CPC1973 Power SIP Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Rating 400 0.35 5 Description Units VP Arms IXYS Integrated Circuits Division and IXYS have combined to bring OptoMOS® technology, reliability and compact size to a new family of high power solid state relays. As part of that family, the CPC1973 is a 1-Form-A solid state relay. The CPC1973 employs optically coupled MOSFET technology to provide 2500Vrms of input to output isolation. The optically coupled outputs, that use patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The combination of low on-resistance and high load current handling capabilities makes the relay suitable for a variety of high performance switching applications. Features • • • • • • • • • Power SIP Package Handle Load Currents Up to 0.35Arms High Reliability No Moving Parts Low Drive Power Requirements (TTL/CMOS Compatible) Arc-Free With No Snubbing Circuits 2500Vrms Input/Output Isolation No EMI/RFI Generation Machine Insertable, Wave Solderable Approvals • UL 508 Recognized Component: File # E69938 • CSA Certified Component: Certificate # 1172007 Applications • • • • • Industrial Controls Motor Control Robotics Medical Equipment—Patient/Equipment Isolation Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • IC Equipment • Home Appliances Ordering Information Part # CPC1973Y Description Power SIP Package (25 per tube) Pin Configuration 1 - 2 + 3 4 Switching Characteristics of Normally Open (Form A) Devices Form-A IF 90% 10% ILOAD ton Pb DS-CPC1973-R04 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION CPC1973 Absolute Maximum Ratings (@ 25˚ C) Parameter Blocking Voltage Reverse Input Voltage Input control Current Peak (10ms) Input Power Dissipation1 Isolation voltage Input to Output Operational Temperature Storage Temperature 1 Ratings 400 5 50 1 150 2500 -40 to +85 -40 to +125 Units VP V mA A mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Derate Linearly 3.33 mw / ºC Electrical Characteristics Parameter Output Characteristics @ 25°C Load Current, Continuous Peak On-Resistance1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Input Characteristics @ 25°C Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics @ 25°C Capacitance Input/Output 1 Conditions Symbol Min Typ Max free air t<10ms IL=350mA VL=400V IL ILPK RON ILEAK - 3.4 - 0.35 3.5 5 1 - 5 ms tOFF - - 3 ms IL=350mA IF=5mA VR=5V IF IF VF IR 0.9 - 1.2 - 10 1.4 10 mA mA V A f=1MHz CI/O - 2 - pF Conditions Symbol Min Typ Max Units - RJC - 1.5 - °C/W tON IF=10mA, VL=10V Units Arms A Measurement taken within 1 second of on time. Thermal Characteristics Parameter Thermal Resistance (junction to case) 2 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1973 PERFORMANCE DATA* 35 35 30 25 20 15 10 30 25 20 15 10 5 5 1.25 1.26 1.28 3.36 3.42 3.45 3.48 523 20 15 10 5 2.0 2.25 15 10 5 2.5 0.008 0.010 0.012 0.014 0.016 0.018 0.020 2.75 Turn-Off (ms) Typical Blocking Voltage vs. Temperature 570 0.30 0.25 0.20 0.010 0.008 0.006 0.004 0.002 80 100 Typical Turn-On vs. Temperature (IL=100mADC) 0.45 1.2 0 20 40 60 80 Turn-Off (ms) 0.8 0.6 0.4 0.2 0 20 40 60 Temperature (ºC) 80 100 520 510 -20 0 20 40 60 80 100 Typical Turn-Off vs. Temperature (IL=100 mADC) Typical LED Forward Voltage Drop vs. Temperature 0.35 0.30 0.25 IF=10mA 0.20 -40 -40 Temperature (ºC) 0.10 -20 530 Temperature (ºC) 0.15 0 540 100 0.40 IF=10mA 550 490 -20 LED Forward Voltage Drop (V) 20 40 60 Temperature (ºC) 560 500 0 -40 0.15 Turn-On (ms) Blocking Voltage (VP) Leakage (PA) Load Current (Arms) 0.012 0.35 -40 535 20 Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=400V) 0.014 0.40 1.0 527 529 531 533 Blocking Voltage (VP) 0 1.75 Maximum Load Current vs. Temperature (IF=10mA) 1.4 525 25 Turn-On (ms) 0 10 Typical Turn-Off Time (N=50, TA=25ºC, IL=0.5ADC, IF=10mA) Typical Turn-On Time (N=50, TA=25ºC, IL=0.5ADC, IF=10mA) 1.5 -20 15 On-Resistance (:) Device Count (N) Device Count (N) 3.39 0 -40 20 0 3.33 1.29 LED Forward Voltage (V) 25 25 5 0 1.24 Typical Blocking Voltage Distribution (N=50, TA=25ºC) 35 30 Device Count (N) Device Count (N) 40 0 Typical On-Resistance Distribution (N=50, TA=25ºC, IL=0.5ADC, IF=10mA) Device Count (N) 45 Typical LED Forward Voltage Drop (N=50, TA=25ºC, IF=10mA) -20 0 20 40 60 Temperature (ºC) 80 100 1.8 1.6 1.4 IF=50mA 1.2 IF=20mA IF=10mA 1.0 0.8 -40 -20 0 20 40 60 80 100 120 Temperature (ºC) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1973 PERFORMANCE DATA* 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0 Typical Turn-Off vs. LED Forward Current (IL=100mADC) 6.0 0.045 5.5 On-Resistance (:) 0.035 0.030 0.025 0.020 0.015 0.005 5 10 15 20 25 30 35 40 45 50 0 5 10 LED Forward Current (mA) 0.4 15 20 25 4.0 3.5 30 35 40 45 50 2.5 -40 -20 0 20 40 60 Temperature (ºC) 80 100 Energy Rating Curve (Free Air, No Heat Sink) 4.0 0.3 3.5 Load Current (A) Load Current (A) 4.5 LED Forward Current (mA) Typical Load Current vs. Load Voltage (TA=25ºC, IF=10mA) 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.4 -2.0 -1.5 -1.0 5.0 3.0 0.010 0 Typical On-Resistance vs. Temperature (IL=100mADC) 0.050 0.040 Turn-Off (ms) Turn-On (ms) Typical Turn-On vs. LED Forward Current (IL=100mADC) 3.0 2.5 2.0 1.5 1.0 0.5 -0.5 0.0 0.5 1.0 Load Voltage (V) 1.5 2.0 0.0 10Ps 100Ps 1ms 10ms 100ms Time 1s 10s 100s *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R04 INTEGRATED CIRCUITS DIVISION CPC1973 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating CPC1973Y MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time CPC1973Y 245ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R04 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1973 MECHANICAL DIMENSIONS 21.082±0.381 (0.830±0.015) PCB Hole Pattern 3.302±0.051 (0.130±0.002) 10.160±0.127 (0.400±0.005) 1.75 (0.069) 7º TYP 4 Places Pin 1 1.778 (0.070) 0.762±0.076 (0.030±0.003) 2.540±0.127 (0.100±0.005) 4.572±0.127 (0.180±0.005) 10.160±0.127 (0.400±0.005) 5.080±0.127 (0.200±0.005) 1.651±0.102 (0.065±0.004) 5.080 (0.200) 10.160 (0.400) 1.016±0.127 (0.040±0.005) Pin 1 1.150 DIA. x4 (0.045 DIA. x4) 2.540 (0.100) 0.381±0.013 (0.015±0.0005) 1.778 (0.070) 7º TYP 4 Places Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1973-R04 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012