PLA191

PLA191
Single Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameters
Blocking Voltage
Load Current
On-Resistance (max)
Ratings
400
250
8
Description
Units
VP
mArms / mADC

PLA191 is a single-pole, normally open (1-Form-A)
solid state relay that uses optically coupled MOSFET
technology to provide 5000Vrms of enhanced input to
output isolation.
Features
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebooks, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Part #
PLA191
PLA191S
PLA191STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
- Control
NC
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
- Control
NC
1
6
2
5
3
4
+ Load
- Load
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
ton
Pb
DS-PLA191-R03
toff
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1
INTEGRATED CIRCUITS DIVISION
PLA191
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Package Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
400
5
50
1
150
800
5000
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Load Current, Continuous
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance 1
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
1
2
Conditions
Min
Typ
Max
Units
-
-
250
350
±500
mArms / mADC
mADC
mAP
-
8
3
1

ILEAK
-
A
VL=50V, f=1MHz
ton
toff
COUT
-
65
3
1
-
ms
ms
pF
IL=150mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
5
1.4
10
mA
mA
V
A
-
CI/O
-
3
-
pF
t=10ms
IL=150mA
IL=250mA
VL=400VP
IF=5mA, VL=10V
Symbol
IL
ILPK
RON
Measurement taken within 1 second of on-time.
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INTEGRATED CIRCUITS DIVISION
PLA191
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
25
25
20
15
10
5
20
15
10
5
1.17
1.21
1.23
1.25
0.39
0.65
0.91
1.17
1.43
15
10
5
0.018
1.69
0.030
0.042
0.054
0.066
0.078
LED Forward Voltage Drop (V)
Turn-On Time (ms)
Turn-Off Time (ms)
Typical IF for Switch Operation
(N=50, IL=250mADC)
Typical IF for Switch Dropout
(N=50, IL=250mADC)
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=250mADC)
25
Device Count (N)
20
15
10
5
0
35
30
20
Device Count (N)
25
1.19
20
0
0
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=250mADC)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=250mADC)
15
10
5
2.1
3.3
2.7
3.9
20
15
10
5
0
1.5
25
0
4.5
0.9
LED Forward Current (mA)
1.5
2.1
2.7
3.3
3.9
5.03
5.38
5.73
6.08
6.43
6.78
On-Resistance (:)
LED Forward Current (mA)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
430
442
454
466
478
490
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(IL=250mADC)
1.6
1.4
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
1.2
1.0
0.8
-40
-20
0
20
40
60
Temperature (ºC)
80
100
120
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
Turn-Off Time (ms)
1.8
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
0
5
10
15
20
25
30
35
40
LED Forward Current (mA)
45
50
Typical Turn-Off Time
vs. LED Forward Current
(IL=250mADC)
0.050
0.045
0.040
0.035
0.030
0.025
0.020
0.015
0.010
0.005
0
0
5
10
15
20
25
30
35
40
45
50
LED Forward Current (mA)
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R03
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INTEGRATED CIRCUITS DIVISION
PLA191
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time
vs. Temperature
(IL=250mADC)
0.07
IF=5mA
IF=10mA
IF=20mA
1.5
1.0
0.5
0.04
0.03
0.02
0
20
40
60
80
0
-40
100
-40
-20
0
20
40
60
80
10
9
8
7
6
5
4
3
2
1
0
-40
100
-20
0
20
40
60
Temperature (ºC)
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=250mADC)
Typical IF for Switch Dropout
vs. Temperature
(IL=250mADC)
Typical Load Current
vs. Load Voltage
(IF=5mA)
-20
0
20
40
60
80
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
100
-20
0
20
40
60
80
100
-1.0
-0.5
0
0.5
1.0
100
1.5
2.0
Temperature (ºC)
Load Voltage (V)
Maximum Load Current
vs. Temperature
Typical Blocking Voltage
vs. Temperature
Typical Leakage vs. Temperature
Measured across Pins 4&6
0.12
250
IF=20mA
IF=10mA
IF=5mA
200
150
480
0.10
475
Leakage (PA)
300
Blocking Voltage (VP)
485
470
465
460
0
20
40
60
80
100
0.06
0.04
0.02
445
120
0.08
455
450
100
-20
250
200
150
100
50
0
-50
-100
-150
-200
-250
-2.0 -1.5
80
Temperature (ºC)
350
-40
Typical On-Resistance
vs. Temperature
(IF=5mA, IL=250mADC)
Temperature (ºC)
LED Current (mA)
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20
Load Current (mA)
-40
LED Current (mA)
0.05
0.01
0
Load Current (mA)
On-Resistance (:)
2.0
0.06
Turn-Off Time (ms)
Turn-On Time (ms)
2.5
Typical Turn-Off Time
vs. Temperature
(IF=5mA, IL=250mADC)
-40
Temperature (ºC)
-20
0
20
40
60
80
100
0
-40
-20
0
20
40
60
80
100
Temperature (ºC)
Temperature (ºC)
Energy Rating Curve
1.2
Load Current (A)
1.0
0.8
0.6
0.4
0.2
0
10Ps 100Ps 1ms 10ms 100ms
1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R03
INTEGRATED CIRCUITS DIVISION
PLA191
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PLA191 / PLA191S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PLA191 / PLA191S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb
R03
e3
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5
INTEGRATED CIRCUITS DIVISION
PLA191
Mechanical Dimensions
PLA191
8.382 ± 0.381
(0.330 ± 0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
7.620 ± 0.254
(0.300 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457 ± 0.076
(0.018 ± 0.003)
PLA191S
8.382 ± 0.381
(0.330 ± 0.015)
9.524 ± 0.508
(0.375 ± 0.020)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
Dimensions
mm
(inches)
1.651 ± 0.254
(0.065 ± 0.010)
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R03
INTEGRATED CIRCUITS DIVISION
PLA191
PLA191STR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
P = 12.00
(0.472)
User Direction of Feed
Embossed
Carrier
Embossment
A0 = 10.10
(0.398)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-PLA191-R03
©Copyright 2012, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012