LCB110 Single-Pole, Normally Closed OptoMOS® Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) Ratings 350 120 35 Units VP mArms / mADC Description The LCB110 is a single-pole, normally closed (1-Form-B) relay that uses optically coupled MOSFET technology to provide 3750Vrms of input to output isolation. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. Features • 3750Vrms Input/Output Isolation • Low Drive Power Requirements (TTL/CMOS Compatible) • Arc-Free With No Snubbing Circuits • FCC Compatible • VDE Compatible • No EMI/RFI Generation • Small 6-Pin Package • Machine Insertable, Wave Solderable • Surface Mount Tape & Reel Version Available The LCB110 has low on-resistance and is well suited for most applications requiring a normally closed relay. Approvals • UL Recognized Component: File E76270 • CSA Certified Component: Certificate 1175739 • EN/IEC 60950-1 Certified Component: TUV Certificate B 09 07 49410 006 Applications Ordering Information • Telecommunications • Telecom Switching • Tip/Ring Circuits • Modem Switching (Laptop, Notebook, Pocket Size) • Hook Switch • Dial Pulsing • Ground Start • Ringing Injection • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Medical Equipment-Patient/Equipment Isolation • Security • Aerospace • Industrial Controls Part # LCB110 LCB110S LCB110STR Description 6-Pin DIP (50/Tube) 6-Pin Surface Mount (50/Tube) 6-Pin Surface Mount (1000/Reel) * For other packaging options consult factory. Pin Configuration AC/DC Configuration + Control – Control N/C 1 6 2 5 3 4 Load Do Not Use Load DC Only Configuration + Control – Control N/C 1 6 2 5 3 4 + Load – Load Switching Characteristics of Normally Closed Devices Form-B IF ILOAD 90% 10% Pb DS-LCB110-R09 toff e3 www.ixysic.com ton 1 INTEGRATED CIRCUITS DIVISION LCB110 Absolute Maximum Ratings @ 25ºC Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation voltage, Input to Output Operational Temperature Storage Temperature 1 1 Ratings 350 5 50 1 150 800 3750 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms °C °C Derate linearly 3.33 mW / ºC Derate linearly 6.67 mW / ºC Electrical Characteristics @ 25ºC Parameter Output Characteristics Load Current Continuous AC/DC Configuration DC Configuration Peak Load Current On-Resistance AC/DC Configuration DC Configuration Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Input to Output Capacitance 2 Conditions Symbol Min Typ Max Units - IL - - 120 200 ±350 mArms / mADC mADC mAP t=10ms IL - 23 7 - 35 10 1 ILEAK - IF=5mA, VL=50V, f=1MHz ton toff COUT - 0.38 0.93 25 3 3 - IL=120mA IF=5mA VR=5V IF IF VF IR 0.4 0.9 - 0.7 1.2 - 5 1.4 10 mA mA V A - CI/O - 3 - pF IL=120mA IL=200mA IF=5mA, VL=350VP RON IF=5mA, VL=10V www.ixysic.com A ms pF R09 INTEGRATED CIRCUITS DIVISION LCB110 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* Typical LED Forward Voltage Drop (N=50, IF=5mA) 35 25 25 20 15 10 20 15 10 5 5 0 20 15 10 5 0 1.17 1.21 1.23 0 1.25 0.18 0.25 0.32 0.39 0.46 0.53 0.75 0.80 0.85 0.90 0.95 1.0 1.05 LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms) Typical IF for Switch Operation (N=50, IL=120mADC) Typical IF for Switch Dropout (N=50, IL=120mADC) Typical On-Resistance Distribution (N=50, IL=120mADC) Device Count (N) 20 15 10 5 25 25 20 20 Device Count (N) 25 1.19 Typical Turn-Off Time (N=50, IF=5mA, IL=120mADC) 25 Device Count (N) Device Count (N) Device Count (N) 30 Device Count (N) Typical Turn-On Time (N=50, IF=5mA, IL=120mADC) 15 10 5 0 0 0.45 0.50 0.55 0.60 0.65 0.70 15 10 5 0 0.40 0.75 0.45 0.50 0.55 0.60 0.65 0.70 22.4 22.7 LED Current (mA) LED Current (mA) 23.0 23.3 23.6 23.9 24.2 On-Resistance (:) Typical Blocking Voltage Distribution (N=50, IF=5mA) Device Count (N) 25 20 15 10 5 0 370 375 380 385 390 395 Blocking Voltage (VP) Typical Turn-On Time vs. LED Forward Current (IL=120mADC) 0.30 1.6 0.25 1.4 I F =50mA 1.2 I F =10mA I F =5mA 1.0 0.6 0.20 0.15 0.10 0.05 0.8 -20 0 20 40 60 Temperature (ºC) 80 100 120 0.5 0.4 0.3 0.2 0.1 0 0 -40 Typical Turn-Off Time vs. LED Forward Current (IL=120mADC) 0.7 Turn-Off Time (ms) 1.8 Turn-On Time (ms) LED Forward Voltage Drop (V) Typical LED Forward Voltage Drop vs. Temperature 0 5 10 15 20 25 30 35 40 LED Forward Current (mA) 45 50 0 5 10 15 20 25 30 35 40 45 50 LED Forward Current (mA) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R09 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION LCB110 PERFORMANCE DATA @25ºC (Unless Otherwise Noted)* 0.6 50 0.5 40 30 AC/DC Configuration 20 10 Typical Turn-On Time vs. Temperature (IF=5mA, IL=120mADC) 1.8 0.4 0.3 0.2 0.1 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 Temperature (ºC) Temperature (ºC) Typical On-Resistance vs. Temperature (IL=100mA) 50 45 40 35 30 25 20 15 10 5 0 80 1.2 1.0 0.8 I F =10mA 0.6 -40 100 LED Current (mA) LED Current (mA) 1.5 1.0 20 40 60 80 1.0 0 20 40 60 80 100 20 40 60 80 Typical Load Current vs. Load Voltage Typical Blocking Voltage vs. Temperature (IF=5mA) 140 120 AC/DC Configuration 150 400 100 395 50 0 -50 -100 60 40 0 20 40 60 80 100 120 -4 -3 -2 Temperature (ºC) 0 -1 1 Load Voltage (V) Typical Leakage vs. Temperature Measured Across Pins 4&6 (IF=5mA, VL=350V) 0.040 Load Current (A) Leakage (PA) 0.035 0.030 0.025 0.020 0.015 0.010 0.005 -20 0 390 385 380 375 370 20 40 60 Temperature (ºC) 80 2 3 -40 4 -20 0 20 40 60 80 100 Temperature (ºC) Energy Rating Curve 0.045 0 -40 100 365 -150 -20 0 Maximum Load Current vs. Temperature (IF=0mA) 160 -40 -20 -40 Temperature (ºC) 180 80 -20 Temperature (ºC) DC Configuration 100 1.5 Temperature (ºC) 200 100 80 0 -40 100 60 0.5 Blocking Voltage (VP) 220 0 40 2.0 0 -20 20 2.5 2.0 0.5 -40 0 Typical IF for Switch Dropout vs. Temperature (IL=120mADC) 3.0 2.5 Instantaneous -20 Temperature (ºC) Typical IF for Switch Operation vs. Temperature (IL=120mADC) 3.0 Load Current (mA) On-Resistance (:) 1.4 0 -40 Load Current (mA) I F =5mA 1.6 0.4 DC Configuration 0 Typical Turn-Off Time vs. Temperature (IL=120mADC) 2.0 Turn-Off Time (ms) 60 Turn-On Time (ms) On-Resistance (:) Typical On-Resistance vs. Temperature (IL=120mADC) 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LCB110 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating LCB110 / LCB110S MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time LCB110 / LCB110S 250ºC for 30 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb R09 e3 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION LCB110 MECHANICAL DIMENSIONS LCB110 8.382 ± 0.381 (0.330 ± 0.015) PCB Hole Pattern 7.239 TYP (0.285 TYP) 2.54 ± 0.127 (0.100 ± 0.005) 6 - 0.800 DIA. (6 - 0.031 DIA.) 9.144 ± 0.508 (0.360 ± 0.020) 6.350 ± 0.127 (0.250 ± 0.005) 2.540 ± 0.127 (0.100 ± 0.005) 7.620 ± 0.127 (0.300 ± 0.005) Pin 1 7.620 ± 0.254 (0.300 ± 0.010) 1.651 ± 0.254 (0.065 ± 0.010) 3.302 ± 0.051 (0.130 ± 0.002) 0.254 ± 0.0127 (0.010 ± 0.0005) 6.350 ± 0.127 (0.250 ± 0.005) 5.080 ± 0.127 (0.200 ± 0.005) 4.064 TYP (0.160 TYP) Dimensions mm (inches) 0.457 ± 0.076 (0.018 ± 0.003) LCB110S 8.382 ± 0.381 (0.330 ± 0.015) 9.524 ± 0.508 (0.375 ± 0.020) Pin 1 0.635 ± 0.127 (0.025 ± 0.005) PCB Land Pattern 2.54 ± 0.127 (0.100 ± 0.005) 2.54 (0.10) 6.350 ± 0.127 (0.250 ± 0.005) 0.457 ± 0.076 (0.018 ± 0.003) 1.651 ± 0.254 (0.065 ± 0.010) 7.620 ± 0.254 (0.300 ± 0.010) 0.254 ± 0.0127 (0.010 ± 0.0005) 8.90 (0.3503) 1.65 (0.0649) 0.65 (0.0255) 3.302 ± 0.051 (0.130 ± 0.002) 4.445 ± 0.254 (0.175 ± 0.010) Dimensions mm (inches) 1.651 ± 0.254 (0.065 ± 0.010) 6 www.ixysic.com R09 INTEGRATED CIRCUITS DIVISION LCB110 LCB110STR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=16.00 (0.63) B0 = 10.10 (0.398) K0 = 4.90 (0.19) K1 = 3.80 (0.15) P = 12.00 (0.472) User Direction of Feed Embossed Carrier Embossment A0 = 10.10 (0.398) Dimensions mm (inches) NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS-LCB110-R09 ©Copyright 2012, IXYS Integrated Circuits Division OptoMOS® is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/22/2012