR VOUT SETTING
R1
16.2 kΩ
FIGURE 9. OUTPUT VOLTAGE RESISTOR SETTING EXAMPLE
RV1
(kΩ)
RV0
10
LOW
0.60
11
LOW
0.65
12.1
LOW
0.70
13.3
LOW
0.75
14.7
LOW
0.80
16.2
LOW
0.85
VOUT
17.8
LOW
0.90
19.6
LOW
0.95
21.5
LOW
1.00
23.7
LOW
1.05
26.1
LOW
1.10
28.7
LOW
1.15
31.6
LOW
1.20
34.8
LOW
1.25
38.3
LOW
1.30
42.2
LOW
1.40
46.4
LOW
1.50
51.1
LOW
1.60
56.2
LOW
1.70
61.9
LOW
1.80
68.1
LOW
1.90
75
LOW
2.00
82.5
LOW
2.10
90.9
LOW
2.20
100
LOW
2.30
110
LOW
2.50
121
LOW
3.00
13
R0
21. 5 kΩ
V1
If the device is to be synchronized to an external clock source, the
clock frequency must be stable prior to asserting the EN pin. The
device requires approximately 5ms to 10ms to check for specific
values stored in its internal memory. If the user has stored values
in memory, those values will be loaded. The device will then
check the status of all multi-mode pins and load the values
associated with the pin settings.
Once this process is completed, the device is ready to accept
commands via the I2C/SMBus interface and the device is ready
to be enabled. Once enabled, the device requires a minimum
delay period following an enable signal and prior to ramping its
output, as described in “Soft-Start Delay and Ramp Times” on
page 14. If a soft-start delay period less than the minimum has
been configured (using PMBus commands), the device will
default to the minimum delay period. If a delay period greater
than the minimum is configured, the device will wait for the
configured delay period prior to starting to ramp its output.
After the delay period has expired, the output will begin to ramp
towards its target voltage according to the pre-configured
soft-start ramp time that has been set using the SS pin. It should
be noted that if the EN pin is tied to VDD, the device will still
require approximately 5ms to 10ms before the output can begin
its ramp-up as described in Table 5.
FN6906.5
December 19, 2013
ZL6105
TABLE 5. ZL6105 START-UP SEQUENCE
STEP #
STEP NAME
DESCRIPTION
TIME DURATION
1
Power Applied
Input voltage is applied to the ZL6105’s VDD pin
2
Internal Memory Check
3
Multi-mode Pin Check
The device will check for values stored in its internal memory. This step Approximately 5ms to 10ms
is also performed after a Restore command.
(device will ignore an enable
signal or PMBus traffic during this
The device loads values configured by the multi-mode pins.
period)
4
Device Ready
The device is ready to accept an enable signal.
5
Pre-ramp Delay
The device requires a minimum delay period following an enable signal −
and prior to ramping its output, as described in “Soft-Start Delay and
Ramp Times” on page 14.
Soft-Start Delay and Ramp Times
It may be necessary to set a delay from when an enable signal is
received until the output voltage starts to ramp to its target
value. In addition, the designer may wish to precisely set the time
required for VOUT to ramp to its target value after the delay period
has expired. These features may be used as part of an overall
inrush current management strategy or to precisely control how
fast a load IC is turned on. The ZL6105 gives the system designer
several options for precisely and independently controlling both
the delay and ramp time periods.
The soft-start delay period begins when the EN pin is asserted
and ends when the delay time expires. The soft-start delay period
is set using the SS pin.
The soft-start ramp timer enables a precisely controlled ramp to
the nominal VOUT value that begins once the delay period has
expired. The ramp-up is guaranteed monotonic and its slope may
be precisely set using the SS pin.
The soft start delay and ramp times can be set to standard
values according to Table 6.
TABLE 6. SOFT-START PIN-STRAP SETTINGS
SS PIN
RAMP TIME
(ms)
LOW
5
2
OPEN
5
5
HIGH
10
10
If the desired soft-start delay and ramp times are not one of the values
listed in Table 6, the times can be set to a custom value by connecting a
resistor from the SS pin to SGND using the appropriate resistor value
from Table 7. The value of this resistor is measured upon start-up or
Restore and will not change if the resistor is varied after power has been
applied to the ZL6105.
The soft-start delay and ramp times can also be set to custom
values via the I2C/SMBus interface. When the SS delay time is
set to 0ms, the device will begin its ramp-up after the internal
circuitry has initialized (approximately 2ms). When the soft-start
ramp period is set to 0ms, the output will ramp up as quickly as
the output load capacitance and loop settings will allow. It is
generally recommended to set the soft-start ramp to a value
greater than 500µs to prevent inadvertent fault conditions due to
excessive in-rush current.
14
−
The ZL6105 has a minimum TON_DELAY requirement that is a
function of the operating mode. Table 8 shows the different
mode configurations and the minimum TON_DELAY required for
each mode. Current sharing is configured with the
ISHARE_CONFIG PMBus command, Auto compensation is
configured with the AUTO_COMP_CONFIG command, and
Standby Mode is configured as Low Power with the
USER_CONFIG command. See Application Note AN2033 for
details.
TABLE 7. SS RESISTOR SETTINGS
RSS
(kΩ)
DELAY TIME
(ms)
13.3
14.7
16.2
RAMP TIME
(ms)
2
5
5
10
17.8
20
19.6
2
21.5
23.7
DELAY TIME
(ms)
Depends on input supply ramp
time
10
5
10
26.1
20
28.7
2
31.6
34.8
15
5
10
38.3
20
42.2
2
46.4
51.1
20
5
10
56.2
20
61.9
2
68.1
75
82.5
30
5
10
20
FN6906.5
December 19, 2013
ZL6105
TABLE 8. MINIMUM TON DELAY vs OPERATING MODE
AutoComp
Low-Power
Standby
Min.
TON_DELAY
(ms)
X
Disabled
False
5
Disabled
Enabled
False
5
Disabled
X
True
10
Enabled
Disabled
True
15
Enabled
Enabled
X
15
Current
Sharing
Power-Good
The ZL6105 provides a Power-Good (PG) signal that indicates the
output voltage is within a specified tolerance of its target level
and no fault condition exists. By default, the PG pin will assert if
the output is within -10% of the target voltage. These limits and
the polarity of the pin may be changed via the I2C/SMBus
interface. See Application Note AN2033 for details.
A PG delay period is defined as the time from when all conditions
within the ZL6105 for asserting PG are met to when the PG pin is
actually asserted. This feature is commonly used instead of using
an external reset controller to control external digital logic. By
default, the ZL6105 PG delay is set equal to the soft-start ramp
time setting. Therefore, if the soft-start ramp time is set to 10ms,
the PG delay will be set to 10ms. The PG delay may be set
independently of the soft-start ramp using the I2C/SMBus as
described in Application Note AN2033.
If Auto Comp is enabled, the PG timing is further controlled by
the PG Assert parameter, as described in “Loop Compensation”
on page 21.
Switching Frequency and PLL
The ZL6105 incorporates an internal phase-locked loop (PLL) to clock
the internal circuitry. The PLL can be driven by an external clock source
connected to the SYNC pin. When using the internal oscillator, the SYNC
pin can be configured as a clock source for other Zilker Labs devices.
The SYNC pin is a unique pin that can perform multiple functions
depending on how it is configured. The CFG1 pin is used to select
the operating mode of the SYNC pin as shown in Table 9.
Figure 13 illustrates the typical connections for each mode.
TABLE 9. SYNC PIN FUNCTION SELECTION
CFG1 PIN
SYNC PIN FUNCTION
CONFIGURATION B: SYNC INPUT
When the SYNC pin is configured as an input (CFG1 pin is tied LOW) and
the device is in Monitor Mode or self-enabled (EN tied to V25 or
ON_OFF_CONFIG[4] = 0), the device will check for a clock signal on the
SYNC pin immediately after power-up. In this case, the incoming clock
signal must be in the range of 200kHz to 1.4MHz and must be stable
within 10µs after V25 rises above 2.25V. When the SYNC pin is
configured as an input (CFG1 pin is tied LOW) and the device is in Low
Power Mode, the device will check for a clock signal on the SYNC pin
immediately after EN goes true. In this case, the incoming clock signal
must be in range and stable before EN goes true. The ZL6105's
oscillator will then synchronize with the rising edge of the external clock.
The incoming clock signal must be in the range of 200kHz to
1.4MHz and must be stable when the enable pin is asserted. The
clock signal must also exhibit the necessary performance
requirements (see “Electrical Specifications” on page 8). In the
event of a loss of the external clock signal, the output voltage
may show transient over/undershoot.
If this happens, the ZL6105 will automatically switch to its
internal oscillator and switch at a frequency close to the previous
incoming frequency.
CONFIGURATION C: SYNC AUTO DETECT
When the SYNC pin is configured in auto detect mode (CFG1 pin is left
OPEN) and the device is in Monitor Mode or self-enabled (EN tied to V25
or ON_OFF_CONFIG[4] = 0), the device will check for a clock signal on
the SYNC pin immediately after power-up. In this case, the incoming
clock signal must be in the range of 200kHz to 1.4MHz and must be
stable within 10µs after V25 rises above 2.25V. When the SYNC pin is
configured in auto detect mode (CFG1 pin is left OPEN) and the device is
in Low Power Mode, the device will check for a clock signal on the SYNC
pin immediately after EN goes true. In this case, the incoming clock
signal must be in range and stable before EN goes true.
If a clock signal is present, the ZL6105's oscillator will then
synchronize with the rising edge of the external clock. Refer to
“Configuration B: SYNC INPUT” in the preceding section.
If no incoming clock signal is present, the ZL6105 will configure
the switching frequency according to the state of the SYNC pin as
listed in Table 10. In SYNC AutoDetect mode, the ZL6105 will
only read the SYNC pin connection during the first start-up
sequence; changes to SYNC pin connections will not affect fSW
until the power (VDD) is cycled off and on.
TABLE 10. SWITCHING FREQUENCY PIN-STRAP SETTINGS
SYNC PIN
FREQUENCY
LOW
SYNC is configured as an input
LOW
200kHz
OPEN
Auto Detect mode
OPEN
400kHz
HIGH
SYNC is configured as an output
fSW = 400kHz
CONFIGURATION A: SYNC OUTPUT
When the SYNC pin is configured as an output (CFG1 pin is tied HIGH),
the device will run from its internal oscillator and will drive the resulting
internal oscillator signal (preset to 400kHz) onto the SYNC pin so other
devices can be synchronized to it. The SYNC pin will not be checked for
an incoming clock signal while in this mode.
15
HIGH
1MHz
Resistor
See Table 11
If the user wishes to run the ZL6105 at a frequency not listed in
Figure 10, the switching frequency can be set using an external
resistor, RSYNC, connected between SYNC and SGND using Table 11.
FN6906.5
December 19, 2013
ZL6105
SYNC
200kHz – 1.4MHz
ZL
ZL
A) SYNC = output
ZL
Open
SYNC
OR
Logic
low
N/C
CFG1
N/ C
CFG1
SYNC
200kHz – 1.4MHz
B) SYNC = input
Logic
high
CFG1
N/ C
CFG 1
SYNC
200 kHz – 1.33MHz
CFG 1
Logic
high
SYNC
OR
ZL
ZL
RSYNC
C) SYNC = Auto Detect
FIGURE 10. SYNC PIN CONFIGURATIONS
TABLE 11. SWITCHING FREQUENCY RESISTOR SETTINGS
RSYNC
(kΩ)
fSW
(kHz)
200
26.1
533
222
28.7
571
RSYNC
(kΩ)
fSW
(kHz)
10
11
12.1
242
31.6
615
13.3
267
34.8
727
14.7
296
38.3
800
16.2
320
46.4
889
17.8
364
51.1
1000
19.6
400
56.2
1143
21.5
421
68.1
1333
23.7
Power Train Component Selection
The ZL6105 is a synchronous buck converter that uses external
MOSFETs, inductor and capacitors to perform the power
conversion process. The proper selection of the external
components is critical for optimized performance.
To select the appropriate external components for the desired
performance goals, the power supply requirements listed in
Table 12 must be known.
TABLE 12. POWER SUPPLY REQUIREMENTS
PARAMETER
Input Voltage (VIN)
Output Voltage (VOUT)
471
The switching frequency can also be set to any value between
200kHz and 1.33MHz using the I2C/SMBus interface. The available
frequencies below 1.4MHz are defined by fSW = 8MHz/N, where the
whole number N is 6 ≤ N ≤ 40. See Application Note AN2033 for
details.
If a value other than fSW = 8MHz/N is entered using a PMBus
command, the internal circuitry will select the valid switching
frequency value that is closest to the entered value. For example,
if 810kHz is entered, the device will select 800kHz (N = 10).
When multiple Zilker Labs devices are used together, connecting
the SYNC pins together will force all devices to synchronize with
each other. The CFG1 pin of one device must set its SYNC pin as
an output and the remaining devices must have their SYNC pins
set as Auto Detect.
Note: The switching frequency read back using the appropriate
PMBus command will differ slightly from the selected values in
Table 11. The difference is due to hardware quantization.
16
RANGE
EXAMPLE
VALUE
3V to 14V
12V
0.6V to 5.0V
1.2V
Output Current (IOUT)
0A to ~25A
20A
Output Voltage Ripple
(VORIP)
<3% of VOUT
1% of VOUT
<IO
50% of IO
Output Load Step Rate
-
10A/µs
Output Deviation Due to Load Step
-
±50mV
+120°C
+85°C
-
85%
Various
Optimize for
small size
Output Load Step (IOSTEP)
Maximum PCB Temp.
Desired Efficiency
Other Considerations
DESIGN GOAL TRADE-OFFS
The design of the buck power stage requires several
compromises among size, efficiency, and cost. The inductor core
loss increases with frequency, so there is a trade-off between a
small output filter made possible by a higher switching frequency
and getting better power supply efficiency. Size can be decreased
FN6906.5
December 19, 2013
ZL6105
by increasing the switching frequency at the expense of
efficiency. Cost can be minimized by using through-hole
inductors and capacitors; however these components are
physically large.
ILrms is given by Equation 9.
To start the design, select a switching frequency based on Table
13. This frequency is a starting point and may be adjusted as the
design progresses.
where IOUT is the maximum output current. Next, calculate the
core loss of the selected inductor. Since this calculation is
specific to each inductor and manufacturer, refer to the chosen
inductor datasheet. Add the core loss and the ESR loss and
compare the total loss to the maximum power dissipation
recommendation in the inductor datasheet.
(I )
2
I Lrms = I OUT +
2
TABLE 13. CIRCUIT DESIGN CONSIDERATIONS
(EQ. 9)
opp
12
FREQUENCY RANGE
EFFICIENCY
CIRCUIT SIZE
200kHz to 400kHz
Highest
Larger
OUTPUT CAPACITOR SELECTION
400kHz to 800kHz
Moderate
Smaller
800kHz to 1.4MHz
Lower
Smallest
Several trade-offs must also be considered when selecting an
output capacitor. Low ESR values are needed to have a small
output deviation during transient load steps (VOSAG) and low
output voltage ripple (VORIP). However, capacitors with low ESR,
such as semi-stable (X5R and X7R) dielectric ceramic capacitors,
also have relatively low capacitance values. Many designs can
use a combination of high capacitance devices and low ESR
devices in parallel.
INDUCTOR SELECTION
The output inductor selection process must include several
trade-offs. A high inductance value will result in a low ripple
current (IO(P-P)), which will reduce output capacitance and
produce a low output ripple voltage, but may also compromise
output transient load performance. Therefore, a balance must be
struck between output ripple and optimal load transient
performance. A good starting point is to select the output
inductor ripple equal to the expected load transient step
magnitude (IOSTEP) as shown in Equation 5:
I opp = I ostep
(EQ. 5)
Now the output inductance can be calculated using Equation 6:
LOUT
⎛ V
VOUT × ⎜⎜1 − OUT
⎝ V INM
=
fsw × I opp
⎞
⎟⎟
⎠
(EQ. 6)
(EQ. 7)
2
Select an inductor rated for the average DC current with a peak
current rating above the peak current computed in Equation 7.
In overcurrent or short-circuit conditions, the inductor may have
currents greater than 2x the normal maximum rated output
current. It is desirable to use an inductor that still provides some
inductance to protect the load and the MOSFETs from damaging
currents in this situation.
Once an inductor is selected, the DCR and core losses in the
inductor are calculated as in Equation 8. Use the DCR specified in
the inductor manufacturer’s datasheet.
2
(EQ. 8)
17
(EQ. 10)
Vorip
2
Vorip
(EQ. 11)
2 × I opp
Use these values to make an initial capacitor selection, using a
single capacitor or several capacitors in parallel.
After a capacitor has been selected, the resulting output voltage
ripple can be calculated using Equation 12:
Vorip = I opp × ESR +
where IOUT is the maximum output current.
PLDCR = DCR × I Lrms
I opp
8 × f sw ×
ESR =
The average inductor current is equal to the maximum output
current. The peak inductor current (ILpk) is calculated using
Equation 7:
I opp
As a starting point, apportion one-half of the output ripple
voltage to the capacitor ESR and the other half to capacitance, as
shown in the Equations 10 and 11:
C OUT =
where VINM is the maximum input voltage.
I Lpk = I OUT +
For high ripple currents, a low capacitance value can cause a
significant amount of output voltage ripple. Likewise, in high
transient load steps, a relatively large amount of capacitance is
needed to minimize the output voltage deviation while the
inductor current ramps up or down to the new steady state
output current value.
I opp
8 × f sw × C OUT
(EQ. 12)
Because each part of this equation was made to be less than or
equal to half of the allowed output ripple voltage, the VORIP
should be less than the desired maximum output ripple.
INPUT CAPACITOR
It is highly recommended that dedicated input capacitors be
used in any point-of-load design, even when the supply is
powered from a heavily filtered 5V or 12V “bulk” supply from an
off-line power supply. This is because of the high RMS ripple
current that is drawn by the buck converter topology. This ripple
(ICINrms) can be determined from Equation 13:
I CINrms = I OUT × D × (1 − D)
(EQ. 13)
FN6906.5
December 19, 2013
ZL6105
Without capacitive filtering near the power supply circuit, this
current would flow through the supply bus and return planes,
coupling noise into other system circuitry. The input capacitors
should be rated at 1.2x the ripple current calculated in Equation
13 to avoid overheating of the capacitors due to the high ripple
current, which can cause premature failure. Ceramic capacitors
with X7R or X5R dielectric with low ESR and 1.1x the maximum
expected input voltage are recommended.
The high-side driver boost circuit utilizes an external Schottky diode
(DB) and an external bootstrap capacitor (CB) to supply sufficient
gate drive for the high-side MOSFET driver. DB should be a 20mA,
30V Schottky diode or equivalent device and CB should be a 1µF
ceramic type rated for at least 6.3V.
QL SELECTION
The bottom MOSFET should be selected primarily based on the
device’s rDS(ON) and secondarily based on its gate charge. To
choose QL, use Equation 14 and allow 2% to 5% of the output
power to be dissipated in the rDS(ON) of QL (lower output voltages
and higher step-down ratios will be closer to 5%):
(EQ. 14)
Calculate the RMS current in QL as shown in Equation 15:
I botrms = I Lrms × 1 − D
(EQ. 15)
Calculate the desired maximum rDS(ON) as shown in Equation 16:
RDS ( ON ) =
PQL
(EQ. 16)
(I botrms )2
Note that the rDS(ON) given in the manufacturer’s datasheet is
measured at +25°C. The actual rDS(ON) in the end-use application
will be much higher. For example, a Vishay Si7114 MOSFET with
a junction temperature of +125°C has an rDS(ON) that is 1.4x
higher than the value at +25°C. Select a candidate MOSFET, and
calculate the required gate drive current as shown in Equation
17:
I g = f SW × Qg
(EQ. 17)
Keep in mind that the total allowed gate drive current for both QH
and QL is 80mA.
MOSFETs with lower rDS(ON) tend to have higher gate charge
requirements, which increases the current and resulting power
required to turn them on and off. Since the MOSFET gate drive
circuits are integrated in the ZL6105, this power is dissipated in
the ZL6105 according to the Equation 18:
PQL = f sw × Qg × VINM
(EQ. 18)
PQH = 0.05 × VOUT × I OUT
(I
PQH
18
(EQ. 20)
)
(EQ. 21)
2
toprms
Select a MOSFET and calculate the resulting gate drive current.
Verify that the combined gate drive current from QL and QH does
not exceed 80mA.
Next, calculate the switching time using Equation 22:
t SW =
Qg
(EQ. 22)
I gdr
where Qg is the gate charge of the selected QH and Igdr is the
peak gate drive current available from the ZL6105.
Although the ZL6105 has a typical gate drive current of 3A, use
the minimum guaranteed current of 2A for a conservative
design. Using the calculated switching time, calculate the
switching power loss in QH using Equation 23:
Pswtop = VINM × t sw × I OUT × f sw
(EQ. 23)
The total power dissipated by QH is given by Equation 24:
PQHtot = PQH + Pswtop
(EQ. 24)
MOSFET THERMAL CHECK
Once the power dissipations for QH and QL have been calculated,
the MOSFETs junction temperature can be estimated. Using the
junction-to-case thermal resistance (Rth) given in the MOSFET
manufacturer’s datasheet and the expected maximum printed
circuit board temperature, calculate the junction temperature as
shown in Equation 25:
T j max = T pcb + (PQ × Rth )
(EQ. 25)
CURRENT SENSING COMPONENTS
Once the current sense method has been selected (Refer to
“Current Limit Threshold Selection” on page 19”), the
components are selected as indicated in the following.
When using the inductor DCR sensing method, the user must
also select an R/C network comprised of R1 and CL (see
Figure 11).
QH SELECTION
In addition to the rDS(ON) loss and gate charge loss, QH also has
switching loss. The procedure to select QH is similar to the
procedure for QL. First, assign 2% to 5% of the output power to
be dissipated in the rDS(ON) of QH using Equation 18 for QL. As
was done with QL, calculate the RMS current as shown in
Equation 19:
(EQ. 19)
Calculate a starting rDS(ON) as shown in Equation 20. This
equation uses 5% as an example:
RDS ( ON ) =
BOOTSTRAP CAPACITOR SELECTION
PQL = 0.05 × VOUT × I OUT
I toprms = I Lrms × D
GH
SW
ZL
R1
CL
GL
ISENA
ISENB
R2
FIGURE 11. DCR CURRENT SENSING
FN6906.5
December 19, 2013
ZL6105
For the voltage across CL to reflect the voltage across the DCR of
the inductor, the time constant of the inductor must match the
time constant of the RC network as shown in Equation 26:
VIN
τ RC = τ L / DCR
R1 ⋅ C L =
GH
(EQ. 26)
L
DCR
ZL
GL
ISENB
For L, use the average of the nominal value and the minimum
value. Include the effects of tolerance, DC Bias and switching
frequency on the inductance when determining the minimum
value of L. Use the typical value for DCR.
MOSFET RDS(ON) Sensing
VIN
The value of R1 should be as small as feasible and no greater
than 5kΩ for best signal-to-noise ratio. The designer should
make sure the resistor package size is appropriate for the power
dissipated and include this loss in efficiency calculations. In
calculating the minimum value of R1, the average voltage across
CL (which is the average IOUTDCR product) is small and can be
neglected. Therefore, the minimum value of R1 may be
approximated by Equation 27:
D (VIN − max − VOUT ) + (1 − D ) ⋅ VOUT
PR1 pkg −max ⋅ δ P
2
R1−min =
L
R1−min ⋅ DCR
(EQ. 27)
(EQ. 28)
Next, choose the next-lowest readily available value (eg: For CLmax = 1.86µF, CL = 1.5µF is a good choice). Then substitute the
chosen value into the same equation and re-calculate the value
of R1. Choose the 1% resistor standard value closest to this
re-calculated value of R1. The error due to the mismatch of the
two time constants is as shown in Equation 29.
⎛
ε τ = ⎜⎜1 −
⎝
R1 ⋅ C L ⋅ DCR ⎞⎟
⋅ 100%
⎟
Lavg
⎠
GH
SW
ZL
(EQ. 29)
The value of R2 should be 2kΩ.
For the rDS(ON) current sensing method, the external low side
MOSFET will act as the sensing element as indicated in
Figure 12.
VOUT
GL
ISENA
ISENB
Inductor DCR Sensing
(VOUT must be less than 4.0 V)
FIGURE 12. CURRENT SENSING METHODS
2
where PR1pkg-max is the maximum power dissipation
specification for the resistor package and δP is the derating
factor for the same parameter (eg: PR1pkg-max = 0.0625W for
0603 package, δP = 50% @ +85°C). Once R1-min has been
calculated, solve for the maximum value of CL from Equation 28:
C L−max =
VOUT
SW
ISENA
Current Limit Threshold Selection
It is recommended that the user include a current limiting
mechanism in their design to protect the power supply from
damage and prevent excessive current from being drawn from
the input supply in the event that the output is shorted to ground
or an overload condition is imposed on the output. Current
limiting is accomplished by sensing the current through the
circuit during a portion of the duty cycle.
Output current sensing can be accomplished by measuring the
voltage across a series resistive sensing element according to
Equation 30:
V LIM = I LIM × RSENSE
(EQ. 30)
Where:
ILIM is the desired maximum current that should flow in the
circuit.
RSENSE is the resistance of the sensing element.
VLIM is the voltage across the sensing element at the point
circuit should start limiting the output current.
the
The ZL6105 supports “lossless” current sensing by measuring
the voltage across a resistive element that is already present in
the circuit. This eliminates additional efficiency losses incurred
by devices that must use an additional series resistance in the
circuit.
To set the current limit threshold, the user must first select a
current sensing method. The ZL6105 incorporates two methods
for current sensing, synchronous MOSFET rDS(ON) sensing and
inductor DC resistance (DCR) sensing; Figure 12 shows a
simplified schematic for each method. The current sensing
method can be selected via the I2C/SMBus interface. Please
refer to Application Note AN2033 for details.
19
FN6906.5
December 19, 2013
ZL6105
In addition to selecting the current sensing method, the ZL6105
gives the power supply designer several choices for the fault
response during over or under current condition. The user can
select the number of violations allowed before declaring fault, a
blanking time and the action taken when a fault is detected.
The blanking time represents the time when no current
measurement is taken. This is to avoid taking a reading just after
a current load step (less accurate due to potential ringing). It is a
configurable parameter.
Once the sensing method has been selected, the user must
select the voltage threshold (VLIM), the desired current limit
threshold, and the resistance of the sensing element.
The current limit threshold voltage can be selected by simply
connecting the ILIM pin as shown in Table 14. The
ground-referenced sensing method is being used in this mode.
Note that IOUT_CAL_GAIN is set to 2mΩ for RDS sensing and set
to 1mΩ for DCR sensing by default.
TABLE 14. CURRENT LIMIT THRESHOLD VOLTAGE
PIN-STRAP SETTINGS
TABLE 15. CURRENT LIMIT THRESHOLD VOLTAGE RESISTOR
SETTINGS
RLIM
(kΩ)
RDS VLIM
(mV)
DCR VLIM
(mV)
10
0
0
11
5
2.5
12.1
10
5
13.3
15
7.5
14.7
20
10
16.2
25
12.5
17.8
30
15
19.6
35
17.5
21.5
40
20
23.7
45
22.5
26.1
50
25
28.7
55
27.5
31.6
60
30
ILIM Pin
RDS VLIM
(mV)
DCR VLIM
(mV)
LOW
50
25
34.8
65
32.5
OPEN
60
30
38.3
70
35
HIGH
70
35
42.2
75
37.5
46.4
80
40
51.1
85
42.5
56.2
90
45
61.9
95
47.5
68.1
100
50
75
105
52.5
82.5
110
55
90.9
115
57.5
100
120
60
The threshold voltage can also be selected in 5mV increments by
connecting a resistor, RLIM, between the ILIM pin and ground
according to Table 15. This method is preferred if the user does
not desire to use or does not have access to the I2C/SMBus
interface and the desired threshold value is contained in
Table 15.
The current limit threshold can also be set to a custom value via
the I2C/SMBus interface. Please refer to Application Note
AN2033 for further details.
20
FN6906.5
December 19, 2013
ZL6105
Loop Compensation
The ZL6105 operates as a voltage-mode synchronous buck
controller with a fixed frequency PWM scheme. Although the
ZL6105 uses a digital control loop, it operates much like a
traditional analog PWM controller. Figure 13 is a simplified block
diagram of the ZL6105 control loop, which differs from an
analog control loop only by the constants in the PWM and
compensation blocks. As in the analog controller case, the
compensation block compares the output voltage to the desired
voltage reference and compensates to keep the loop stable. The
resulting integrated error signal is used to drive the PWM logic,
converting the error signal to a duty cycle to drive the external
MOSFETs.
The ZL6105 has an auto compensation feature that measures
the characteristics of the power train and calculates the proper
tap coefficients. Auto compensation is configured using the FC0
and FC1 pins as shown in Table 16 and Table 17.
When auto compensation is enabled, the routine can be set to
execute one time after ramp or periodically while regulating.
Note that the Auto Compensation feature requires a minimum
TON_DELAY as described in “Soft-Start Delay and Ramp Times”
on page 14.
VIN
immediately after the first Auto Comp cycle completes
(POWER_GOOD_DELAY will be ignored).
The Auto Comp Gain control scales the Auto Comp results to
allow a trade-off between transient response and steady-state
duty cycle jitter. A setting of 100% will provide the fastest
transient response while a setting of 10% will produce the lowest
jitter.
Note that if Auto Comp is enabled, for best results Vin must be
stable before Auto Comp begins, as shown in Equation 31.
ΔVin
100%
--------------------- ( in% ) ≤ --------------------------------------Vin Nom
256 • Vout
1 + ----------------------------Vin Nom
(EQ. 31)
The auto compensation function can also be configured via the
AUTO_COMP_CONFIG command and controlled using the
AUTO_COMP_CONTROL command over the I2C/SMBus interface.
Please refer to Application Note AN2033 for further details.
TABLE 16. FC0 PIN-STRAP SETTINGS
FC0 PIN
STORE VALUES
LOW
SINGLE/REPEAT
PG ASSERT
Auto Comp Disabled
OPEN
Not Stored
Single
After Auto Comp
HIGH
Store in Flash
Single
After Auto Comp
10kΩ
Not Stored
Single
11kΩ
Store in Flash
12.1kΩ
Not Stored
13.3kΩ
Store in Flash
14.7kΩ
Not Stored
16.2kΩ
Store in Flash
FIGURE 13. CONTROL LOOP BLOCK DIAGRAM
17.8kΩ
Not Stored
If the device is configured to store auto comp values, the
calculated compensation values will be saved in the Auto Comp
Store and may be read back through the PID_TAPS command. If
repeat mode is enabled, the first Auto Comp results after the first
ramp will be stored; the values calculated periodically are not
stored in the Auto Comp Store. When compensation values are
saved in the Auto Comp Store, the device will use those
compensation values on subsequent ramps. In repeat mode, the
latest Auto Comp results will always be used during operation.
Stored Auto Comp results can only be cleared by disabling Auto
Comp Store, which is not permitted while the output is enabled.
However, sending the AUTOCOMP_CONTROL command while
enabled in Store mode will cause the next results to be stored,
overwriting previously stored values. If auto compensation is
disabled, the device will use the compensation parameters that
are stored in the DEFAULT_STORE or USER_STORE.
19.6kΩ
Store in Flash
21.5kΩ
Not Stored
23.7kΩ
Store in Flash
26.1kΩ
Not Stored
28.7kΩ
Store in Flash
31.6kΩ
Not Stored
34.8kΩ
Store in Flash
38.3kΩ
Not Stored
42.2kΩ
Store in Flash
D
L
VOUT
DPWM
1-D
C
RO
RC
Compensation
Repeat ~1 sec
After Auto Comp
Single
Repeat ~1 sec
After PG Delay
Single
Repeat ~1 min
After Auto Comp
Single
Repeat ~1 min
After PG Delay
If the PG Assert parameter is set to "Use PG Delay," PG will be asserted
according to the POWER_GOOD_DELAY command, after which Auto
Comp will begin. When Auto Comp is enabled, the user must not
program a Power-Good Delay that will expire before the ramp is
finished. If PG Assert is set to "After Auto Comp," PG will be asserted
21
FN6906.5
December 19, 2013
ZL6105
TABLE 17. FC1 PIN-STRAP SETTINGS
FC1 PIN
AUTO COMP GAIN
LOW
100%
OPEN
50%
HIGH
30%
10kΩ
10%
11kΩ
20%
12.1kΩ
30%
13.3kΩ
40%
14.7kΩ
50%
16.2kΩ
60%
17.8kΩ
70%
19.6kΩ
80%
21.5kΩ
90%
23.7kΩ
100%
Non-linear Response (NLR) Settings
The ZL6105 incorporates a non-linear response (NLR) loop that
decreases the response time and the output voltage deviation in
the event of a sudden output load current step. The NLR loop
incorporates a secondary error signal processing path that
bypasses the primary error loop when the output begins to
transition outside of the standard regulation limits. This scheme
results in a higher equivalent loop bandwidth than what is
possible using a traditional linear loop.
When a load current step function imposed on the output causes
the output voltage to drop below the lower regulation limit, the
NLR circuitry will force a positive correction signal that will turn
on the upper MOSFET and quickly force the output to increase.
Conversely, a negative load step (i.e. removing a large load
current) will cause the NLR circuitry to force a negative correction
signal that will turn on the lower MOSFET and quickly force the
output to decrease.
NLR can be configured using resistor pin-straps as follows:
• CFG0 disables NLR or enables NLR inner thresholds to 1.5%,
2% or 3% (see Table 29).
• CFG1 sets NLR inner thresholds timeout and blanking to 1 and
4 or 2 and 8 (see Table 26).
Please refer to Application Note AN2032 for more details
regarding NLR settings.
Efficiency Optimized Driver Dead-time
Control
The ZL6105 utilizes a closed loop algorithm to optimize the
dead-time applied between the gate drive signals for the top and
bottom FETs. In a synchronous buck converter, the MOSFET drive
circuitry must be designed such that the top and bottom
MOSFETs are never in the conducting state at the same time.
Potentially damaging currents flow in the circuit if both top and
22
bottom MOSFETs are simultaneously on for periods of time
exceeding a few nanoseconds. Conversely, long periods of time in
which both MOSFETs are off reduce overall circuit efficiency by
allowing current to flow in their parasitic body diodes.
It is therefore advantageous to minimize this dead-time to
provide optimum circuit efficiency. In the first order model of a
buck converter, the duty cycle is determined by Equation 32:
D≈
VOUT
VIN
(EQ. 32)
However, non-idealities exist that cause the real duty cycle to
extend beyond the ideal. Dead-time is one of those non-idealities
that can be manipulated to improve efficiency. The ZL6105 has
an internal algorithm that constantly adjusts dead-time
non-overlap to minimize duty cycle, thus maximizing efficiency.
This circuit will null out dead-time differences due to component
variation, temperature, and loading effects.
This algorithm is independent of application circuit parameters such
as MOSFET type, gate driver delays, rise and fall times and circuit
layout. In addition, it does not require drive or MOSFET voltage or
current waveform measurements.
Adaptive Diode Emulation
Most power converters use synchronous rectification to optimize
efficiency over a wide range of input and output conditions.
However, at light loads the synchronous MOSFET will typically
sink current and introduce additional energy losses associated
with higher peak inductor currents, resulting in reduced
efficiency. Adaptive diode emulation mode turns off the low-side
FET gate drive at low load currents to prevent the inductor current
from going negative, reducing the energy losses and increasing
overall efficiency.
Note: the overall bandwidth of the device may be reduced when
in diode emulation mode. It is recommended that diode
emulation is disabled prior to applying significant load steps.
Power Management Functional
Description
Input Undervoltage Lockout
The input undervoltage lockout (UVLO) prevents the ZL6105 from
operating when the input falls below a preset threshold,
indicating the input supply is out of its specified range. The UVLO
threshold (VUVLO) can be set between 2.85V and 16V using the
UVLO pin. The simplest implementation is to connect the UVLO
pin as shown in Table 18. If the UVLO pin is left unconnected, the
UVLO threshold will default to 4.5V.
TABLE 18. UVLO THRESHOLD PIN-STRAP SETTINGS
UVLO PIN
UVLO THRESHOLD (V)
LOW
3
OPEN
4.5
HIGH
10.8
FN6906.5
December 19, 2013
ZL6105
If the desired UVLO threshold is not one of the listed choices, the
user can configure a threshold between 2.85V and 16V by
connecting a resistor between the UVLO pin and SGND by
selecting the appropriate resistor from Table 19.
TABLE 19. UVLO THRESHOLD RESISTOR SETTINGS
RUVLO
(kΩ)
UVLO
(V)
RUVLO
(kΩ)
UVLO
(V)
17.8
2.85
46.4
7.42
19.6
3.14
51.1
8.18
21.5
3.44
56.2
8.99
23.7
3.79
61.9
9.9
26.1
4.18
68.1
10.9
28.7
4.59
75
12
31.6
5.06
82.5
13.2
34.8
5.57
90.9
14.54
38.3
6.13
100
16
42.2
6.75
The UVLO voltage can also be set to any value between 2.85V
and 16V via the I2C/SMBus interface.
Once an input undervoltage fault condition occurs, the device
can respond in a number of ways as follows:
1. Continue operating without interruption.
2. Continue operating for a given delay period, followed by
shutdown if the fault still exists. The device will remain in
shutdown until instructed to restart.
3. Initiate an immediate shutdown until the fault has been
cleared. The user can select a specific number of retry
attempts.
The default response from a UVLO fault is an immediate
shutdown of the device. The device will continuously check for
the presence of the fault condition. If the fault condition is no
longer present, the ZL6105 will be re-enabled.
Please refer to Application Note AN2033 for details on how to
configure the UVLO threshold or to select specific UVLO fault
response options via the I2C/SMBus interface.
Output Overvoltage Protection
The ZL6105 offers an internal output overvoltage protection
circuit that can be used to protect sensitive load circuitry from
being subjected to a voltage higher than its prescribed limits. A
hardware comparator is used to compare the actual output
voltage (seen at the VSEN pin) to a threshold set to 15% higher
than the target output voltage (the default setting). If the VSEN
voltage exceeds this threshold, the PG pin will de-assert and the
device can then respond in a number of ways as follows:
The default response from an overvoltage fault is to immediately
shut down. The device will continuously check for the presence of
the fault condition, and when the fault condition no longer exists
the device will be re-enabled.
For continuous overvoltage protection when operating from an
external clock, the only allowed response is an immediate
shutdown.
Please refer to Application Note AN2033 for details on how to
select specific overvoltage fault response options via I2C/SMBus.
Output Pre-Bias Protection
An output pre-bias condition exists when an externally applied
voltage is present on a power supply’s output before the power
supply’s control IC is enabled. Certain applications require that
the converter not be allowed to sink current during start up if a
pre-bias condition exists at the output. The ZL6105 provides
pre-bias protection by sampling the output voltage prior to
initiating an output ramp.
If a pre-bias voltage lower than the target voltage exists after the
pre-configured delay period has expired, the target voltage is set
to match the existing pre-bias voltage and both drivers are
enabled. The output voltage is then ramped to the final
regulation value at the ramp rate set by the SS pin.
The actual time the output will take to ramp from the pre-bias
voltage to the target voltage will vary depending on the pre-bias
voltage but the total time elapsed from when the delay period
expires and when the output reaches its target value will match
the pre-configured ramp time. See Figure 14.
If a pre-bias voltage higher than the target voltage exists after the
pre-configured delay period has expired, the target voltage is set
to match the existing pre-bias voltage and both drivers are
enabled with a PWM duty cycle that would ideally create the prebias voltage.
Once the pre-configured soft-start ramp period has expired, the
PG pin will be asserted (assuming the pre-bias voltage is not
higher than the overvoltage limit). The PWM will then adjust its
duty cycle to match the original target voltage and the output will
ramp down to the pre-configured output voltage.
If a pre-bias voltage higher than the overvoltage limit exists, the
device will not initiate a turn-on sequence and will declare an
overvoltage fault condition to exist. In this case, the device will
respond based on the output overvoltage fault response method
that has been selected. See “Output Overvoltage Protection” on
page 23 for response options due to an overvoltage condition.
1. Initiate an immediate shutdown until the fault has been
cleared. The user can select a specific number of retry
attempts.
2. Turn off the high-side MOSFET and turn on the low-side
MOSFET. The low-side MOSFET remains ON until the device
attempts a restart.
23
FN6906.5
December 19, 2013
ZL6105
Thermal Overload Protection
The ZL6105 includes an on-chip thermal sensor that
continuously measures the internal temperature of the die and
shuts down the device when the temperature exceeds the preset
limit. The default temperature limit is set to +125°C in the
factory, but the user may set the limit to a different value if
desired. See Application Note AN2033 for details. Note that
setting a higher thermal limit via the I2C/SMBus interface may
result in permanent damage to the device. Once the device has
been disabled due to an internal temperature fault, the user may
select one of several fault response options as follows:
1. Initiate a shutdown and attempt to restart an infinite number
of times with a preset delay period between attempts.
2. Initiate a shutdown and attempt to restart a preset number of
times with a preset delay period between attempts.
3. Continue operating for a given delay period, followed by
shutdown if the fault still exists.
4. Continue operating through the fault (this could result in
permanent damage to the power supply).
5. Initiate an immediate shutdown.
If the user has configured the device to restart, the device will
wait the preset delay period (if configured to do so) and will then
check the device temperature. If the temperature has dropped
below a threshold that is approximately +15°C lower than the
selected temperature fault limit, the device will attempt to restart. If the temperature still exceeds the fault limit the device
will wait the preset delay period and retry again.
FIGURE 14. OUTPUT RESPONSES TO PRE-BIAS VOLTAGES
Output Overcurrent Protection
The ZL6105 can protect the power supply from damage if the
output is shorted to ground or if an overload condition is imposed
on the output. Once the current limit threshold has been selected
(see “Current Limit Threshold Selection” on page 19), the user
may determine the desired course of action in response to the
fault condition. The following overcurrent protection response
options are available:
1. Initiate a shutdown and attempt to restart an infinite number
of times with a preset delay period between attempts.
2. Initiate a shutdown and attempt to restart a preset number of
times with a preset delay period between attempts.
3. Continue operating for a given delay period, followed by
shutdown if the fault still exists.
4. Continue operating through the fault (this could result in
permanent damage to the power supply).
5. Initiate an immediate shutdown.
The default response from an overcurrent fault is an immediate
shutdown of the device. The device will continuously check for
the presence of the fault condition, and if the fault condition no
longer exists the device will be re-enabled.
Please refer to Application Note AN2033 for details on how to
select specific overcurrent fault response options via I2C/SMBus.
24
The default response from a temperature fault is an immediate
shutdown of the device. The device will continuously check for
the fault condition, and once the fault has cleared the ZL6105
will be re-enabled.
Please refer to Application Note AN2033 for details on how to select
specific temperature fault response options via I2C/SMBus.
Voltage Tracking
Numerous high performance systems place stringent demands
on the order in which the power supply voltages are turned on.
This is particularly true when powering FPGAs, ASICs, and other
advanced processor devices that require multiple supply voltages
to power a single die. In most cases, the I/O interface operates at
a higher voltage than the core and therefore the core supply
voltage must not exceed the I/O supply voltage according to the
manufacturers' specifications.
Voltage tracking protects these sensitive ICs by limiting the
differential voltage between multiple power supplies during the
power-up and power down sequence. The ZL6105 integrates a
lossless tracking scheme that allows its output to track a voltage
that is applied to the VTRK pin with no external components
required. The VTRK pin is an analog input that, when tracking
mode is enabled, configures the voltage applied to the VTRK pin
to act as a reference for the device’s output regulation.
The ZL6105 offers two modes of tracking as follows:
1. Coincident. This mode configures the ZL6105 to ramp its
output voltage at the same rate as the voltage applied to the
VTRK pin.
FN6906.5
December 19, 2013
ZL6105
2. Ratiometric. This mode configures the ZL6105 to ramp its
output voltage at a rate that is a percentage of the voltage
applied to the VTRK pin. The default setting is 50%, but an
external resistor string may be used to configure a different
tracking ratio.
Figure 15 illustrates the typical connection and the two tracking
modes.
The master ZL6105 device in a tracking group is defined as the
device that has the highest target output voltage within the
group. This master device will control the ramp rate of all
tracking devices and is not configured for tracking mode. A delay
of at least 10ms must be configured into the master device using
the SS pin, and the user may also configure a specific ramp rate
using the SS pin. Any device that is configured for tracking mode
will ignore its soft-start delay and ramp time settings (SS pin) and
its output will take on the turn-on/turn-off characteristics of the
reference voltage present at the VTRK pin. All of the ENABLE pins
in the tracking group must be connected together and driven by a
single logic source. Tracking is configured via the I2C/SMBus
interface by using the TRACK_CONFIG PMBus command. Please
refer to Application Note AN2033 for more information on
configuring tracking mode using PMBus.
When a current sharing rail is tracking, the on-delay time of the
voltage being tracked must not exceed the on-delay of the
tracking rail by 5ms.
VIN
ZL
SW
VTRK
GH
GL
Q1
L1
Q2
VOUT
C1
VTRK
VOUT
VTRK
VOUT
Time
Coincident
VOUT
VTRK
VOUT
Time
Ratiometric
FIGURE 15. TRACKING MODES
25
TABLE 20. TRACKING RESISTOR SETTINGS
RSS
(kΩ)
TRACK
RATIO
(%)
90.9
100
110
UPPER TRACK
LIMIT
Output does not decrease
Limited by target before PG
100
Output always follows VTRK
Output does not decrease
Limited by VTRK before PG
121
Output always follows VTRK
Output does not decrease
Limited by target before PG
133
147
162
RAMP-UP/DOWN BEHAVIOR
50
Output always follows VTRK
Output does not decrease
Limited by VTRK before PG
178
Output always follows VTRK
Voltage Margining
The ZL6105 offers a simple means to vary its output higher or
lower than its nominal voltage setting in order to determine
whether the load device is capable of operating over its specified
supply voltage range. The MGN command is set by driving the
MGN pin or through the I2C/SMBus interface. The MGN pin is a
tri-level input that is continuously monitored and can be driven
directly by a processor I/O pin or other logic-level output.
The ZL6105’s output will be forced higher than its nominal set
point when the MGN command is set HIGH, and the output will
be forced lower than its nominal set point when the MGN
command is set LOW. Default margin limits of VNOM ±5% are
pre-loaded in the factory, but the margin limits can be modified
through the I2C/SMBus interface to as high as VNOM + 10% or as
low as 0V, where VNOM is the nominal output voltage set point
determined by the V0 and V1 pins. The ZL6105-01 allows 150%
margin limits.
The margin limits and the MGN command can both be set
individually through the I2C/SMBus interface. Additionally, the
transition rate between the nominal output voltage and either
margin limit can be configured through the I2C interface. Please
refer to Application Note AN2033 for detailed instructions on
modifying the margining configurations.
I2C/SMBus Communications
The ZL6105 provides an I2C/SMBus digital interface that enables
the user to configure all aspects of the device operation as well
as monitor the input and output parameters. The ZL6105 can be
used with any standard 2-wire I2C host device. In addition, the
device is compatible with SMBus version 2.0 and includes an
SALRT line to help mitigate bandwidth limitations related to
continuous fault monitoring. Pull-up resistors are required on the
I2C/SMBus as specified in the SMBus 2.0 specification. The
ZL6105 accepts most standard PMBus commands. When
controlling the device with PMBus commands, it is
recommended that the enable pin is tied to SGND.
I2C/SMBus Device Address Selection
When communicating with multiple SMBus devices using the
I2C/SMBus interface, each device must have its own unique
FN6906.5
December 19, 2013
ZL6105
address so the host can distinguish between the devices. The
device address can be set according to the pin-strap options
listed in Table 21. Address values are right-justified.
TABLE 21. SMBus ADDRESS PIN-STRAP SELECTION
SA0
SA1
LOW
OPEN
HIGH
LOW
0x20
0x21
0x22
OPEN
0x23
0x24
HIGH
0x26
0x27
TABLE 23. SMBus ADDRESS INDEX VALUES
RSA
(kΩ)
SA0 OR SA1
INDEX
RSA
(kΩ)
SA0 OR SA1
INDEX
10
0
34.8
13
11
1
38.3
14
12.1
2
42.2
15
13.3
3
46.4
16
0x25
14.7
4
51.1
17
Reserved
16.2
5
56.2
18
If additional device addresses are required, a resistor can be
connected to the SA0 pin according to Table 22 to provide up to
25 unique device addresses. In this case, the SA1 pin should be
tied to SGND.
TABLE 22. SMBus ADDRESS RESISTOR SELECTION
RSA0
(kΩ)
SMBus
ADDRESS
RSA0
(kΩ)
SMBus
ADDRESS
10
0x00
34.8
0x0D
11
0x01
38.3
0x0E
12.1
0x02
42.2
0x0F
13.3
0x03
46.4
0x10
14.7
0x04
51.1
0x11
16.2
0x05
56.2
0x12
17.8
0x06
61.9
0x13
19.6
0x07
68.1
0x14
21.5
0x08
75
0x15
23.7
0x09
82.5
0x16
26.1
0x0A
90.9
0x17
28.7
0x0B
100
0x18
31.6
0x0C
17.8
6
61.9
19
19.6
7
68.1
20
21.5
8
75
21
23.7
9
82.5
22
26.1
10
90.9
23
28.7
11
100
24
31.6
12
Using this method, the user can theoretically configure up to 625
unique SMBus addresses, however the SMBus is inherently
limited to 128 devices so attempting to configure an address
higher than 128 (0x80) will cause the device address to repeat
(i.e., attempting to configure a device address of 129 (0x81)
would result in a device address of 1). Therefore, the user should
use index values 0 to 4 on the SA1 pin and the full range of index
values on the SA0 pin, which will provide 125 device address
combinations.
To determine the SA0 and SA1 resistor values given an SMBus
address (in decimal), follow the indicated steps to calculate an
index value and then use Table 23 to select the resistor that
corresponds to the calculated index value as follows:
1. Calculate SA1 Index:
SA1 index = Address (in decimal) ÷ 25
(EQ. 34)
2. Round the result down to the nearest whole number.
If more than 25 unique device addresses are required or if other
SMBus address values are desired, both the SA0 and SA1 pins
can be configured with a resistor to SGND according to Equation
33 and Table 23.
SMBus address = 25 x (SA1 index) + (SA0 index)
(in decimal)
(EQ. 33)
Note that the SMBus address 0x4B is reserved for device test and
cannot be used in the system.
3. Select the value of R1 from Table 23 using the SA1 Index
rounded value from Step 2.
4. Calculate SA0 Index:
SA0 index = Address - (25 x SAl Index)
(EQ. 35)
5. Select the value of R0 from Table 23 using the SA0 Index
value from step 4.
Digital-DC Bus
The Digital-DC Communications (DDC) bus is used to
communicate between Zilker Labs Digital-DC devices. This
dedicated bus provides the communication channel between
devices for features such as sequencing, fault spreading, and
current sharing. The DDC pin on all Digital-DC devices in an
application should be connected together. A pull-up resistor is
required on the DDC bus in order to guarantee the rise time as
follows:
Risetime = R PU∗ C LOAD ≈ 1μs
26
(EQ. 36)
FN6906.5
December 19, 2013
ZL6105
where RPU is the DDC bus pull-up resistance and CLOAD is the bus
loading. The pull-up resistor may be tied to VR or to an external
3.3V or 5V supply as long as this voltage is present prior to or
during device power-up. As rules of thumb, each device
connected to the DDC bus presents ~10pF of capacitive loading,
and each inch of FR4 PCB trace introduces ~2pF. The ideal
design will use a central pull-up resistor that is well-matched to
the total load capacitance. In power module applications, the
user should consider whether to place the pull-up resistor on the
module or on the PCB of the end application. The minimum pullup resistance should be limited to a value that enables any
device to assert the bus to a voltage that will ensure a logic 0
(typically 0.8V at the device monitoring point) given the pull-up
voltage (5V if tied to VR) and the pull-down current capability of
the ZL6105 (nominally 4mA).
TABLE 25. PHASE OFFSET RESISTOR SETTINGS
RCFG2
(kΩ)
PHASE OFFSET
(°)
10
22.5
11
45
12.1
67.5
13.3
90
14.7
112.5
16.2
135
17.8
157.5
19.6
180
Phase Spreading
21.5
202.5
When multiple point of load converters share a common DC
input supply, it is desirable to adjust the clock phase offset of
each device such that not all devices start to switch
simultaneously. Setting each converter to start its switching cycle
at a different point in time can dramatically reduce input
capacitance requirements and efficiency losses. Since the peak
current drawn from the input supply is effectively spread out over
a period of time, the peak current drawn at any given moment is
reduced and the power losses proportional to the IRMS2 are
reduced dramatically.
23.7
225
26.1
247.5
28.7
270
31.6
292.5
34.8
315
38.3
337.5
42.2
22.5
46.4
45
51.1
67.5
56.2
90
61.9
112.5
68.1
135
75
157.5
TABLE 24. PHASE OFFSET PIN-STRAP SETTINGS
82.5
180
PHASE OFFSET
(°)
90.9
202.5
RCFG2
100
225
LOW
90
110
247.5
OPEN
0
121
270
HIGH
180
133
292.5
147
315
162
337.5
In order to enable phase spreading, all converters must be
synchronized to the same switching clock. The CFG1 pin is used
to set the configuration of the SYNC pin for each device as
described in “Switching Frequency and PLL” on page 15.
The phase offset of each single-phase device may be set to any
value between 0° and 337.5° in 22.5° increments using the
CFG2 pin as shown in Tables 24 and 25.
27
CURRENT SENSE
DCR
CURRENT
SENSE
DCR
RDS
FN6906.5
December 19, 2013
ZL6105
The phase offset of (multi-phase) current sharing devices is
automatically set to a value between 0° and 337.5° in 22.5°
increments as described in “Phase Spreading” on page 27.
The phase offset of each device may also be set to any value
between 0° and 360° in 22.5° increments via the I2C/SMBus
interface. Refer to Application Note AN2033 for further details.
Output Sequencing
A group of Digital-DC devices may be configured to power up in a
predetermined sequence. This feature is especially useful when
powering advanced processors, FPGAs, and ASICs that require
one supply to reach its operating voltage prior to another supply
reaching its operating voltage in order to avoid latch-up from
occurring. Multi-device sequencing can be achieved by
configuring each device through the I2C/SMBus interface or by
using Zilker Labs patented autonomous sequencing mode.
Autonomous sequencing mode configures sequencing by using
events transmitted between devices over the DDC bus. This mode
is not available on current sharing rails.
The sequencing order is determined using each device’s SMBus
address. Using autonomous sequencing mode (configured using
the CFG1 pin), the devices must be assigned sequential SMBus
addresses with no missing addresses in the chain. This mode will
also constrain each device to have a phase offset according to its
SMBus address as described in “Phase Spreading” on page 27.
The sequencing group will turn on in order starting with the
device with the lowest SMBus address and will continue through
to turn on each device in the address chain until all devices
connected have been turned on. When turning off, the device
with the highest SMBus address will turn off first followed in
reverse order by the other devices in the group.
Fault Spreading
Digital-DC devices can be configured to broadcast a fault event
over the DDC bus to the other devices in the group. When a nondestructive fault occurs and the device is configured to shut down
on a fault, the device will shut down and broadcast the fault
event over the DDC bus. The other devices on the DDC bus will
shut down together or in sequencing order if configured to do so,
and will attempt to re-start in their prescribed order if configured
to do so.
Temperature Monitoring Using the XTEMP Pin
The ZL6105 supports measurement of an external device
temperature using either a thermal diode integrated in a
processor, FPGA or ASIC, or using a discrete diode-connected
2N3904 NPN transistor. Figure 16 illustrates the typical
connections required.
XTEMP
100 pF
ZL
2N3904
SGND
Discrete NPN
XTEMP
ZL
100pF
SGND
µP
FPGA
DSP
ASIC
Embedded Thermal Diode
FIGURE 16. EXTERNAL TEMPERATURE MONITORING
Sequencing is configured by connecting a resistor from the CFG1
pin to ground as described in Table 26. The CFG1 pin is also used
to set the configuration of the SYNC pin as well as to determine
the sequencing method and order. Please refer to “Switching
Frequency and PLL” on page 15 for more details on the operating
parameters of the SYNC pin.
Active Current Sharing
Multiple device sequencing may also be achieved by issuing PMBus
commands to assign the preceding device in the sequencing chain as
well as the device that will follow in the sequencing chain. This method
places fewer restrictions on SMBus address (no need of sequential
address) and also allows the user to assign any phase offset to any
device irrespective of its SMBus device address.
Figure 17 illustrates a typical connection for three devices.
The Enable pins of all devices in a sequencing group must be tied
together and driven high to initiate a sequenced turn-on of the
group. Enable must be driven low to initiate a sequenced turnoff
of the group.
Droop resistance is used to add artificial resistance in the output
voltage path to control the slope of the load line curve,
calibrating out the physical parasitic mismatches due to power
train components and PCB layout. A minimum droop resistance
of 0.5mΩ is recommended.
Refer to Application Note AN2033 for details on sequencing via
the I2C/SMBus interface.
28
Paralleling multiple ZL6105 devices can be used to increase the
output current capability of a single power rail. By connecting the
DDC pins of each device together and configuring the devices as
a current sharing rail, the units will share the current equally
within a few percent.
The ZL6105 uses a low-bandwidth, first-order digital current
sharing technique to balance the unequal device output loading
by aligning the load lines of member devices to a reference
device.
FN6906.5
December 19, 2013
ZL6105
TABLE 26. SEQUENCING PIN-STRAP AND RESISTOR SETTINGS
RCFG1
SYNC PIN CONFIG
LOW
Input
OPEN
Auto detect
HIGH
Output
10kΩ
Input
11kΩ
Auto detect
12.1kΩ
Output
14.7kΩ
Input
16.2kΩ
Auto detect
17.8kΩ
Output
21.5 kΩ
Input
23.7kΩ
Auto detect
26.1kΩ
Output
31.6kΩ
Input
34.8kΩ
Auto detect
38.3kΩ
Output
SEQUENCING CONFIGURATION
NLR TIMEOUT AND
BLANKING
Sequencing is disabled.
1 and 4
Sequencing is disabled.
The ZL6105 is configured as the first device in a nested sequencing group. Turn on
order is based on the device SMBus address.
1 and 4
46.4kΩ
Input
51.1kΩ
Auto detect
56.2kΩ
Output
68.1kΩ
Input
75kΩ
Auto detect
82.5kΩ
Output
100kΩ
Input
110 kΩ
Auto detect
121kΩ
Output
147kΩ
Input
162kΩ
Auto detect
178kΩ
Output
The ZL6105 is configured as a last device in a nested sequencing group. Turn on order
is based on the device SMBus address.
The ZL6105 is configured as the middle device in a nested sequencing group. Turn on
order is based on the device SMBus address.
Sequencing is disabled.
The ZL6105 is configured as the first device in a nested sequencing group. Turn on
order is based on the device SMBus address.
2 and 8
The ZL6105 is configured as a last device in a nested sequencing group. Turn on order
is based on the device SMBus address.
The ZL6105 is configured as the middle device in a nested sequencing group. Turn on
order is based on the device SMBus address.
VIN
3.3V - 5V
CIN
DDC
ZL
COUT
VREFERENCE
VOUT
-R
CIN
DDC
ZL
VMEMBER
-R
VOUT
COUT
CIN
DDC
I MEMBER
ZL
COUT
I OUT
I REFERENCE
FIGURE 18. ACTIVE CURRENT SHARING
FIGURE 17. CURRENT SHARING GROUP
29
FN6906.5
December 19, 2013
ZL6105
Upon system start-up, the device with the lowest member
position as selected in ISHARE_CONFIG is defined as the
reference device. The remaining devices are members. The
reference device broadcasts its current over the DDC bus. The
members use the reference current information to trim their
voltages (VMEMBER) to balance the current loading of each device
in the system.
Figure 18 shows that, for load lines with identical slopes, the
member voltage is increased towards the reference voltage
which closes the gap between the inductor currents.
The relation between reference and member current and voltage
is given by Equation 37:
VMEMBER = VOUT + R × (I REFERENCE − I MEMBER )
(EQ. 37)
TABLE 28. CURRENT SHARE PIN-STRAP SETTINGS
CFG0 Pin
NLR
LOW
1.5%
OPEN
Disabled
HIGH
2%
CURRENT SHARE #
OF MEMBERS
CURRENT
SHARING
0
Disabled
TABLE 29. CURRENT SHARE RESISTOR SETTINGS
RCFG0
(kΩ)
NLR
CURRENT SHARE #
OF MEMBERS
10
2
11
3
The ISHARE_CONFIG command is used to configure the device
for active current sharing. The default setting is a stand-alone
non-current sharing device. A current sharing rail can be part of a
system sequencing group.
12.1
4
14.7
6
For fault configuration, the current share rail is configured in a
quasi-redundant mode. In this mode, when a member device
fails, the remaining members will continue to operate and
attempt to maintain regulation. Of the remaining devices, the
device with the lowest member position will become the
reference. If fault spreading is enabled, the current share rail
failure is not broadcast until the entire current share rail fails.
16.2
7
17.8
8
19.6
0
21.5
2
23.7
3
where R is the value of the droop resistance.
When Auto Compensation is enabled, only two (2) devices can be
configured for current sharing. With Auto Compensation
disabled, up to eight (8) devices can be configured in a given
current sharing rail.
TABLE 27. CURRENT SHARE POSITION SETTINGS
13.3
26.1
28.7
Disabled
3%
5
5
31.6
6
34.8
7
38.3
8
42.2
0
CURRENT SHARE
POSITION
10
0
46.4
2
11
1
51.1
3
12.1
2
56.2
13.3
3
14.7
4
16.2
61.9
DCR
2%
5
6
5
75
7
17.8
6
82.5
8
19.6
7
90.9
0
42.2
0
100
2
46.4
1
110
3
51.1
2
121
56.2
3
61.9
4
68.1
133
RDS
Enabled
Disabled
Enabled
Disabled
4
5
147
6
5
162
7
75
6
178
8
82.5
7
30
Disabled
4
68.1
1.5%
Enabled
4
RCFG2
(kΩ)
CURRENT SENSE
CURRENT
SHARING
Enabled
FN6906.5
December 19, 2013
ZL6105
The phase offset of a current sharing group is automatically set
to a value between 0° and 337.5° in 22.5° increments as
follows:
Phase Offset = (SMBus Address[4:0] – Current Share
Position) * 22.5°
(EQ. 38)
The phase of the individual members in a group are spread
evenly from the phase offset of the group.
Please refer to Application Note AN2034 for additional details on
current sharing.
Phase Adding/Dropping
The ZL6105 allows multiple power converters to be connected in
parallel to supply higher load currents than can be addressed
using a single-phase design. In doing so, the power converter is
optimized at a load current range that requires all phases to be
operational. During periods of light loading, it may be beneficial
to disable one or more phases in order to eliminate the current
drain and switching losses associated with those phases,
resulting in higher efficiency.
The ZL6105 offers the ability to add and drop phases using a the
phase enable pin or a PMBus command in response to an
observed load current change. All phases in a current share rail
are considered active prior to the current sharing rail ramp to
power-good.
Phases can be dropped after power-good is reached. The phase
enable pin can be used to drop and add phases:
• Set PH_EN = 0 to drop a phase
• Set PH_EN = 1 to add a phase
The time to detect a change of state of the phase enable pin is
between 0ms and 3ms (max).
Any member of the current sharing rail can be dropped. Any
change to the number of members of a current sharing rail will
precipitate autonomous phase distribution within the rail where
all active phases realign their phase position based on their order
within the number of active members.
If the members of a current sharing rail are forced to shut down
due to an observed fault, all members of the rail will attempt to
re-start simultaneously after the fault has cleared.
For single phase operation, that is, not current sharing, the
PH_EN pin is ignored and can be left open.
Monitoring via I2C/SMBus
A system controller can monitor a wide variety of different
ZL6105 system parameters through the I2C/SMBus interface.
The device can monitor for fault conditions by monitoring the
SALRT pin, which will be pulled low when any number of preconfigured fault conditions occur.
The device can also be monitored continuously for any number of
power conversion parameters including but not limited to the
following:
• Internal and external temperature
• Switching frequency
• Duty cycle
The PMBus Host should respond to SALRT as follows:
1. ZL device pulls SALRT low.
2. PMBus Host detects that SALRT is now low, performs
transmission with Alert Response Address to find which ZL
device is pulling SALRT low.
3. PMBus Host talks to the ZL device that has pulled SALRT low.
The actions that the host performs are up to the System
Designer.
If multiple devices are faulting, SALRT will still be low after doing
the above steps and will require transmission with the Alert
Response Address repeatedly until all faults are cleared.
Please refer to Application Note AN2033 for details on how to
monitor specific parameters via the I2C/SMBus interface.
Snapshot Parameter Capture
The ZL6105 offers a special feature that enables the user to
capture parametric data during normal operation or following a
fault. The Snapshot functionality is enabled by setting Bit 1 of
MISC_CONFIG to 1.
See AN2033 for details on using the Snapshot in addition to the
parameters supported.
The Snapshot feature enables the user to read status and
parameters via a block read transfer through the SMBus. This can
be done during normal operation, although it should be noted that
reading the 22 bytes will occupy the SMBus for some time.
The SNAPSHOT_CONTROL command enables the user to store
the snapshot parameters to Flash memory in response to a
pending fault as well as to read the stored data from Flash
memory after a fault has occurred. Table 30 describes the usage
of this command. Automatic writes to Flash memory following a
fault are triggered when any fault threshold level is exceeded,
provided that the specific fault’s response is to shut down
(writing to Flash memory is not allowed if the device is configured
to re-try following the specific fault condition). It should also be
noted that the device’s VDD voltage must be maintained during
the time when the device is writing the data to Flash memory; a
process that requires between 700µs to 1400µs depending on
whether the data is set up for a block write. Undesirable results
may be observed if the device’s VDD supply drops below 3.0V
during this process.
TABLE 30. SNAPSHOT_CONTROL COMMAND
DATA
VALUE
DESCRIPTION
1
Copies current SNAPSHOT values from Flash memory to
RAM for immediate access using SNAPSHOT command.
2
Writes current SNAPSHOT values to Flash memory. Only
available when device is disabled.
• Input voltage/Output voltage
• Output current
31
FN6906.5
December 19, 2013
ZL6105
In the event that the device experiences a fault and power is lost, the
user can extract the last SNAPSHOT parameters stored during the
fault by writing a 1 to SNAPSHOT_CONTROL (transfers data from
Flash memory to RAM) and then issuing a SNAPSHOT command
(reads data from RAM via SMBus).
Non-Volatile Memory and Device Security
Features
The ZL6105 has internal non-volatile memory where user
configurations are stored. Integrated security measures ensure
that the user can only restore the device to a level that has been
made available to them. Refer to “Start-up Procedure” on
page 13 for details on how the device loads stored values from
internal memory during start-up.
During the initialization process, the ZL6105 checks for stored
values contained in its internal non-volatile memory. The ZL6105
offers two internal memory storage units that are accessible by
the user as follows:
1. Default Store: A power supply module manufacturer may
want to protect the module from damage by preventing the
user from being able to modify certain values that are related
to the physical construction of the module. In this case, the
module manufacturer would use the Default Store and would
allow the user to restore the device to its default setting but
would restrict the user from restoring the device to the factory
settings.
2. User Store: The manufacturer of a piece of equipment may
want to provide the ability to modify certain power supply
settings while still protecting the equipment from modifying
values that can lead to a system level fault. The equipment
manufacturer would use the User Store to achieve this goal.
Please refer to Application Note AN2033 for details on how to set
specific security measures via the I2C/SMBus interface.
32
FN6906.5
December 19, 2013
ZL6105
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev.
DATE
December 19, 2013
REVISION
CHANGE
FN6906.5 Sentence after Equation 29 on page 19 changed from “The value of R2 should be simply 5x that of R1 as shown in
Equation 30:” to “The value of R2 should be 2kΩ”. Equation was deleted.
July 30, 2013
ISENA pin. The voltage rating changed from: -1.5V to 6.5V, to: -1.5V to 30V.
Changed the 6.5V to 30V on page 7 Absolute Maximum Ratings
October 15, 2012
FN6906.4 Changed POD from L36.6x6A to L36.6x6C - change in side view MAX from 0.90 to 1.00
October 1, 2012
Removed all references to ZL6105-01, page 5, Ordering Information
December 15, 2010
FN6906.3 In “Voltage Margining” on page 25, in the 2nd paragraph, changed the last sentence from "A safety feature prevents
the user from configuring the output voltage to exceed VNOM + 10% under any conditions." to "The ZL6105-01 allows
150% margin limits."
Added following parts to “Ordering Information” on page 6:
ZL6105ALAF-01
ZL6105ALAFT-01
ZL6105ALAFTK-01
Updated note in MIN, MAX column of spec table from "Parameters with MIN and/or MAX limits are 100% tested
at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production
tested." to "Compliance to datasheet limits is assured by one or more methods: production test, characterization
and/or design."
Removed note "Limits established by characterization and are not production tested." and all references to it.
December 8, 2010
FN6906.2 Added following statement to disclaimer on page 34: “This product is subject to a license from Power One, Inc.
related to digital power technology as set forth in U.S. Patent No. 7,000,125 and other related patents owned by
Power One, Inc. These license rights do not extend to stand-alone POL regulators unless a royalty is paid to Power
One, Inc.”
September 20, 2010
FN6906.1 -Added a second sentence ("A minimum droop resistance of 0.5mΩ is recommended.") to “Active Current
Sharing” on page 28
-On page 21, in Equation 31, changed "δ" to "Δ".
-Added “Limits established by characterization and are not production tested.” to “Soft-start Delay Duration
Range” on page 8, “Soft-start Ramp Duration Range” on page 8 and “VTRK Regulation Accuracy” on page 8.
-Removed PG and SALRT from Conditions column of “Logic Input Leakage Current” on page 8.
September 14, 2010
-Added Table 8 “MINIMUM TON DELAY vs OPERATING MODE”
-Added the following paragraph to page 14:
"The ZL6105 has a minimum TON_DELAY requirement ... See Application Note AN2033 for details."
-Changed LOW delay time from "2" to "5" in Table 6 on page 14
-Removed first three rows (10, 11, and 12.1 rows) from Table 7 on page 14
-Rewrote paragraph directly above Figure 13 on page 21 (“When auto compensation is enabled ... as described
in “Soft-Start Delay and Ramp Times” on page 14")
-Changed min “Soft-start Delay Duration Range” on page 8 from 2 to 5 and 0.002 to 0.005
-Reworded Note 15 on page 9
-Changed Step 5 Description in Table 5 on page 14
-Replaced Step 5 Time Duration entry in Table 5 on page 14 with a dash (“-”)
-Rewrote paragraph on page 13 (“Once this process is completed...to ramp its output”)
-Replaced Table 16 “FC0 PIN-STRAP SETTINGS” on page 21
-Replaced Table 17 “FC1 PIN-STRAP SETTINGS” on page 22
-Rewrote the last three paragraphs of “Loop Compensation” on page 21
-Added third paragraph to “Power-Good” on page 15 (“If Auto Comp is enabled, the PG timing is further controlled
by the PG Assert parameter as described “Loop Compensation” on page 21.”)
-Added sentence to Note 17 on page 9 ("Refer to “Soft-Start Delay and Ramp Times” on page 14 for further
restrictions on PG Delay.")
-In“Soft-start Delay Duration Accuracy” on page 8, in the Conditions, changed both references to Note 16 to be
Note 15. Removed Note 16.
-Rewrote first paragraph of “Configuration B: SYNC INPUT” on page 15
-Rewrote first three paragraphs of “Configuration C: SYNC AUTO DETECT” on page 15
-Added sentence just before Table 23 on page 26 (“Note that the SMBus address 0x4B is reserved for device test
and cannot be used in the system.”)
33
FN6906.5
December 19, 2013
ZL6105
Revision History
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you
have the latest Rev. (Continued)
DATE
August 5, 2010
REVISION
CHANGE
FN6906.1 On page 1, 1st sentence, changed "The ZL6105 is a digital DC/DC controller …" to "The ZL6105 is a digital power
(Cont.)
controller …"
On page 1, 2nd paragraph, end of 1st sentence, changed from "… 3.3V to a supply operating from a 12V input."
to "… 3.3V to a multiphase current sharing supply operating from a 12V input."
On page 3, Figure 3, added arrow head to line going into pin 34 (PH_EN)
On page 3, Note 3, 3rd sentence, corrected the ohm symbol after 10k,which was missing.
On page 6, Note 1, corrected "pindependents" to "pin dependents"
On page 8, “VTRK Tracking Ramp Accuracy”, in the conditions column, added "no prebias"
On page 9, Typ entry in table for “Current Limit Protection Delay” (condition factory default): changed from 5 to 10
On page 9, Note 15 at bottom of table, 3rd sentence, corrected from "Current Share Reference must be 10ms
…", to "Current Share Reference delay must be 10ms …"
On page 13, corrected the font size for title “SMBus Mode” (to be the same font as the title “Single Resistor Output
Voltage Setting Mode”)
On page 14, 1st column, 2nd paragraph, “Soft-Start Delay and Ramp Times”, removed last two sentences,
"Precise ramp delay timing … AN2033 for details."
August 4, 2010
May 17, 2010
On page 30, 2nd column, 3rd paragraph, changed from "Up to eight (8) devices can be configured in a given
current sharing rail." to "When Auto Compensation is enabled, only two (2) devices can be configured for current
sharing. With Auto Compensation disabled, up to eight (8) devices can be configured in a given current sharing
rail."
FN6906.0 Initial Release
About Intersil
Intersil Corporation is a leader in the design and manufacture of high-performance analog, mixed-signal and power management
semiconductors. The company's products address some of the largest markets within the industrial and infrastructure, personal
computing and high-end consumer markets. For more information about Intersil, visit our website at www.intersil.com.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting
www.intersil.com/en/support/ask-an-expert.html. Reliability reports are also available from our website at
http://www.intersil.com/en/support/qualandreliability.html#reliability
For additional products, see www.intersil.com/en/products.html
Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
34
FN6906.5
December 19, 2013
ZL6105
Package Outline Drawing
L36.6x6C
36 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 4/10
4X 4.0
6.00
36X 0.50
A
B
28
6
PIN 1
INDEX AREA
36
6
PIN #1
INDEX AREA
27
6.00
1
4 .10 ± 0.10
9
19
(4X)
0.15
18
10
TOP VIEW
36X 0.60 ± 0.10
36X 0.25 4
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
MAX 1.00
C
0.08 C
( 5. 60 TYP )
( 36 X 0 . 50 )
SIDE VIEW
(
4. 10 )
(36X 0.25 )
C
( 36X 0.80 )
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
JEDEC reference drawing: MO-220VJJD.
either a mold or mark feature.
35
FN6906.5
December 19, 2013