CPC1726

CPC1726
Single-Pole, Normally Open
DC Power SIP Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
250
1
0.75
Description
Units
VP
ADC

IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of high power solid
state relays. As part of that family, the CPC1726 is
a normally open (1-Form-A) solid state relay. The
CPC1726 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation.
Features
•
•
•
•
•
•
Handle Load Currents Up to 1ADC
2500Vrms Input/Output Isolation
Power SIP Package
High Reliability
No Moving Parts
Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED. The combination of
low on-resistance and high load current handling
capabilities makes the relay suitable for a variety of
high performance switching applications.
Approvals
Applications
• UL 508 Certified Component: File E69938
• CSA Certified Component: Certificate 1172007
•
•
•
•
•
Ordering Information
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• IC Equipment
• Home Appliances
Part #
CPC1726Y
Description
4-Pin (8-Pin Body) Power SIP Package (25 per tube)
Pin Configuration
Switching Characteristics
of Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-CPC1726-R03
toff
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1
INTEGRATED CIRCUITS DIVISION
CPC1726
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Ratings
250
5
50
1
150
1600
2500
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Derate linearly 3.33 mW / ºC
Derate linearly 16.667 mW / ºC
2
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current, Continuous
Peak Load Current
On-Resistance1
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Input/Output Characteristics
Input to Output Capacitance
1
Conditions
Symbol
Min
Typ
Max
Units
Free air
t=10ms
IL=1A
VL=250VP
IL
ILPK
RON
ILEAK
-
0.64
-
1
3
0.75
1
ADC
A

µA
VL=50V, f=1MHz
ton
toff
COFF
-
0.67
0.04
60
5
2
-
IL=1A
IF=5mA
VR=5V
IF
IF
VF
IR
0.6
0.9
-
1.8
1.2
-
10
1.4
10
mA
mA
V
µA
f=1MHz
CI/O
-
2
-
pF
Conditions
Symbol
Min
Typ
Max
Units
-
RJC
-
1.5
-
°C/W
IF=10mA, VL=10V
ms
pF
Measurement taken within 1 second of on-time.
Thermal Characteristics
Parameter
Thermal Resistance (junction to case)
2
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R03
INTEGRATED CIRCUITS DIVISION
CPC1726
PERFORMANCE DATA*
15
10
5
25
25
20
20
Device Count (N)
Device Count (N)
20
15
10
5
0
0.55
0.61 0.67 0.73 0.79
Turn-On Time (ms)
0.85
0.035
25
25
20
15
10
5
288
291
294
297
Blocking Voltage (VP)
700
20
15
10
1.230
5
1.235
1.240
1.245
LED Forward Voltage (V)
0.62
0.63 0.64 0.65 0.66
On Resistance (:)
0.67
Typical LED Forward Voltage
vs. Temperature
1.6
1.5
IF=50mA
1.4
IF=20mA
1.3
IF=10mA
1.2
1.1
-40
1.250
Typical Turn-On Time
vs. Temperature
(IF=10mA, VL=10V, RL=1k:)
1.1
3.6
-20
0
20
40
60
Temperature (ºC)
80
100
Typical IF for Switch Operation
vs. Temperature
(IL=500mA)
Turn-On Time (ms)
500
400
300
200
LED Current (mA)
1.0
600
Turn-On Time (Ps)
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
300
Typical Turn-On Time
vs. LED Forward Current
(VL=10V, RL=1k:)
10
0.61
0
285
15
0.050
5
0
0.9
0.8
0.7
0.6
0.5
3.2
2.8
2.4
2.0
0.4
1.6
-40
0.3
100
0
10
20
30
40
LED Forward Current (mA)
-40
50
Typical Turn-Off Time
vs. LED Forward Current
(VL=10V, RL=1k:)
0.055
Turn-Off Time (ms)
60
Turn-Off Time (Ps)
0.038 0.041 0.044 0.047
Turn Off Time (ms)
LED Forward Voltage (V)
30
Device Count (N)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
30
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=1A, TA=25ºC)
0
0
0.49
55
50
45
40
0
10
20
30
40
LED Forward Current (mA)
50
-20
0
20
40
60
Temperature (ºC)
80
100
Typical Turn-Off Time
vs. Temperature
(IF=10mA, VL=10V, RL=1k:)
0
20
40
60
Temperature (ºC)
80
100
2.2
2.1
0.050
0.045
0.040
0.035
2.0
1.9
1.8
1.7
0.030
0.025
-40
-20
Typical IF for Switch Dropout
vs. Temperature
LED Current (mA)
Device Count (N)
Typical Turn-Off Time Distribution
(N=50, IF=10mA, VL=10V, TA=25ºC)
Typical Turn-OnTime Distribution
(N=50, IF=10mA, VL=10V, TA=25ºC)
-20
0
20
40
60
Temperature (ºC)
80
100
1.6
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R03
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3
INTEGRATED CIRCUITS DIVISION
CPC1726
PERFORMANCE DATA*
Typical Load Current
vs. Load Voltage
(IF=10mA, TA=25ºC)
1100
800
600
400
200
0
900
800
700
600
0.2
0.3 0.4 0.5 0.6
Load Voltage (V)
0.7
0.8
-40
Typical Blocking Voltage
vs. Temperature
30
315
Leakage Current (nA)
310
305
300
295
290
285
280
275
-40
-20
0
20
40
60
Temperature (ºC)
80
100
1.1
1.0
0.9
0.8
0.7
0.6
0.5
-20
0
20
40
60
Temperature (ºC)
80
0.4
-40
100
Leakage Current vs. Temperature
Measured Across Pins 3 & 4
(VL=250V)
0
20
40
60
Temperature (ºC)
80
100
10s
100s
8
7
25
20
15
10
5
0
-40
-20
Energy Rating Curve
Free air, No Heat Sink
Load Current (A)
0.1
Typical On-Resistance vs. Temperature
(IF=10mA, IL=500mA)
1.2
500
0.0
Blocking Voltage (VP)
1.3
1000
On-Resistance (:)
1000
Load Current (mADC)
Load Current (mA)
1200
Maximum Load Current
vs. Temperature
(IF=10mA)
6
5
4
3
2
1
-20
0
20
40
60
Temperature (ºC)
80
100
0
10Ps 100Ps 1ms 10ms 100ms
1s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R03
INTEGRATED CIRCUITS DIVISION
CPC1726
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1726Y
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1726Y
245ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R03
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INTEGRATED CIRCUITS DIVISION
CPC1726
MECHANICAL DIMENSIONS
21.082±0.381
(0.830±0.015)
PCB Hole Pattern
3.302±0.051
(0.130±0.002)
10.160±0.127
(0.400±0.005)
1.75
(0.069)
7º TYP
4 Places
Pin 1
1.778
(0.070)
0.762±0.076
(0.030±0.003)
2.540±0.127
(0.100±0.005)
4.572±0.127
(0.180±0.005)
10.160±0.127
(0.400±0.005)
5.080±0.127
(0.200±0.005)
1.651±0.102
(0.065±0.004)
5.080
(0.200)
10.160
(0.400)
1.016±0.127
(0.040±0.005)
Pin 1
1.150 DIA. x4
(0.045 DIA. x4)
2.540
(0.100)
0.381±0.013
(0.015±0.0005)
1.778
(0.070)
7º TYP
4 Places
Dimensions
mm
(inches)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1726-R03
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/17/2012