CPC1135N

CPC1135N
Single-Pole, Normally Closed
4-Pin SOP OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
350
120
35
Units
VP
mArms / mADC

Description
The CPC1135N is a miniature single-pole, normally
closed (1-Form-B) solid state relay that uses optically
coupled MOSFET technology to provide 1500Vrms of
input to output isolation.
Its optically coupled output, which uses the patented
OptoMOS architecture, is controlled by a highly
efficient GaAIAs infrared LED.
Features
• 1500Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 4-Pin SOP Package
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available
IXYS Integrated Circuits Division’s state of the art
double-molded vertical construction packaging
enables the CPC1135N to be one of the world’s
smallest 4-pin solid state relays. It offers board space
savings over the competitor’s larger 4-pin SOP relay.
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket
Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Approvals
• UL 1577 Approved Component: File E76270
• CSA Certified Component: Certificate 1172007
• EN 60950 Certified Component:
TUV Certificate B 10 05 49410 006
Ordering Information
Part #
CPC1135N
CPC1135NTR
Description
4-Pin SOP (100/tube)
4-Pin SOP (2000/reel)
Pin Configuration
+ Control
– Control
1
4
3
2
Load
Load
Switching Characteristics
of Normally Closed Devices
Form-B
IF
ILOAD
90%
10%
toff
Pb
DS-CPC1135N-R08
ton
e3
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1
INTEGRATED CIRCUITS DIVISION
CPC1135N
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
Total Power Dissipation 1
Capacitance, Input to Output
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Ratings
350
5
50
1
150
400
1
1500
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
pF
Vrms
°C
°C
Derate linearly 3.33 mW / ºC
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current
Continuous 1
Peak
On-Resistance 2
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate3
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
1
2
3
2
Conditions
Symbol
Min
Typ
Max
Units
t =10ms
IL=120mA
IF=2mA, VL=350VP
IL
ILPK
RON
ILEAK
-
-
120
±350
35
5
mArms / mADC
mAP

µA
VL=50V, f=1MHz
ton
toff
COUT
-
25
2
2
-
IL=120mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.3
0.9
-
0.6
0.55
1.2
-
2
1.4
10
IF=5mA, VL=10V
ms
pF
mA
mA
V
µA
Load current derates linearly from 120mA @ 25oC to 80mA @ 85oC.
Measurement taken within 1 second of on-time.
For applications requiring high temperature operation (greater than 60°C) a LED drive current of 4mA is recomended.
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R08
INTEGRATED CIRCUITS DIVISION
CPC1135N
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
25
20
15
10
5
0
15
10
5
1.19
1.21
1.23
1.25
LED Forward Voltage Drop (V)
15
10
5
0.22
0.23
0.24
0.25
0.26
0.55
0.60
0.65
0.70
5
0.50
0.60
15
10
5
1.10
Typical On-Resistance Distribution
(N=50, IL=120mA)
25
20
15
10
5
0
0.45
0.75
35
0.70 0.80 0.90 1.00
Turn-Off Time (ms)
30
20
0
0.50
10
0.27
Typical IF for Switch Dropout
(N=50, IL=120mA)
25
0
0.45
15
Turn-On Time (ms)
Typical IF for Switch Operation
(N=50, IL=120mA)
20
20
0
0.21
Device Count (N)
Device Count (N)
25
20
0
1.17
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mA)
25
Device Count (N)
Device Count (N)
Device Count (N)
30
25
Typical Turn-On Time
(N=50, IF=5mA, IL=120mA)
Device Count (N)
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0.50
LED Current (mA)
0.55 0.60 0.65 0.70
LED Current (mA)
0.75
28.5
29
29.5
30
30.5
31
31.5
On-Resistance (:)
Typical Blocking Voltage Distribution
(N=50)
35
Device Count (N)
30
25
20
15
10
5
0
365
370
375 380 385 390
Blocking Voltage (VP)
395
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
R08
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INTEGRATED CIRCUITS DIVISION
CPC1135N
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical Turn-On Time
vs. LED Forward Current
(IL=120mA)
0.7
1.8
1.6
1.4
IF=50mA
IF=30mA
IF=20mA
IF=10mA
IF=5mA
1.2
1.0
0.4
0.3
0.2
0
0.8
-20
0
20
40
60
80
100
0
120
10
15
25
30
35
40
45
50
0
15
20
25
30
35
40
Typical Turn-On Time
vs. Temperature
(IL=50mA)
Typical Turn-Off Time
vs. Temperature
(IL=50mA)
Turn-On Time (ms)
1.5
1.0
0
-20
0
20
40
60
Temperature (ºC)
80
100
60
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
IF=10mA
IF=5mA
-40
-20
0
20
40
60
80
100
20
10
Load Current (mA)
Load Current (mA)
30
50
0
-50
-100
20
40
60
80
-4
-2
0
2
4
0.014
390
0.012
Leakage (µA)
395
385
380
375
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(IF=2mA, VL=350V)
0.010
0.008
0.006
0.004
370
0.002
365
-20
0
20
40
60
Temperature (ºC)
80
100
100
120
140
120
100
80
60
40
0
-40
-20
0
20
40
60
Temperature (ºC)
80
-20
0
20
40
60
80
Temperature (ºC)
Energy Rating Curve
Load Current (A)
Typical Blocking Voltage
vs. Temperature
0.016
100
Maximum Load Current
vs. Temperature
(IF=0mA)
-40
6
Load Voltage (V)
Temperature (ºC)
400
80
0
-6
100
20
40
60
Temperature (ºC)
20
-150
0
0
0
160
100
40
50
IF=10mA
-20
180
150
45
IF=5mA
-40
Typical Load Current vs. Load Voltage
(IF=0mA)
50
-20
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
Temperature (ºC)
Typical On-Resistance
vs. Temperature
(IF=0mA, IL=120mA)
-40
10
Typical IF for Switch Operation
vs. Temperature
(IL=50mA)
2.0
-40
5
LED Forward Current (mA)
0.5
Blocking Voltage (VP)
20
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
LED Forward Current (mA)
2.5
-40
5
Typical Turn-Off Time
vs. LED Forward Current
(IL=120mA)
Temperature (ºC)
Turn-Off Time (ms)
3.0
LED Current (mA)
0.5
0.1
-40
On-Resistance (:)
Turn-Off Time (ms)
0.6
Turn-On Time (ms)
LED Forward Voltage Drop (V)
Typical LED Forward Voltage Drop
vs. Temperature
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10μs 100μs 1ms 10ms 100ms
1s
10s 100s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
4
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R08
INTEGRATED CIRCUITS DIVISION
CPC1135N
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
CPC1135N
MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
CPC1135N
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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R08
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INTEGRATED CIRCUITS DIVISION
CPC1135N
Mechanical Dimensions
CPC1135N
4.089 ± 0.203
(0.161 ± 0.008)
Recommended PCB Land Pattern
0.200 ± 0.025
(0.008 ± 0.001)
0.60
(0.0217)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003)
0.432 ± 0.127
(0.017 ± 0.005)
5.60
(0.2205)
1.02 ± 0.025
(0.040 ± 0.001)
Pin 1
2.54 Typ
(0.100 Typ)
1.30
(0.0512)
2.184 Max
(0.086 Max)
2.54
(0.10)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
Dimensions
mm
(inches)
0.381 TYP.
(0.015 TYP.)
CPC1135NTR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=12.00
(0.472)
B0=4.70
(0.185)
K0=2.70
(0.106)
K1=2.30
(0.091)
P=8.00
(0.315)
A0=6.50
(0.256)
User Direction of Feed
Dimensions
mm
(inches)
Embossed
Carrier
Embossment
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
6
Specification: DS-CPC1135N-R08
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/14/2012