DATASHEET To request the full datasheet, please visit www.intersil.com/products/isl78600 Multi-Cell Li-Ion Battery Manager ISL78600 Features The ISL78600 Li-ion battery manager IC supervises up to 12 series connected cells. The part provides accurate monitoring, cell balancing and extensive system diagnostics functions. Three cell balancing modes are incorporated: Manual Balance mode, Timed Balance mode, and Auto Balance mode. The auto balance mode terminates balancing functions when a charge transfer value specified by the host microcontroller has been met. • Up to 12-cell voltage monitors, support Li-ion CoO2, Li-ion Mn2O4, and Li-ion FePO4 chemistries The ISL78600 communicates to a host microcontroller via an SPI interface and to other ISL78600 devices using a robust, proprietary, two-wire Daisy Chain system. • Cell voltage scan rate of 19.5µs per cell (234µs to scan 12 cells) The ISL78600 is offered in a 64 Ld TQFP package and is specified for operation at a temperature range of -40°C to +105°C. • Cell voltage measurement accuracy ±2.5mV • 13-bit cell voltage measurement • Pack voltage measurement accuracy ±100mV • 14-bit pack voltage and temperature measurements • Internal and external temperature monitoring • Up to four external temperature inputs • Robust Daisy Chain communications system • Integrated system diagnostics for all key internal functions Applications • Hybrid Electric Vehicle (HEV), Plug-in Hybrid Electric Vehicle (PHEV) and Electric Vehicle (EV) battery packs • Electric motorcycle battery packs • Backup battery and energy storage systems requiring high accuracy management and monitoring • Hardwired and communications based fault notification • Integrated watchdog shuts down device if communication is lost • 7µA shutdown current: Enable = VSS • 2Mbps SPI • Portable and semiportable equipment TO OTHER DEVICES (OPTIONAL) ISL78600 ISL78600 VG2 VG2 VG1 VG1 DHi2 DLo2 DHi2 DHi1 DLo2 DLo1 SCLK DOUT DIN CS DATA READY HOST MICRO FAULT EN VG1 VG1 MONITOR BOARD (Master or Stand-alone) VG2 MONITOR BOARD (Daisy Chain - Optional) FIGURE 1. TYPICAL APPLICATION January 20, 2015 FN7672.6 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC. 2012-2015. All Rights Reserved Intersil is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL78600 Table of Contents Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin Configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Typical Performance Curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 About Intersil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Submit Document Feedback 2 FN7672.6 January 20, 2015 ISL78600 Ordering Information PART NUMBER (Notes 1, 2, 3, 4) PART MARKING TRIM VOLTAGE, VNOM (V) TEMP. RANGE (°C) PACKAGE (Pb-Free) 3.3 -40 to +105 64 Ld TQFP ISL78600ANZ ISL78600ANZ ISL78600/601EVAL1Z Evaluation Board for ISL78600 PKG. DWG. # Q64.10x10D NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For more information on handling and processing moisture sensitive devices, please see Techbrief TB363. 4. For other trim options, please contact Intersil Automotive Marketing. Pin Configuration VC10 CB11 VC11 CB12 VC12 VBAT VBAT NC DHi2 DLo2 NC SCLK/DHi1 CS/DLo1 NC DIN/NC DOUT/NC 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 ISL78600 (64 LD 10x10 TQFP) TOP VIEW VC4 12 37 DNC CB4 13 36 V3P3 VC3 14 35 V2P5 CB3 15 34 VCC VC2 16 33 REF Submit Document Feedback 3 32 BASE VDDEXT 38 31 DNC 11 NC 39 CB5 30 VC5 29 COMMS SELECT 2 ExT4 40 10 TEMPREG 9 28 CB6 27 COMMS SELECT 1 NC COMMS RATE 1 41 ExT3 42 8 26 7 VC6 25 CB7 NC COMMS RATE 0 ExT2 DGND 43 24 44 6 ExT1 5 VC7 23 CB8 22 FAULT NC 45 VSS 4 21 VC8 20 DATA READY VC0 EN 46 VSS 47 3 19 2 CB9 18 VC9 VC1 DNC CB1 48 17 1 CB2 CB10 FN7672.6 January 20, 2015 ISL78600 Pin Descriptions SYMBOL VC0, VC1, VC2, VC3, VC4, VC5, VC6, VC7, VC8, VC9, VC10, VC11, VC12 PIN NUMBER DESCRIPTION 20, 18, 16, Battery cell voltage inputs. VCn connects to the positive terminal of CELLn and the negative terminal of 14, 12, 10, 8, CELLn+1. (VC12 connects only to the positive terminal of CELL12 and VC0 only connects with the negative 6, 4, 2, 64, terminal of CELL1.) 62, 60 19, 17, 15, Cell Balancing FET control outputs. Each output controls an external FET which provides a current path CB1, CB2, CB3, CB4, CB5, CB6, CB7, CB8, CB9, CB10, 13, 11, 9, 7, around the cell for balancing. 5, 3, 1, 63, 61 CB11, CB12 VBAT 58, 59 Main IC Supply pins. Connect to the most positive terminal in the battery string. VSS 21, 22 Ground. These pins connect to the most negative terminal in the battery string. ExT1, ExT2, ExT3, ExT4 24, 26, 28, 30 External temperature monitor or general purpose inputs. The temperature inputs are intended for use with external resistor networks using NTC type thermistor sense elements but may also be used as general purpose analog inputs at the user’s discretion. 0V to 2.5V input range. TEMPREG 29 Temperature monitor voltage regulator output. This is a switched 2.5V output which supplies a reference voltage to external NTC thermistor circuits to provide ratiometric ADC inputs for temperature measurement. VDDEXT 32 External V3P3 supply input/output. Connected to the V3P3 pin via a switch, this pin may be used to power external circuits from the V3P3 supply. The switch is open when the ISL78600 is placed in Sleep mode. REF 33 2.5V voltage reference decoupling pin. Connect a 2.0µF to 2.5µF X7R capacitor to VSS. Do not connect any additional external load to this pin. VCC 34 Analog supply voltage input. Connect to V3P3 via a 33Ω resistor. Connect a 1µF capacitor to ground. V2P5 35 Internal 2.5V digital supply decoupling pin. Connect a 1µF capacitor to DGND. V3P3 36 3.3V digital supply voltage input. Connect the emitter of the external NPN regulator transistor to this pin. Connect a 1µF capacitor to DGND. BASE 38 DNC 37, 39, 48 Regulator control pin. Connect the external NPN transistor’s base. Do not let this pin float. COMMS SELECT 1 41 Communications port 1 mode select pin. Connect via a 1kΩ resistor to V3P3 for Daisy Chain communications on port 1 or to DGND for SPI operation on port 1. COMMS SELECT 2 40 Communications port 2 mode select pin. Connect via a 1kΩ resistor to V3P3 to enable port 2 or to DGND to disable this port. COMMS RATE 0, COMMS RATE 1 43, 42 Daisy Chain communications data rate setting. Connect via a 1kΩ resistor to DGND (‘0’) or to V3P3 (‘1’) to select between various communication data rates. Do not connect. Leave pins floating. DGND 44 Digital Ground. FAULT 45 Logic fault output. Asserted low if a fault condition exists. DATA READY 46 SPI data ready. Asserted low when the device is ready to transmit data to the host microcontroller. EN 47 Enable input. Tie to V3P3 to enable the part. Tie to DGND to disable (all IC functions are turned off). DOUT/NC 49 Serial Data Output (SPI) or NC (Daisy Chain). 0V to 3.3V push-pull output. DIN/NC 50 Serial Data Input (SPI) or NC (Daisy Chain). 0V to 3.3V input. CS/DLo1 52 Chip-Select, active low 3.3V input (SPI) or Daisy Chain port 1 Lo connection. SCLK/DHi1 53 Serial-Clock Input (SPI) or Daisy Chain port 1 Hi connection. DHi2 56 Daisy Chain port 2 Hi connection. DLo2 55 NC 23, 25, 27, 31, 51, 54, 57 Submit Document Feedback 4 Daisy Chain port 2 Lo connection. No internal connection. FN7672.6 January 20, 2015 ISL78600 Block Diagram DHI 2 DLO 2 CONTROL LOGIC AND COMMUNICATIONS VBAT VC12 CB12 VC11 CB11 VC10 CB10 VC9 INPUT BUFFER/LEVEL SHIFT AND FAULT DETECTION CB9 CB8 VC7 CB7 VC6 CB6 VC5 CB5 VC4 SPI COMMS CS/DLO 1 DIN DOUT DATA READY COMMS RATE 1 COMMS RATE 0 COMMS SELECT 2 COMMS SELECT 1 DGND FAULT EN BASE VREG V3P3 VDDEXT V2P5 V2P5 VCC VREF MUX CB4 DAISY CHAIN AND REF VC MUX VC8 SCLK/DHI 1 VC3 ADC CB3 TEMPREG VC2 TEMP MUX IC TEMP VC1 CB1 VC0 ExT1 ExT2 ExT3 ExT4 VSS Submit Document Feedback REFERENCE CB2 5 FN7672.6 January 20, 2015 ISL78600 Absolute Maximum Ratings Thermal Information Unless otherwise specified. With respect to VSS. Thermal Resistance (Typical) θJA(C/W) θJC(C/W) 64 Ld TQFP Package (Notes 5, 6) . . . . . . . 49 9 Max Continuous Package Power Dissipation . . . . . . . . . . . . . . . . . .400mW Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C Max Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . .+125°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . Refer to JEDEC J STD 020D DIN, SCLK, CS, DOUT, DATA READY, COMMS SELECT n, ExTn, TEMPREG, REF, V3P3, VCC, FAULT, COMMS RATE n, BASE, EN, VDDEXT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.2V to 4.1V V2P5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.2V to 2.9V VBAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 63V Dhi1, DLo1, DHi2, DLo2 . . . . . . . . . . . . . . . . . . . . . . .-0.5V to (VBAT + 0.5V) VC0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +9.0V VC1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +18V VC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +18V VC3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +27V VC4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +27V VC5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +36V VC6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +36V VC7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +45V VC8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +45V VC9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +54V VC10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +63V VC11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +63V VC12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +63V VCn (for n = 0 to 12). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to VBAT +0.5V CBn (for n = 1 to 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to VBAT +0.5V CBn (for n = 1 to 9) . . . . . . . . . . . . . . . . . . . . . . . . V(VCn-1) -0.5V to V(VCn-1) +9V CBn (for n = 10 to 12). . . . . . . . . . . . . . . . . . . . . . . . . V(VCn) -9V to V(VCn) +0.5V Current into VCn, VBAT, VSS (Latch-up Test) . . . . . . . . . . . . . . . . . . ±100mA ESD Rating Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 2kV Capacitive Discharge Model (Tested per JESD22-C101D). . . . . . . . 500V Latch-up (Tested per JESD-78B; Class 2, Level A) . . . . . . . . . . . . . . 100mA Recommended Operating Conditions TA, Ambient Temperature Range . . . . . . . . . . . . . . . . . . . .-40°C to +105°C VBAT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V to 60V VBAT (Daisy Chain Operation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10V to 60V VCn (for n = 1 to 12) . . . . . . . . . . . . . . . . . . . . . . . . . . . .V(VCn-1) to V(VCn-1) + 5V VC0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.1V to 0.1V CBn (for n = 1 to 9) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V(VCn-1) to V(VCn-1) + 9V CBn (for n = 10 to 12). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V(VCn) -9V to V(VCn) DIN, SCLK, CS, COMMS SELECT 1, COMMS SELECT 2, V3P3, VCC, COMMS RATE 0, COMMS RATE 1, EN. . . . . . . . . . . . . . . . . . . . . . .0V to 3.6V ExT1, ExT2, ExT3, ExT4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to 2.5V NOTE: DOUT, DATA READY, and FAULT are digital outputs and should not be driven from external sources. V2P5, REF, TEMPREG and BASE are analog outputs and should not be driven from external sources. CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 5. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. For JC, the “case temp” location is taken at the package top center. Electrical Specifications PARAMETER VBAT = 6 to 60V, TA = -20°C to +60°C, unless otherwise specified. SYMBOL Power-Up Condition Threshold VPOR Power-Up Condition Hysteresis VPORhys TEST CONDITIONS VBAT voltage (rising) MIN (Note 7) TYP MAX (Note 7) UNITS 4.8 5.1 5.6 V 400 mV Initial Power-Up Delay tPOR Time after VPOR condition VREF from 0V to 0.95 x VREF(nom) (EN tied to V3P3) Device can now communicate 27.125 ms Enable Pin Power-Up Delay tPUD Delay after EN = 1 to VREF from 0V to 0.95 x VREF(nom) (VBAT = 39.6V) - Device can now communicate 27.125 ms Submit Document Feedback 6 FN7672.6 January 20, 2015 ISL78600 Electrical Specifications VBAT = 6 to 60V, TA = -20°C to +60°C, unless otherwise specified. (Continued) PARAMETER SYMBOL VBAT Supply Current IVBAT TEST CONDITIONS MIN (Note 7) TYP MAX (Note 7) UNITS Non Daisy Chain configuration. Device enabled. No communications, ADC, measurement, balancing or open wire detection activity. 6V 7 35 80 µA 39.6V 0 64 241 µA 60V 0 90 250 µA -40°C to +105°C (Note 9) 0 280 µA IVBATMASTER Daisy Chain configuration – master device. Enabled. No communications, ADC, measurement, balancing or open wire detection activity. 6V 400 530 660 µA 39.6V 500 680 900 µA 60V 550 750 1000 µA -40°C to +105°C (Note 9) 1150 Peak current when Daisy Chain transmitting IVBATMID 18 Daisy Chain configuration – MIDDLE stack device. Enabled. No communications, ADC, measurement, balancing or open wire detection activity. 6V 700 1020 1210 µA 39.6V 900 1250 1560 µA 60V 1000 1400 1700 µA -40°C to +105°C (Note 9) 1850 Peak current when Daisy Chain transmitting IVBATTOP 18 6V 400 530 660 µA 39.6V 500 680 900 µA 60V 550 750 1000 µA -40°C to +105°C (Note 9) IVBATSLEEP1 Sleep mode (EN = 1, Daisy Chain configuration) (Note 9) 6V 1150 18 18 23 µA 39.6V 18 23 29 µA 60V 20 25 30 µA 41 µA 16 µA 70 µA IVBATSLEEP2 Sleep mode (EN = 1, Stand-alone, non-Daisy Chain) (Note 9) -40°C to +105°C 3.5 8 3 IVBATSHDN Shutdown. device “off” (EN = 0) (Daisy Chain and Non-Daisy Chain configurations) (Note 9) 6V 1.5 7 15.5 39.6V µA 3 7 18 60V 5 7 23 µA -40°C to +105°C 1 77 µA 8 µA 17 µA IVBATΔSLEEP EN = 1, Daisy Chain Sleep Mode configuration. VBAT (Note 9) current difference between any two devices operating at the same temperature and supply voltage. -40°C to +105°C 7 µA mA 14 -40°C to +105°C Submit Document Feedback µA mA Daisy Chain configuration – top device. Enabled. No communications, ADC, measurement, balancing or open wire detection activity. Peak Current when Daisy Chain transmitting VBAT Supply Current Tracking. Sleep Mode. µA mA 0 0 4 µA FN7672.6 January 20, 2015 ISL78600 Electrical Specifications VBAT = 6 to 60V, TA = -20°C to +60°C, unless otherwise specified. (Continued) PARAMETER SYMBOL VBAT Incremental Supply Current, Balancing IVBATBAL TEST CONDITIONS All balancing circuits on. Incremental current: Add to nonbalancing VBAT current. VBAT = 39.6V -40°C to +105°C (Note 9) V3P3 Regulator Voltage (Normal) V3P3N EN = 1, Load current range 0 to 5mA. VBAT = 39.6V -40°C to +105°C (Note 9) V3P3 Regulator Voltage (Sleep) V3P3S EN = 1, Load current range. No load. (SLEEP). VBAT = 39.6V -40°C to +105°C (Note 9) V3P3 Regulator Control Current IBASE Current sourced from BASE output. VBAT = 6V -40°C to +105°C (Note 9) V3P3 Supply Current IV3P3 Device Enabled No measurement activity, Normal Mode -40°C to +105°C (Note 9) VREF Reference Voltage VREF VDDEXT Switch Resistance RVDDEXT IVCC TYP MAX (Note 7) UNITS 250 300 350 µA 200 300 400 µA 3.25 3.35 3.45 V 3.5 V 2.95 V 3.05 V 3.2 2.45 Switch “On” resistance, VBAT = 39.6V Device enabled (EN = 1). Stand-Alone or Daisy Configuration. No ADC or Daisy Chain communications active. -40°C to +105°C (Note 9) 1 Device enabled (EN = 1). Sleep mode. VBAT = 39.6V IVCCSHDN Device disabled (EN = 0). Shutdown mode. 1.5 mA 1 0.8 mA 1 0.8 1.2 mA 1.3 mA 2.5 8 12 5 2.0 3.25 2.0 V 17 Ω 22 Ω 4.5 mA 5.0 mA 6.0 IVCCACTIVE1 Device enabled (EN = 1). Stand-Alone or Daisy Configuration. Average current during 16ms Scan Continuous operation. VBAT = 39.6V IVCCSLEEP 2.7 2.4 EN = 1, No Load, Normal Mode -40°C to +105°C (Note 9) VCC Supply Current MIN (Note 7) mA 2.4 0 1.2 -40°C to +105°C (Note 9) µA 4.1 µA 9.0 µA 5 V MEASUREMENT SPECIFICATIONS Cell Voltage Input Measurement Range Cell Monitor Voltage Resolution VCELL VCELLRES ISL78600 Initial Cell Monitor Voltage Error (Note 10) VNOM = nominal calibration voltage. Note: Cell measurement accuracy figures assume a fixed 1kΩ resistor is placed in series with each VCn pin (n = 0 to 12). VCELL VC(n) - VC(n-1). For Design Reference. [VC(n)-VC(n-1)] LSB step size (13-bit signed number), 5V full scale value mV -2.5 2.5 VCELL = VNOM - 0.7V < VCELL < VNOM + 0.7V -3.5 3.5 mV VCELL = 4.95 -10 10 mV VCELL = 0.5 -15 15 mV VCELL = VNOM - 0.7V < VCELL < VNOM + 0.7V -40°C to +85°C (Note 9) -9.5 9.0 mV -26.5 26.5 mV -11 11 mV -26.5 26.5 mV -18 18 mV -37 37 mV VCELL = 4.95, -40°C to +85°C (Note 9) -40°C to +105°C (Note 9) VCELL = 0.5, -40°C to +85°C (Note 9) -40°C to +105°C (Note 9) 8 0.61 VCELL = VNOM - 0.3V < VCELL < VNOM + 0.3V -40°C to +105°C (Note 9) Submit Document Feedback 0 mV FN7672.6 January 20, 2015 ISL78600 Electrical Specifications VBAT = 6 to 60V, TA = -20°C to +60°C, unless otherwise specified. (Continued) PARAMETER MIN (Note 7) TYP VC0 ≥ 0.5 and VC0 ≤ 4.0V -1.5 -1 VC0 > 4.0V -1.75 SYMBOL Cell Input Current. IVCELL Note: Cell accuracy figures assume a fixed 1kΩ resistor is placed in series with each VCn pin (n = 0 to 12) TEST CONDITIONS MAX (Note 7) UNITS VC0 Input -0.5 µA -0.5 µA -2.0 -1 -0.5 µA VCn - VC(n-1) ≥ 0.5 and VCn-VC(n-1) ≤ 4.0V -2.7 -2 -1.3 µA VCn - VC(n-1) > 4.0V -2.85 -1.0 µA -40°C to +105°C (Note 9) -3.0 -2 -0.84 µA VCn - VC(n-1) ≥ 0.5 and VCn-VC(n-1) ≤ 4.0V -0.6 0 0.71 µA VCn - VC(n-1) > 4.0V -0.8 1.15 µA -40°C to +105°C (Note 9) VC1, VC2, VC3 Inputs VC4 Input -40°C to +105°C (Note 9) - 0.84 0 1.31 µA VCn - VC(n-1) < 2.6V 0.5 2 2.7 µA VCn - VC(n-1) ≥ 2.6V and VCn-VC(n-1) ≤ 4.0V 1.32 2 2.89 µA VCn - VC(n-1) > 4.0V 1.16 2 3.33 µA -40°C to +105°C (Note 9) 0.5 2 3.43 µA VC12 - VC11 ≥ 0.5 and VC12-VC11 ≤ 4.0V 0.37 1 1.85 µA VC12 - VC11 > 4.0V 0.19 2.3 µA -40°C to +105°C (Note 9) 0.15 2.47 µA VC5, VC6, VC7, VC8, VC9, VC10, VC11 Inputs VC12 Input VBAT Monitor Voltage Resolution VBATRES Initial VBAT monitor Voltage Error (Note 10) VBAT ADC resolution referred to input (VBAT) level. 14-bit unsigned number. Full scale value = 79.67V. 1 4.863 mV Measured at VBAT = 36V to 43.2V -100 100 mV Measured at VBAT = 31.2V to 48V -125 125 mV Measured at VBAT = 31.2V to 59.4V -250 250 mV Measured at VBAT = 6V to 59.4V -320 332 mV Measured at VBAT = 6V to 59.4V -40°C to +105°C (Note 9) -490 490 mV External Temperature Monitoring Regulator VTEMP Voltage on TEMPREG output. (0 to 2mA load) 2.475 2.5 2.525 V External Temperature Output Impedance RTEMP Output Impedance at TEMPREG pin. (Note 9) 0 0.1 0.2 Ω Effective ExTn input voltage range. For design reference. This is the input voltage range that does not trigger an open input condition. 0 2344 mV External Temperature Input Range VEXT External Temperature Input Pull-up REXTTEMP Pull-up resistor to VTEMPREG applied to each input during measurement External Temperature Input Offset VEXTOFF External Temperature Input INL VEXTINL VBAT = 39.6V VBAT = 39.6V, -40°C to +105°C (Note 9) External Temperature Input Gain Error VEXTG (Note 9) Error at 2.5V input -40°C to +105°C (Note 9) Internal Temperature Monitor Error Submit Document Feedback VINTMON 9 10 -7.0 MΩ 7.0 mV -10 10 mV -0.65 0.65 mV -7.5 11 mV -13.4 19.3 mV ±10 °C FN7672.6 January 20, 2015 ISL78600 Electrical Specifications VBAT = 6 to 60V, TA = -20°C to +60°C, unless otherwise specified. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN (Note 7) TYP MAX (Note 7) UNITS Internal Temperature Monitor Resolution TINTRES Output resolution (LSB/°C). 14-bit number. 31.9 LSB/°C Internal Temperature Monitor Output TINT25 Output count at +25°C 9180 Decimal Balance stops and auto scan stops. Temperature rising or Falling. 150 °C OVER-TEMPERATURE PROTECTION SPECIFICATIONS Internal Temperature Limit Threshold TINTSD External Temperature Limit Threshold TXT Corresponding to 0V (min) and VTEMPREG (max) External temperature input voltages higher than 15/16 VTEMPREG are registered as open input faults. 0 16383 Decimal Undervoltage Threshold VUV Programmable. Corresponding to 0V (min) and 5V (max) 0 8191 Decimal Overvoltage Threshold VOV Programmable. Corresponding to 0V (min) and 5V (max) 0 8191 Decimal V3P3 Power-good Window V3PH 3.3V power-good window high threshold. VBAT = 39.6V 3.99 V 4.05 V 2.64 2.71 V 2.8 V 2.7 2.766 V 2.77 V 2.08 V 2.14 V 3.9 V 4.0 V 2.8 V FAULT DETECTION SYSTEM SPECIFICATIONS -40°C to +105°C (Note 9) V3PL 3.3V power-good window low threshold. VBAT = 39.6V V2PH 2.5V power-good window high threshold. VBAT = 39.6V -40°C to +105°C (Note 9) V2P5 Power-good Window -40°C to +105°C (Note 9) VCC Power-good Window V2PL (Note 9) 2.5V power-good window low threshold. VBAT = 39.6V VVCCH VCC power-good window high threshold. VBAT = 39.6V -40°C to +105°C -40°C to +105°C (Note 9) VVCCL VCC power-good window low threshold. VBAT = 39.6V VRPH VREF power-good window high threshold. VBAT = 39.6V -40°C to +105°C (Note 9) VREF Power-good Window -40°C to +105°C (Note 9) VRPL VREF power-good window low threshold. VBAT = 39.6V VREF Reference Accuracy Test VRACC VREF value calculated using stored coefficients. VBAT = 39.6V Voltage Reference Check Timeout tVREF Oscillator Check Timeout Oscillator Check Filter Time -40°C to +105°C (Note 9) 3.79 3.89 3.7 2.57 2.5 2.62 2.616 1.96 2.02 1.90 3.6 3.74 3.6 2.6 2.7 2.55 2.525 2.7 2.525 2.15 2.30 2.0 2.85 V 2.9 V 2.9 V 2.465 V 2.5 V 2.500 V Time to check voltage reference value from power-on, enable or wakeup 20 ms tOSC Time to check main oscillator frequency from power-on, enable or wakeup 20 ms tOSCF Minimum duration of fault required for detection 100 ms CELL OPEN WIRE DETECTION Open Wire Current IOW ISCN bit = 0; VBAT = 39.6V 0.125 0.15 0.185 mA ISCN bit = 1; VBAT = 39.6V 0.85 1.0 1.15 mA Open Wire Detection Time tOW Open wire current source “on” time Open VC0 Detection Threshold VVC0 CELL1 negative terminal (with respect to VSS) VBAT = 39.6V (Note 9) 1.2 1.5 1.8 V Open VC1 Detection Threshold VVC1 CELL1 positive terminal (with respect to VSS) VBAT = 39.6V (Note 9) 0.6 0.7 0.8 V Submit Document Feedback 10 4.6 ms FN7672.6 January 20, 2015 ISL78600 Electrical Specifications VBAT = 6 to 60V, TA = -20°C to +60°C, unless otherwise specified. (Continued) PARAMETER SYMBOL TEST CONDITIONS Primary Detection Threshold, VC2 to VC12 VVC2_12P V(VC(n - 1))-V(VCn), n = 2 to 12 VBAT = 39.6V (Note 9) Secondary Detection Threshold, VC2 to VC12 VVC2_12S Via ADC. VC2 to VC12 only VBAT = 39.6V (Note 9) MIN (Note 7) TYP MAX (Note 7) UNITS -2 -1.5 0 V -100 -30 50 mV Open VBAT Fault Detection Threshold VVBO VC12 - VBAT 200 mV Open VSS Fault Detection Threshold VVSSO VSS - VC0 250 mV Cell Sample Time Start Time to sample the first cell (CELL12) following CS going High. Scan voltages command 65 71.5 µs Cell Sample Time Duration Time to scan all 12 cells (sample of CELL12 to sample of CELL1) scan voltages command. 233 257 µs Scan Voltages Processing Time Time from start of scan to registers loaded to DATA READY going low 770 847 µs Scan Temperatures Processing Time Time from start of scan to registers loaded to DATA READY going low 2690 2959 µs Scan Mixed Processing Time Time from start of scan to registers loaded to DATA READY going low 830 913 µs Scan Wires Processing Time Time from start of scan to registers loaded to DATA READY going low 59.4 65.3 ms Scan All Processing Time Time from start of scan to registers loaded to DATA READY going low 63.2 69.5 ms Measure Cell Voltage Processing Time Time from start of measurement to register(s) loaded to DATA READY going low 180 198 µs Measure VBAT Voltage Processing Time Time from start of measurement to register(s) loaded to DATA READY going low 130 143 µs Measure Internal Temperature Processing Time Time from start of measurement to register(s) loaded to DATA READY going low 110 121 µs Measure External Temperature Input Processing Time Time from start of measurement to register(s) loaded to DATA READY going low 2520 2772 µs Measure Secondary Voltage Reference Time Time from start of measurement to register(s) loaded to DATA READY going low 2520 2772 µs MEASUREMENT FUNCTION TIMING (Note 8) CELL BALANCE OUTPUT SPECIFICATIONS Cell Balance Pin Output Impedance RCBL CBn output off impedance between CB(n) to VC(n-1): cells 1 to 9, and between CB(n) to VC(n): cells 10 to 12 3 4 5 MΩ Cell Balance Output Current ICBH1 CBn output on. (CB1-CB9); VBAT = 39.6V; device sinking current -28 -25 -21 μA ICBH2 CBn output on. (CB10-CB12); VBAT = 39.6V; device sourcing current 21 25 28 μA ICBSD EN = GND. VBAT = 39.6V -500 10 700 nA CBn Output on; External 320kΩ between VCn and CBn (n = 10 to 12) and between CBn and VCn-1 (n = 1 to 9) 7.04 8.0 8.96 V ICB = 100µA 8.94 Cell Balance Output Leakage in Shutdown External Cell Balance FET Gate Voltage Internal Cell Balance Output Clamp VGS VCBCL V LOGIC INPUTS: SCLK, CS, DIN Low Level Input Voltage Submit Document Feedback VIL 11 0.8 V FN7672.6 January 20, 2015 ISL78600 Electrical Specifications VBAT = 6 to 60V, TA = -20°C to +60°C, unless otherwise specified. (Continued) PARAMETER SYMBOL High Level Input Voltage TEST CONDITIONS VIH Input Hysteresis VHYS Input Current IIN Input Capacitance (Note 9) CIN MIN (Note 7) TYP MAX (Note 7) 1.75 (Note 9) 0V < VIN < V3P3 UNITS V 100 mV -1 +1 µA 10 pF 0.3*V3P3 V LOGIC INPUTS: EN, COMMS SELECT1, COMMS SELECT2, COMMS RATE 0, COMMS RATE 1 Low Level Input Voltage VIL High Level Input Voltage VIH Input Hysteresis VHYS Input Current IIN Input Capacitance (Note 9) CIN (Note 9) 0V < VIN < V3P3 0.7*V3P3 V 0.05*V3P3 V -1 +1 µA 10 pF LOGIC OUTPUTS: DOUT, FAULT, DATA READY Low Level Output Voltage High Level Output Voltage VOL1 At 3mA sink current 0 0.4 V VOL2 At 6mA sink current 0 0.6 V VOH1 At 3mA source current V3P3 – 0.4 V3P3 V VOH2 At 6mA source current V3P3 – 0.6 V3P3 V 2 MHz 200 ns SPI INTERFACE TIMING - See Figures 1 and 2. SCLK Clock Frequency fSCLK Pulse Width of Input Spikes Suppressed 50 tIN1 Enable Lead Time tLEAD Chip select low to ready to receive clock data 200 ns Clock High Time tHIGH (Note 9) 200 ns Clock Low Time tLOW (Note 9) 200 ns tLAG Last data read clock edge to Chip Select high (Note 9) 250 ns Minimum high time for CS between bytes 200 ns Enable Lag Time CHIP SELECT High Time tCS:WAIT Slave Access Time tA Chip Select low to DOUT active. (Note 9) 200 ns Data Valid Time tV Clock low to DOUT valid 350 ns 240 ns Data Output Hold Time (Note 9) tHO Data hold time after falling edge of SCLK DOUT Disable Time tDIS DOUT disabled following rising edge of CS (Note 9) Data Setup Time tSU Data input valid prior to rising edge of SCLK 100 ns Data Input Hold Time tHI Data input to remain valid following rising edge of SCLK 80 ns 100 DATA READY Start Delay Time tDR:ST Chip select high to DATA READY low. (Note 9) DATA READY Stop Delay Time tDR:SP Chip select high to DATA READY high. (Note 9) DATA READY High Time tDR:WAIT SPI Communications Timeout tSPI:TO Time between bytes. (Note 9) Time the CS remains high before SPI communications time out - requiring the start of a new command 0 ns ns 750 0.6 ns µs 100 µs DOUT Rise Time tR Up to 50pF load 30 ns DOUT Fall Time tF Up to 50pF load 30 ns Submit Document Feedback 12 FN7672.6 January 20, 2015 ISL78600 Electrical Specifications VBAT = 6 to 60V, TA = -20°C to +60°C, unless otherwise specified. (Continued) PARAMETER SYMBOL MIN (Note 7) TEST CONDITIONS TYP MAX (Note 7) UNITS DAISY CHAIN COMMUNICATIONS INTERFACE: DHi1, DLo1, DHi2, DLo2 Daisy Chain Clock Frequency Comms Rate (0, 1) = 11 450 500 550 kHz Comms Rate (0, 1) = 10 225 250 275 kHz Comms Rate (0, 1) = 01 112.5 125 137.5 kHz Comms Rate (0, 1) = 00 56.25 62.5 68.75 kHz VBAT/2 Common Mode Reference Voltage V NOTES: 7. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 8. Scan and Measurement start times are synchronised by the receiver to the falling edge of the 24th clock pulse (Daisy Chain systems) or to the falling edge of the 16th clock pulse (non-Daisy Chain, single device systems) of the Scan or Measure command. Clock pulses are at the SCLK pin for Master and Stand-alone devices, and at the DHi/DLo1 pins for middle and top Daisy Chain devices. Maximum values are based on characterization of the internal clock and are not 100% tested. 9. These MIN and/or MAX values are based on characterization data and are not 100% tested. 10. Stresses may be induced in the ISL78600 during soldering or other high temperature events that affect measurement accuracy. Initial accuracy does not include effects due to this. See Figure 4B for cell reading accuracy obtained after soldering to Intersil evaluation boards. When soldering the ISL78600 to a customized circuit board with a layout or construction significantly differing from the Intersil evaluation board, design verification tests should be applied to determine drift due to soldering and over lifetime. Timing Diagrams CS (FROM µC) tSPI:TO tLEAD tHIGH tLOW tCS:WAIT tLAG SCLK (FROM µC) tA tV tF tDIS tHO DOUT (TO µC) tSU tR tHI DIN (FROM µC) CLOCK DATA INTO ISL78600 CLOCK DATA OUT OF ISL78600 FIGURE 1. SPI FULL DUPLEX (4-WIRE) INTERFACE TIMING Submit Document Feedback 13 FN7672.6 January 20, 2015 ISL78600 CS (FROM µC) tCS:WAIT tSPI:TO tDR:ST tDR:WAIT tDR:SP DATA READY (TO µC) SCLK (FROM µC) tA DOUT (TO µC) CLOCK DATA OUT OF ISL78600 SIGNALS ON DIN IGNORED WHILE DATA READY IS LOW DIN (FROM µC) CLOCK DATA INTO ISL78600 FIGURE 2. SPI HALF DUPLEX (3-WIRE) INTERFACE TIMING 20 40 15 30 READING ERROR (mV) READING ERROR (mV) Typical Performance Curves 10 5 0 -5 -10 -15 -20 20 10 0 -10 -20 -30 -40 0 1 2 3 4 5 CELL VOLTAGE (V) FIGURE 3A. CELL VOLTAGE READING ERROR FROM -20°C TO +60°C Submit Document Feedback 14 -50 0 1 2 3 4 5 CELL VOLTAGE (V) FIGURE 3B. CELL VOLTAGE READING ERROR FROM -40°C to +105°C FN7672.6 January 20, 2015 ISL78600 Typical Performance Curves (Continued) 35 PERCENTAGE OF CELLS (%) PERCENTAGE OF CELLS (%) 50 40 30 20 10 0 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0 30 25 20 15 10 5 0 0.5 1.0 1.5 2.0 2.5 3.0 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 READING ERROR (mV) READING ERROR (mV) FIGURE 4B. CELL READING ERROR FROM 114 EVALUATION BOARDS AT 3.3V, +25°C HISTOGRAM FIGURE 4A. INITIAL CELL VOLTAGE ACCURACY AT 3.3V, +25°C HISTOGRAM 600 400 400 READING ERROR (mV) READING ERROR (mV) 300 200 100 0 -100 -200 0 -200 -400 -300 -400 200 0 10 20 30 40 50 -600 60 0 10 PACK VOLTAGE (V) 40 50 60 FIGURE 5B. PACK VOLTAGE READING ERROR FROM -40°C TO +105°C 4 NORMALIZED VARIATIONS (%) 35 30 PERCENTAGE (%) 30 PACK VOLTAGE (V) FIGURE 5A. PACK VOLTAGE READING ERROR FROM -20°C TO +60°C 25 20 15 10 5 0 20 -50 -40 -30 -20 -10 0 10 20 30 40 50 READING ERROR (mV) FIGURE 6. INITIAL PACK VOLTAGE ACCURACY AT 39.6V, +25°C HISTOGRAM Submit Document Feedback 15 -20°C 3 2 -40°C 1 0 +105°C +85°C -1 -2 +60°C -3 +25°C -4 -5 0 10 20 30 40 50 60 PACK VOLTAGE (V) FIGURE 7. IC TEMPERATURE ERROR vs PACK VOLTAGE FN7672.6 January 20, 2015 ISL78600 Typical Performance Curves (Continued) 0.5 1.00 0.50 0.3 BGVREF ACCURACY (mV) BGVREF ACCURACY (mV) 0.4 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.50 -1.00 -1.50 -2.00 -2.50 -0.4 -0.5 0.00 6 15 24 33 42 51 -3.00 60 -40 -20 0 VBAT (V) 20 40 60 80 100 TEMPERATURE ( °C ) FIGURE 8. VOLTAGE REFERENCE CHECK FUNCTION vs PACK VOLTAGE (AT +25°C) FIGURE 9. VOLTAGE REFERENCE CHECK FUNCTION vs TEMPERATURE (VBAT = 39.6) 0 25.60 -0.05 BALANCE CURRENT (µA) VREF SHIFT (mV) -0.10 -0.15 -0.20 -0.25 -0.30 -0.35 -0.40 25.55 25.50 25.45 -0.45 -0.50 0 100 200 300 400 500 600 700 800 25.40 900 1000 HOURS AT +125°C FIGURE 10. VREF SHIFT OVER HTOL 10 20 30 40 PACK VOLTAGE (V) 50 60 FIGURE 11. BALANCE CURRENT vs PACK VOLTAGE 25.6 157 VCELL = 3.3V 156 25.4 25.0 24.8 24.6 154 153 152 151 24.4 24.2 -40 VCELL = 3.3V 155 25.2 IOPWI (µA) BALANCE CURRENT (µA) 0 150 -20 0 20 40 60 80 TEMPERATURE (°C) FIGURE 12. BALANCE CURRENT vs TEMPERATURE Submit Document Feedback 16 100 149 -40 -20 0 20 40 60 80 100 TEMPERATURE (°C) FIGURE 13. OPEN WIRE TEST CURRENT vs TEMPERATURE (150µA SETTING) FN7672.6 January 20, 2015 ISL78600 Typical Performance Curves (Continued) 970 158.0 VCELL = 3.3V 965 IOPWI (µA) IOPWI (µA) 157.5 960 955 157.0 950 156.5 945 940 -40 -20 0 20 40 60 80 156.0 100 0 10 20 TEMPERATURE (°C) 50 60 0.4 1000 0.2 ERROR (%) 950 IOPWI (µA) 40 FIGURE 15. OPEN WIRE TEST CURRENT vs PACK VOLTAGE (150µA SETTING) FIGURE 14. OPEN WIRE TEST CURRENT vs TEMPERATURE (1mA SETTING) 900 850 800 30 PACK VOLTAGE (V) 0 -0.2 -0.4 0 10 20 30 40 PACK VOLTAGE (V) 50 -0.6 2.7 60 2.9 3.1 3.3 3.5 3.7 VCC (V) FIGURE 16. OPEN WIRE TEST CURRENT vs PACK VOLTAGE (1mA SETTING) FIGURE 17. 4MHz OSCILLATOR ERROR vs VCC 1 1 0 0 -2 ERROR (%) ERROR (%) -1 -3 -4 -1 -2 -3 -5 -4 -6 -7 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FIGURE 18. 4MHz OSCILLATOR ERROR vs TEMPERATURE Submit Document Feedback 17 -5 -40 -20 0 20 40 60 TEMPERATURE (°C) 80 100 120 FIGURE 19. 32kHz OSCILLATOR ERROR vs TEMPERATURE FN7672.6 January 20, 2015 ISL78600 Typical Performance Curves (Continued) 0.4 19 17 0.2 VBAT = 60V 0 IVBAT (µA) ERROR (%) 15 -0.2 13 VBAT = 39.6V 11 VBAT = 6V 9 -0.4 7 -0.6 2.7 2.9 3.1 3.3 3.5 5 -60 3.7 -40 -20 FIGURE 20. 32kHz OSCILLATOR ERROR vs VCC 60 80 100 120 33 VBAT = 60V (MASTER) 31 29 29 27 27 IVBAT (µA) 31 25 23 21 VBAT = 39.6V (MASTER) 19 15 -60 -40 -20 0 20 40 60 VBAT = 60V (TOP) VBAT = 39.6V (TOP) 25 23 21 80 100 VBAT = 6V (TOP) 19 VBAT = 6V (MASTER) 17 17 15 -60 120 -40 -20 TEMPERATURE ( °C ) 0 20 40 60 80 100 120 TEMPERATURE ( °C ) FIGURE 21B. PACK VOLTAGE SLEEP CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V (DAISY CHAIN MODE) FIGURE 21C. PACK VOLTAGE SLEEP CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V (DAISY CHAIN MODE) 35 120 33 VBAT = 60V 100 31 VBAT = 39.6V (MID) 29 80 27 IVBAT (µA) IVBAT (µA) 40 35 33 25 20 FIGURE 21A. PACK VOLTAGE SLEEP CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V (STANDALONE MODE) 35 IVBAT (µA) 0 TEMPERATURE ( °C ) VCC (V) VBAT = 60V (MID) 23 60 40 21 19 VBAT = 6V 20 17 15 -60 VBAT = 39.6V VBAT = 6V (MID) -40 -20 0 20 40 60 80 100 120 TEMPERATURE ( °C ) FIGURE 21D. PACK VOLTAGE SLEEP CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V (DAISY CHAIN MODE) Submit Document Feedback 18 0 -60 -40 -20 0 20 40 60 80 100 120 TEMPERATURE ( °C ) FIGURE 22A. PACK VOLTAGE SUPPLY CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V (STANDALONE MODE) FN7672.6 January 20, 2015 ISL78600 Typical Performance Curves (Continued) 1500 850 VBAT = 60V (TOP) 800 VBAT = 60V (MID) 1400 750 1300 IVBAT (µA) IVBAT (µA) 700 650 VBAT = 39.6V (TOP) 600 550 1200 1000 500 VBAT = 6V (MID) VBAT = 6V (TOP) 900 450 400 -60 -40 -20 0 20 40 60 TEMPERATURE ( °C ) 80 100 800 -60 120 -40 -20 0 12 750 80 100 120 VBAT = 6V (STAND-ALONE) 11 IVBAT (µA) 700 650 VBAT = 39.6V (MASTER) 600 550 500 10 9 8 VBAT = 39.6V (STAND-ALONE) 7 VBAT = 6V (MASTER) 450 6 400 -60 5 -60 -40 -20 0 20 40 60 80 100 120 VBAT = 60V (STAND-ALONE) -40 -20 0 20 40 60 80 TEMPERATURE ( °C ) TEMPERATURE ( °C ) FIGURE 22D. PACK VOLTAGE SUPPLY CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V (DAISY CHAIN MASTER) 100 120 140 FIGURE 23A. PACK VOLTAGE SHUTDOWN CURRENT vs TEMPERATURE (EN = 0) AT 6V, 39.6V, 60V 13 13 VBAT = 60V (MASTER) 12 12 11 11 10 10 IVBAT (µA) IVBAT (µA) 60 13 VBAT = 60V (MASTER) 800 9 VBAT = 39.6V (MASTER) VBAT = 60V (MID) 9 VBAT = 39.6V (MID) 8 7 7 VBAT = 6V (MASTER) 6 5 -60 40 FIGURE 22C. PACK VOLTAGE SUPPLY CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V (DAISY CHAIN MIDDLE) 850 8 20 TEMPERATURE ( °C ) FIGURE 22B. PACK VOLTAGE SUPPLY CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V (DAISY CHAIN TOP) IVBAT (µA) VBAT = 39.6V (MID) 1100 -40 -20 0 20 40 60 80 TEMPERATURE (°C) 100 120 140 FIGURE 23B. VBAT SHUTDOWN CURRENT vs TEMPERATURE (EN = 0) AT 6V, 39.6V, 60V Submit Document Feedback 19 VBAT = 6V (MID) 6 5 -60 -40 -20 0 20 40 60 80 TEMPERATURE (°C) 100 120 140 FIGURE 23C. VBAT VOLTAGE SHUTDOWN CURRENT vs TEMPERATURE (EN = 0) AT 6V, 39.6V, 60V FN7672.6 January 20, 2015 ISL78600 Typical Performance Curves (Continued) 13 3.50 3.45 12 VBAT = 60V (TOP) 3.40 3.35 10 9 IVCC (mA) IVBAT (µA) 11 VBAT = 39.6V (TOP) 8 3.25 3.20 3.15 7 VBAT = 6V (TOP) 3.10 6 5 -60 3.30 3.05 -40 -20 0 20 40 60 80 3.00 -60 100 120 140 -40 -20 0 TEMPERATURE (°C) FIGURE 23D. VBAT VOLTAGE SHUTDOWN CURRENT vs TEMPERATURE (EN = 0) AT 6V, 39.6V, 60V 60 80 100 120 2.5 2.0 CELL INPUT CURRENT (µA) 1.05 SUPPLY CURRENT (mA) 40 FIGURE 24. VCC SUPPLY CURRENT vs TEMPERATURE AT 6V, 39.6V, 60V 1.06 1.04 39.6V 1.03 60V 1.02 6V 1.01 1.00 0.99 -40 20 TEMPERATURE ( °C ) VCELL = 3.3V 1.5 0 20 40 60 80 100 VC5 VC10 1.0 0 VC7 VC9 VC6 VC4 -0.5 -1.0 VC0 -1.5 -2.5 -40 VC3 -20 VC2 0 VC1 20 40 60 TEMPERATURE (°C) TEMPERATURE (°C) FIGURE 25. V3P3 SUPPLY CURRENT vs TEMPERATURE VC8 VC12 0.5 -2.0 -20 VC11 80 100 120 FIGURE 26. CELL INPUT CURRENT vs TEMPERATURE CELL INPUT CURRENT (µA) 2.5 2.0 VC11 VC10 VC9 1.5 VC8 VC7 1.0 VC6 VC5 0.5 VC12 VC4 0.0 -0.5 VC0 -1.0 -1.5 VC3 -2.0 VC2 VC1 -2.5 0 10 20 30 40 PACK VOLTAGE (V) 50 60 FIGURE 27. CELL INPUT CURRENT vs PACK VOLTAGE (+25°C) Submit Document Feedback 20 FN7672.6 January 20, 2015 ISL78600 About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support For additional products, see www.intersil.com/en/products.html Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com Submit Document Feedback 21 FN7672.6 January 20, 2015 ISL78600 Package Outline Drawing Q64.10x10D 64 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE Rev 2, 9/12 12.00 4 5 10.00 D 3 12.00 A 10.00 4 5 B 0.50 3 4X 0.20 C A-B D TOP VIEW 4X 11/13° 0.20 H A-B D BOTTOM VIEW 1.20 MAX 0.05 / / 0.10 C C SIDE VIEW 7 0.08 SEE DETAIL "A" 0° MIN. H 3 0.08 M C A-B D WITH LEAD FINISH 0.22 ±0.05 0.09/0.20 2 1.00 ±0.05 0.05/0.15 0.09/0.16 0.08 R. MIN. 0.20 MIN. 0.20 ±0.03 BASE METAL DETAIL "A" SCALE: NONE 0.25 0-7° GAUGE PLANE 0.60 ±0.15 (1.00) NOTES: 1. All dimensioning and tolerancing conform to ANSI Y14.5-1982. 2. Datum plane H located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and D to be determined at centerline between leads where leads exit plastic body at datum plane H. 4. Dimensions do not include mold protrusion. Allowable mold protrusion is 0.254mm. 5. These dimensions to be determined at datum plane H. 6. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 7. Does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm total at maximum material condition. Dambar cannot be located on the lower radius or the foot. 8. Controlling dimension: millimeter. 9. This outline conforms to JEDEC publication 95 registration MS-026, variation ACD. 10. Dimensions in ( ) are for reference only. Submit Document Feedback 22 FN7672.6 January 20, 2015