Pad Dimensions - KOA Speer Electronics

Appendix E
pad dimensions
standard soldering pad dimensions
Type
WK73
RK73
SG73
RN73
RN73H
SR73
LT73
NT73
PT72
LA73
RF73
KL73
HV73
LP73
SDT73
SL/TSL
SLN
CCP
CCF
LPC
D
Component Size
A
B
C
D
2B
1.6 X 3.2
0.7
2.3
3.2
0.8
2H
2.5 X 5.0
1.0
35
5.0
1.25
2J
3.1 X 4.6
1.6
3.9
4.75
1.15
3A
3.1 X 6.4
1.6
3.9
6.4
1.15
1F
0.4 X 0.2
0.12
0.48
0.18
0.18
1H
0.6 X 0.3
0.25
0.7
0.3
0.225
1E
1.0 X 0.5
0.5
1.3
0.3
0.4
1J
1.6 X 0.8
1.0
2.0
0.6
0.5
2A
2.0 X 1.25
1.3
2.5
1.05
0.6
2B
3.2 X 1.6
2.2
4.0
1.4
0.9
2E
3.2 X 2.5
2.2
4.0
2.3
0.9
2H
5.0 X 2.5
3.3
6.1
2.3
1.4
3A
6.4 X 3.2
4.6
8.0
3.0
1.7
07
5.0 X 2.5
2.3
7.0
2.6
2.35
2B, 2BW
1
6.3 X 3.1
3.4
8.0
3.0
2.3
2-3
11.5 X 7.0
5.4
15.0
5.0
4.8
2/3
11.5 X 7.0
5.0
15.0
6.0
5.0
2E
3.2 X 2.5
2.2
5.0
2.0
1.4
2B
3.2 x 1.6
2.2
5.0
1.4
1.4
1N
6.0 X 2.5
3.0
7.2
2.8
2.1
1F
6.0 X 2.5
3.2
8.8
5.0
2.8
4.5 X 4.0
1.5
5.1
3.5
4.5 X 4.2
1.9
5.5
2.6
1.8
4545
4.1 X 4.6
2.9
5.3
4.7
3.0
1.2
__
9.0 X 4.8
4.0
2.6
C
B
Soldering Pad
Chip Component
Type
Component Size
A
B
C
D
1E
1.0 X 0.5
0.2
1.3
0.6
0.55
2A
2.0 X 1.25
0.5
2.5
1.3
1.0
2B, 2BW
(1mΩ)
3.2 X 1.6
0.8
4.0
1.8
1.6
(2mΩ~20mΩ)
3.2 X 1.6
1.4
4.0
1.8
1.3
2H, 2HW
(1mΩ)
5.0 X 2.5
1.0
6.1
3.0
2.55
5.0 X 2.5
1.3
6.1
3.0
2.4
(7mΩ~10mΩ)
5.0 X 2.5
3.3
6.1
3.0
1.4
3A(1mΩ)
6.35 X 3.18
1.45
7.55
3.83
3.05
3A(2mΩ)
6.35 X 3.18
3.45
7.55
3.83
2.05
3A(3mΩ)
6.35 X 3.18
2.45
7.55
3.83
2.70
3A(4mΩ)
6.35 X 3.18
3.45
7.55
3.83
2.05
6.35 X 3.18
1.45
7.55
3.83
3.05
6.35 X 3.18
3.45
7.55
3.83
2.05
6.35 X 3.18
4.40
7.55
3.83
1.575
6.35 X 3.18
0.80
7.55
3.83
3.375
6.35 X 3.18
1.45
7.55
3.83
3.05
6.35 X 3.18
1.05
7.55
3.83
3.25
6.35 X 3.18
1.45
7.55
3.83
3.05
6.35 X 3.18
3.45
7.55
3.83
2.05
(9mΩ~10mΩ)
6.35 X 3.18
4.40
7.55
3.83
1.575
2H, 2HW
(2mΩ~6mΩ)
2H, 2HW
3AW
TLR
(1mΩ~4mΩ)
9040E
9.0 X 4.8
4.0
2.6
3.0
10065
10.0 X 10.4
5.0
13.0
6.0
4.0
12065
12 X 12.4
5.0
15.0
7.5
5.0
KL
32
3.2 X 2.5
2.2
5.0
2.0
1.4
KQT
0402
1.0 X 0.5
0.46
1.18
0.66
0.36
0603
1.6 X 1.0
0.64
1.92
1.02
0.64
0805
2.0 X 1.5
0.76
2.8
1.78
1.02
1008
2.5 X 2.2
1.27
3.31
2.54
(2mΩ)
1E
0.50 X 0.10
0.4
1.6
0.6
1.02
__
1J
0.80 X 1.6
0.55
2.6
0.94
__
(3mΩ~4mΩ)
2A
1.25 X 2.0
0.66
3.0
1.45
__
3AP
(5mΩ~8mΩ)
KQC
CZB
CZP
MHL
appendix & add.
information
SDR
TF
2B
1.6 X 3.2
1.5
4.4
1.8
__
0603,0604
5.6 X 4.5
1.7
6.0
5.8
__
0805
7.5 X 7.5
2.4
7.8
8.0
2.7
1006
9.5 X 9.5
2.8
10.0
10.0
3.6
10
1.0 X 0.5
0.5
1.3
0.3
0.4
16
1.6 X 0.8
1.0
2.0
0.6
0.5
Dimensions millimeters
Style
__
KQ
A
C
1.8
4235
9040N
A
B
Dimensions millimeters
Style
4045
LPC 9040N
Flat Type Components
The optimum soldering pad dimensions may differ
depending on soldering conditions, however, the
following land dimensions are generally recommended.
3AW
(5mΩ~8mΩ)
3AW
(9mΩ~10mΩ)
3AP
(0.5~0.82mΩ)
3AP
(1mΩ)
3AP
3AP
3AP
2A
2.0 X 1.25
0.5
2.5
1.3
1.0
3AW
6.3 X 3.2
4.4
7.5
3.7
1.55
UR73
1E
1.0 X 0.5
0.5
1.8
0.5
0.65
UR73D
1J
1.6 X 0.8
0.5
2.5
0.9
TLRH
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
316
1.0
7/08/15
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
Appendix E
pad dimensions
standard soldering pad dimensions (continued)
The optimum soldering pad dimensions may differ
depending on soldering conditions, however, the
following land dimensions are generally recommended.
Flat Type Components
B
D
Type
A
Dimensions millimeters
Style
Component Size
A
B
C
D
2A
2.0 X 1.25
0.8
3.4
1.3
1.3
2B
3.2 X 1.6
1.2
4.6
1.8
1.7
(10mΩ~30mΩ)
5.0 X 2.5
1.8
6.1
2.6
2.5
UR73
2H
UR73D (33mΩ~100mΩ)
5.0 X 2.5
3.3
6.1
2.5
1.4
Soldering Pad
6.4 X 3.2
2.3
8.0
3.3
1.7
Chip Component
(33mΩ~100mΩ)
6.4 X 3.2
4.6
8.0
3.0
1.7
1H
0.6 X 0.3
1E
1.0 X 0.5
0.51
1.73
0.51
0.61
1J
1.6 X 0.8
1.0
3.0
1.2
1.0
2A
2.0 X 1.25
1.2
4.0
1.0
1.4
2H
3A
(10mΩ~30mΩ)
3A
NV73
NV73DL
SDS
PS
SLF
0.25-0.35 0.65-0.95 0.25-0.35 0.2-0.3
2B
3.2 X 1.6
2.2
5.0
1.3
1.4
2E
3.2 X 2.5
2.2
5.0
2.2
1.4
2J
4.5 X 3.2
3.0
5.8
2.9
1.4
2L
5.7 X 5.0
4.5
7.5
4.7
1.5
NV73DS
C
2L
6.1 X 5.1
4.5
7.5
4.7
1.5
0804
0805
8.0 X 10.5
5.7
10.5
2.2
2.4
1003
1005
10.0 X 12.7
7.3
13.3
2.8
3.0
0908
9.5 X 10.5
10.3
14.7
9.0
2.2
1205
1206
1208
12.7 X 12.7
6.0
14.0
7.0
4.0
B(0.75mΩ)
10.0 X 8.4
2.8
10.7
8.9
3.95
B(1mΩ)
10.0 X 8.4
3.8
10.7
8.9
3.95
B(0.2mΩ)
10.0 X 8.4
2.2
10.8
9.0
4.30
I
10.0 X 5.2
5.6
11.0
6.2
2.7
E
6.4 X 6.4
1.4
7.6
7.0
3.1
SLF
0905
––
9.5
3.74
2.0
1.2
LCM
1060
10 X 10
5.6
10.7
3.2
2.5
A
C
C
D
B
D
surface mount inductor—SDR
Style
SDR0603, SDR0604
SDR0805
SDR1006
SDR0906
Pad
1
1
1
2
A
1.7
2.4
2.8
14.7
B
6.0
7.8
10.0
10.3
SDR
Pad 1
C
5.8
8.0
10.0
2.2
D
2.15
2.7
3.6
1.0
E
––
––
––
2.5
These pad dimensions are only for standard pattern and the characteristics
are not guaranteed, which you are suggested to confirm before use.
D
A
Pad 2
C
B
B
C
D
D
C
E
Soldering pad
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
A
11/25/14
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
317
appendix & add.
information
Dimensions millimeters
Appendix E
pad dimensions
CSR
L
current sense resistor—CSR
G
F
Dimensions inches (mm)
Type
L
.393
CSR1 (10.0)
.472
CSR2 (12.0)
W
A
B
C
D
E
F
G
.236
(6.0)
.314
(8.0)
.039
(1.0)
.062
(1.6)
.078
(2.0)
.125
(3.2)
.196
(5.0)
.236
(6.0)
.062
(1.6)
.086
(2.2)
.118
(3.0)
.208
(5.3)
.078
(2.0)
.090
(2.3)
.039
(1.0)
.045
(1.15)
W
E
B
A
D
resistor arrays—CN
C
Dimensions
Type
Style
Component Size
W
L*
0.8
0.6
1.4
1H2N
1H4N
1E2K
0.5 X n
1E4K
1F8K
3.8
1JA/K
0.8 X n
CN
1E2
0.5 X n
1E4
2B4A
5.1
1J
0.8 X n
2A
1.27 X n
2B
* n = number of resistors
A
B
C
D
E
0.3
0.9
0.9
0.5
1.5
0.3
0.2
0.25
0.25
0.5
0.5
0.5
0.4
0.67
0.5
0.5
0.8
1.6
1.6
1.0
1.0
2.6
2.6
0.4
0.3
0.3
0.6
1.0
0.5
1.5
0.3
0.25
0.5
3.1
1.6
2.0
3.2
2.1
0.8
1.0
2.2
4.1
2.6
3.0
4.2
0.9
0.4
0.65
0.65
0.5
0.5
0.5
0.5
1.27
0.8
1.27
1.27
1.0
Chip Networks
D
Soldering
Pad
B W A
Chip
Component
D
C
E
L
CNB2E5Z, CNB2B9Z
resistor arrays—CN
F
Dimensions
Type
Style
1J10K
2B10
2A
CND
CNN
Component Size
W
L
3.2
1.6
6.4
3.1
2.54
2.0
A
B
C
D
E
0.9
2.1
1.2
2.6
4.1
2.8
0.4
0.6
0.6
0.5
0.5
0.4
0.64
1.27
1.27
B A
D
C
E
Dimensions
Type
Style
CND
CND
CNB
CNB
1J10Y
2A10Y
2E5Z
2B9Z
Component Size
3.2
4.0
3.2
6.4
X
X
X
X
1.6
2.1
2.5
3.2
A
B
C
D
E
F
G
0.9
1.0
1.7
2.4
2.3
3.0
3.9
4.6
0.3
0.4
0.5
0.5
0.7
1.0
1.1
1.1
0.635
0.8
1.0
1.3
2.45
3.4
0.5
0.65
0.4
0.4
—
—
CND1J10Y, CND2A10Y
C
E
D
BA
G
O
F
D
MRGF
thick film resistor—MRGF
A
Dimensions
Type
appendix & add.
information
MRGF16
Component Size
A
B
C
D
E
11.0 X 7.7
1.27
0.76
0.51
1.27
7.62
B
D
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
318
D
C
E
11/25/14
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
Appendix E
pad dimensions
integrated passive devices—SOIC, TSSOP, QSOP & SOT23
Chip
Size
N08
N14
N16
Q16
Q20
Q24
SOT23
SOIC, TSSOP, QSOP
Dimensions inches (mm)
A
B
C
D
E
F
.028
(0.7)
.028
(0.7)
.028
(0.7)
.012
(0.3)
.012
(0.3)
.012
(0.3)
.035
(0.9)
.050
(1.27)
.050
(1.27)
.050
(1.27)
.025
(0.63)
.025
(0.63)
.025
(0.63)
.037
(0.95)
.094
(2.4)
.094
(2.4)
.094
(2.4)
.050
(1.27)
.050
(1.27)
.050
(1.27)
.055
(1.4)
.098
(2.5)
.098
(2.5)
.098
(2.5)
.180
(4.56)
.180
(4.56)
.180
(4.56)
.031
(0.8)
.287
(7.3)
.287
(7.3)
.287
(7.3)
.280
(7.1)
.280
(7.1)
.280
(7.1)
.141
(3.6)
.150
(3.81)
.300
(7.62)
.350
(8.89)
.175
(4.45)
.225
(5.72)
.275
(6.99)
F
E
D
C
A
B
SOT23
D
–––
E
C
A
B
melf type components—RD41, RN41, RM41, MLT, CC
Type
RD41
RN41
RM41
MLT
CC
Dimensions millimeters
Style
Solder Pad
Component Size
A
B
C
D
2A 10
2.0 X 1.25
1.3
1.3
2.0
1.3
2ES 12M
3.5 X 1.40
1.5
2.2
1.5
2.0
2D 20
3.2 X 1.55
1.5
2.2
1.5
2.0
2E 25
5.9 X 2.2
2.0
3.0
3.0
4.0
2H
5.9 X 2.2
2.0
3.0
3.0
4.0
A
B
C
D
Adhesive
Area
other chips—RCS, RCT, RCU, RCW
Dimensions millimeters
Type
A
B
B
RCS
4.1-4.3
1.4-1.6
RCT
2.9-3.1
1.05-1.25
RCU
2.5-2.7
0.6-0.8
RCW
4.1-4.3
1.4-1.6
A
ceramic chip capacitors
• Pad width equal to component width. It is permissible to decrease
this to as low as 85% of component width but it is not advisable
to go below this.
• Pad overlap 0.5mm beneath component
• Pad extension 0.5mm beyond components for reflow
and 1.0mm for wave soldering
C
D
C
Dimensions inches (mm)
Case Size
0402
0603
0805
1206
1210
A
B
C
D
0.02
(0.50)
0.03
(0.75)
0.05
(1.25)
0.06
(1.60)
0.10
(2.50)
0.07
(1.70)
0.09
(2.30)
0.12
(3.00)
0.16
(4.00)
0.16
(4.00)
0.02
(0.60)
0.03
(0.80)
0.04
(1.00)
0.04
(1.00)
0.04
(1.00)
0.02
(0.50)
0.03
(0.70)
0.04
(1.00)
0.09
(2.00)
0.09
(2.00)
A
B
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
1/06/13
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
319
appendix & add.
information
Component pads should be designed to achieve good solder
filets and minimize component movement during reflow soldering.
Pad dimensions are given below for multilayer ceramic capacitors
for both reflow and wave soldering. The basis for these designs is:
Appendix E
pad dimensions
surface mount inductors—LKS
B
Dimensions inches (mm)
Solder pad
A
D
Chip componment
Case Size
0745
C
1045
1260
A
B
C
D
0.22
(5.5)
0.22
(5.5)
0.37
(9.5)
0.34
(8.70)
0.42
(10.7)
0.55
(13.9)
0.09
(2.30)
0.14
(3.60)
0.21
(5.30)
0.06
(1.60)
0.10
(2.60)
0.09
(2.20)
surface mount inductors—KT11835
B
C
A
Unit
F
E
D
Dimensions inches (mm)
mm
D
A
Solder pad
Case
Size
A
B
C
D
E
F
11835
0.07
(1.90)
0.27
(6.80)
0.12
(3.00)
0.07
(1.90)
0.03
(0.80)
0.18
(4.60)
Chip component
appendix & add.
information
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
320
2/11/15
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com