CPC1973

CPC1973
Power SIP Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
400
0.35
5
Description
Units
VP
Arms

IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high power solid
state relays. As part of that family, the CPC1973
is a 1-Form-A solid state relay. The CPC1973
employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED. The combination of
low on-resistance and high load current handling
capabilities makes the relay suitable for a variety of
high performance switching applications.
Features
•
•
•
•
•
•
•
•
•
Power SIP Package
Handle Load Currents Up to 0.35Arms
High Reliability
No Moving Parts
Low Drive Power Requirements (TTL/CMOS
Compatible)
Arc-Free With No Snubbing Circuits
2500Vrms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Approvals
• UL 508 Recognized Component: File # E69938
• CSA Certified Component: Certificate # 1172007
Applications
•
•
•
•
•
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• IC Equipment
• Home Appliances
Ordering Information
Part #
CPC1973Y
Description
Power SIP Package (25 per tube)
Pin Configuration
1
-
2
+
3
4
Switching Characteristics
of Normally Open (Form A) Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
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INTEGRATED CIRCUITS DIVISION
CPC1973
Absolute Maximum Ratings (@ 25˚ C)
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation1
Isolation voltage Input to Output
Operational Temperature
Storage Temperature
1
Ratings
400
5
50
1
150
2500
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate Linearly 3.33 mw / ºC
Electrical Characteristics
Parameter
Output Characteristics @ 25°C
Load Current, Continuous
Peak
On-Resistance1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Input Characteristics @ 25°C
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics @ 25°C
Capacitance Input/Output
1
Conditions
Symbol
Min
Typ
Max
free air
t<10ms
IL=350mA
VL=400V
IL
ILPK
RON
ILEAK
-
3.4
-
0.35
3.5
5
1
-
5
ms
tOFF
-
-
3
ms
IL=350mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.9
-
1.2
-
10
1.4
10
mA
mA
V
A
f=1MHz
CI/O
-
2
-
pF
Conditions
Symbol
Min
Typ
Max
Units
-
RJC
-
1.5
-
°C/W
tON
IF=10mA, VL=10V
Units
Arms

A
Measurement taken within 1 second of on time.
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
2
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INTEGRATED CIRCUITS DIVISION
CPC1973
PERFORMANCE DATA*
35
35
30
25
20
15
10
30
25
20
15
10
5
5
1.25
1.26
1.28
3.36
3.42
3.45
3.48
523
20
15
10
5
2.0
2.25
15
10
5
2.5
0.008 0.010 0.012 0.014 0.016 0.018 0.020
2.75
Turn-Off (ms)
Typical Blocking Voltage vs. Temperature
570
0.30
0.25
0.20
0.010
0.008
0.006
0.004
0.002
80
100
Typical Turn-On vs. Temperature
(IL=100mADC)
0.45
1.2
0
20
40
60
80
Turn-Off (ms)
0.8
0.6
0.4
0.2
0
20
40
60
Temperature (ºC)
80
100
520
510
-20
0
20
40
60
80
100
Typical Turn-Off vs. Temperature
(IL=100 mADC)
Typical LED Forward Voltage Drop
vs. Temperature
0.35
0.30
0.25
IF=10mA
0.20
-40
-40
Temperature (ºC)
0.10
-20
530
Temperature (ºC)
0.15
0
540
100
0.40
IF=10mA
550
490
-20
LED Forward Voltage Drop (V)
20
40
60
Temperature (ºC)
560
500
0
-40
0.15
Turn-On (ms)
Blocking Voltage (VP)
Leakage (PA)
Load Current (Arms)
0.012
0.35
-40
535
20
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=400V)
0.014
0.40
1.0
527
529 531 533
Blocking Voltage (VP)
0
1.75
Maximum Load Current vs. Temperature
(IF=10mA)
1.4
525
25
Turn-On (ms)
0
10
Typical Turn-Off Time
(N=50, TA=25ºC, IL=0.5ADC, IF=10mA)
Typical Turn-On Time
(N=50, TA=25ºC, IL=0.5ADC, IF=10mA)
1.5
-20
15
On-Resistance (:)
Device Count (N)
Device Count (N)
3.39
0
-40
20
0
3.33
1.29
LED Forward Voltage (V)
25
25
5
0
1.24
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
35
30
Device Count (N)
Device Count (N)
40
0
Typical On-Resistance Distribution
(N=50, TA=25ºC, IL=0.5ADC, IF=10mA)
Device Count (N)
45
Typical LED Forward Voltage Drop
(N=50, TA=25ºC, IF=10mA)
-20
0
20
40
60
Temperature (ºC)
80
100
1.8
1.6
1.4
IF=50mA
1.2
IF=20mA
IF=10mA
1.0
0.8
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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INTEGRATED CIRCUITS DIVISION
CPC1973
PERFORMANCE DATA*
2.50
2.25
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
Typical Turn-Off vs. LED Forward Current
(IL=100mADC)
6.0
0.045
5.5
On-Resistance (:)
0.035
0.030
0.025
0.020
0.015
0.005
5
10
15
20
25
30
35
40
45
50
0
5
10
LED Forward Current (mA)
0.4
15
20
25
4.0
3.5
30
35
40
45
50
2.5
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
(Free Air, No Heat Sink)
4.0
0.3
3.5
Load Current (A)
Load Current (A)
4.5
LED Forward Current (mA)
Typical Load Current vs. Load Voltage
(TA=25ºC, IF=10mA)
0.2
0.1
0.0
-0.1
-0.2
-0.3
-0.4
-2.0 -1.5 -1.0
5.0
3.0
0.010
0
Typical On-Resistance vs. Temperature
(IL=100mADC)
0.050
0.040
Turn-Off (ms)
Turn-On (ms)
Typical Turn-On vs. LED Forward Current
(IL=100mADC)
3.0
2.5
2.0
1.5
1.0
0.5
-0.5 0.0 0.5 1.0
Load Voltage (V)
1.5
2.0
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R04
INTEGRATED CIRCUITS DIVISION
CPC1973
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1973Y
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1973Y
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
CPC1973
MECHANICAL DIMENSIONS
21.082±0.381
(0.830±0.015)
PCB Hole Pattern
3.302±0.051
(0.130±0.002)
10.160±0.127
(0.400±0.005)
1.75
(0.069)
7º TYP
4 Places
Pin 1
1.778
(0.070)
0.762±0.076
(0.030±0.003)
2.540±0.127
(0.100±0.005)
4.572±0.127
(0.180±0.005)
10.160±0.127
(0.400±0.005)
5.080±0.127
(0.200±0.005)
1.651±0.102
(0.065±0.004)
5.080
(0.200)
10.160
(0.400)
1.016±0.127
(0.040±0.005)
Pin 1
1.150 DIA. x4
(0.045 DIA. x4)
2.540
(0.100)
0.381±0.013
(0.015±0.0005)
1.778
(0.070)
7º TYP
4 Places
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1973-R04
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012