CPC1908

CPC1908
60V Single-Pole, Normally
Open Power Relay
INTEGRATED CIRCUITS DIVISION
Description
Characteristics
Parameter
Rating
Units
Blocking Voltage
60
VP
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
8.5
3.5
Arms / ADC
On-Resistance (max)
0.3

Thermal Resistance,
Junction-to-case, JC
0.35
°C/W
Features
•
•
•
•
•
•
•
•
•
•
8.5Arms Load Current with 5°C/W Heat Sink
Low 0.3 On-Resistance
60VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Resistance: JC = 0.35 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
•
•
•
•
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high-power Solid
State Relays.
As part of this family, the CPC1908 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 8.5Arms continuous load current with a
5°C/W heat sink.
The CPC1908 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The optically coupled outputs, that use
patented OptoMOS architecture, are controlled by a
highly efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation,
but also very low junction-to-case thermal resistance
(0.35 °C/W).
Ordering Information
Part
Description
CPC1908J
i4-PAC Package (25 per tube)
Switching Characteristics
Approvals
• UL 508 Certified Component: File E69938
Form-A
Pin Configuration
IF
90%
10%
ILOAD
ton
toff
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CPC1908
INTEGRATED CIRCUITS DIVISION
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Symbol
Ratings
Units
Blocking Voltage
60
VP
Reverse Input Voltage
5
V
Input Control Current
100
mA
1
A
150
mW
Peak (10ms)
Input Power Dissipation
Isolation Voltage, Input to Output
2500
Vrms
Operational Temperature
-40 to +85
°C
Storage Temperature
-40 to +125
°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
Parameter
Conditions
Symbol
Minimum
Typical
Maximum
Units
25
AP
Output Characteristics
Load Current 1
Peak
t10ms
Continuous
No Heat Sink
Continuous
TC=25°C
Continuous
TC=99°C
IL(99)
IF=10mA, IL=1A
RON
-
0.09
0.3

VL=60VP
ILEAK
-
-
1
A
ton
-
16
20
toff
-
0.17
5
VL=25V, f=1MHz
Cout
-
1100
-
pF
Input Control Current for Activation 3
IL=1A
IF
-
-
10
mA
Input Control Current for Deactivation
-
IF
0.6
-
-
mA
Input Voltage Drop
IF=5mA
VF
0.9
1.2
1.4
V
Reverse Input Current
VR=5V
IR
-
-
10
A
-
CI/O
-
1
-
pF
On-Resistance 2
Off-State Leakage Current
IL
-
-
3.5
15
Arms / ADC
3.9
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
IF=20mA, VL=10V
ms
Input Characteristics
Input/Output Characteristics
Capacitance, Input-to-Output
1
Higher load currents possible with proper heat sinking.
Measurement taken within 1 second of on-time.
3 For applications requiring high temperature operation (T > 60ºC), an LED drive current of 20mA is recommended.
C
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CPC1908
INTEGRATED CIRCUITS DIVISION
2 Thermal Characteristics
Parameter
Conditions
Symbol
Rating
Units
-
JC
0.35
°C/W
Free Air
JA
33
°C/W
-
TJ
-40 to +100
°C
Thermal Resistance (Junction to Case)
Thermal Resistance (Junction to Ambient)
Junction Temperature (Operating)
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Heat Sink Rating
θCA =
(TJ - TA) IL(99)2
IL2 • PD(99)
- θJC
TJ = Junction Temperature (°C), TJ ≤ 100°C *
TA = Ambient Temperature (°C)
IL(99) = Load Current with Case Temperature @ 99°C (ADC)
IL = Desired Operating Load Current (ADC), IL ≤ IL(MAX)
θJC = Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θCA = Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD(99) = Maximum power dissipation with case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
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CPC1908
INTEGRATED CIRCUITS DIVISION
3 Performance Data @ 25°C (Unless Otherwise Noted)
Typical LED Forward Voltage Drop
(N=50, IF=10mA, IL=1ADC)
25
Device Count (N)
Device Count (N)
30
25
20
15
10
5
20
15
10
5
0
0
1.30
1.31
1.32
1.33
Typical Turn-Off Time
(N=50, IF=10mA, IL=1ADC)
25
Device Count (N)
35
Typical Turn-On Time
(N=50, IF=10mA, IL=1ADC)
20
15
10
5
0
1.34
11
13
15
LED Forward Voltage Drop (V)
17
19
21
0.11
0.13
0.15
Turn-On (ms)
0.17
0.19
0.21
Turn-Off (ms)
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1ADC)
35
Device Count (N)
30
25
20
15
10
5
0
0.078
0.082
0.086
0.090 0.094
0.098
On-Resistance (Ω)
Typical Turn-On Time
vs. LED Forward Current
(IL=1ADC)
1.8
40
1.6
0.28
1.2
1.0
0.8
0
20
40
60
80
100
25
20
15
120
0.20
0.16
0.12
0.08
5
0.04
0
0
5
10
15
20
25
30
35
40
45
50
0
5
10
15
20
25
30
35
40
45
50
Temperature (ºC)
LED Forward Current (mA)
LED Forward Current (mA)
Typical IF for Switch Operation
vs. Temperature
(IL=1ADC)
Typical Turn-On Time vs. Temperature
(IF=10mA, IL=1ADC)
Typical Turn-Off Time vs. Temperature
(IF=10mA, IL=1ADC)
0.35
18
0.30
15
0.25
Turn-Off (ms)
21
12
9
6
-20
0
20
40
60
Temperature (ºC)
80
100
0.20
0.15
0.10
0.05
3
-40
0.24
10
0
Turn-On (ms)
10
9
8
7
6
5
4
3
2
1
0
-20
Turn-Off (ms)
IF=50mA
IF=20mA
IF=10mA
-40
LED Current (mA)
0.32
30
1.4
Typical Turn-Off Time
vs. LED Forward Current
(IL=1ADC)
0.36
35
Turn-On (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
0
0
-40
-20
0
20
40
60
80
100
-40
Temperature (ºC)
-20
0
20
40
60
80
100
Temperature (ºC)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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CPC1908
INTEGRATED CIRCUITS DIVISION
0.14
Load Current (A)
0.10
0.08
0.06
0.04
0.02
-40
-20
0
20
40
60
80
100
16
14 1ºC/W
12
10
6
No Heat Sink
2
-0.22
0
0
-0.11
0.11
0.22
0.33
0
20
40
60
80
Temperature (ºC)
Temperature (ºC)
Normalized Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
at Maximum Rated Voltage
Measured Across Pins 1&2
Energy Rating Curve
Free Air, No Heat Sink
0.014
30
1.06
0.012
25
1.04
1.02
1.00
0.98
0.96
0.010
0.008
0.006
0.004
-20
0
20
40
Temperature (ºC)
60
80
100
0
-40
100
20
15
10
5
0.002
0.94
-40
10ºC/W
4
1.08
0.92
5ºC/W
8
Load Voltage (V)
Leakage (μA)
Blocking Voltage (V)
0
5
4
3
2
1
0
-1
-2
-3
-4
-5
-0.33
Load Current (AP)
On-Resistance (Ω)
0.12
Maximum Load Current
vs. Temperature with Heat Sink
(IF=20mA)
Typical Load Current
vs. Load Voltage
(IF=10mA)
Load Current (Arms)
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=1ADC)
0
-20
0
20
40
60
80
100
10µs 100µs 1ms 10ms 100ms
Temperature (ºC)
1s
10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
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CPC1908
INTEGRATED CIRCUITS DIVISION
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1908J
MSL 1
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
CPC1908J
245°C for 30 seconds
NOTE: The exposed surface of the DCB substrate is not be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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CPC1908
INTEGRATED CIRCUITS DIVISION
4.5 Mechanical Dimensions
5.029 ± 0.127
(0.198 ± 0.005)
19.914 ± 0.254
(0.784 ± 0.010)
1.181 ± 0.076
(0.047 ± 0.003)
1.930 ± 0.381
(0.076 ± 0.015)
17.221 ± 0.254
(0.678 ± 0.010)
15.317 ± 0.254
(0.603 ± 0.010)
20.879 ± 0.254
(0.822 ± 0.010)
DCB Substrate
NOTE: Not to be soldered
2.362 ± 0.381
(0.093 ± 0.015)
20.396 ± 0.508
(0.803 ± 0.020)
DIMENSIONS
mm
(inches)
3.810 ± 0.254
(0.150 ± 0.010)
15.240 ± 0.508
(0.600 ± 0.020)
0.635 ± 0.076
(0.025 ± 0.003)
2.794 ± 0.127
(0.110 ± 0.005)
1.270 TYP
(0.050 TYP)
NOTE: Metallized external surface of DCB substrate maintains 2500Vrms
isolation to device internal structure and all external pins.
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1908-R10
©Copyright 2015, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
3/9/2015
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