PLA190

PLA190
Single Pole, Normally Open
OptoMOS® Relay
INTEGRATED CIRCUITS DIVISION
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
400
150
22
Units
VP
mArms / mADC

Features
Description
The PLA190 is a 400V, single-pole, normally open
(1-Form-A) solid state relay that uses optically
coupled relay technology to provide an enhanced
5000Vrms isolation barrier between the input and
output of the relay.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Aerospace
• Industrial Controls
Part Number
PLA190
PLA190S
PLA190STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
AC/DC Configuration
+ Control
- Control
NC
1
6
2
5
3
4
Load
Do Not Use
Load
DC-Only Configuration
+ Control
- Control
NC
1
6
2
5
3
4
+ Load
- Load
Switching Characteristics of
Normally Open Devices
Form-A
IF
90%
10%
ILOAD
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INTEGRATED CIRCUITS DIVISION
PLA190
Absolute Maximum Ratings @ 25ºC
Parameter
Blocking Voltage
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation 1
Total Power Dissipation 2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
Derate linearly 1.33 mW / ºC
2
Derate linearly 6.67 mW / ºC
Ratings
400
5
50
1
150
800
5000
-40 to +85
-40 to +125
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Units
VP
V
mA
A
mW
mW
Vrms
°C
°C
Electrical Characteristics @ 25ºC
Parameter
Output Characteristics
Load Current (Continuous)
AC/DC Configuration
DC Configuration
Peak Load Current
On-Resistance
AC/DC Configuration
DC Configuration
Off-State Leakage Current
Switching Speeds
Turn-On
Turn-Off
Output Capacitance
Input Characteristics
Input Control Current to Activate
Input Control Current to Deactivate
Input Voltage Drop
Reverse Input Current
Common Characteristics
Input to Output Capacitance
2
Conditions
Symbol
Min
Typ
Max
Units
-
IL
-
-
150
250
±400
mArms / mADC
mADC
mAP
t=10ms
ILPK
-
22
7
1

ILEAK
-
VL=50V, f=1mHz
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COUT
-
25
1
0.5
-
IL=150mA
IF=5mA
VR=5V
IF
IF
VF
IR
0.4
0.9
-
0.7
1.2
-
5
1.4
10
mA
mA
V
µA
-
CI/O
-
3
-
pF
IF=150mA
IF=250mA
VL=400VP
RON
IF=5mA, VL=10V
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A
ms
pF
R04
INTEGRATED CIRCUITS DIVISION
PLA190
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
20
15
10
0
15
10
1.24
1.25
1.26
1.27
LED Forward Voltage (V)
30
0.24
0.26
0.28 0.30 0.32 0.34
Turn-On Time (ms)
0.11
10
5
15
10
0.45 0.55 0.65 0.75
LED Current (mA)
13.9
Typical LED Forward Voltage Drop
vs. Temperature
1.2
1.1
-40
IF=10mA
IF=5mA
460
0.5
0.4
0.3
0.2
0
0
20
40
60
Temperature (ºC)
80
0.45
485
0.142
0.140
0.138
0.136
0.134
0.132
0
100
465
470
475
480
Blocking Voltage (VP)
Typical Turn-Off Time
vs. LED Forward Current
(IL=30mA)
0.144
0.1
-20
10
14.5
Typical Turn-On Time
vs. LED Forward Current
(IL=30mA)
0.7
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
0.65
14.1 14.2 14.3 14.4
On-Resistance (:)
Turn-Off Time (ms)
IF=50mA
IF=20mA
1.4
1.3
14.0
0.6
1.5
15
0
0.85
Turn-On Time (ms)
1.6
0.35
20
5
0
0.25
0.17
25
20
5
0
0.13 0.14 0.15 0.16
Turn-Off Time (ms)
30
Device Count (N)
Device Count (N)
15
0.12
Typical Blocking Voltage Distribution
(N=50)
25
20
10
0.36
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mA)
30
25
15
0
1.28
Typical IF for Switch Operation
(N=50, IL=150mA)
20
5
0
1.23
Device Count (N)
20
5
5
LED Forward Voltage (V)
25
Device Count (N)
25
Typical Turn-Off Time
(N=50, IF=5mA, IL=150mA)
30
25
Device Count (N)
Device Count (N)
30
10
20
30
40
LED Forward Current (mA)
50
0
Typical Turn-On Time vs. Temperature
(IF=5mA, IL=80mA)
0.18
10
20
30
40
LED Forward Current (mA)
50
Typical Turn-Off Time vs. Temperature
(IF=5mA, IL=80mA)
0.55
0.50
0.45
Turn-Off Time (ms)
0.17
0.60
Turn-On Time (ms)
LED Current to Operate (mA)
Typical Turn-On Time
(N=50, IF=5mA, IL=150mA)
30
0.40
0.35
0.30
0.16
0.15
0.14
0.13
0.12
0.11
0.40
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.25
-40
-20
0
20
40
60
Temperature (ºC)
80
100
0.10
-40
-20
0
20
40
60
Temperature (ºC)
80
100
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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INTEGRATED CIRCUITS DIVISION
PLA190
PERFORMANCE DATA @ 25ºC (Unless Otherwise Noted) *
150
17
100
15
14
13
12
11
-40
-20
0
20
40
60
Temperature (ºC)
80
100
50
0
-50
-100
-150
-2.0 -1.5 -1.0
260
490
250
485
240
230
220
210
200
190
80
120
110
-40
100
460
1.0
Load Current (A)
9
465
170
20
40
60
Temperature (ºC)
130
2.0
470
450
-40
0
1.5
475
455
-20
140
100
-0.5 0.0 0.5 1.0
Load Voltage (V)
480
180
-40
150
Typical Blocking Voltage
vs. Temperature
Blocking Voltage (VP)
Load Current (mA)
Maximum Load Current vs. Temperature
DC-Only Configuration
(IF=5mA)
160
Leakage Current (nA)
16
Maximum Load Current vs. Temperature
AC/DC Configuration
(IF=5mA)
Typical Load Current vs. Load Voltage
(IF=5mA)
Load Current (mA)
18
Load Current (mA)
On-Resistance (:)
Typical On-Resistance vs. Temperature
(IF=5mA, IL=100mA)
-20
0
20
40
60
Temperature (ºC)
80
100
-20
0
20
40
60
Temperature (ºC)
80
100
Leakage Current vs. Temperature
Measured Across Pins 5&6
(VL=400V)
8
7
6
5
4
3
-40
-20
0
20
40
60
Temperature (ºC)
80
100
Energy Rating Curve, Single Pole
(IF=5mA)
0.8
0.6
0.4
0.2
0.0
10Ps 100Ps 1ms 10ms 100ms
Time
1s
10s
100s
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
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R04
INTEGRATED CIRCUITS DIVISION
PLA190
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
PLA190 / PLA190S
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
Maximum Temperature x Time
PLA190 / PLA190S
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
PLA190
Mechanical Dimensions
PLA190
8.382 ± 0.381
(0.330 ± 0.015)
PCB Hole Pattern
7.239 TYP
(0.285 TYP)
2.54 ± 0.127
(0.100 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
9.144 ± 0.508
(0.360 ± 0.020)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
Pin 1
7.620 ± 0.254
(0.300 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002)
0.254 ± 0.0127
(0.010 ± 0.0005)
6.350 ± 0.127
(0.250 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
4.064 TYP
(0.160 TYP)
Dimensions
mm
(inches)
0.457 ± 0.076
(0.018 ± 0.003)
PLA190S
8.382 ± 0.381
(0.330 ± 0.015)
9.524 ± 0.508
(0.375 ± 0.020)
Pin 1
0.635 ± 0.127
(0.025 ± 0.005)
PCB Land Pattern
2.54 ± 0.127
(0.100 ± 0.005)
2.54
(0.10)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.254 ± 0.0127
(0.010 ± 0.0005)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
Dimensions
mm
(inches)
1.651 ± 0.254
(0.065 ± 0.010)
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INTEGRATED CIRCUITS DIVISION
PLA190
PLA190STR Tape & Reel
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
K0 = 4.90
(0.19)
K1 = 3.80
(0.15)
P = 12.00
(0.472)
User Direction of Feed
Embossed
Carrier
Embossment
A0 = 10.10
(0.398)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
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Specification: DS-PLA190-R04
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/22/2012