MIL-PRF-38534 AND 38535 CERTIFIED FACILITY M.S.KENNEDY CORP. M.S. KENNEDY CORP. 4303 10 AMP, 75 VOLT MOSFET SMART POWER 3-PHASE MOTOR DRIVE HYBRID 4707 Dey Road Liverpool, N.Y. 13088 (315) 701-6751 FEATURES: 75V, 10 Amp Capability Ultra Low Thermal Resistance - Junction to Case - 1.5°C/W (Each MOSFET) Self-Contained, Smart Lowside/Highside Drive Circuitry Bootstrap High-Side Supplies Under-Voltage Lockout Capable of Switching Frequencies to 25KHz Isolated Case Allows Direct Heat Sinking Bolt-down Design Allows Superior Heat Dissipation Contact MSK for MIL-PRF-38534 Qualification Status DESCRIPTION: The MSK 4303 is a 10 Amp, 3 Phase Bridge Smart Power Motor Drive Hybrid with a 75 volt rating on the output switches. The output switches are MOSFETs. This new smart power motor drive hybrid is 5.0 volt input logic compatible. Under-voltage lockout shuts down the bridge when the supply voltage gets to a point of incomplete turn-on of the output switches. The internal high-side bootstrap power supply derived from the +VB supply completely eliminates the need for 3 floating independent power supplies. EQUIVALENT SCHEMATIC PIN-OUT INFORMATION TYPICAL APPLICATIONS TYPICAL APPLICATIONSPIN-OUT INFORMATION 3 PHASE SIX STEP DC BRUSHLESS MOTOR DRIVE OR 3 PHASE SINUSOIDAL INDUCTION MOTOR DRIVE 1 1 2 3 4 5 6 7 8 9 10 H INA L INA +VCC H INB L INB COM COM +VB H INC L INC 20 19 18 17 16 15 14 13 12 11 V+ N/C AVAØ N/C BVBØ N/C CVCØ 8548-109 Rev. E 11/13 6 ABSOLUTE MAXIMUM RATINGS V+ VCC IOUT IPK θJC High Voltage Supply 7 Logic Supply Continuous Output Current Peak Output Current Thermal Resistance @ 125°C (Output Switches)(Junction to Case) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ TsT Storage Temperature Range 8 TLD Lead Temperature Range TC (10 Seconds) Case Operating Temperature MSK 4303 MSK 4303H/E TJ Junction Temperature 75V 18V 10A 14A ○ ○ ○ 1.5°C/W ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 300°C -40°C to +85°C -55°C to +125°C +150°C ○ ○ ○ -65° to +150°C ○ ○ ○ ○ ○ ○ ELECTRICAL SPECIFICATIONS Parameters GROUP A MSK 4303H/E 3 SUBGROUP Min. Typ. Max. 5 Test Conditions MSK 4303 2 UNITS Min. Typ. Max. OUTPUT CHARACTERISTICS Drain-Source ON Resistance 1 (each MOSFET) (for thermal calculations only) Ic=10A Drain-Source Voltage (VDS(on)) (each MOSFET) Ic=10A Leakage Current (Each MOSFET) V+ = 75V V+ = 60V 1 V+ = 75V 1 ID=10A, di/dt=100A/μS Reverse Recovery Time 1 BIAS SUPPLY CHARACTERISTICS +VCC Bias Current +VCC=15V +VB Bias Current +VB=15V INPUT SIGNAL CHARACTERISTICS Positive Trigger Threshold Voltage 1 +VCC=15V Negative Trigger Threshold Voltage 1 +VCC=15V +VCC Positive Going Threshold Under-voltage Lockout +VCC Negative Going Threshold Low Side Turn-off to High Side Turn-On Dead Time 1 High Side Turn-off to Low Side Turn-On 0.013 0.026 0.013 0.56 1.2 0.78 1.5 0.42 1.0 1 250 10 500 1 250 120 - 1 2 3 1 2 3 1 2 3 - - 1,2,3 1,2,3 - 12 6 20 9 1,2,3 1,2,3 - 2.7 8.0 7.4 280 280 8.9 8.2 400 400 0.8 9.8 9.0 520 520 - - 0.013 Ω Ω Ω 0.56 1.4 volts volts volts 250 1 μA μA μA 120 nS 12 6 20 9 2.7 0.8 8.0 8.9 9.8 7.4 8.2 9.0 280 400 520 280 400 520 mA mA volts volts volts volts nSEC nSEC NOTES: 1 2 3 4 5 6 7 8 Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only. Industrial grade and "E" suffix devices shall be tested to subgroups 1 and 4 unless otherwise specified. Military grade devices ("H" suffix) shall be 100% tested to subgroups 1, 2 and 3. Subgroups 5 and 6 testing available upon request. Subgroup 1, 4 TA=TC=+25°C 2, 5 TA=TC=+125°C 3, 6 TA=TC=-55°C Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle. When applying power to the device, apply the low voltage followed by the high voltage or alternatively, apply both at the same time. Do not apply high voltage without low voltage present. Internal solder reflow temperature is 180°C, do not exceed. 2 8548-109 Rev. E 11/13 TYPICAL PERFORMANCE CURVES 3 8548-109 Rev. E 11/13 APPLICATION NOTES MSK 4303 PIN DESCRIPTIONS +VCC - Is the low voltage supply for all the internal logic and drivers. A 0.1 μF ceramic capacitor in parallel with a 10μF tantalum capacitor is the recommended bypassing from the +VCC pin to the COM pin. H INA, H INB, H INC - Are high active logic inputs for signalling the corresponding phase high-side switch to turn on. The logic inputs are compatible with standard CMOS or LSTTL outputs. These logic inputs are internally zener clamped at 5.2 volts. L INA, L INB, L INC - Are low active logic inputs for signalling the corresponding phase low-side switch to turn on. The logic inputs are compatible with standard CMOS or LSTTL outputs. These logic inputs are internally zener clamped at 5.2 volts. AØ, BØ, CØ - Are the pins connecting the 3 phase bridge switch outputs. AV-, BV-, CV- - Are the connections from the bottoms of the three half bridges. These pins get connected to the COM pin. If current sensing is desired they may be connected to the COM pin through a low value sense resistor. +VB - Is the connection used to provide power to the floating high-side bootstrap supplies in the gate drive circuitry. V+ - Is the high voltage positive rail connection to the tops of the three half bridges. Proper power supply bypassing must be connected from this pin to the COM pin for good filtering. This bypassing must be done as close to the hybrid as possible. COM - Is the connection that all hybrid power supply connections are returned to and bypassed to. 4 8548-109 Rev. E 11/13 TYPICAL SYSTEM OPERATION The MSK 4303 is designed to be used with a +28 volt high voltage bus, +15 volt low power bus and +5 volt logic signals. Proper derating should be applied when designing the MSK 4303 into a system. High frequency layout techniques with ground planes on a printed circuit board is the only method that should be used for circuit construction. This will prevent pulse jitter caused by excessive noise pickup on the current sense signal or the error amp signal. Ground planes for the lower power circuitry and the high power circuitry should be kept separate. The connection between the bottom of the current sense resistor, COM pin and the high power ground, AV-, BV- and CV- pins are connected at this point. This is a critical path and high currents should not be flowing between the current sense and COM. Inductance in this path should be kept to a minimum. An RC filter (shown in 2 places) will filter out the current spikes and keep the detected noise for those circuits down to a minimum. In the system shown a PWM pulse by pulse current limit scheme controlled by the motor controller is implemented. When controlling the motor speed by the PWM method, it is required that the low side switches be PWM pulsed due to the bootstrap supplies used to power the high side switch drives. The higher the PWM speed the higher the current load on the drive supply. PWM of the low side will prevent sagging of the high side supplies. A separate pin (+VB) is provided for connecting an external floating power supply to power the bootstrap supplies. 5 8548-109 Rev. E 11/13 MECHANICAL SPECIFICATIONS Weight=42 Grams Typical Contains Internal BeO (Beryllium Oxide) All dimensions are ±0.01 inches unless otherwise specified. ESD Triangle Indicates Pin 1 ORDERING INFORMATION MSK4303 H U LEAD CONFIGURATIONS S=STRAIGHT; U=BENT UP; D=BENT DOWN SCREENING BLANK=INDUSTRIAL; H=MIL-PRF-38534 CLASS H; E=EXTENDED RELIABILITY GENERAL PART NUMBER M.S. Kennedy Corp. 4707 Dey Road, Liverpool, New York 13088 Phone (315) 701-6751 FAX (315) 701-6752 www.mskennedy.com The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make changes to its products or specifications without notice, however and assumes no liability for the use of its products. Please visit our website for the most recent version of this datasheet Contact MSK for MIL-PRF-38534 qualification status.. 6 8548-109 Rev. E 11/13