Appendix E pad dimensions standard soldering pad dimensions Type WK73 RK73 SG73 RN73 RN73H SR73 LT73 NT73 PT72 LA73 RF73 KL73 HV73 LP73 SDT73 SL/TSL SLN CCP CCF LPC D Component Size A B C D 2B 1.6 X 3.2 0.7 2.3 3.2 0.8 2H 2.5 X 5.0 1.0 35 5.0 1.25 2J 3.1 X 4.6 1.6 3.9 4.75 1.15 3A 3.1 X 6.4 1.6 3.9 6.4 1.15 1F 0.4 X 0.2 0.12 0.48 0.18 0.18 1H 0.6 X 0.3 0.25 0.7 0.3 0.225 1E 1.0 X 0.5 0.5 1.3 0.3 0.4 1J 1.6 X 0.8 1.0 2.0 0.6 0.5 2A 2.0 X 1.25 1.3 2.5 1.05 0.6 2B 3.2 X 1.6 2.2 4.0 1.4 0.9 2E 3.2 X 2.5 2.2 4.0 2.3 0.9 2H 5.0 X 2.5 3.3 6.1 2.3 1.4 3A 6.4 X 3.2 4.6 8.0 3.0 1.7 07 5.0 X 2.5 2.3 7.0 2.6 2.35 2B, 2BW 1 6.3 X 3.1 3.4 8.0 3.0 2.3 2-3 11.5 X 7.0 5.4 15.0 5.0 4.8 2/3 11.5 X 7.0 5.0 15.0 6.0 5.0 2E 3.2 X 2.5 2.2 5.0 2.0 1.4 2B 3.2 x 1.6 2.2 5.0 1.4 1.4 1N 6.0 X 2.5 3.0 7.2 2.8 2.1 1F 6.0 X 2.5 3.2 8.8 5.0 2.8 4.5 X 4.0 1.5 5.1 3.5 4.5 X 4.2 1.9 5.5 2.6 1.8 4545 4.1 X 4.6 2.9 5.3 4.7 3.0 1.2 __ 9.0 X 4.8 4.0 2.6 C B Soldering Pad Chip Component Type Component Size A B C D 1E 1.0 X 0.5 0.2 1.3 0.6 0.55 2A 2.0 X 1.25 0.5 2.5 1.3 1.0 2B, 2BW (1mΩ) 3.2 X 1.6 0.8 4.0 1.8 1.6 (2mΩ~20mΩ) 3.2 X 1.6 1.4 4.0 1.8 1.3 2H, 2HW (1mΩ) 5.0 X 2.5 1.0 6.1 3.0 2.55 5.0 X 2.5 1.3 6.1 3.0 2.4 (7mΩ~10mΩ) 5.0 X 2.5 3.3 6.1 3.0 1.4 3A(1mΩ) 6.35 X 3.18 1.45 7.55 3.83 3.05 3A(2mΩ) 6.35 X 3.18 3.45 7.55 3.83 2.05 3A(3mΩ) 6.35 X 3.18 2.45 7.55 3.83 2.70 3A(4mΩ) 6.35 X 3.18 3.45 7.55 3.83 2.05 6.35 X 3.18 1.45 7.55 3.83 3.05 6.35 X 3.18 3.45 7.55 3.83 2.05 6.35 X 3.18 4.40 7.55 3.83 1.575 6.35 X 3.18 0.80 7.55 3.83 3.375 6.35 X 3.18 1.45 7.55 3.83 3.05 6.35 X 3.18 1.05 7.55 3.83 3.25 6.35 X 3.18 1.45 7.55 3.83 3.05 6.35 X 3.18 3.45 7.55 3.83 2.05 (9mΩ~10mΩ) 6.35 X 3.18 4.40 7.55 3.83 1.575 2H, 2HW (2mΩ~6mΩ) 2H, 2HW 3AW TLR (1mΩ~4mΩ) 9040E 9.0 X 4.8 4.0 2.6 3.0 10065 10.0 X 10.4 5.0 13.0 6.0 4.0 12065 12 X 12.4 5.0 15.0 7.5 5.0 KL 32 3.2 X 2.5 2.2 5.0 2.0 1.4 KQT 0402 1.0 X 0.5 0.46 1.18 0.66 0.36 0603 1.6 X 1.0 0.64 1.92 1.02 0.64 0805 2.0 X 1.5 0.76 2.8 1.78 1.02 1008 2.5 X 2.2 1.27 3.31 2.54 (2mΩ) 1E 0.50 X 0.10 0.4 1.6 0.6 1.02 __ 1J 0.80 X 1.6 0.55 2.6 0.94 __ (3mΩ~4mΩ) 2A 1.25 X 2.0 0.66 3.0 1.45 __ 3AP (5mΩ~8mΩ) KQC CZB CZP MHL appendix & add. information SDR TF 2B 1.6 X 3.2 1.5 4.4 1.8 __ 0603,0604 5.6 X 4.5 1.7 6.0 5.8 __ 0805 7.5 X 7.5 2.4 7.8 8.0 2.7 1006 9.5 X 9.5 2.8 10.0 10.0 3.6 10 1.0 X 0.5 0.5 1.3 0.3 0.4 16 1.6 X 0.8 1.0 2.0 0.6 0.5 Dimensions millimeters Style __ KQ A C 1.8 4235 9040N A B Dimensions millimeters Style 4045 LPC 9040N Flat Type Components The optimum soldering pad dimensions may differ depending on soldering conditions, however, the following land dimensions are generally recommended. 3AW (5mΩ~8mΩ) 3AW (9mΩ~10mΩ) 3AP (0.5~0.82mΩ) 3AP (1mΩ) 3AP 3AP 3AP 2A 2.0 X 1.25 0.5 2.5 1.3 1.0 3AW 6.3 X 3.2 4.4 7.5 3.7 1.55 UR73 1E 1.0 X 0.5 0.5 1.8 0.5 0.65 UR73D 1J 1.6 X 0.8 0.5 2.5 0.9 TLRH Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 316 1.0 7/08/15 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com Appendix E pad dimensions standard soldering pad dimensions (continued) The optimum soldering pad dimensions may differ depending on soldering conditions, however, the following land dimensions are generally recommended. Flat Type Components B D Type A Dimensions millimeters Style Component Size A B C D 2A 2.0 X 1.25 0.8 3.4 1.3 1.3 2B 3.2 X 1.6 1.2 4.6 1.8 1.7 (10mΩ~30mΩ) 5.0 X 2.5 1.8 6.1 2.6 2.5 UR73 2H UR73D (33mΩ~100mΩ) 5.0 X 2.5 3.3 6.1 2.5 1.4 Soldering Pad 6.4 X 3.2 2.3 8.0 3.3 1.7 Chip Component (33mΩ~100mΩ) 6.4 X 3.2 4.6 8.0 3.0 1.7 1H 0.6 X 0.3 1E 1.0 X 0.5 0.51 1.73 0.51 0.61 1J 1.6 X 0.8 1.0 3.0 1.2 1.0 2A 2.0 X 1.25 1.2 4.0 1.0 1.4 2H 3A (10mΩ~30mΩ) 3A NV73 NV73DL SDS PS SLF 0.25-0.35 0.65-0.95 0.25-0.35 0.2-0.3 2B 3.2 X 1.6 2.2 5.0 1.3 1.4 2E 3.2 X 2.5 2.2 5.0 2.2 1.4 2J 4.5 X 3.2 3.0 5.8 2.9 1.4 2L 5.7 X 5.0 4.5 7.5 4.7 1.5 NV73DS C 2L 6.1 X 5.1 4.5 7.5 4.7 1.5 0804 0805 8.0 X 10.5 5.7 10.5 2.2 2.4 1003 1005 10.0 X 12.7 7.3 13.3 2.8 3.0 0908 9.5 X 10.5 10.3 14.7 9.0 2.2 1205 1206 1208 12.7 X 12.7 6.0 14.0 7.0 4.0 B(0.75mΩ) 10.0 X 8.4 2.8 10.7 8.9 3.95 B(1mΩ) 10.0 X 8.4 3.8 10.7 8.9 3.95 B(0.2mΩ) 10.0 X 8.4 2.2 10.8 9.0 4.30 I 10.0 X 5.2 5.6 11.0 6.2 2.7 E 6.4 X 6.4 1.4 7.6 7.0 3.1 SLF 0905 –– 9.5 3.74 2.0 1.2 LCM 1060 10 X 10 5.6 10.7 3.2 2.5 A C C D B D surface mount inductor—SDR Style SDR0603, SDR0604 SDR0805 SDR1006 SDR0906 Pad 1 1 1 2 A 1.7 2.4 2.8 14.7 B 6.0 7.8 10.0 10.3 SDR Pad 1 C 5.8 8.0 10.0 2.2 D 2.15 2.7 3.6 1.0 E –– –– –– 2.5 These pad dimensions are only for standard pattern and the characteristics are not guaranteed, which you are suggested to confirm before use. D A Pad 2 C B B C D D C E Soldering pad Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. A 11/25/14 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com 317 appendix & add. information Dimensions millimeters Appendix E pad dimensions CSR L current sense resistor—CSR G F Dimensions inches (mm) Type L .393 CSR1 (10.0) .472 CSR2 (12.0) W A B C D E F G .236 (6.0) .314 (8.0) .039 (1.0) .062 (1.6) .078 (2.0) .125 (3.2) .196 (5.0) .236 (6.0) .062 (1.6) .086 (2.2) .118 (3.0) .208 (5.3) .078 (2.0) .090 (2.3) .039 (1.0) .045 (1.15) W E B A D resistor arrays—CN C Dimensions Type Style Component Size W L* 0.8 0.6 1.4 1H2N 1H4N 1E2K 0.5 X n 1E4K 1F8K 3.8 1JA/K 0.8 X n CN 1E2 0.5 X n 1E4 2B4A 5.1 1J 0.8 X n 2A 1.27 X n 2B * n = number of resistors A B C D E 0.3 0.9 0.9 0.5 1.5 0.3 0.2 0.25 0.25 0.5 0.5 0.5 0.4 0.67 0.5 0.5 0.8 1.6 1.6 1.0 1.0 2.6 2.6 0.4 0.3 0.3 0.6 1.0 0.5 1.5 0.3 0.25 0.5 3.1 1.6 2.0 3.2 2.1 0.8 1.0 2.2 4.1 2.6 3.0 4.2 0.9 0.4 0.65 0.65 0.5 0.5 0.5 0.5 1.27 0.8 1.27 1.27 1.0 Chip Networks D Soldering Pad B W A Chip Component D C E L CNB2E5Z, CNB2B9Z resistor arrays—CN F Dimensions Type Style 1J10K 2B10 2A CND CNN Component Size W L 3.2 1.6 6.4 3.1 2.54 2.0 A B C D E 0.9 2.1 1.2 2.6 4.1 2.8 0.4 0.6 0.6 0.5 0.5 0.4 0.64 1.27 1.27 B A D C E Dimensions Type Style CND CND CNB CNB 1J10Y 2A10Y 2E5Z 2B9Z Component Size 3.2 4.0 3.2 6.4 X X X X 1.6 2.1 2.5 3.2 A B C D E F G 0.9 1.0 1.7 2.4 2.3 3.0 3.9 4.6 0.3 0.4 0.5 0.5 0.7 1.0 1.1 1.1 0.635 0.8 1.0 1.3 2.45 3.4 0.5 0.65 0.4 0.4 — — CND1J10Y, CND2A10Y C E D BA G O F D MRGF thick film resistor—MRGF A Dimensions Type appendix & add. information MRGF16 Component Size A B C D E 11.0 X 7.7 1.27 0.76 0.51 1.27 7.62 B D Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 318 D C E 11/25/14 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com Appendix E pad dimensions integrated passive devices—SOIC, TSSOP, QSOP & SOT23 Chip Size N08 N14 N16 Q16 Q20 Q24 SOT23 SOIC, TSSOP, QSOP Dimensions inches (mm) A B C D E F .028 (0.7) .028 (0.7) .028 (0.7) .012 (0.3) .012 (0.3) .012 (0.3) .035 (0.9) .050 (1.27) .050 (1.27) .050 (1.27) .025 (0.63) .025 (0.63) .025 (0.63) .037 (0.95) .094 (2.4) .094 (2.4) .094 (2.4) .050 (1.27) .050 (1.27) .050 (1.27) .055 (1.4) .098 (2.5) .098 (2.5) .098 (2.5) .180 (4.56) .180 (4.56) .180 (4.56) .031 (0.8) .287 (7.3) .287 (7.3) .287 (7.3) .280 (7.1) .280 (7.1) .280 (7.1) .141 (3.6) .150 (3.81) .300 (7.62) .350 (8.89) .175 (4.45) .225 (5.72) .275 (6.99) F E D C A B SOT23 D ––– E C A B melf type components—RD41, RN41, RM41, MLT, CC Type RD41 RN41 RM41 MLT CC Dimensions millimeters Style Solder Pad Component Size A B C D 2A 10 2.0 X 1.25 1.3 1.3 2.0 1.3 2ES 12M 3.5 X 1.40 1.5 2.2 1.5 2.0 2D 20 3.2 X 1.55 1.5 2.2 1.5 2.0 2E 25 5.9 X 2.2 2.0 3.0 3.0 4.0 2H 5.9 X 2.2 2.0 3.0 3.0 4.0 A B C D Adhesive Area other chips—RCS, RCT, RCU, RCW Dimensions millimeters Type A B B RCS 4.1-4.3 1.4-1.6 RCT 2.9-3.1 1.05-1.25 RCU 2.5-2.7 0.6-0.8 RCW 4.1-4.3 1.4-1.6 A ceramic chip capacitors • Pad width equal to component width. It is permissible to decrease this to as low as 85% of component width but it is not advisable to go below this. • Pad overlap 0.5mm beneath component • Pad extension 0.5mm beyond components for reflow and 1.0mm for wave soldering C D C Dimensions inches (mm) Case Size 0402 0603 0805 1206 1210 A B C D 0.02 (0.50) 0.03 (0.75) 0.05 (1.25) 0.06 (1.60) 0.10 (2.50) 0.07 (1.70) 0.09 (2.30) 0.12 (3.00) 0.16 (4.00) 0.16 (4.00) 0.02 (0.60) 0.03 (0.80) 0.04 (1.00) 0.04 (1.00) 0.04 (1.00) 0.02 (0.50) 0.03 (0.70) 0.04 (1.00) 0.09 (2.00) 0.09 (2.00) A B Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 1/06/13 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com 319 appendix & add. information Component pads should be designed to achieve good solder filets and minimize component movement during reflow soldering. Pad dimensions are given below for multilayer ceramic capacitors for both reflow and wave soldering. The basis for these designs is: Appendix E pad dimensions surface mount inductors—LKS B Dimensions inches (mm) Solder pad A D Chip componment Case Size 0745 C 1045 1260 A B C D 0.22 (5.5) 0.22 (5.5) 0.37 (9.5) 0.34 (8.70) 0.42 (10.7) 0.55 (13.9) 0.09 (2.30) 0.14 (3.60) 0.21 (5.30) 0.06 (1.60) 0.10 (2.60) 0.09 (2.20) surface mount inductors—KT11835 B C A Unit F E D Dimensions inches (mm) mm D A Solder pad Case Size A B C D E F 11835 0.07 (1.90) 0.27 (6.80) 0.12 (3.00) 0.07 (1.90) 0.03 (0.80) 0.18 (4.60) Chip component appendix & add. information Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use. 320 2/11/15 KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com