IX2204 Dual Low Side IGBT Gate Driver INTEGRATED CIRCUITS DIVISION Features Description • • • • • • • • The IX2204 is a dual high current gate driver specifically designed to drive the gates of high current IGBTs. The IX2204 provides two high current outputs capable of sourcing 2A and sinking 4A. The outputs can be paralleled for IGBT gates that require higher drive current. The outputs have a wide operating voltage range, and are able to provide a negative gate drive voltage to ensure the turn-off of high power IGBTs. A desaturation detection circuit protects the power IGBT during a short circuit. The IX2204 has a programmable two-level turn-off feature that protects the device against excessive voltages when the IGBT is being turned off due to an over-current situation. High Output Current: 2A Source/4A Sink Wide Operating Voltage Range: -10V to +26V Negative Gate Drive Capability Desaturation Detection Circuit Separate Source and Sink Outputs Programmable Blanking and Output Tristate TTL Compatible Inputs -40°C to +125°C Extended Operating Temperature Range • Under-Voltage Lockout Circuitry • Fault Status Output Applications • Efficient IGBT Switching • Motor Controls • Switch Mode Power Supplies The IX2204 has under voltage lockout circuitry and a fault status output, and is available in a 16-lead thermally enhanced SOIC package. Ordering Information Part Description IX2204NE 16-Pin SOIC in Tubes (50/Tube) IX2204NETR 16-Pin SOIC in Tape & Reel (2000/Reel) IX2204 Functional Block Diagram VHA UVLO INA A Channel Level Shift OUTHA OUTLA Control Logic INB VLA MODE BLANK TRISTATE VHB DESAT 1.4V FAULT B Channel Level Shift OUTLB VLB GND DS-IX2204-R03 OUTHB www.ixysic.com 1 IX2204 INTEGRATED CIRCUITS DIVISION 1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout: 16-Pin SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description: 16-Pin SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 AC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.8 AC Input/Output Timing Diagram (MODE=0V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.9 AC Fault Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 3 4 4 4 5 5 5 5 2. Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Desaturation Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 Under-Voltage Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 Fault Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.6 Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 7 7 7 7 7 7 4. Application Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.1 Parallel-Mode IGBT Drive with Desaturation Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.2 Direct IGBT Drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.3 Stack-Mode IGBT Drive with Desaturation Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 8 8 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2 www.ixysic.com R03 IX2204 INTEGRATED CIRCUITS DIVISION 1 Specifications 1.1 Package Pinout: 16-Pin SOIC Package VLA - 1 OUTLA - 2 OUTHA - 3 VHA - 4 DESAT - 5 TRISTATE - 6 MODE - 7 BLANK - 8 R03 16 - VLB 15 - OUTLB 14 - OUTHB 13 - VHB 12 - INB 11 - INA 10 - FAULT 9 - GND 1.2 Pin Description: 16-Pin SOIC Package Pin# Name 1 VLA 2 OUTLA Channel A sinking output 3 OUTHA Channel A sourcing output 4 VHA 5 DESAT 6 TRISTATE 7 MODE Mode control 8 BLANK Channel A start-up blanking time 9 GND Signal ground 10 FAULT Fault status output 11 INA Channel A logic input 12 INB Channel B logic input 13 VHB Channel B positive Supply 14 OUTHB Channel B sourcing output 15 OUTLB Channel B sinking output 16 VLB www.ixysic.com Description Channel A negative supply Channel A positive supply & logic supply Desaturation comparator input Channel A tristate timing Channel B negative supply 3 IX2204 INTEGRATED CIRCUITS DIVISION 1.3 Absolute Maximum Ratings Parameter VH Supply Voltage 1 VL Supply Voltage Supply Voltage All Other Pins Output Sourcing Current Output Sinking Current Junction Temperature Storage Temperature Symbol Minimum Maximum Units VHA, VHB VLA, VLB IOUTH IOUTL TJ TSTG - 26 V -10 - V GND-0.3 VHA+0.3 V - -2 A - 4 A -55 +150 °C -65 +150 °C Note 1: VHx-VLx maximum is 26V. 1.4 Recommended Operating Conditions Parameter VH Supply Voltage VL Supply Voltage Operating Temperature Range Symbol Minimum Maximum Units VHA, VHB VLA, VLB TA - 25 -10 GND V V -40 +125 °C 1.5 DC Electrical Characteristics 13V < VHA < 25V; 13V<VHB<25V; -40°C<TA<125°C. Parameter Conditions Symbol Minimum Typical Maximum Units Power Supply Current VHA=18V IVHA - - 3.5 mA Under-Voltage Lockout Output Enable Threshold VHA Rising UVLO+ 10 - 13 V Under-Voltage Lockout Output Hysteresis - UVLOHYS - 1 - V INA / INB Logic Low Threshold - VIL 0.8 - - V INA / INB Logic High Threshold - VIH - - 2 V INA / INB / MODE Input Current - IIN - - 1 A DESAT Threshold - VDESAT 1.26 1.4 1.54 V TRISTATE / BLANK Source Current - ISRC -100 -160 -210 A IFAULT=8mA VFAULT - - 0.8 V Low Output Voltage No Load VOUTL - - VL+0.025 V High Output Voltage No Load VOUTH VH-0.025 - - V VH=18V, IOUTH= -100mA ROUTH - 2.4 5 VH=18V, IOUTL= 100mA ROUTL - 1.2 2 FAULT Output FAULT Low Voltage Outputs Output Resistance 4 www.ixysic.com R03 IX2204 INTEGRATED CIRCUITS DIVISION 1.6 AC Electrical Characteristics 13V < VHA < 25V; -40°C<TA<125°C Parameter Conditions OUT Rise Time OUT Fall Time VH=18V, CLOAD=1nF Delay, IN to OUT Rising Delay, IN to OUT Falling (twin - twout), CLOAD=0 IN to OUT Pulse Distortion (twin - twout), CLOAD=1nF CBLANK=0 DESAT Blank Time RL=100 to GND Maximum tr - - 40 tf - 8 20 TDLH - 70 100 TDHL - 70 100 tw tTRISTATE CTRISTATE=100pF VH=18V, CLOAD=1nF Delay Time, TRISTATE high to OUT Low Typical tDELAY1 CTRISTATE=0 Duration of Tristate OUT Minimum tBLANK CBLANK=100pF Delay Time, DESAT to Output Tristate Symbol tDELAY2 - 7 25 - 7 25 - - 100 - 875 - - 50 100 - - 100 - 1000 - - - 100 Units ns ns ns ns ns ns 1.7 Thermal Characteristics Parameter Thermal Resistance, Junction to Ambient Symbol Rating Units JA 75.4 °C/W 1.8 AC Input/Output Timing Diagram (MODE=0V) t DHL t DLH V IH IN X tw in V IL tf OUT X tw out 90% 50% tr 90% 50% 10% 90% 10% 10% 1.9 AC Fault Timing Diagram 1.4V DESAT tDELAY1 tTRISTATE OUT VH tDELAY2 VL R03 www.ixysic.com 5 IX2204 INTEGRATED CIRCUITS DIVISION 2 Performance Characteristics Propagation Delay vs. Temperature TDHL 60 TDLH 40 20 0 -50 -25 0 25 50 75 100 Temperature (ºC) 125 150 25 20 15 10 5 0 -5 -10 -15 -20 -25 -50 1.50 Threshold (V) Timing Error (ns) 1.30 -25 125 -160 -170 -180 -50 -25 0 25 50 75 100 Temperature (ºC) 125 150 2.0 2 ROUTL 1 -50 -25 0 25 50 75 100 Temperature (ºC) 125 150 150 125 150 125 150 12.0 11.5 11.0 10.5 1.0 -50 -25 0 25 50 75 100 Temperature (ºC) 125 150 ROUTH 6 5 4 ROUTL 3 2 0 -50 -25 0 25 50 75 100 Temperature (ºC) www.ixysic.com 10.0 -50 -25 0 25 50 75 100 Temperature (ºC) Peak Output Current vs. Temperature (10μs Pulse) Output Resistance vs. Temperature (IOUTH=-2A, IOUTL=4A) 1 0 125 1.5 Resistance (Ω) 3 25 50 75 100 Temperature (ºC) 12.5 7 ROUTH 0 UVLO+ Threshold vs. Temperature 2.5 8 4 -25 13.0 Output Resistance vs. Temperature (IOUTH=-100mA, IOUTL=100mA) 5 6 -50 150 Threshold (V) Supply Current (mA) Source Current (μA) 25 50 75 100 Temperature (ºC) 3.0 -150 Output Resistance (Ω) 0 Power Supply Current vs. Temperature -120 -140 1.40 1.35 TRISTATE and BLANK Source Current vs. Temperature -130 1.45 Output Source/Sink Current (A) Propagation Delay (ns) 100 80 VDESAT Threshold vs. Temperature Pulse Width Distortion vs. Temperature 125 150 8 7 IOUTL 6 5 4 IOUTH 3 2 -50 -25 0 25 50 75 100 Temperature (ºC) R03 IX2204 INTEGRATED CIRCUITS DIVISION 3 Functional Description 3.1 Input This blanking time starts when INA transitions from low to high. The INA and INB inputs are TTL compatible and must be referenced to GND. 3.2 Mode The MODE input determines how the desaturation protection and Under-Voltage Lock Out (UVLO) protection circuitry controls the OUTHA, OUTLA, OUTHB and OUTLB outputs. For parallel-mode IGBT drive, MODE should be connected to GND (see 4.1). For driving IGBTs that require higher gate drive current than the IX2204 can provide, the IX2204 can be used to control external drive transistors. In this stacked configuration, the external drive transistors constitute an inverting stage, and MODE should be connected to VHA for proper desaturation protection and UVLO operation (see 4.3). 3.3 Desaturation Protection tTRISTATE = 8750 • CTRISTATE The Under Voltage Lock Out (UVLO) circuit protects the IGBT from insufficient gate voltage. The UVLO circuit monitors the VHA supply voltage. If MODE is connected to GND and VHA is below the UVLO+ threshold, OUTHA and OUTHB are both turned-off (high impedance), and both OUTLA and OUTLB are both turned on (pulled low). If VHA is below the UVLO+ threshold and MODE is connected to VHA, OUTHA and OUTHB are both are turned on, and OUTLA and OUTLB are both turned off. Table 2: Output States with VHA < UVLO+ Mode GND VHA OUTHA Z 1 OUTLA OUTHB OUTLB 0 Z Z 1 0 Z 3.5 Fault Output The desaturation circuit is disabled for a fixed blanking time to avoid detecting a false desaturation event during IGBT turn-on, thus allowing enough time for IGBT saturation. This blanking time is set by an internal current source and an external capacitor, CBLK. The blanking time is approximately: R03 The desaturation protection circuit cannot be used when the IX2204 is used to drive two separate IGBTs (direct IGBT drive, see 4.2). When driving two separate IGBTs, the DESAT, TRISTATE, MODE, and BLANK pins should all be connected to GND. 3.4 Under-Voltage Protection The desaturation protection circuit ensures the protection of an external IGBT in the event of an over-current situation. When the voltage at DESAT exceeds 1.4V (typically) and MODE is connected to GND, OUTLA and OUTLB are driven low in a two-step process. First OUTLA, OUTHA, OUTLB and OUTHB are all turned off (high impedance). Then after a programmable time (tTRISTATE), both OUTLA and OUTLB are turned on (driven low), which quickly turns off the IGBT. This two-step action avoids both dangerous over-voltages across the IGBT and reverse-bias SOA problems, especially during a short circuit turn-off. The time that all the outputs are in tristate is set by an internal current source and an external capacitor (CTRISTATE ) that is connected to the TRISTATE pin. The tristate time is approximately: tBLK = 8750 • CBLK The desaturation two-step turn off is slightly different when MODE is connected to VHA for stack-mode IGBT drive. When the DESAT voltage exceeds 1.4V, OUTHA and OUTLB are turned on, tristating the IGBT. After the tTRISTATE time, OUTHA and OUTLB are turned off, and OUTHB is turned on, which in conjunction with the external drive transistor quickly turns off the IGBT. When MODE is connected to VHA, the blanking time starts when INA transitions from high to low. The FAULT output is pulled low during a desaturation event, or when VHA is below UVLO+. 3.6 Outputs The output stages are able to source 2A, and sink 4A. Separated sink and source outputs allow independent gate charge and discharge control. For higher gate drive applications, the source and sink outputs can be paralleled to source 4A, and sink 8A. www.ixysic.com 7 IX2204 INTEGRATED CIRCUITS DIVISION 4 Application Drawings 4.1 Parallel-Mode IGBT Drive with Desaturation Detection 15V -10V 15V CTRISTATE VLA VLB OUTLA OUTLB OUTHA OUTHB VHA VHB DESAT INB TRISTATE INA MODE FAULT BLANK GND CBLK -10V OUT 15V VDD IX2204 4.2 Direct IGBT Drive -10V VLA VLB OUTLA OUTLB OUTHA OUTHB -10V OUTA OUTB 15V VHA VHB DESAT INB TRISTATE INA MODE FAULT BLANK GND 15V VDD IX2204 4.3 Stack-Mode IGBT Drive with Desaturation Detection 15V 15V VLA 15V CTRISTATE 8 CBLK VLB OUTLA OUTLB OUTHA OUTHB VHA -10V VHB DESAT INB TRISTATE INA MODE FAULT BLANK GND OUT -10V VDD IX2204 www.ixysic.com R03 IX2204 INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Rating IX2204NE MSL 1 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed. Device Maximum Temperature x Time Maximum Reflow Cycles IX2204NE 260°C for 30 seconds 3 5.4 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R03 www.ixysic.com 9 IX2204 INTEGRATED CIRCUITS DIVISION 5.5 Mechanical Dimensions 5.5.1 IX2204NE 16-Pin Narrow SOIC Package Recommended PCB Pattern 0.25 - 0.50 x 45º (0.010 - 0.020 x 45º) 9.90 BSC (0.390 BSC) See Note 3 3.90 BSC (0.154 BSC) See Note 4 4.55 (0.179) 2.40 (0.094) 6.00 ± 0.50 BSC (0.236 ± 0.020 BSC) 5.50 (0.217) 0.20 TYP (0.008 TYP) 0.31 - 0.51 (0.012 - 0.020) 0.60 (0.024) 1.25 min (0.049 min) 1.70 (0.059) 1.27 TYP (0.05 TYP) 1.70 max (0.067 max) 1.27 (0.05) 0º - 8º 0.80 ± 0.50 (0.031 ± 0.020) 0.00 - 0.15 (0.000 - 0.006) DIMENSIONS mm (inches) 3.86 - 4.57 (0.152 - 0.180) 1.68 - 2.41 (0.066 - 0.095) NOTES: 1. All dimensions are MM (IN) 2. Reference JEDEC outline: MS-012 BC Rev F. (Thermal) 3. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.15 (0.006) per side. 4. Dimension does not include inter-lead flash, and protrusions shall not exceed 0.25 (0.010) per side. 5.5.2 IX2204NETR Tape & Reel Packaging for 16-Pin Narrow SOIC Package (TBD) 330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 0.30 ± 0.05 (0.012 ± 0.002) 8.00 ± 0.10 (0.315 ± 0.004) 2.00 ± 0.10 Note 3 (0.079 ± 0.004) 4.00 Note 1 (0.157) ∅ 1.5 +0.1 / -0.0 1.75 ± 0.10 (0.069 ± 0.004) A R 0.3 max ∅ 1.50 min A 7.5 ± 0.10 Note 3 R 0.5 typ (0.295 ± 0.004) 16.0 ± 0.3 NOTES: (0.63 ± 0.012) 1.10 Sprocket hole pitch cumulative tolerance ±0.2 2. Camber in compliance with EIA 481 Dimensions 3. Pocket position relative to sprocket hole measured mm as true position of pocket, not pocket hole (inches) B0=10.30 ± 0.10 (0.406 ± 0.004) Embossed Carrier K0=2.10 ± 0.1 (0.083 ± 0.004) Embossment Section A-A A0=6.50 ± 0.10 (0.256 ± 0.004) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IX2204-R03 ©Copyright 2014, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 11/11/2014 10 www.ixysic.com R03