PLA191 Single Pole, Normally Open OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameters Blocking Voltage Load Current On-Resistance (max) Ratings 400 250 8 Description Units VP mArms / mADC PLA191 is a single-pole, normally open (1-Form-A) solid state relay that uses optically coupled MOSFET technology to provide 5000Vrms of enhanced input to output isolation. Features Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. • 5000Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • No Moving Parts • High Reliability • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 6-Pin Package • Machine Insertable, Wave Solderable Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 004 Ordering Information Applications • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebooks, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment—Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Part # PLA191 PLA191S PLA191STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) Pin Configuration AC/DC Configuration + Control - Control NC 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control - Control NC 1 6 2 5 3 4 + Load - Load Switching Characteristics of Normally Open Devices Form-A IF 90% 10% ILOAD ton Pb DS-PLA191-R03 toff e3 www.ixysic.com 1 INTEGRATED CIRCUITS DIVISION PLA191 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Package Dissipation 2 Isolation Voltage, Input to Output Operational Temperature Storage Temperature 1 Derate linearly 1.33 mW / ºC 2 Derate linearly 6.67 mW / ºC Ratings 400 5 50 1 150 800 5000 -40 to +85 -40 to +125 Units VP V mA A mW mW Vrms °C °C Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC Parameters Output Characteristics Load Current, Continuous AC/DC Configuration DC Configuration Peak Load Current On-Resistance 1 AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 1 2 Conditions Min Typ Max Units - - 250 350 ±500 mArms / mADC mADC mAP - 8 3 1 ILEAK - A VL=50V, f=1MHz ton toff COUT - 65 3 1 - ms ms pF IL=150mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.4 10 mA mA V A - CI/O - 3 - pF t=10ms IL=150mA IL=250mA VL=400VP IF=5mA, VL=10V Symbol IL ILPK RON Measurement taken within 1 second of on-time. www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION PLA191 PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * Typical LED Forward Voltage Drop (N=50, IF=5mA) 35 25 25 20 15 10 5 20 15 10 5 1.17 1.21 1.23 1.25 0.39 0.65 0.91 1.17 1.43 15 10 5 0.018 1.69 0.030 0.042 0.054 0.066 0.078 LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms) Typical IF for Switch Operation (N=50, IL=250mADC) Typical IF for Switch Dropout (N=50, IL=250mADC) Typical On-Resistance Distribution (N=50, IF=5mA, IL=250mADC) 25 Device Count (N) 20 15 10 5 0 35 30 20 Device Count (N) 25 1.19 20 0 0 0 Typical Turn-Off Time (N=50, IF=5mA, IL=250mADC) 25 Device Count (N) Device Count (N) Device Count (N) 30 Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=250mADC) 15 10 5 2.1 3.3 2.7 3.9 20 15 10 5 0 1.5 25 0 4.5 0.9 LED Forward Current (mA) 1.5 2.1 2.7 3.3 3.9 5.03 5.38 5.73 6.08 6.43 6.78 On-Resistance (:) LED Forward Current (mA) Typical Blocking Voltage Distribution (N=50) 35 Device Count (N) 30 25 20 15 10 5 0 430 442 454 466 478 490 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=250mADC) 1.6 1.4 IF=50mA IF=30mA IF=20mA IF=10mA IF=5mA 1.2 1.0 0.8 -40 -20 0 20 40 60 Temperature (ºC) 80 100 120 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 Typical Turn-Off Time vs. LED Forward Current (IL=250mADC) 0.050 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 0 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R03 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION PLA191 PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) * Typical Turn-On Time vs. Temperature (IL=250mADC) 0.07 IF=5mA IF=10mA IF=20mA 1.5 1.0 0.5 0.04 0.03 0.02 0 20 40 60 80 0 -40 100 -40 -20 0 20 40 60 80 10 9 8 7 6 5 4 3 2 1 0 -40 100 -20 0 20 40 60 Temperature (ºC) Temperature (ºC) Typical IF for Switch Operation vs. Temperature (IL=250mADC) Typical IF for Switch Dropout vs. Temperature (IL=250mADC) Typical Load Current vs. Load Voltage (IF=5mA) -20 0 20 40 60 80 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 100 -20 0 20 40 60 80 100 -1.0 -0.5 0 0.5 1.0 100 1.5 2.0 Temperature (ºC) Load Voltage (V) Maximum Load Current vs. Temperature Typical Blocking Voltage vs. Temperature Typical Leakage vs. Temperature Measured across Pins 4&6 0.12 250 IF=20mA IF=10mA IF=5mA 200 150 480 0.10 475 Leakage (PA) 300 Blocking Voltage (VP) 485 470 465 460 0 20 40 60 80 100 0.06 0.04 0.02 445 120 0.08 455 450 100 -20 250 200 150 100 50 0 -50 -100 -150 -200 -250 -2.0 -1.5 80 Temperature (ºC) 350 -40 Typical On-Resistance vs. Temperature (IF=5mA, IL=250mADC) Temperature (ºC) LED Current (mA) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -20 Load Current (mA) -40 LED Current (mA) 0.05 0.01 0 Load Current (mA) On-Resistance (:) 2.0 0.06 Turn-Off Time (ms) Turn-On Time (ms) 2.5 Typical Turn-Off Time vs. Temperature (IF=5mA, IL=250mADC) -40 Temperature (ºC) -20 0 20 40 60 80 100 0 -40 -20 0 20 40 60 80 100 Temperature (ºC) Temperature (ºC) Energy Rating Curve 1.2 Load Current (A) 1.0 0.8 0.6 0.4 0.2 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION PLA191 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating PLA191 / PLA191S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time PLA191 / PLA191S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R03 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION PLA191 Mechanical Dimensions PLA191 8.382 ± 0.381 (0.330 ± 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 ± 0.127 (0.100 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) Pin 1 7.620 ± 0.254 (0.300 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.254 ± 0.0127 (0.010 ± 0.0005) 6.350 ± 0.127 (0.250 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 ± 0.076 (0.018 ± 0.003) PLA191S 8.382 ± 0.381 (0.330 ± 0.015) 9.524 ± 0.508 (0.375 ± 0.020) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) PCB Land Pattern 2.54 ± 0.127 (0.100 ± 0.005) 2.54 (0.10) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) Dimensions mm (inches) 1.651 ± 0.254 (0.065 ± 0.010) 6 www.ixysic.com R03 INTEGRATED CIRCUITS DIVISION PLA191 PLA191STR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-PLA191-R03 ©Copyright 2012, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012