PLA160

PLA160
Single Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Maximum Turn-On/Turn-Off Times
Blocking Voltage
Load Current
On-Resistance (max)
Rating
50
300
50
100
Units
s
VP
mArms / mADC

Description
PLA160 is a 300V, 50mA, 100 1-Form-A relay. This
performance leader features the fastest switching
speed (50s) available in an OptoMOS relay.
Approvals
• UL Recognized Component: File # E76270
• CSA Certified Component: Certificate # 1175739
• EN/IEC 60950 Certified Component:
TUV Certificate B 13 12 82667 003
Features
• Fastest Switching OptoMOS Relay, 50s
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• No EMI/RFI Generation
• Small 6-Pin DIP Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
• Flammability Classification Rating of V-0
Ordering Information
Part Number
PLA160
PLA160S
PLA160STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
AC/DC Configuration
Applications
+ Control
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Aerospace
• Industrial Controls
• Reed Relay Replacement
– Control
Do Not Use
1
6
2
5
3
4
Load
Do Not Use
Load
DC Only Configuration
+ Control
– Control
Do Not Use
1
6
2
5
3
4
+ Load
– Load
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
IF
90%
10%
ILOAD
ton
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toff
1
INTEGRATED CIRCUITS DIVISION
PLA160
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
300
5
50
1
150
800
3750
-40 to +85
-40 to +125
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current (Continuous)
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
2
Conditions
Symbol
-
IL
t=10ms
ILPK
IF=50mA
IF=80mA
VL=300V
VL=100V
RON
ILEAK
50V, f=1MHz
ton
toff
COUT
IL=50mA
IF=10mA
VR=5V
-
IF=10mA, VL=10V
Min
Typ
Max
Units
-
-
50
80
±200
mArms / mADC
mADC
mAP
-
60
15
1
100
30
25
10

nA
-
25
42
3
IF
IF
VF
IR
0.4
1.8
-
1.35
1.25
2.4
-
10
2.8
10
mA
mA
V
µA
CI/O
-
3
-
pF
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-
50
s
-
pF
R07
INTEGRATED CIRCUITS DIVISION
PLA160
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50)
35
25
25
20
15
10
5
0
25
20
15
10
5
30
2.38
2.42
2.46
19
LED Forward Voltage Drop (V)
23
25
27
Turn-On Time (Ps)
Typical IF for Switch Operation
(N=50, IL=50mADC)
Typical IF for Switch Dropout
(N=50, IL=50mADC)
30
21
29
38
10
5
20
15
10
1.1
1.3
1.5
1.7
LED Current (mA)
48
25
20
15
10
5
0
0
0.9
42
44
46
Turn-Off Time (Ps)
30
5
0
40
Typical On-Resistance Distribution
(N=50, IF=10mA, IL=50mADC)
35
Device Count (N)
Device Count (N)
15
10
31
25
20
15
0
2.50
25
20
5
0
2.34
Turn-Off Time Distribution
(N=50, IF=10mA, IL=50mA)
30
Device Count (N)
Device Count (N)
Device Count (N)
30
Device Count (N)
Turn-On Time Distribution
(N=50, IF=10mA, IL=50mA)
1.9
0.9
1.1
1.3
1.5
1.7
60
1.9
61
LED Current (mA)
62
63
64
On-Resistance (:)
65
Typical Blocking Voltage Distribution
(N=50)
18
Device Count (N)
16
14
12
10
8
6
4
2
0
335
45
365
2.8
IF=50mA
IF=30mA
IF=20mA
IF=10mA
2.4
2.0
48
Turn-Off Time (Ps)
3.2
35
30
25
20
15
-20
0
20
40
60
80
Temperature (ºC)
100
120
44
42
38
5
-40
46
40
10
1.6
Typical Turn-Off Time
vs. LED Forward Current
(VL=10V, IL=50mA)
50
40
Turn-On Time (Ps)
LED Forward Voltage Drop (V)
345 350
355 360
Blocking Voltage (VP)
Typical Turn-On Time
vs. LED Forward Current
(VL=10V, IL=50mA)
Typical LED Forward Voltage Drop
vs. Temperature
3.6
340
0
10
20
30
LED Current (mA)
40
50
0
10
20
30
LED Current (mA)
40
50
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
R07
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INTEGRATED CIRCUITS DIVISION
PLA160
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
25
IF=20mA
20
15
5
-40
-20
0
20
40
60
Temperature (ºC)
80
IF=20mA
45
40
IF=10mA
35
100
3
2
1
80
-20
0
20
40
60
80
4
3
2
100
30
-40
0
-40
40
100
1
0
-40
-20
0
Temperature (ºC)
20
40
60
Temperature (ºC)
80
50
40
30
20
10
0
-10
-20
-30
-40
-50
100
-3
380
0.07
70
375
0.06
60
50
IF=20mA
IF=10mA
IF=5mA
40
30
20
365
360
355
350
345
10
340
0
335
-40
-20
0
20
40
60
80
Temperature (ºC)
100
0
20
40
60
Temperature (ºC)
80
100
-2
-1
0
1
Load Voltage (V)
2
3
Typical Leakage vs. Temperature
Measured across Pins 4&6
(VL=300VP)
370
Leakage (PA)
Blocking Voltage (VP)
80
-20
Typical Load Current vs. Load Voltage
(IF=10mA)
Typical Blocking Voltage
vs. Temperature
Maximum Load Current
vs. Temperature
Load Current (mA)
20
40
60
Temperature (ºC)
Load Current (mA)
LED Current (mA)
LED Current (mA)
0
5
4
50
10
-20
Typical IF for Switch Dropout
vs. Temperature
(IL=50mADC)
6
5
60
20
30
-40
Typical IF for Switch Operation
vs. Temperature
(IL=50mADC)
6
70
50
10
Typical On-Resistance
vs. Temperature
(IL=50mADC, IF=10mA)
80
On-Resistance (:)
30
Turn-On Time (Ps)
55
Typical Turn-Off Time vs. Temperature
(VL=10V)
IF=10mA
Turn-Off Time (Ps)
35
Typical Turn-On Time vs. Temperature
(VL=10V)
0.04
0.03
0.02
0.01
-40
120
0.05
-20
0
20
40
60
Temperature (ºC)
80
100
10s
100s
0
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve
0.45
Load Current (A)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
10Ps 100Ps 1ms 10ms 100ms
1s
Time
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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INTEGRATED CIRCUITS DIVISION
PLA160
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PLA160 / PLA160S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PLA160 / PLA160S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
R07
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5
INTEGRATED CIRCUITS DIVISION
PLA160
Mechanical Dimensions
PLA160
8.382 ± 0.381
(0.330 ± 0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
3.302 ± 0.051
(0.130 ± 0.002)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457 ± 0.076
(0.018 ± 0.003)
PLA160S
8.382 ± 0.381
(0.330 ± 0.015)
9.524 ± 0.508
(0.375 ± 0.020)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
Dimensions
mm
(inches)
1.651 ± 0.254
(0.065 ± 0.010)
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R07
INTEGRATED CIRCUITS DIVISION
PLA160
PLA160STR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
P = 12.00
(0.472)
User Direction of Feed
Embossed
Carrier
Embossment
A0 = 10.10
(0.398)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-PLA160-R07
©Copyright 2015, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
5/13/2015